A semiconductor chip mounting device for processing dashcams

Abstract

This invention discloses a semiconductor chip mounting device for processing dashcams, belonging to the field of semiconductor device manufacturing technology. It includes a worktable and an adhesive application assembly. A material box is mounted on the top of the worktable, and a feeding tray is rotatably connected to the top of the worktable. A positioning groove is formed on the top of the feeding tray. A mounting assembly is mounted at one end of the top of the worktable, and the adhesive application assembly is located at one end of the mounting assembly. The adhesive application assembly includes a drive board, and a roller seat is located below the drive board. A limit seat is slidably connected to the outer side of the roller seat. This invention enables simultaneous workpiece mounting and chip adhesive application, completing workpiece bonding immediately after adhesive application. This prevents long-term exposure of adhesive to dust and impurities, effectively ensuring chip bonding cleanliness. Furthermore, the rigid limit precisely controls the adhesive application stroke, ensuring the adhesive width is smaller than the workpiece width, preventing excessive adhesive overflow when the workpiece squeezes out adhesive, thus improving chip mounting accuracy and bonding stability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, specifically a semiconductor chip mounting device for processing dashcams. Background Technology

[0002] A dashcam is an in-vehicle electronic device that is installed on a vehicle and relies on an image recording module and storage components to record the images and sounds of the vehicle in front and around it in real time while it is driving. In the production process of dashcams, a semiconductor chip mounting device is needed to attach the workpiece to the chip.

[0003] For example, invention publication number CN119673832B discloses a chip mounting device for semiconductor chip processing. This invention employs an automatic adhesive coating structure, enabling continuous automatic adhesive coating of chips. Specifically, a first cylinder drives a positioning plate downwards. After the positioning plate is aligned with the chip, the first cylinder extends further, cooperating with a connecting rod and a slider to move the material cylinder and the adhesive coating plate, thus achieving automatic adhesive coating. During the coating process, the piston, cylinder, and the inlet and outlet one-way valves on the cylinder allow air to enter the material cylinder. By increasing the internal air pressure of the cylinder, the adhesive inside can be more easily discharged, ensuring normal adhesive coating. However, this type of equipment has several process defects in practical use: on the one hand, because gas is compressible, the material... The air pressure inside the cylinder is difficult to control precisely, resulting in an inaccurate control over the amount of adhesive dispensed. On the other hand, when the adhesive applicator moves to the left on the positioning plate, some holes on the positioning plate will be exposed on its right side first. At this time, this area is not sealed. If too much adhesive is dispensed, the adhesive is very easy to overflow and accumulate on the inner wall of the positioning plate. After solidification, it forms stubborn contamination, which directly affects the accuracy and uniformity of the adhesive layer in subsequent applications. At the same time, after the adhesive application process is completed, chip mounting cannot be carried out immediately. It must be transferred to multiple workstations with the disc before chip mounting can be performed. During this process, the adhesive on the chip surface is exposed to the external environment for a long time, which easily attracts dust and other impurities, causing contamination and seriously affecting the bonding effect and adhesion stability of subsequent chip mounting. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor chip mounting device for processing dashcams, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor chip mounting device for processing dashcams, comprising a worktable and an adhesive applicator. A material box is mounted on the top of the worktable, and a feeding tray is rotatably connected to the top of the worktable. A positioning groove is formed on the top of the feeding tray. A mounting assembly is mounted at one end of the top of the worktable. The adhesive applicator is located at one end of the mounting assembly and includes a drive plate. A roller seat is located below the drive plate, and a limit seat is slidably connected to the outer side of the roller seat. A lower part of one side of the roller seat is connected to... The device is equipped with a glue dispensing tube, one end of which is fitted with a glue dispensing head. A piston rod is fixed to the upper part of the other side of the glue dispensing tube, and one end of the piston rod abuts against a return spring. One end of the return spring abuts against a piston cylinder, and the piston cylinder is slidably connected to the piston rod. A convex ring is fixed to the outer side of the middle part of the piston rod. A connecting plate is fitted to the outer side of one end of the piston cylinder, and a tension spring is fixed to one side of the lower part of the connecting plate. A damper is also fixed to one side of the lower part of the connecting plate. A glue storage tank is installed on the top of the workbench, and the glue storage tank is connected to the interior of the piston cylinder through a hose and a one-way valve.

