Double-sided multi-layer PCB electroplating equipment and process

Abstract

The double-sided multi-layer PCB electroplating equipment comprises two side strip frames which are parallel to each other, and further comprises a plurality of electrolytic bath structures and a plurality of non-electrified liquid tanks, the angle of the PCB can be changed through the air cylinder, when the PCB is lifted to leave liquid, the PCB is inclined, so that the liquid starts to flow down from one corner, then the PCB is changed into a vertical state, the amount of the liquid stained on the surface of the PCB is reduced, the liquid can be emptied more orderly through the path, on the basis, the two sides of the PCB can be shielded by the fixed flow guide baffle and the movable flow guide baffle, and under the action of gravity, the PCB can be separated from the liquid. Liquid flows downwards, the downward flowing path of the liquid is optimized by changing the inclined mode into the vertical mode, and due to the fact that the liquid can be preferentially attached to the continuous solid surface which is firstly in contact with the liquid and reaches the surfaces of the adjacent fixed flow guide baffle and the movable flow guide baffle under the capillary action, the flowing displacement of the liquid on the PCB is improved, and the flowing speed of the PCB is increased. Therefore, the influence of the downward flowing liquid on the surface of the PCB is relieved, and the electroplating uniformity is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB electroplating technology, specifically to a double-sided multilayer PCB electroplating equipment and process. Background Technology

[0002] A PCB, also called a printed circuit board or printed circuit board, is a multilayer PCB, which refers to a PCB with two or more layers. It consists of several insulating substrates with connecting wires and solder pads for assembling and soldering electronic components. It serves both to conduct the circuitry between layers and to insulate the layers from each other. The connection between different layers of a multilayer PCB is achieved through electroplating. Before electroplating, multilayer PCBs undergo drilling, followed by electroplating. The main objectives of electroplating are hole metallization and circuit thickening. Hole metallization refers to depositing a layer of conductive metal (usually copper) on the insulating hole walls (especially through-holes and blind / buried vias) to achieve electrical connection between different layers. Circuit thickening refers to increasing the copper thickness on the fine lines formed after etching to meet current carrying capacity requirements. Currently, double-sided electroplating of multilayer PCBs mainly uses vertical hanging... Electroplating utilizes a gantry conveyor structure to carry PCB boards, immersing them in different tanks for different processes. For example, Chinese invention application CN114836807A discloses a PCB board electroplating device, relating to the field of PCB board electroplating technology. To address the problem of low efficiency, it specifically includes a comprehensive tank, which is divided into a pre-loading section, an electroplating tank, and a unloading section by internal partitions. The top of the comprehensive tank is connected to a gantry frame via a linear sliding assembly, and the bottom of the gantry frame is connected to a lifting plate via a lifting assembly. The bottom of the lifting plate is equipped with a suction male head. Several sets of modular support parts for carrying PCB boards are placed at the top of the comprehensive tank, and the top of the modular support parts is equipped with a mating female head that mates with the suction male head. However, this vertical hanging plating method has the following drawbacks: In vertical rack plating, as the board is slowly lifted from the plating tank, the plating solution adhering to the board surface and hole walls flows downwards due to gravity. This causes microscopic inhomogeneities. On the board surface pattern, the downward flowing liquid causes small but crucial changes in current density and additive concentration in local areas, resulting in subtle, imperceptible thickness differences in the deposited copper layer. Currently, the main solution to this problem is the advanced vertical continuous plating method, namely VCP plating. However, the cost is high, and many mid-range PCB products cannot afford it, so vertical rack plating is still required. During plating, the anode in the tank is responsible for generating copper ions, but the anode position is fixed, and the anode dissolution is not uniform enough, resulting in uneven current distribution on the cathode surface, which affects the plating quality.

[0003] To address these issues, we propose a double-sided multilayer PCB electroplating equipment and process. Summary of the Invention

[0004] The purpose of this invention is to provide a double-sided multilayer PCB board electroplating equipment and process to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a double-sided multilayer PCB board electroplating equipment, comprising two parallel side frames, multiple electrolytic cell structures and multiple non-electrified liquid tanks, wherein the multiple electrolytic cell structures and multiple non-electrified liquid tanks are arranged between the two side frames, a transverse mounting mechanism is horizontally slidably arranged on the top surface of the two side frames, the transverse mounting mechanism includes a crossbeam, two adjusting blocks are horizontally slidably arranged on the side wall of the crossbeam, two lifting pillars are vertically slidably arranged on the side wall of the two adjusting blocks, and a bottom frame is fixedly connected to the bottom end of the two lifting pillars. Multiple carrier plates are evenly arranged on the bottom surface of the bottom frame, and a hanging assembly is arranged on the bottom surface of each carrier plate. A rotating block is fixedly connected to the top surface of one end of the carrier plate, and a top block is fixedly connected to the top surface of the other end of the carrier plate. An opening is opened on the bottom frame, and multiple rotating seats are rotatably connected to the opening above the multiple carrier plates. A cylinder is fixedly sleeved on the rotating seat, the top end of the rotating block is rotatably connected to the opening, and the output end of the cylinder is rotatably connected to the top block. The mounting assembly includes a top plate, with multiple fixed clamps evenly fixed to one side of the bottom surface of the top plate. The multiple fixed clamps are fixed to the top sidewall of the fixed flow guide baffle. Multiple upper rotating openings are opened on the side of the top plate away from the fixed flow guide baffle. Multiple U-shaped brackets are rotatably mounted on the multiple upper rotating openings. The bottom ends of the multiple U-shaped brackets are fixed to the top sidewall of the moving flow guide baffle. A first baffle is fixed to the upper part of the sidewall of the fixed flow guide baffle, and a second baffle is fixed to the upper part of the sidewall of the moving flow guide baffle.

[0006] Preferably, the electrolytic cell structure includes a cell body, two anode carrier plates are horizontally slidably disposed at both ends of the cell body, multiple anode units are fixedly connected to the anode carrier plates near the middle of the cell body, an electrical interface is fixedly connected to the outside of the cell body, multiple second guide rods are fixedly connected to both sides of the inner end of the cell body, and multiple second guide holes are opened on the anode carrier plates corresponding to the positions of the multiple second guide rods, and the second guide rods are horizontally slidably sleeved into the second guide holes.

