A method and apparatus for repairing broken microcircuits in micro-nano 3D printed micro-nano circuits based on electric field-driven micro / nano 3D printing.

Abstract

This invention belongs to the field of precision electronic circuit manufacturing technology, and provides a method and device for repairing broken lines in micro-circuits based on electric field-driven micro / nano 3D printing. This invention employs electric field-driven jet deposition micro / nano 3D printing technology, with the printing nozzle connected to a high-voltage power supply. Utilizing the diameter reduction effect of the Taylor cone in electrostatic dynamics, it achieves the fabrication of micro / nano-scale feature structures. Under the action of electrostatic field tension (changing traditional pressure-driven to tension-driven), high-viscosity materials can be printed with high resolution, enabling the repair of conductive line defects below 1μm. It is particularly suitable for repairing three-dimensional / curved conductive lines and conductive line defects in large-size (meter-scale) substrates. This invention can achieve high-resolution, high-precision, low-cost, and efficient repair of micro-precision conductive line defects.

Description

Technical Field

[0001] This invention belongs to the field of precision electronic circuit manufacturing technology, specifically relating to a method and apparatus for repairing broken wires in micro-nano 3D printed micro-circuits based on electric field-driven micro-nano 3D printing. Background Technology

[0002] The statements in this section are merely background information related to the present invention and do not necessarily constitute prior art.

[0003] Electronic devices, as crucial tools for human development, are rapidly evolving towards higher performance, miniaturization, intelligence, and wider applications. Conductive circuits are the fundamental components of electronic devices, responsible for transmitting power and information. They form the physical basis for the operation of all electronic devices and are widely used in printed circuit boards (PCBs), flexible printed circuit boards (FPCs), touch panels, LCDs, LEDs, OLEDs, QLEDs, chip packaging, flexible electronics, transparent electrodes, integrated structural and functional electronics, and stretchable electronics. As the requirements for electronic devices continue to increase, conductive circuits are also evolving towards finer (micrometer to submicrometer) designs, higher integration, higher reliability, and greater form factor adaptability. This presents greater challenges to circuit manufacturing technologies and processes. Increasingly smaller linewidths / spacings increase the probability of defects in conductive circuits during production, especially as future circuits will no longer be limited to planar surfaces and will require wiring and interconnection on three-dimensional surfaces. Therefore, improving the yield rate of conductive circuit production is difficult; often, even small defects can lead to the scrapping of the entire product, significantly increasing industrial production costs. For high-resolution microcircuits, the small feature size and low structural strength of the conductive circuits make them prone to damage during use, especially on flexible substrates. Repairing defects that occur during the production and use of conductive circuits is an effective way to improve product yield, reduce costs, and extend product lifespan.

[0004] Currently, the repair methods for conductive circuits can be categorized into traditional manual repair, laser-induced deposition, micro-arc welding / spark deposition, focused ion beam, and direct writing techniques, depending on the application and feature size. Traditional manual repair methods include wire bonding and mask-filled conductive adhesive. These methods have limitations such as low repair precision, reliance on operator experience for repair results, and difficulty in repairing fine circuits. Laser-induced deposition, on the other hand, uses localized laser heating to catalyze the deposition of metal compound solutions, enabling the repair of micro-circuits with high precision and strong adhesion. However, laser-induced deposition equipment is expensive, and the cost of repairing conductive lines is high, requiring specialized chemical solutions, thus limiting its application scenarios. Micro-arc welding / spark deposition uses instantaneous high pressure to generate micro-arcs, melting metal electrode materials onto the substrate. It is suitable for thick-film circuits, with extremely high bonding strength, and can repair more serious defects. However, the heat-affected zone is large, which may damage surrounding areas. Focused ion beams use ion beams in a vacuum environment to perform nanoscale "carving" and deposition, achieving repair precision down to the nanometer level. It is commonly used for internal chip repair, but the equipment is extremely expensive and slow, and is only used for ultra-high-value devices. Direct-write technology does not require a mask and is suitable for repairing various types of defects. It is low-cost and highly flexible, but the repair precision and resolution are limited, making it difficult to repair lines with linewidths below 10μm. Summary of the Invention

[0005] To address the aforementioned problems, this invention proposes a method and apparatus for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro-nano 3D printing. This invention can achieve high-resolution, high-precision, low-cost, and efficient repair of defects in micro-precision conductive circuits.