[0006] Furthermore, the piston rod is hollow, with one end connected to the interior of the dispensing tube via a roller seat, and the other end connected to the interior of the piston cylinder via a one-way valve.

[0007] Furthermore, the limiting seat is fixedly connected to the tension spring and the damper respectively, and the limiting seat abuts against the piston cylinder.

[0008] Furthermore, the patch assembly includes a first linear module, which is mounted on the top of the worktable. The output end of the first linear module is connected to a second linear module. A cylinder is fixed to the output end of the second linear module, and a connecting seat is mounted on the output end of the cylinder. A pressure rod is connected to the bottom of the connecting seat, and a pneumatic suction cup is mounted at the center of the bottom of the pressure rod. A multi-view camera is fixed to the outer periphery of the bottom of the pressure rod.

[0009] Furthermore, the connecting seat is fixedly connected to the drive plate, and the drive plate is in the shape of a right trapezoid.

[0010] Furthermore, a synchronization component is connected to the top of the limiting seat, and the synchronization component includes a fork sleeve. The fork sleeve is placed on the top of the limiting seat, and a ball is embedded in the upper inner side of the fork sleeve. A first magnet is fixed in the middle of the inner side of the fork sleeve, and a magnetic strip is magnetically connected to one side of the first magnet.

[0011] Furthermore, the magnetic strip is fixedly connected to the pressure rod, and the pressure rod abuts against the ball bearing.

[0012] Furthermore, a second magnet is fixedly connected to one side of the limiting seat, and a floating frame is slidably connected to the end of the limiting seat. A third magnet is fixed to one side of the floating frame, and the third magnet corresponds to the second magnet. Guide rods are slidably connected inside the four corners of the floating frame, and a support spring is sleeved on the lower outer side of the guide rod. A steel ball seat is placed at the bottom of the guide rod inside one end of the floating frame, and the steel ball seat is slidably connected to the feeding tray. A slide is placed at the bottom of the guide rod inside the other end of the floating frame, and a guide frame is slidably connected inside the slide, and the guide frame is fixedly connected to the worktable.

[0013] Furthermore, a positioning component is provided on the top of the limiting seat, and the positioning component includes a torsion spring shaft. The torsion spring shaft is mounted on the top of the limiting seat, and a swing plate is provided on the outer side of the torsion spring shaft. One end of the swing plate is rotatably connected to a connecting rod, and one end of the connecting rod is rotatably connected to a slider. A stop is fixed on one side of the slider. A pulley is rotatably connected to one end of the swing plate. A baffle is mounted on the top of one end of the floating frame, and a roller is rotatably connected to one corner of the roller seat.

[0014] Furthermore, the lower part of the slider is dovetail-shaped, and the slider is slidably connected to the limiting seat.

[0015] This invention provides a semiconductor chip mounting device for processing dashcams, which has the following advantages: 1. This invention enables simultaneous workpiece mounting and chip adhesive application. The workpiece is immediately bonded after adhesive application, preventing long-term exposure of adhesive to dust and impurities, effectively ensuring chip bonding cleanliness. Furthermore, the rigid limit precisely controls the adhesive application stroke and ensures that the adhesive application width is smaller than the workpiece width, avoiding excessive adhesive overflow when the workpiece is squeezed, thus improving chip mounting accuracy and bonding stability.

[0016] 2. This invention can achieve synchronous and precise adjustment of the gluing position and the chip placement position, ensuring that the gluing and chip placement positions are matched in height. At the same time, the gluing component can be automatically raised during the position adjustment and reset process to avoid collision with the already placed workpiece. During placement, it can automatically adapt to the chip gluing height, making the gluing operation more stable. Furthermore, the gluing component and the chip placement component can be automatically separated during material picking, so that the material picking and gluing processes do not interfere with each other, greatly improving the continuity of equipment processing.