[0007] Preferably, the bottom sidewall of the top strip plate has multiple downward rotating openings corresponding to multiple fixed clamping plate positions. These downward rotating openings are rotatably connected to the top of the movable clamping plate. A T-shaped block is fixedly installed at the center of the top surface of the top strip plate. Two T-shaped positioning blocks are fixedly installed on both sides of the top surface of the top strip plate. A T-shaped mounting opening with screw holes is opened in the middle of the sidewall of the carrier plate. Two T-shaped positioning openings are opened on both sides of the sidewall of the carrier plate. The bottom ends of both the T-shaped mounting opening with screw holes and the T-shaped positioning openings are open structures. The mounting T-shaped block is inserted into the T-shaped mounting opening with screw holes. The T-shaped positioning... The T-shaped mounting block has a T-shaped positioning port. Multiple through holes are horizontally opened on the T-shaped mounting block. Multiple mounting bolts are threaded to the side wall of the T-shaped mounting port with screw holes. The mounting bolts are inserted into the through holes. A side circular opening is opened on the side of the fixed clamping plate near the movable clamping plate. A conductive contact is horizontally slidably sleeved on the side circular opening. An inner opening is opened inside the fixed clamping plate. The inner opening is horizontally slidably connected to the limiting circular plate. The end of the conductive contact is fixedly connected to the limiting circular plate. A spring is fixedly connected between the end of the inner opening and the side wall of the limiting circular plate.

[0008] Preferably, both the fixed and movable guide baffles have V-shaped guide microgrooves on their adjacent sides. The top plate is horizontally rotatably fitted with a lower long shaft corresponding to multiple lower rotating openings. The lower long shaft passes through multiple lower rotating openings. The top of the movable clamp is fixedly fitted onto the lower rotating opening. A third servo reduction motor is fixedly embedded at one end of the top plate. A first active synchronous pulley is fixedly fitted onto the shaft end of the third servo reduction motor. A first driven synchronous pulley is fixedly fitted onto the end of the lower long shaft. The first active synchronous pulley and the first driven synchronous pulley... A first synchronous belt is fitted onto the moving synchronous pulley. The upper long shaft is horizontally rotatably fitted onto the top bar plate corresponding to multiple upper rotating holes. The upper long shaft passes through multiple upper rotating holes. The top of the U-shaped bracket is fixedly fitted onto the upper long shaft. A fourth servo reduction motor is fixedly embedded at the end of the top bar plate away from the third servo reduction motor. The shaft end of the fourth servo reduction motor is fixedly fitted onto the second driving synchronous pulley. The end of the upper long shaft is fixedly fitted onto the second driven synchronous pulley. A second synchronous belt is fitted onto the second driving synchronous pulley and the second driven synchronous pulley.

[0009] Preferably, the sidewall of the tank is fixedly connected to a side bar compartment, and two sliding grooves are formed on the sidewalls at both ends of the side bar compartment. The top sidewall of the anode carrier plate is located outside the tank and is fixedly connected to a sliding plate. A sliding opening is formed on the sidewall of the sliding plate, and the side bar compartment is horizontally slidably fitted through the sliding opening. A slider is fixedly connected to the sidewall of the sliding opening, and the slider is horizontally slidably connected to the sliding groove. A second lead screw is horizontally rotatably connected inside the sliding groove. A second threaded sleeve is fixedly connected to the slider, and the second lead screw is threadedly connected to the second threaded sleeve. Two horizontal shafts are horizontally rotatably fitted inside the side bar compartment. One end of the two horizontal shafts is rotatably connected to each other, and the other ends of the two horizontal shafts are respectively fixedly connected to the ends of two second lead screws. The center of the side bar compartment is... A rotatable short shaft is connected, with one end of the short shaft fixedly sleeved with a large driving gear and the other end of the short shaft fixedly sleeved with a small driving gear. A driven large gear is fixedly sleeved at the end of the horizontal shaft near the large driving gear, and a driven small gear is fixedly sleeved at the end of the horizontal shaft near the small driving gear. A rotating small gear is rotatably connected inside the side bar compartment, located between the small driving gear and the driven small gear. The large driving gear meshes with the driven large gear, the small driving gear meshes with the rotating small gear, and the rotating small gear meshes with the driven small gear. A fifth servo reduction motor is fixedly connected to one end of the side bar compartment, and the shaft end of the fifth servo reduction motor is fixedly connected to the end of one of the second lead screws.

[0010] Preferably, the bottom surface of the side frame is fixed to a side support frame, the top surface of the side frame is fixed to two parallel support strips, the top surface of the support strips is fixed to an electrically conductive slide rail, the top surfaces of the two support strips are horizontally slidably provided with a trolley structure, and one of the support strips has a long toothed plate fixed to its side wall.

[0011] Preferably, the trolley structure includes a sliding platform, with multiple conductive slide blocks fixedly connected to both sides of the bottom surface of the sliding platform. The conductive slide blocks are slidably connected to an energized slide rail. A top support block is fixedly connected to the top surface of the sliding platform. The bottom surface of the crossbeam end is fixedly connected to the top surface of the top support block. A sixth servo reduction motor is fixedly sleeved on one side of the sliding platform. A traveling gear is fixedly connected to the shaft end of the sixth servo reduction motor. The traveling gear meshes with a long toothed plate. A guide gear is rotatably connected to the bottom surface of the sliding platform. The guide gear meshes with the long toothed plate.

[0012] Preferably, two guide rails are fixed to the side wall of the cross frame, two guide seats are fixed to the side wall of the adjusting block, the guide seats are horizontally slidably connected to the guide rails, two end blocks are fixed to the side walls at both ends of the cross frame, a drive shaft is rotatably connected between the two end blocks, two first lead screws are fixedly sleeved on the drive shaft corresponding to the positions of the two adjusting blocks, a first threaded sleeve is fixed to the side wall of the adjusting block, the first lead screw is threadedly connected to the first threaded sleeve, a first servo reduction motor is fixed to one end of the cross frame, and the shaft end of the first servo reduction motor is fixed to the end of the drive shaft.

[0013] Preferably, the sidewall of the adjusting block has a sliding opening, the lifting column is vertically slidably fitted into the sliding opening, four short blocks are fixedly connected to the top and bottom sidewalls of the lifting column, two first guide rods are vertically fixed between the four short blocks, a first guide hole is vertically opened on the adjusting block corresponding to the position of the first guide rod, the first guide rod is vertically slidably fitted into the first guide hole, a rack is fixedly connected to the side of the lifting column near the adjusting block, a drive gear is rotatably connected inside the adjusting block, the drive gear meshes with the rack, a second servo reduction motor is fixedly connected to the sidewall of the adjusting block, and the shaft end of the second servo reduction motor is fixedly connected to the shaft of the drive gear.