[0006] According to some embodiments, the present invention adopts the following technical solution: A method for repairing broken wires in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing includes the following steps: Step 1: Place the repair material in the printhead, fill the printhead with the repair conductive ink according to the requirements of the conductive circuit, initialize the repair equipment, and move the printhead to its original working position; Step 2: Place and secure the product containing the circuit to be repaired; Step 3: Accurately locate the area and position of the broken micro-circuit, clean the circuit and substrate at the defect location, and remove contaminants; Step 4: Inspect the line defects, determine the type of defect based on the defect detection results, and mark the line defects, including the starting location, geometry and size of the defects; Step 5: Based on the defect type, geometry, and size information of the broken line, determine the repair mode and the print head to be used; combine the starting position of the defect, set the starting coordinates, ending coordinates, and repair path of the broken line, as well as the repair process parameters, and generate the repair program; Step 6: According to the repair procedure, perform the repair printing to complete the defect repair; Step 7: Curing and sintering the repaired broken wires. The required sintering temperature and time are determined comprehensively based on the selected conductive paste and substrate. Step 8: Perform visual inspection on the repaired broken wire defects, then conduct a circuit continuity test and measure the resistance of the repaired circuit; Step 9: After the repaired line passes inspection, proceed to repair the next broken line defect until all defects are repaired, then cover with a protective film.

[0007] As an alternative implementation, the repair material includes conductive ink, conductive ink, conductive polymer and conductive paste, wherein the conductive paste includes liquid conductive paste of nano silver paste, nano copper paste, nano gold paste or conductive paste, and the viscosity range of the conductive paste is 10 mPa·s - 80000 mPa·s. Repair materials include one or more materials.

[0008] As an alternative implementation, in step 1, the requirements for the conductive lines include requirements for conductivity, line width, length, and thickness, wherein conductivity includes line resistance, sheet resistance, and the resistivity of the repair material. Equipment initialization includes starting the equipment, calibrating the printhead position, and matching the corresponding printing parameters according to the characteristics of different repair materials.

[0009] As an alternative implementation, in step 2, the product with the circuit to be repaired is placed on the repair equipment working platform, which is located below the print head, and the repair equipment working platform fixes the product by vacuum adsorption, mechanical clamping or electrostatic adsorption.

[0010] As an alternative implementation, in step 3, the broken wire defect area is identified by using an automatic optical inspection sensor or a machine vision positioning method. When using an automatic optical inspection sensor, the sensor is one of a laser rangefinder, a spectral confocal displacement sensor, and a capacitive displacement sensor. When using machine vision positioning methods, at least two sets of different magnification modes are included, where the low magnification mode is used for rough positioning of the defect location and the high magnification mode is used for precise positioning of the defect location coordinates.

[0011] As an alternative implementation, in step 3, cleaning the lines and substrate at the defect location includes cleaning and dust removal, burr removal, and removal of residual conductive line material. If the conductive lines of the product are covered with a protective film or protective material, the protective film / protective material also needs to be removed to expose the conductive line repair area.

[0012] As an alternative implementation, in step 4, the defect shape types include breakpoints, line segments, polylines, and irregular surfaces, and the line segments include constant line width segments and variable line width segments.

[0013] As an optional implementation, in step 5, the repair mode includes: non-contact droplet jetting mode, continuous conical jet printing mode, and micro-extrusion mode. The printing nozzle used for repair is a glass nozzle, ceramic nozzle, or stainless steel nozzle with an inner diameter ranging from 100nm to 200µm and a nozzle placement angle of 90-30°.

[0014] As an alternative implementation, in step 5, if the thickness of the repaired broken line cannot meet the requirements in a single scan, multiple printing depositions are used to increase the thickness or height of the repaired broken line.

[0015] As an optional implementation, in step 5, the process parameters include printhead printing height, printing speed, back pressure, and voltage; wherein the printing height range is 1-2000μm, the printing speed range is 0.1-100mm / s, the back pressure range is 1-500kPa, and the voltage range is 0-4000V.

[0016] As an alternative implementation, in step 7, the curing and sintering process is achieved using laser or infrared heating, with a heating temperature of 50-500℃ and a heating time of 5-30 minutes.