[0014] This invention also provides an electroplating process for a double-sided multilayer PCB board electroplating equipment, comprising the following steps: Step 1: Clamping the PCB: Clamp the pre-drilled multilayer PCB onto the mounting assembly. During clamping, rotate the movable baffle to a horizontal position, place the top of the multilayer PCB into the fixed clamping position, and rotate the movable clamping plate to clamp the multilayer PCB. Then, rotate the movable baffle to a vertical position. Step Two: Chemical Copper Plating Step ① Degreasing and Cleaning: The transverse mounting mechanism moves the PCB board, immersing it in a non-electric liquid tank. This non-electric liquid tank contains an alkaline or acidic degreasing agent, achieving cleaning through chemical erosion and surfactant action. Step ② First water wash: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank, which contains deionized water; Step ③ Micro-etching and roughening: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank. This non-energized liquid tank contains sodium persulfate solution, which slightly corrodes the surface of the outer copper foil, making it micro-roughened. This increases the mechanical bonding force and bonding area between the subsequent chemical copper layer and the substrate copper foil, preventing the copper layer from falling off. Step 4: Secondary water washing: The transverse mounting mechanism moves the PCB board and immerses it in the next non-electric liquid tank, which contains deionized water. Step 5: Pre-immersion: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank. This non-energized liquid tank contains a solution with a chemical environment similar to the activation solution in the next step to prevent concentration imbalance when directly entering the activation step. Step 6 Activation: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank. This non-energized liquid tank contains an activation solution containing colloidal palladium, which can adsorb a layer of catalytically active metallic palladium colloidal particles on the insulating hole wall substrate. These particles are the "seeds" or "catalysts" for the subsequent copper plating reaction. Step ⑦ Three-stage water washing: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank, which contains deionized water, to wash away excess and unadsorbed palladium colloids; Step 8 Acceleration: The transverse mounting mechanism moves the PCB board, immersing it in the next non-energized liquid tank, which contains a fluoroboric acid solution. This removes the tin ion shell surrounding the palladium core, exposing the highly catalytically active palladium metal core. Step 9: Four water washes: The transverse mounting mechanism moves the PCB board, immersing it in the next non-electric liquid tank, which contains deionized water; Step 10: Copper Plating: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank, which contains an alkaline formaldehyde solution. Under the catalysis of palladium, the formaldehyde reduces copper ions to metallic copper and is oxidized at the same time. Through the autocatalytic redox reaction, a continuous layer of metallic copper is deposited on the activated hole walls and the entire board surface. Step 11: Five water washes: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank, which contains deionized water. After cleaning, the board completes the hole metallization. Step 3: Full-board copper plating: Step ① Acid Immersion: The transverse mounting mechanism moves the PCB board and immerses it in the next non-energized liquid tank. This non-energized liquid tank contains 10% dilute sulfuric acid to remove the extremely thin oxide layer formed on the surface of the electroless copper layer in the air and to provide an acidic environment to prevent copper surface oxidation and ensure the adhesion of the plating layer. Step ② Copper plating: The transverse mounting mechanism moves the PCB board, immersing it in the electrolytic tank structure. The electrolytic tank structure contains an acidic copper sulfate system, which includes copper sulfate, sulfuric acid, chloride ions, and organic additives. The PCB board is energized, serving as the cathode, and the anode unit is a phosphor bronze ball, providing copper ions. Step 3: Multi-stage water washing: The transverse mounting mechanism moves the PCB board and immerses it in multiple non-electric liquid tanks in sequence. The non-electric liquid tanks contain deionized water. The PCB board is washed multiple times to complete the entire electroplating process. The finished PCB board is then removed from the mounting assembly.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention uses a cylinder to change the angle of the PCB board, tilting it as it is lifted away from the liquid. This allows the liquid to flow down from one corner first, and then the PCB board returns to a vertical position, reducing the amount of liquid adhering to its surface. This path allows for more orderly liquid drainage. Based on this, after the mounting assembly hangs the PCB board, fixed and movable flow guide baffles are placed on both sides of the PCB board to block the flow. When the PCB board is lifted away from the liquid, the liquid flows downward under gravity. The tilting and then vertical adjustment optimizes the downward flow path, as the liquid preferentially adheres to the first continuous contact point. On a solid surface, the shortest flow path for the liquid flowing out of the PCB board is a very short lateral movement. Under capillary action, it reaches the surfaces of adjacent fixed and moving guide baffles. This improves the displacement of the liquid flowing on the PCB board, thereby mitigating the impact of the downstream liquid on the PCB board surface and improving electroplating uniformity. During electroplating, the two anode carriers in the electrolytic cell structure slowly reciprocate along a shorter path. This disperses the current density distribution on the anode surface, promotes uniform dissolution of the anode unit, and improves the current distribution uniformity on the cathode surface. Attached Figure Description

[0016] Figure 1 These are schematic diagrams of the main body structure in the first and second embodiments of the present invention; Figure 2 These are schematic diagrams of the transverse mounting mechanism in the first and second embodiments of the present invention; Figure 3 These are schematic diagrams of the bottom frame structure in the first and second embodiments of the present invention; Figure 4 This is a schematic diagram of one side of the hanging assembly in the first and second embodiments of the present invention; Figure 5 This is a schematic diagram of the structure on the other side of the hanging assembly in the second embodiment of the present invention; Figure 6 This is a schematic diagram of the electrolytic cell structure in the second embodiment of the present invention; Figure 7 This is a schematic diagram of the side bar compartment structure in the second embodiment of the present invention; Figure 8 This is a schematic diagram of the trolley structure in the second embodiment of the present invention; Figure 9 This is a schematic diagram of the cross-sectional structure at the adjusting block in the second embodiment of the present invention; Figure 10 This is a cross-sectional view of the fixed clamping plate in the second embodiment of the present invention.

[0017] In the diagram: 1. Side frame; 2. Lateral transport mechanism; 3. Electrolytic cell structure; 4. Non-electrified liquid tank; 5. Trolley structure; 11. Support bolster; 12. Electrified slide rail; 13. Long toothed plate; 14. Side support frame; 21. Cross frame; 22. Adjusting block; 23. Lifting support column; 24. Bottom frame; 25. Carrier plate; 26. Hanging assembly; 27. Through port; 28. Rotating block; 29. ​​Top block; 210. Rotary seat; 211. Cylinder; 212. T-shaped mounting port with screw holes; 213. T-shaped positioning port; 214. Mounting bolt; 215. Guide rail; 216. Guide seat; 217. End block; 218. 219. Drive shaft; 220. First lead screw; 221. First threaded sleeve; 222. Side sliding port; 223. Short block; 224. First guide rod; 225. First servo geared motor; 226. Drive gear; 227. Rack; 228. Second servo geared motor; 261. Top strip plate; 262. Fixed clamping plate; 263. Lower rotating port; 264. Movable clamping plate; 265. Fixed guide baffle; 266. First baffle; 267. Upper rotating port; 268. U-shaped bracket; 269. Moving guide baffle; 2610. Second baffle; 2611. Mounting T-block; 2612. T-shaped positioning block; 2613, through hole; 2614, third servo geared motor; 2615, first active synchronous pulley; 2616, lower long shaft; 2617, first driven synchronous pulley; 2618, first synchronous belt; 2619, fourth servo geared motor; 2620, second active synchronous pulley; 2621, upper long shaft; 2622, second driven synchronous pulley; 2623, second synchronous belt; 2624, side circular opening; 2625, conductive contact; 2626, inner opening; 2627, limiting circular plate; 2628, spring; 31, groove; 32, anode carrier plate; 33, anode unit; 34. Side bar compartment; 35. Sliding plate; 36. Slide groove; 37. Slide opening; 38. Slider; 39. Second lead screw; 310. Second threaded sleeve; 311. Horizontal shaft; 312. Short shaft; 313. Driving large gear; 314. Driving small gear; 315. Driven large gear; 316. Driven small gear; 317. Intermediate small gear; 318. Fifth servo geared motor; 319. Second guide rod; 320. Second guide hole; 321. Power interface; 51. Sliding table; 52. Top support block; 53. Conductive slide block; 54. Sixth servo geared motor; 55. Traveling gear; 56. Guide gear. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: Please see Figure 1-4 This invention provides a technical solution: a double-sided multilayer PCB board electroplating equipment, including two parallel side racks 1, multiple electrolytic cell structures 3 and multiple non-energized liquid tanks 4, which are positioned between the two side racks 1. A transverse mounting mechanism 2 is horizontally slidably mounted on the top surface of the two side racks 1. The transverse mounting mechanism 2 includes a crossbeam 21, two adjusting blocks 22 are horizontally slidably mounted on the side wall of the crossbeam 21, and two lifting pillars 23 are vertically slidably mounted on the side wall of the two adjusting blocks 22. The bottom ends of the two lifting pillars 23 are fixedly connected to a bottom rack 24. Multiple carrier plates 25 are evenly arranged on the bottom surface of the bottom rack 24. Each carrier plate 25 has a bottom... A mounting assembly 26 is provided on the surface. A rotating block 28 is fixedly connected to the top surface of one end of the carrier plate 25, and a top block 29 is fixedly connected to the top surface of the other end of the carrier plate 25. An opening 27 is opened on the bottom frame 24. The opening 27 is located above multiple carrier plates 25 and is rotatably connected to multiple rotating seats 210. A cylinder 211 is fixedly sleeved on the rotating seat 210. The top of the rotating block 28 is rotatably connected to the opening 27, and the output end of the cylinder 211 is rotatably connected to the top block 29. The angle of the PCB board can be changed by the cylinder 211. When lifting away from the liquid, it is tilted so that the liquid flows down from one corner. Then the PCB board is turned to a vertical state, reducing the amount of liquid on the surface of the PCB board. This path can drain the liquid more orderly. Hanging assembly 26 includes a top plate 261. Multiple fixing plates 262 are evenly fixed to one side of the bottom surface of the top plate 261. The fixing plates 262 are fixed to the top sidewall of a fixed flow guide baffle 265. Multiple upper openings 267 are formed on the side of the top plate 261 away from the fixed flow guide baffle 265. Multiple U-shaped brackets 268 are rotatably mounted on the openings 267. The bottom ends of the U-shaped brackets 268 are fixed to the top sidewall of a moving flow guide baffle 269. A first baffle 266 is fixed to the upper part of the sidewall of the fixed flow guide baffle 265, and a second baffle 2610 is fixed to the upper part of the sidewall of the moving flow guide baffle 269. After the hanging assembly 26 is hung on the PCB board, the fixed flow guide baffle 265 and the moving flow guide baffle 269 will be present on both sides of the PCB board. The shielding mechanism ensures that when the PCB board is lifted away from the liquid, a thin film of liquid adheres to the surfaces of the PCB board, the fixed flow guide baffle 265, and the moving flow guide baffle 269. Under the influence of gravity, the liquid flows downward. By using a method that changes from tilting to vertical to optimize its downward flow path, the liquid preferentially adheres to the first continuous solid surface it contacts. Thus, the shortest flow path for the liquid flowing out of the PCB board surface is a very short lateral movement. Under capillary action, it reaches the surfaces of the adjacent fixed flow guide baffle 265 and the moving flow guide baffle 269. This improves the displacement of the liquid flowing on the PCB board, thereby mitigating the impact of the downward flowing liquid on the PCB board surface and improving the uniformity of electroplating.

[0020] Example 2: Please see Figure 1-10 This is the second embodiment of the present invention, based on the previous embodiment. The electrolytic cell structure 3 includes a cell body 31. Two anode carrier plates 32 are horizontally slidably disposed at both ends inside the cell body 31. Multiple anode units 33 are fixedly connected to the anode carrier plates 32 near the middle of the cell body 31. An electrical interface 321 is fixedly connected to the outside of the cell body 31. Multiple second guide rods 319 are fixedly connected to both sides of the inner end of the cell body 31. Multiple second guide holes 320 are opened on the anode carrier plates 32 corresponding to the positions of the multiple second guide rods 319. The second guide rods 319 are horizontally slidably sleeved into the second guide holes 320 for electroplating. During this process, the two anode carrier plates 32 in the electrolytic cell structure 3 slowly move back and forth along a shorter path. This disperses the current density distribution on the anode surface, promotes uniform dissolution of the anode unit 33, and improves the uniformity of the current distribution on the cathode surface. The anode system uses multiple anode units 33, each connected to an independent programmable power supply submodule or resistor regulator. By adjusting the current output of the anode units 33 at different positions, the edge effect caused by the geometry of the PCB board is dynamically compensated, thereby achieving active uniformity of the current density on the entire PCB board.

[0021] Multiple downward rotating openings 263 are provided on the bottom sidewall of the top strip plate 261 corresponding to the positions of multiple fixed clamping plates 262. The downward rotating openings 263 are rotatably connected to the top of the movable clamping plate 264. A T-shaped block 2611 is fixedly installed at the center of the top surface of the top strip plate 261. Two T-shaped positioning blocks 2612 are fixedly installed on both sides of the top surface of the top strip plate 261. A T-shaped mounting port 212 with screw holes is provided in the middle of the sidewall of the carrier plate 25. Two T-shaped positioning ports 213 are provided on both sides of the sidewall of the carrier plate 25. The bottom ends of the T-shaped mounting port 212 with screw holes and the T-shaped positioning ports 213 are open structures. The T-shaped block 2611 is inserted into the T-shaped mounting port 212 with screw holes, and the T-shaped positioning block 2612 is inserted into the T-shaped positioning port 213. Multiple through holes are horizontally provided on the T-shaped block 2611. 2613, a T-shaped mounting port 212 with screw holes is threaded to multiple mounting bolts 214 on its side wall. The mounting bolts 214 are inserted into the through hole 2613. A side circular opening 2624 is opened on the side of the fixed clamping plate 262 near the movable clamping plate 264. The side circular opening 2624 is horizontally slidably fitted with a conductive contact 2625. An inner opening 2626 is opened inside the fixed clamping plate 2622. The inner opening 2626 is connected to the side circular opening 2624. A limiting circular plate 2627 is horizontally slidably connected inside the inner opening 2626. The end of the conductive contact 2625 is fixedly connected to the limiting circular plate 2627. A spring 2628 is fixed between the end of the inner opening 2626 and the side wall of the limiting circular plate 2627. The conductive contact 2625 is used to energize the PCB board and is used as the cathode during electrolysis.