[0017] As an alternative implementation, step 8 involves measuring the resistance of a broken wire repair circuit. Alternatively, in step 8, a visual inspection is performed on the repaired broken wire defect. After step 6 is completed, the following step is performed to confirm that the repaired broken wire is visually acceptable, and then step 7 is executed. Alternatively, step 8 may include testing the bonding strength between the repaired circuit and the substrate, depending on actual requirements, either performed in this step or after all broken wire defects have been repaired.

[0018] A device for repairing broken micro-circuits in micro-nano 3D printed circuits based on electric field-driven micro / nano 3D printing includes a working platform, a three-axis motion module, a base, a frame, an electric field-driven micro / nano 3D printing repair nozzle, a defect location and identification module, a sintering module, a repair break inspection module, a repair nozzle calibration module, and a control module, wherein: The frame is equipped with a base, and the base is equipped with a work platform for placing the product to be repaired. A three-axis motion module is set above the work platform, and an electric field driven micro-nano 3D printing repair nozzle is set on the three-axis motion module. This nozzle is used to move the electric field driven micro-nano 3D printing repair nozzle above the work platform to the position to be repaired. The three-axis motion module is also equipped with a defect location and identification module, a sintering module, a repair broken line inspection module, and a repair nozzle calibration module; The electric field driven micro / nano 3D printing repair nozzle includes a repair nozzle I for performing a non-contact droplet jetting mode, a repair nozzle II for performing a continuous conical jetting mode, and a repair nozzle III for performing a micro-extrusion mode. The control module is used to control the actions of the three-axis motion module, the electric field driven micro / nano 3D printing repair nozzle, the defect location and identification module, the sintering module, the repair breakage inspection module, and the repair nozzle calibration module.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention combines the advantages of electric field-driven jet 3D printing technology, proposing a method and its application that achieves high-resolution, high-precision, efficient, and low-cost repair of conductive circuit defects. Its significant advantages include: (1) The electric field driven jet microscale 3D printing technology with single potential is used as a conductive circuit defect repair technology. This technology has the ability to manufacture micro-nano scale feature structures and can realize the repair of conductive circuit structure defects with feature size ≤1μm. The line width range of the repaired broken line is 200nm-200µm.

[0020] (2) The method provided by the present invention is applicable to a wide variety of printing materials with a wide range of viscosity; it can use low-viscosity conductive ink or high-viscosity conductive paste for defect repair, and can be adapted to a wide range of repair requirements.

[0021] (3) The method provided by this invention can repair various types of conductive lines, including breaks, segments, discontinuous multi-segment lines, and irregular shapes. By using micro-nano 3D printing technology and planning the repair path, defects of arbitrary shapes in a two-dimensional plane can be repaired.

[0022] (4) The method provided by this invention has fast repair efficiency and high yield for conductive circuits. The entire repair process is simple, the overall size of the defective area is small, the repair action is short, and the influence of uncontrollable factors can be effectively avoided.

[0023] (5) Low cost of repairing conductive lines. This method is an additive manufacturing method, which involves almost no waste of repair materials, does not require a mask, and has a material utilization rate of nearly 100%.

[0024] (6) The structure repaired by electric field driven jet deposition micro-nano 3D printing technology has high dimensional accuracy and good edge roughness, which can effectively reduce the impact of the repaired structure on the conductivity of conductive lines, especially the high requirements of signal transmission of communication lines.

[0025] (7) The micro-circuit line breakage repair of the present invention is applicable to: repair of data lines or scan lines of display panels such as PCB, touch panel, LCD, LED, OLED, QLED, etc.; repair of broken gate lines of thin film transistors; repair of broken ultra-fine circuits of high-precision PCB and semiconductor chip substrate. MEMS, conductor chip packaging, high-resolution metal mesh transparent electrodes, hybrid electronics, high-resolution anti-counterfeiting and other products and industries.

[0026] (8) The method provided by the present invention is green and environmentally friendly and does not involve the three wastes.

[0027] (9) The method provided by the present invention can effectively improve the production yield of enterprise products and reduce production costs.