[0022] Both the fixed flow guide baffle 265 and the movable flow guide baffle 269 have V-shaped flow guide micro-grooves on one side close to each other. The purpose is to apply a controllable, lateral guiding force in the gravity-dominated vertical downward flow, thereby attracting the liquid to "actively" move away from the PCB board. The top strip plate 261 is horizontally rotated and sleeved with the lower long shaft 2616 corresponding to the positions of multiple lower rotating ports 263. The lower long shaft 2616 passes through multiple lower rotating ports 263. The top of the movable clamping plate 264 is fixedly sleeved on the lower rotating port 263. One end of the top strip plate 261 is fixedly embedded with the third servo reduction motor 2614. The shaft end of the third servo reduction motor 2614 is fixedly sleeved with the first active synchronous pulley 2615. The end of the lower long shaft 2616 is fixedly sleeved with the first driven synchronous pulley 2617. A first synchronous belt 2618 is sleeved on the active synchronous pulley 2615 and the first driven synchronous pulley 2617. The upper long shaft 2621 is horizontally rotatably sleeved on the top plate 261 corresponding to the positions of multiple upper rotating holes 267. The upper long shaft 2621 passes through multiple upper rotating holes 267. The top of the U-shaped bracket 268 is fixedly sleeved on the upper long shaft 2621. The fourth servo reduction motor 2619 is fixedly embedded at the end of the top plate 261 away from the third servo reduction motor 2614. The second active synchronous pulley 2620 is fixedly sleeved on the shaft end of the fourth servo reduction motor 2619. The second driven synchronous pulley 2622 is fixedly sleeved on the end of the upper long shaft 2621. The second synchronous belt 2623 is sleeved on the second active synchronous pulley 2620 and the second driven synchronous pulley 2622.

[0023] The side wall of the tank 31 is fixedly connected to the side bar bin 34. Two sliding grooves 36 are opened on the side walls at both ends of the side bar bin 34. The top side wall of the anode carrier plate 32 is located outside the tank 31 and is fixedly connected to the sliding plate 35. The side wall of the sliding plate 35 is opened with a sliding opening 37. The sliding opening 37 is horizontally slidably sleeved to the side bar bin 34. The side wall of the sliding opening 37 is fixedly connected to the slider 38. The slider 38 is horizontally slidably connected to the sliding groove 36. The inside of the sliding groove 36 is horizontally rotatably connected to the second lead screw 39. The slider 38 is fixedly connected to the second threaded sleeve 310. The second lead screw 39 is threadedly connected to the second threaded sleeve 310. The inside of the side bar bin 34 is horizontally rotatably sleeved to two horizontal shafts 311. One end of the two horizontal shafts 311 is rotatably connected to each other. The other end of the two horizontal shafts 311 is respectively fixedly connected to the ends of the two second lead screws 39. The center of the inside of the side bar bin 34 is rotatably connected to a short shaft 312. One end of the short shaft 312 is fixedly sleeved to the drive gear 313. The other end of the short shaft 312 is fixedly sleeved to... The driving pinion 314 is fixedly sleeved with the driven large gear 315 at the end of the horizontal shaft 311 near the driving large gear 313. The driven pinion 316 is fixedly sleeved with the end of the horizontal shaft 311 near the driving pinion 314. The intermediate pinion 317 is rotatably connected inside the side bar compartment 34, located between the driving pinion 314 and the driven pinion 316. The driving large gear 313 meshes with the driven large gear 315, the driving pinion 314 meshes with the intermediate pinion 317, and the intermediate pinion 317 meshes with the driven pinion 316. The fifth servo reduction motor 318 is fixedly connected to one end of the side bar compartment 34. The shaft end of the fifth servo reduction motor 318 is fixedly connected to the end of one of the second lead screws 39. The fifth servo reduction motor 318 rotates slowly and continuously switches directions to realize the reciprocating movement of the two anode carrier plates 32, and always maintains the movement in opposite directions.

[0024] The bottom surface of the side frame 1 is fixed to the side support frame 14, and the top surface of the side frame 1 is fixed to two parallel support bolsters 11. The top surface of the support bolsters 11 is fixed to the power-operated slide rail 12. The top surfaces of the two support bolsters 11 are horizontally slidably equipped with a trolley structure 5, and one of the support bolsters 11 has a long toothed plate 13 fixed to its side wall.

[0025] The trolley structure 5 includes a sliding platform 51, with multiple conductive slide blocks 53 fixedly connected to both sides of the bottom surface of the sliding platform 51. The conductive slide blocks 53 are slidably connected to the energized slide rail 12. A top support block 52 is fixedly connected to the top surface of the sliding platform 51. The bottom surface of the end of the cross frame 21 is fixedly connected to the top surface of the top support block 52. A sixth servo reduction motor 54 is fixedly sleeved on one side of the sliding platform 51. A traveling gear 55 is fixedly connected to the shaft end of the sixth servo reduction motor 54. The traveling gear 55 meshes with a long toothed plate 13. A guide gear 56 is rotatably connected to the bottom surface of the sliding platform 51. The guide gear 56 meshes with the long toothed plate 13. The trolley structure 5 is used to realize the horizontal movement of the transverse transport mechanism 2.

[0026] Two guide rails 215 are fixed to the side wall of the cross frame 21, and two guide seats 216 are fixed to the side wall of the adjusting block 22. The guide seats 216 are horizontally slidably connected to the guide rails 215. Two end blocks 217 are fixed to the side walls of both ends of the cross frame 21. A drive shaft 218 is rotatably connected between the two end blocks 217. Two first lead screws 219 are fixedly sleeved on the drive shaft 218 corresponding to the positions of the two adjusting blocks 22. A first threaded sleeve 220 is fixed to the side wall of the adjusting block 22. The first lead screw 219 is threadedly connected to the first threaded sleeve 220. A first servo reduction motor 225 is fixed to one end of the cross frame 21. The shaft end of the first servo reduction motor 225 is fixed to the end of the drive shaft 218.

[0027] A side sliding opening 221 is opened on the side wall of the adjusting block 22. The lifting column 23 is vertically slidably sleeved on the side sliding opening 221. Four short blocks 222 are fixedly connected to the top and bottom side walls of the lifting column 23. Two first guide rods 223 are vertically fixed between the four short blocks 222. A first guide hole 224 is vertically opened on the adjusting block 22 corresponding to the position of the first guide rod 223. The first guide rod 223 is vertically slidably sleeved on the first guide hole 224. A rack 227 is fixedly connected to the side of the lifting column 23 near the adjusting block 22. The internal rotation of the adjusting block 22 is connected to the drive gear 226. The drive gear 226 meshes with the rack 227. A second servo reduction motor 228 is fixedly connected to the side wall of the adjusting block 22. The shaft end of the second servo reduction motor 228 is fixedly connected to the shaft of the drive gear 226.