[0028] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0029] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0030] Figure 1 This is a schematic diagram of a micro-precision conductive circuit repair process provided in one embodiment; Figure 2 This is a schematic diagram of a circuit break repair device provided in one embodiment, wherein 1 is a working platform, 2 is a three-axis motion module, 3 is a base, 4 is a frame, 5 is an electric field driven micro-nano 3D printing repair nozzle, 6 is a defect location and identification module, 7 is a sintering module, 8 is a repair break inspection module, 9 is a repair nozzle calibration module, and 10 is a control module.

[0031] Figure 3 This is a schematic diagram of a conductive circuit defect type and the repaired structure according to one embodiment; Figure 4 This is a schematic diagram illustrating the planning of irregular pattern defects and repair paths in one embodiment. Figure 5 This is a schematic diagram of the cross-section of a conductive circuit after repair using a single material and multiple materials, according to one embodiment. Figure 6 This is a physical demonstration of a large-size touchscreen conductive film edge line defect repair method, wherein the conductive line width is 20μm. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0033] It should be noted that the following detailed description is illustrative and intended to provide further explanation of the invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0034] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0035] Where there is no conflict, the embodiments and features described in this application may be combined with each other.

[0036] Example 1 As described in the background section, the following difficulties and shortcomings exist in the repair of conductive line defects: (1) It is difficult to repair high-resolution micron-level and submicron-level (line width ≤ 1μm) conductive line defects; (2) The repair cost is high and the cost-effectiveness is low. Existing defect repair equipment and materials are expensive; (3) The repair efficiency of conductive line defects is low; (4) The repair type and size are limited. Existing repair methods are mainly used for repairing planar conductive lines and small-area line structures. It is difficult to achieve the repair of surface circuit defects in three-dimensional / curved structures and the repair of defects in large-size (meter-level) conductive line structures.

[0037] Existing technologies are still insufficient to simultaneously meet the above requirements for repairing conductive line defects, and there is an urgent need to develop a new method for repairing high-resolution conductive line defects on planar / curved surfaces at high efficiency and low cost.

[0038] A conductive circuit repair method based on electric field-driven jet deposition micro / nano 3D printing, such as... Figure 1 As shown, it includes the following steps: Step 1: Place repair material (conductive ink, conductive paste, etc.) into the printhead to complete the repair equipment initialization. Load the conductive ink into the printhead according to the conductive circuit requirements. Initialize the repair equipment and move the printhead to its original working position.

[0039] Step 2: Place and secure the product whose circuitry needs repair. The product whose circuitry needs repair (PCB, touch panel, LCD, OLED, MicroLED, QLED, etc.) is placed on the repair equipment's work platform and secured to the platform using methods such as vacuum adsorption.

[0040] Step 3: Defect Location. Based on the results of the preliminary quality inspection, the area of ​​the initial defect (the approximate area has been marked) is identified. Further precise location of the broken micro-circuit wires is achieved using machine vision systems, displacement sensors, and other devices. Subsequently, lasers and compressed air are used to clean the circuitry and substrate at the defect location, removing particles, dirt, and other contaminants.

[0041] Step 4: Defect Type Detection, Identification, and Calibration. First, inspect the circuit defects and determine the defect type based on the detection results. Then, use methods such as visual calibration to calibrate the circuit defects, including defect coordinates (starting position), defect geometry and length, and defect depth.

[0042] Step 5: Line Repair Planning and Program Generation. First, based on the defect type, geometry, length, width, and depth of the broken line, determine the repair mode and the printhead to be used. Then, combining the geometric information of the defect (location coordinates, etc.), set the starting and ending coordinates of the broken line, the repair path, printing speed, printing height, required voltage, and back pressure (air pressure, etc.) and other repair process parameters. Finally, generate the repair program.

[0043] Step 6: According to the repair procedure, start the repair printing function module to complete the defect repair. According to the repair procedure, quickly move the print head from its working position to the repair initial position (safe height of the break point); then, according to the printing procedure, perform the break repair; finally, after the break repair is completed, raise the print head to the initial position and return it to its original position.

[0044] Step 7: Post-processing such as curing / sintering of the repaired circuit. The laser (or photon, infrared sintering, bottom heating, etc.) curing and sintering unit is moved to the location of the broken wire defect to cure and sinter the repaired wire. The required sintering temperature and time are determined comprehensively based on the selected conductive paste (nano silver paste, nano copper paste, conductive solder paste, etc.) and the substrate. After sintering is completed, the curing and sintering unit returns from the sintering station to its original position on the equipment.