[0028] Example 3: The third embodiment of the present invention, based on the above two embodiments, provides an electroplating process for a double-sided multilayer PCB board electroplating equipment, including the following steps: Step 1: Clamping the PCB: Clamp the pre-drilled multilayer PCB onto the mounting assembly 26. During clamping, the movable baffle 269 rotates to a horizontal position, and the top of the multilayer PCB is placed into the position of the fixed clamping plate 262. The movable clamping plate 264 rotates to clamp the multilayer PCB, and then the movable baffle 269 rotates to a vertical position. Step Two: Chemical Copper Plating Step ① Degreasing and Cleaning: The transverse mounting mechanism 2 moves the PCB board and immerses it in a non-electric liquid tank 4. The non-electric liquid tank 4 contains an alkaline or acidic degreasing agent, which achieves cleaning through chemical erosion and surfactant action. Step ② First water wash: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-electric liquid tank 4, which contains deionized water; Step ③ Micro-etching and roughening: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-energized liquid tank 4. The non-energized liquid tank 4 contains sodium persulfate solution, which slightly corrodes the surface of the outer copper foil, making it micro-roughened, increasing the mechanical bonding force and bonding area between the subsequent chemical copper layer and the substrate copper foil, and preventing the copper layer from falling off; Step 4: Secondary water washing: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-electric liquid tank 4, which contains deionized water; Step 5: Pre-immersion: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-energized liquid tank 4. The non-energized liquid tank 4 contains a solution with a chemical environment similar to the activation solution in the next step to prevent concentration imbalance when directly entering the activation step. Step 6 Activation: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-energized liquid tank 4. The non-energized liquid tank 4 contains an activation solution containing colloidal palladium, which can adsorb a layer of catalytically active metallic palladium colloidal particles on the insulating porous substrate. These particles are the "seeds" or "catalysts" for the subsequent copper plating reaction. Step ⑦ Three-stage water washing: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-electric liquid tank 4, which contains deionized water, to wash away excess and unadsorbed palladium colloids; Step 8 Acceleration: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-energized liquid tank 4, which contains a fluoroboric acid solution. This removes the tin ion shell surrounding the palladium core, exposing the highly catalytically active palladium metal core. Step 9: Four water washes: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-electric liquid tank 4, which contains deionized water; Step 10: Copper plating: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-energized liquid tank 4. The non-energized liquid tank 4 contains an alkaline formaldehyde solution. Under the catalysis of palladium, the formaldehyde reduces copper ions to metallic copper and is oxidized at the same time. Through the autocatalytic oxidation-reduction reaction, a continuous layer of metallic copper is deposited on the activated hole walls and the entire board surface. Step 11: Five water washes: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-electric liquid tank 4, which contains deionized water. After cleaning, the board completes the hole metallization. Step 3: Full-board copper plating: Step ① Acid Immersion: The transverse mounting mechanism 2 moves the PCB board and immerses it in the next non-electric liquid tank 4. The non-electric liquid tank 4 contains 10% dilute sulfuric acid to remove the extremely thin oxide layer formed on the surface of the chemical copper layer in the air and to provide an acidic environment to prevent copper surface oxidation and ensure the adhesion of the plating layer. Step ② Copper plating: The transverse mounting mechanism 2 moves the PCB board and immerses it in the electrolytic tank structure 3. The electrolytic tank structure 3 contains an acidic copper sulfate system, which includes copper sulfate, sulfuric acid, chloride ions, and organic additives. During this process, the PCB board is energized, and the PCB board acts as the cathode. The anode unit 33 is a phosphor bronze ball that provides copper ions. Step ③ Multi-stage water washing: The transverse mounting mechanism 2 moves the PCB board and immerses it in multiple non-electric liquid tanks 4 in sequence. The non-electric liquid tanks 4 contain deionized water. The PCB board is washed multiple times to complete the entire electroplating process. The finished PCB board is then removed from the hanger assembly 26.

[0029] This invention uses cylinder 211 to change the angle of the PCB board, tilting it as it is lifted away from the liquid. This allows the liquid to flow down from one corner before the PCB board returns to a vertical position, reducing the amount of liquid adhering to its surface. This path allows for more orderly liquid drainage. Based on this, after the mounting assembly 26 attaches the PCB board, fixed guide baffles 265 and movable guide baffles 269 on both sides of the PCB board provide some protection. When the PCB board is lifted away from the liquid, the liquid flows downwards under gravity. The tilting and subsequent vertical rotation optimizes the downward flow path, ensuring that the liquid preferentially adheres to the first and most continuous contact point. On a solid surface, the shortest flow path for the liquid flowing out of the PCB board is a very short lateral movement. Under capillary action, it reaches the surfaces of the adjacent fixed flow guide baffle 265 and the moving flow guide baffle 269. This improves the displacement of the liquid flowing on the PCB board, thereby mitigating the impact of the downstream liquid on the PCB board surface and improving the uniformity of electroplating. During electroplating, the two anode carrier plates 32 in the electrolytic cell structure 3 slowly move back and forth along a shorter path. This can disperse the current density distribution on the anode surface, promote the uniform dissolution of the anode unit 33, and improve the uniformity of the current distribution on the cathode surface.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A double-sided multilayer PCB board electroplating equipment, comprising two parallel side racks (1), and further comprising multiple electrolytic cell structures (3) and multiple non-electrified liquid tanks (4), wherein the multiple electrolytic cell structures (3) and multiple non-electrified liquid tanks (4) are disposed between the two side racks (1), characterized in that... : A transverse mounting mechanism (2) is horizontally slidably mounted on the top surface of the two side frame frames (1). The transverse mounting mechanism (2) includes a cross frame (21). Two adjusting blocks (22) are horizontally slidably mounted on the side wall of the cross frame (21). Two lifting pillars (23) are vertically slidably mounted on the side wall of the two adjusting blocks (22). The bottom ends of the two lifting pillars (23) are fixedly connected to the bottom frame frame (24). A plurality of carrier plates (25) are evenly arranged on the bottom surface of the bottom frame frame (24). Each carrier plate (25) has a hanging device on its bottom surface. The component (26) has a rotating block (28) fixedly connected to the top surface of one end of the carrier plate (25), and a top block (29) fixedly connected to the top surface of the other end of the carrier plate (25). A through-hole (27) is opened on the bottom frame (24). The through-hole (27) is located above multiple carrier plates (25) and is rotatably connected to multiple rotating seats (210). A cylinder (211) is fixedly sleeved on the rotating seat (210). The top end of the rotating block (28) is rotatably connected to the through-hole (27), and the output end of the cylinder (211) is rotatably connected to the top block (29). The mounting assembly (26) includes a top plate (261), on one side of the bottom surface of the top plate (261) a plurality of fixed clamps (262) are uniformly fixed, and the plurality of fixed clamps (262) are fixed to the top side wall of the fixed flow guide baffle (265). The top plate (261) away from the fixed flow guide baffle (265) has a plurality of upper rotating openings (267), and the plurality of upper rotating openings (267) are rotatably provided with a plurality of U-shaped brackets (268). The bottom end of the plurality of U-shaped brackets (268) is fixed to the top side wall of the moving flow guide baffle (269). The upper part of the side wall of the fixed flow guide baffle (265) is fixed to a first baffle (266), and the upper part of the side wall of the moving flow guide baffle (269) is fixed to a second baffle (2610).