[0045] Step 8: Repair and Inspection of Broken Wires. First, visually inspect the repaired broken wires; then, perform a circuit continuity test and measure the resistance of the repaired circuit; finally, test the adhesion between the repaired circuit and the substrate according to actual requirements.

[0046] Step 9: After the repaired circuit passes inspection, proceed with the repair procedure for the next broken wire defect.

[0047] Step 10: After all defects have been repaired, cover with a protective film.

[0048] In this embodiment, preferably, the conductive paste includes, but is not limited to, liquid conductive pastes (inks or inks, etc.) such as nano silver paste, nano copper paste, nano gold paste, and conductive grease. The viscosity range of the conductive paste is 10 mPa·s - 80000 mPa·s.

[0049] In this embodiment, preferably, the repair material in step 1 includes, but is not limited to, conductive ink and conductive paste (gold, silver, and copper, etc.), particle-free conductive ink, conductive polymer, etc., with a viscosity range of 10 mPa·s-300,000 mPa·s; specifically, such as Figure 5 As shown, repair materials may include one or more materials, and multiple repair materials may be involved when there are special requirements for the defect repair area (such as appearance color, surface roughness, circuit protection and anti-oxidation).

[0050] In this embodiment, as a preferred embodiment, the conductive circuit requirements in step 1 include, but are not limited to, conductivity, line width, length, and thickness, wherein conductivity includes line resistance, sheet resistance, and the resistivity of the repair material.

[0051] In this embodiment, preferably, step 1, device initialization, includes device startup and printhead position calibration.

[0052] In this embodiment, preferably, step 1 of initializing the device further includes matching the corresponding printing parameters according to the characteristics (viscosity, conductivity, curing shrinkage rate, etc.) of different repair materials (conductive materials).

[0053] In this embodiment, as a preferred embodiment, the product fixing method of the repair platform in step 2 includes, but is not limited to, vacuum adsorption, mechanical clamping, electrostatic adsorption, etc.

[0054] In this embodiment, preferably, step 3 involves using automated optical inspection methods, machine vision, or other techniques to detect and locate the broken wire defect area. Displacement sensors include, but are not limited to, laser rangefinders, spectral confocal displacement sensors, and capacitive displacement sensors.

[0055] In this embodiment, preferably, step 3, machine vision, includes at least two sets of different magnification modes, wherein the low magnification mode is used for rough positioning of the defect location, and the high magnification mode is used for precise positioning of the defect location coordinates, with a positioning accuracy of not less than ±2μm.

[0056] In this embodiment, preferably, the cleaning of the circuit and substrate at the defect location in step 3 includes, but is not limited to, cleaning (dust removal), burr removal, and removal of residual conductive circuit material. Some products have protective films or materials (resin, etc.) covering the conductive circuits, requiring the removal of these films / materials to expose the conductive circuit repair area. Cleaning and dust removal can be performed using compressed air; material removal can be performed using a laser (ultraviolet laser, etc.).

[0057] In this embodiment, preferably, the defect shape type in step 4 includes, but is not limited to, breakpoints, line segments, polylines, and irregular surfaces, and the line segments include constant line width segments and variable line width segments.

[0058] In this embodiment, preferably, steps 4 and 5 involve the electric field-driven micro / nano 3D printing repair nozzle operating in three modes: non-contact droplet jetting mode; continuous conical jet printing mode; and micro-extrusion mode. The nozzles used include glass nozzles, ceramic nozzles, and stainless steel nozzles, with an inner diameter of 100nm-200µm. The nozzle tilt angle is 90-30°, with 45° being preferred.

[0059] In this embodiment, preferably, if the thickness of the repaired broken line cannot be met by a single scan in steps 4 and 5, multiple printing depositions can be used to increase the thickness (height) of the repaired broken line.

[0060] In this embodiment, preferably, the process parameters in step 5 include, but are not limited to, print head height, print speed, back pressure, and voltage; wherein, the print height range is 1-2000μm, the print speed range is 0.1-100mm / s, the back pressure range is 1-500kPa, and the voltage range is 0-4000V.