2. The double-sided multilayer PCB board electroplating equipment according to claim 1, characterized in that... The electrolytic cell structure (3) includes a cell body (31). Two anode carrier plates (32) are horizontally slidably arranged at both ends of the cell body (31). Multiple anode units (33) are fixedly connected to the anode carrier plate (32) near the middle of the cell body (31). An electrical interface (321) is fixedly connected to the outside of the cell body (31). Multiple second guide rods (319) are fixedly connected to both sides of the inner end of the cell body (31). Multiple second guide holes (320) are opened on the anode carrier plate (32) corresponding to the positions of the multiple second guide rods (319). The second guide rods (319) are horizontally slidably sleeved into the second guide holes (320).

3. The double-sided multilayer PCB board electroplating equipment according to claim 1, characterized in that... The top plate (261) has multiple downward rotating openings (263) on its bottom sidewall corresponding to multiple fixed clamping plates (262). The downward rotating openings (263) are rotatably connected to the top of the movable clamping plate (264). A T-shaped block (2611) is fixedly installed at the center of the top surface of the top plate (261). Two T-shaped positioning blocks (2612) are fixedly installed on both sides of the top surface of the top plate (261). A T-shaped mounting port (212) with screw holes is opened in the middle of the sidewall of the carrier plate (25). Two T-shaped positioning ports (213) are opened on both sides of the sidewall of the carrier plate (25). The bottom ends of the T-shaped mounting port (212) with screw holes and the T-shaped positioning ports (213) are open structures. The mounting T-shaped block (2611) is inserted into the T-shaped mounting port (212) with screw holes. The T-shaped positioning block (2612) is inserted into the T-shaped positioning port (213). (2611) Multiple through holes (2613) are opened horizontally on the upper side. Multiple mounting bolts (214) are threaded to the side wall of the T-shaped mounting port (212) with screw holes. The mounting bolts (214) are inserted into the through holes (2613). A side round opening (2624) is opened on the side of the fixed clamping plate (262) near the movable clamping plate (264). The side round opening (2624) is horizontally slidably sleeved with the conductive contact (2625). An inner opening (2626) is opened inside the fixed clamping plate (2622). The inner opening (2626) is connected to the side round opening (2624). A limiting round plate (2627) is horizontally slidably connected inside the inner opening (2626). The end of the conductive contact (2625) is fixedly connected to the limiting round plate (2627). A spring (2628) is fixedly connected between the end of the inner opening (2626) and the side wall of the limiting round plate (2627).

4. The double-sided multilayer PCB board electroplating equipment according to claim 3, characterized in that... The fixed flow guide baffle (265) and the moving flow guide baffle (269) are both provided with V-shaped flow guide micro-grooves on one side close to each other. The top bar plate (261) is horizontally rotated and sleeved with the lower long shaft (2616) corresponding to the positions of multiple lower rotating ports (263). The lower long shaft (2616) passes through multiple lower rotating ports (263). The top of the movable clamping plate (264) is fixedly sleeved on the lower rotating port (263). One end of the top bar plate (261) is fixedly embedded with the third servo reduction motor (2614). The shaft end of the third servo reduction motor (2614) is fixedly sleeved with the first active synchronous pulley (2615). The end of the lower long shaft (2616) is fixedly sleeved with the first driven synchronous pulley (2617). The first active synchronous pulley (2615) and the first driven synchronous pulley (2617) are... The first synchronous belt (2618) is sleeved on. The upper long shaft (2621) is horizontally rotatably sleeved on the top strip plate (261) corresponding to the positions of multiple upper rotating holes (267). The upper long shaft (2621) passes through multiple upper rotating holes (267). The top of the U-shaped bracket (268) is fixedly sleeved on the upper long shaft (2621). The end of the top strip plate (261) away from the third servo reduction motor (2614) is fixedly embedded with the fourth servo reduction motor (2619). The shaft end of the fourth servo reduction motor (2619) is fixedly sleeved on the second active synchronous pulley (2620). The end of the upper long shaft (2621) is fixedly sleeved on the second driven synchronous pulley (2622). The second synchronous belt (2623) is sleeved on the second active synchronous pulley (2620) and the second driven synchronous pulley (2622).

5. A double-sided multilayer PCB board electroplating equipment according to claim 2, characterized in that... The sidewall of the tank (31) is fixedly connected to the side bar bin (34). Two sliding grooves (36) are opened at both ends of the sidewall of the side bar bin (34). The top sidewall of the anode carrier plate (32) is located outside the tank (31) and is fixedly connected to the sliding plate (35). The sidewall of the sliding plate (35) is opened with a sliding opening (37). The sliding opening (37) is horizontally slidably connected to the side bar bin (34). The sidewall of the sliding opening (37) is fixedly connected to the slider (38). The slider (38) is horizontally slidably connected to the sliding groove (36). (36) The second lead screw (39) is horizontally rotatably connected internally. The second threaded sleeve (310) is fixedly connected to the slider (38). The second lead screw (39) is threadedly connected to the second threaded sleeve (310). The two horizontal shafts (311) are horizontally rotatably connected internally in the side bar compartment (34). One end of the two horizontal shafts (311) is rotatably connected to each other. The other end of the two horizontal shafts (311) is fixedly connected to the ends of the two second lead screws (39) respectively. The short shaft is rotatably connected to the center of the side bar compartment (34). (312) One end of the short shaft (312) is fixedly sleeved with the driving large gear (313), and the other end of the short shaft (312) is fixedly sleeved with the driving small gear (314). The end of the horizontal shaft (311) near the driving large gear (313) is fixedly sleeved with the driven large gear (315), and the end of the horizontal shaft (311) near the driving small gear (314) is fixedly sleeved with the driven small gear (316). The side bar compartment (34) is located inside the driving small gear (314) and the driven small gear. (316) Rotary connection of intermediate pinion (317) between positions, the driving large gear (313) meshes with driven large gear (315), the driving small gear (314) meshes with intermediate pinion (317), the intermediate pinion (317) meshes with driven pinion (316), one end of the side bar compartment (34) is fixedly connected to the fifth servo reduction motor (318), and the shaft end of the fifth servo reduction motor (318) is fixedly connected to the end of one of the second lead screws (39).