[0061] In this embodiment, as a preferred embodiment, the curing and sintering process in step 7 includes, but is not limited to, laser, infrared heating, etc., with a heating temperature of 50-500℃ and a heating time of 5-30 minutes.

[0062] In this embodiment, preferably, step 8 uses resistance measurement of the broken wire repair line, which can effectively monitor the resistance value of the repair line and ensure the quality and yield of the repair.

[0063] In this embodiment, preferably, step 8, which involves visually inspecting the repaired broken wire defect, can be performed after step 6 is completed. After confirming that the repaired broken wire is visually acceptable, step 7 is then executed.

[0064] In this embodiment, as a preferred option, step 8, testing the resistance of the repaired circuit and the bonding strength between the repaired circuit and the substrate, is optional. Depending on the actual engineering requirements, it can be performed in this step, or it can be performed separately after all broken wire defects have been repaired.

[0065] This invention employs electric field-driven jet deposition micro / nano 3D printing technology. The printing nozzle is connected to a high-voltage power supply. By utilizing the "diameter reduction" effect of the electrohydrodynamic Taylor cone, micro / nano-scale feature structures can be manufactured. Under the action of electrostatic field tension (changing the traditional pressure drive to tension drive), high-viscosity materials can be printed with high resolution. It can repair conductive circuit defects below 1μm, and is especially suitable for repairing three-dimensional / curved conductive circuits and conductive circuit defects in large-size (meter-level) substrates.

[0066] Example 2 Repairing the edge lines of the conductive film on a 100-inch touchscreen. Conductive circuit type: copper conductor; line width: 20μm; line spacing: 15μm; thickness: 1μm.

[0067] Defect type: Conductive circuit open circuit, with a break length of 300μm, such as... Figure 3 As shown.

[0068] The specific repair process is as follows: Step 1: Place the repair material in the printhead and complete the repair equipment initialization. Load the repair material into the printhead according to the conductive circuit requirements. The repair equipment is initialized, and the printhead moves back to its original working position.

[0069] The conductive film edges of the touchscreen are mainly used for low-frequency signal transmission. The spacing between the conductive lines is small, requiring high dimensional accuracy and edge roughness. Conductive nano-silver paste with a viscosity of approximately 30,000 mPa·s is selected as the repair material. The repair material is placed in the printing equipment, the equipment is initialized, the printhead position coordinates are calibrated, and the printhead is moved to the designated position in preparation for repairing the defect.

[0070] Step 2: Place and secure the product for the circuit to be repaired.

[0071] Lay the conductive film of the touch screen flat on the repair equipment platform, place the defective area within the effective repair area of ​​the platform, and turn on vacuum adsorption to adsorb and fix the conductive film on the repair platform.

[0072] Step 3: Defect location.

[0073] Machine vision is used to locate the broken line in the conductive film. First, a low-magnification electron microscope is used to scan the edge line to find the approximate area of ​​the defect. Then, a high-magnification electron microscope is used to precisely locate the defect. The height of the upper surface of the film is measured using a displacement sensor. High-purity compressed gas is used to clean the local circuit at the defect location to remove particles, dirt, and other contaminants.

[0074] Step 4: Defect type detection, identification, and calibration.

[0075] The defect type is a broken line segment, such as... Figure 4 As shown, the line width is 20μm and the break length is 300μm. A high-magnification electron microscope is used to calibrate the repair start and end points. The start and end points should be centered at the endpoints of the normal conductive line and cover a portion of the normal conductive line. The coordinates of the defect location are calibrated. Based on the defect shape, the repair path is a straight line segment connecting the start and end points, and the repair cycle is set to 1.

[0076] Step 5: Line repair planning and program generation.

[0077] The micro / nano 3D printing process employs an electric field-driven continuous conical jet mode. The nozzle parameters are a 40μm diameter glass nozzle. The equipment's defect repair parameters are set as follows: printing height 60μm, repair speed 0.2mm / s, no-load speed 50mm / s, feed back pressure 200kPa, and nozzle voltage 500V. Upon program startup, the equipment repairs the defective areas along the conductive film edges according to the pre-defined repair path.