6. The double-sided multilayer PCB board electroplating equipment according to claim 1, characterized in that... The side support frame (1) is fixed to the bottom surface of the side support frame (14), and two parallel support pillows (11) are fixed to the top surface of the side support frame (1). The top surface of the support pillows (11) is fixed to the power-operated slide rail (12). The top surfaces of the two support pillows (11) are horizontally slidably provided with a trolley structure (5). One of the support pillows (11) has a long toothed plate (13) fixed to the side wall.

7. A double-sided multilayer PCB board electroplating equipment according to claim 6, characterized in that... The trolley structure (5) includes a sliding platform (51), with multiple conductive slide blocks (53) fixedly connected to both sides of the bottom surface of the sliding platform (51). The conductive slide blocks (53) are slidably connected to the energized slide rail (12). A top support block (52) is fixedly connected to the top surface of the sliding platform (51). The bottom surface of the end of the cross frame (21) is fixedly connected to the top surface of the top support block (52). A sixth servo reduction motor (54) is fixedly sleeved on one side of the sliding platform (51). A traveling gear (55) is fixedly connected to the shaft end of the sixth servo reduction motor (54). The traveling gear (55) meshes with a long toothed plate (13). A guide gear (56) is rotatably connected to the bottom surface of the sliding platform (51). The guide gear (56) meshes with the long toothed plate (13).

8. The double-sided multilayer PCB board electroplating equipment according to claim 1, characterized in that... Two guide rails (215) are fixed to the side wall of the cross frame (21), two guide seats (216) are fixed to the side wall of the adjusting block (22), the guide seats (216) are horizontally slidably connected to the guide rails (215), two end blocks (217) are fixed to the side walls of both ends of the cross frame (21), and a drive shaft (218) is rotatably connected between the two end blocks (217). Two first lead screws (219) are fixedly sleeved to the position of the two adjusting blocks (22) of the drive shaft (218), and a first threaded sleeve (220) is fixed to the side wall of the adjusting block (22). The first lead screw (219) is threadedly connected to the first threaded sleeve (220). A first servo reduction motor (225) is fixed to one end of the cross frame (21), and the shaft end of the first servo reduction motor (225) is fixed to the end of the drive shaft (218).

9. The double-sided multilayer PCB board electroplating equipment according to claim 1, characterized in that... The adjusting block (22) has a side sliding opening (221) on its side wall. The lifting support column (23) is vertically slidably sleeved with the side sliding opening (221). The top and bottom side walls of the lifting support column (23) are fixedly connected to four short blocks (222). Two first guide rods (223) are vertically fixed between the four short blocks (222). The adjusting block (22) has a first guide hole (224) vertically opening at the position corresponding to the first guide rod (223). The first guide rod (223) is vertically slidably sleeved with the first guide hole (224). The lifting support column (23) is fixedly connected to a rack (227) on the side near the adjusting block (22). The adjusting block (22) is rotatably connected to a drive gear (226). The drive gear (226) meshes with the rack (227). The adjusting block (22) has a second servo reduction motor (228) fixedly connected to its side wall. The shaft end of the second servo reduction motor (228) is fixedly connected to the shaft of the drive gear (226).

10. An electroplating process for a double-sided multilayer PCB board electroplating equipment as described in any one of claims 1-9, characterized in that... This includes the following steps: Step 1: Clamping the PCB: Clamp the drilled multilayer PCB onto the mounting assembly (26). During clamping, the moving guide baffle (269) rotates to a horizontal position, and the top of the multilayer PCB is placed into the position of the fixed clamping plate (262). The movable clamping plate (264) rotates to clamp the multilayer PCB. Then, the moving guide baffle (269) rotates to a vertical position. Step Two: Chemical Copper Plating Step ① Degreasing and cleaning: The transverse mounting mechanism (2) moves the PCB board and immerses it in a non-electric liquid tank (4). The non-electric liquid tank (4) contains an alkaline or acidic degreasing agent, which achieves cleaning through chemical erosion and surfactant action. Step ② First water wash: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4), which contains deionized water; Step ③ Micro-etching and roughening: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-energized liquid tank (4). The non-energized liquid tank (4) contains sodium persulfate solution, which slightly corrodes the surface of the outer copper foil, making it micro-roughened, increasing the mechanical bonding force and bonding area between the subsequent chemical copper layer and the substrate copper foil, and preventing the copper layer from falling off; Step 4: Secondary water washing: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4), which contains deionized water; Step ⑤ Pre-immersion: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4). The non-electric liquid tank (4) contains a solution with a chemical environment similar to the activation solution in the next step to prevent concentration imbalance when directly entering the activation step. Step 6 Activation: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-energized liquid tank (4). The non-energized liquid tank (4) contains an activation solution containing colloidal palladium, which can adsorb a layer of catalytically active metallic palladium colloidal particles on the insulating hole wall substrate. These particles are the "seeds" or "catalysts" for the subsequent copper plating reaction. Step ⑦ Three-stage water washing: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4), which contains deionized water to wash away excess, unadsorbed palladium colloids; Step ⑧ Acceleration: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-energized liquid tank (4), which contains a fluoroboric acid solution to remove the tin ion shell surrounding the palladium core and expose the highly catalytically active palladium core. Step 9: Four water washes: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4), which contains deionized water; Step 10 Copper deposition: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-energized liquid tank (4). The non-energized liquid tank (4) contains an alkaline formaldehyde solution. Under the catalysis of palladium, the formaldehyde reduces copper ions to metallic copper and is oxidized at the same time. Through the autocatalytic oxidation-reduction reaction, a continuous layer of metallic copper is deposited on the activated hole walls and the entire board surface. Step 11: Five water washes: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4), which contains deionized water. After cleaning, the board completes the hole metallization. Step 3: Full-board copper plating: Step ① Acid Immersion: The transverse mounting mechanism (2) moves the PCB board and immerses it in the next non-electric liquid tank (4). The non-electric liquid tank (4) contains 10% dilute sulfuric acid to remove the extremely thin oxide layer formed on the surface of the chemical copper layer in the air and to provide an acidic environment to prevent copper surface oxidation and ensure the adhesion of the plating layer. Step ② Copper plating: The transverse mounting mechanism (2) moves the PCB board and immerses it in the electrolytic cell structure (3). The electrolytic cell structure (3) contains an acidic copper sulfate system, which includes copper sulfate, sulfuric acid, chloride ions, and organic additives. The PCB board is energized and acts as the cathode. The anode unit (33) is a phosphorus copper ball that provides copper ions. Step ③ Multi-stage water washing: The transverse mounting mechanism (2) moves the PCB board and immerses it in multiple non-electric liquid tanks (4) in sequence. The non-electric liquid tanks (4) contain deionized water. The PCB board is washed multiple times to complete the entire electroplating process. The finished PCB board is then removed from the hanger assembly (26).

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