[0078] Step 6: According to the repair procedure, start the repair printing function module to complete the defect repair. According to the repair procedure, quickly move the print head from its working position to the repair initial position (safe height of the break point); then, according to the printing procedure, perform the break repair; finally, after the break repair is completed, raise the print head to the initial position and return it to its original position.

[0079] Step 7: Post-treatment such as curing / sintering of the repaired circuit.

[0080] The infrared curing unit is moved to the location of the broken wire defect to cure and sinter the repaired wire. The heating parameters are: heating temperature 80℃, heating time 5 minutes. After sintering is completed, the curing and sintering unit returns from the sintering station to its original position on the equipment.

[0081] Step 8: Repair and inspect broken wires.

[0082] First, a visual inspection is performed on the repaired broken wire defects; then, a circuit continuity test is conducted, and the resistance of the repaired circuit is measured; finally, according to actual requirements, the bonding strength between the repaired circuit and the substrate is tested.

[0083] Step 9: After the repaired circuit passes inspection, proceed with the next repair procedure for the broken wire defect, such as... Figure 6 As shown.

[0084] The circuit repair was deemed satisfactory upon inspection. There were two breaks in the diaphragm, and the next circuit break repair procedure will be executed.

[0085] Step 10: After all defects have been repaired, cover with a protective film.

[0086] Example 3 A repair device for the method provided in Embodiment 1 or Embodiment 2 includes a working platform 1, a three-axis motion module 2, a base 3, a frame 4, an electric field-driven micro / nano 3D printing repair nozzle 5, a defect location and identification module 6, a sintering module 7, a repair line breakage inspection module 8, a repair nozzle calibration module 9, and a control module 10, wherein: A base 3 is provided on the frame 4, and a work platform 1 for placing the product to be repaired is provided on the base 3. A three-axis motion module 2 is provided above the work platform 1, and an electric field driven micro-nano 3D printing repair nozzle 5 is provided on the three-axis motion module 2 to drive the electric field driven micro-nano 3D printing repair nozzle 5 to move above the work platform 1 to the position to be repaired. The three-axis motion module 2 is also equipped with a defect location and identification module 6, a sintering module 7, a repair and breakage inspection module 8, and a repair nozzle calibration module 9. The electric field driven micro / nano 3D printing repair nozzle 5 includes a repair nozzle I for performing a non-contact droplet jetting mode, a repair nozzle II for performing a continuous conical jetting mode, and a repair nozzle III for performing a micro-extrusion mode. The control module 10 is used to control the operation of the three-axis motion module 2, the electric field driven micro-nano 3D printing repair nozzle 5, the defect location and identification module 6, the sintering module 7, the repair broken line inspection module 8, and the repair nozzle calibration module 9.

[0087] All of the above components can be selected from existing devices / parts, and will not be elaborated here.

[0088] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made by those skilled in the art without creative effort within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing, characterized in that, Includes the following steps: Step 1: Place the repair material in the printhead, fill the printhead with the repair conductive ink according to the requirements of the conductive circuit, initialize the repair equipment, and move the printhead to its original working position; Step 2: Place and secure the product containing the circuit to be repaired; Step 3: Accurately locate the area and position of the broken micro-circuit, clean the circuit and substrate at the defect location, and remove contaminants; Step 4: Inspect the line defects, determine the type of defect based on the defect detection results, and mark the line defects, including the starting location, geometry and size of the defects; Step 5: Based on the defect type, geometry, and size of the broken line, determine the repair mode and the printhead to be used; Based on the starting location of the defect, the starting coordinates, ending coordinates, and repair path of the broken line are set, along with the repair process parameters, to generate a repair program; Step 6: According to the repair procedure, perform the repair printing to complete the defect repair; Step 7: Curing and sintering the repaired broken wires. The required sintering temperature and time are determined comprehensively based on the selected conductive paste and substrate. Step 8: Perform visual inspection on the repaired broken wire defects, then conduct a circuit continuity test and measure the resistance of the repaired circuit; Step 9: After the repaired line passes inspection, proceed to repair the next broken line defect until all defects are repaired, then cover with a protective film.

2. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, The repair materials include conductive ink, conductive ink, conductive polymer and conductive paste. The conductive paste includes liquid conductive paste of nano silver paste, nano copper paste, nano gold paste or conductive paste. The viscosity range of the conductive paste is 10 mPa·s - 80000 mPa·s. Repair materials include one or more materials; Alternatively, in step 1, the requirements for the conductive circuit include requirements for conductivity, line width, length, and thickness, wherein conductivity includes line resistance, sheet resistance, and the resistivity of the repair material; Equipment initialization includes starting the equipment, calibrating the printhead position, and matching the corresponding printing parameters according to the characteristics of different repair materials.

3. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, In step 2, the product with the circuit to be repaired is placed on the repair equipment working platform, which is located below the print head. The repair equipment working platform fixes the product by vacuum adsorption, mechanical clamping, or electrostatic adsorption.

4. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, In step 3, the broken wire defect area is identified by using an automatic optical detection sensor or a machine vision positioning method. When using an automatic optical detection sensor, the sensor is one of a laser rangefinder, a spectral confocal displacement sensor, and a capacitive displacement sensor. When using machine vision positioning methods, at least two sets of different magnification modes are included, where the low magnification mode is used for coarse positioning of the defect location and the high magnification mode is used for precise positioning of the defect location coordinates. Alternatively, in step 3, cleaning the lines and substrate at the defect location includes cleaning and dust removal, burr removal, and removal of residual conductive line material. If the conductive lines of the product are covered with a protective film or protective material, the protective film / protective material also needs to be removed to expose the conductive line repair area.

5. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, In step 4, the defect shape types include breakpoints, line segments, polylines, and irregular surfaces. Line segments include constant line width segments and variable line width segments.

6. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, In step 5, the repair modes include: non-contact droplet jetting mode, continuous cone jet printing mode and micro-extrusion mode. The printing nozzles used for repair are glass nozzles, ceramic nozzles or stainless steel nozzles, with an inner diameter range of 100nm-200µm and a nozzle placement angle of 90-30°. Alternatively, in step 5, if the thickness of the repaired broken line cannot meet the requirements in a single scan, multiple printing depositions are used to increase the thickness or height of the repaired broken line. Alternatively, in step 5, the process parameters include printhead printing height, printing speed, back pressure, and voltage; wherein the printing height range is 1-2000μm, the printing speed range is 0.1-100mm / s, the back pressure range is 1-500kPa, and the voltage range is 0-4000V.

7. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, In step 7, the curing and sintering process is achieved using laser or infrared heating, with a heating temperature of 50-500℃ and a heating time of 5-30 minutes.

8. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, In step 8, the resistance measurement of the broken wire repair line is used. Alternatively, in step 8, a visual inspection is performed on the repaired broken wire defect. After step 6 is completed, the following step is performed to confirm that the repaired broken wire is visually acceptable, and then step 7 is executed.

9. The method for repairing broken lines in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing as described in claim 1, characterized in that, Step 8 also includes testing the bonding strength between the repaired circuit and the substrate according to actual requirements. This step can be performed in this step or after all broken wire defects have been repaired.

10. A device for repairing broken wires in micro-nano 3D printed micro-circuits based on electric field-driven micro / nano 3D printing, characterized in that, It includes a work platform, a three-axis motion module, a base, a frame, an electric field-driven micro / nano 3D printing repair nozzle, a defect location and identification module, a sintering module, a repair line breakage inspection module, a repair nozzle calibration module, and a control module, among which: The frame is equipped with a base, and the base is equipped with a work platform for placing the product to be repaired. A three-axis motion module is set above the work platform, and an electric field driven micro-nano 3D printing repair nozzle is set on the three-axis motion module. This nozzle is used to move the electric field driven micro-nano 3D printing repair nozzle above the work platform to the position to be repaired. The three-axis motion module is also equipped with a defect location and identification module, a sintering module, a repair broken line inspection module, and a repair nozzle calibration module; The electric field driven micro / nano 3D printing repair nozzle includes a repair nozzle I for performing a non-contact droplet jetting mode, a repair nozzle II for performing a continuous conical jetting mode, and a repair nozzle III for performing a micro-extrusion mode. The control module is used to control the actions of the three-axis motion module, the electric field driven micro / nano 3D printing repair nozzle, the defect location and identification module, the sintering module, the repair breakage inspection module, and the repair nozzle calibration module.

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