[0017] 3. This invention prevents the adhesive application component from retracing and colliding through the self-locking structure of the positioning component, effectively protecting the workpiece and the adhesive application component. Furthermore, it can automatically unlock and replenish the adhesive during material handling, ensuring sufficient adhesive for continuous adhesive application. At the same time, the damping buffer reduces the impact damage from component rebound, extending the service life of the component. When the mounting component restarts the movement of the adhesive application component, the self-locking structure can be automatically restored, ensuring continuous operation of the equipment without manual intervention, thus improving the overall processing continuity and work efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a semiconductor chip mounting device for processing a vehicle recorder according to the present invention; Figure 2 This is a schematic diagram of the adhesive application assembly structure of a semiconductor chip mounting device for processing a vehicle recorder according to the present invention; Figure 3 This is a schematic diagram of the chip mounting assembly of a semiconductor chip mounting device for processing a dashcam according to the present invention. Figure 4 This is a schematic diagram of the floating frame structure of a semiconductor chip mounting device for processing a vehicle recorder according to the present invention; Figure 5 This is a schematic diagram of the roller seat structure of a semiconductor chip mounting device for processing a vehicle recorder according to the present invention; Figure 6 This is a schematic diagram of the positioning component structure of a semiconductor chip mounting device for processing a vehicle recorder according to the present invention; Figure 7 This is a schematic diagram of the guide rod structure of a semiconductor chip mounting device for processing a dashcam according to the present invention.

[0019] In the diagram: 1. Workbench; 2. Material box; 3. Feeding tray; 4. Positioning slot; 5. Patch assembly; 501. First linear module; 502. Second linear module; 503. Cylinder; 504. Connecting seat; 505. Pressure rod; 506. Pneumatic suction cup; 507. Multi-view camera; 6. Gluing assembly; 601. Drive board; 602. Roller seat; 603. Limit seat; 604. Glue outlet tube; 605. Glue outlet head; 606. Piston rod; 607. Return spring; 608. Piston cylinder; 609. Convex ring; 610. Connecting plate; 611. Stretching 612 Spring; 613 Damper; 7. Glue Storage Tank; 7. Synchronization Assembly; 701 Fork Sleeve; 702 Ball; 703 First Magnet; 704 Magnetic Strip; 705 Second Magnet; 706 Floating Frame; 707 Third Magnet; 708 Guide Rod; 709 Support Spring; 710 Steel Ball Seat; 711 Slide; 712 Guide Frame; 8. Positioning Assembly; 801 Torsion Spring Shaft; 802 Swing Plate; 803 Connecting Rod; 804 Slider; 805 Stop; 806 Pulley; 807 Baffle; 808 Roller. Detailed Implementation

[0020] Please see Figures 1 to 6This invention provides a technical solution: a semiconductor chip mounting device for processing dashcams, comprising a worktable 1 and an adhesive application assembly 6. A material box 2 is mounted on the top of the worktable 1, and a feeding tray 3 is rotatably connected to the top of the worktable 1. A positioning groove 4 is formed on the top of the feeding tray 3. A mounting assembly 5 is mounted at one end of the top of the worktable 1. The mounting assembly 5 includes a first linear module 501. The output end of the first linear module 501 is connected to a second linear module 502, and the output end of the second linear module 502 is fixed. A cylinder 503 is provided, and a connecting seat 504 is installed at the output end of the cylinder 503. A pressure rod 505 is connected to the bottom of the connecting seat 504, and a pneumatic suction cup 506 is installed at the center of the bottom of the pressure rod 505. A multi-view camera 507 is fixed to the outer periphery of the bottom of the pressure rod 505. An adhesive application assembly 6 is provided at one end of the patch assembly 5, and the adhesive application assembly 6 includes a drive plate 601. The connecting seat 504 is fixedly connected to the drive plate 601, and the drive plate 601 is a right trapezoid. A roller seat 602 is provided below the drive plate 601, and a limit seat 6 is slidably connected to the outer side of the roller seat 602. 03. A glue dispensing tube 604 is connected to the lower part of one side of the roller seat 602, and a glue dispensing head 605 is installed at one end of the glue dispensing tube 604. A piston rod 606 is fixed to the upper part of the other side of the glue dispensing tube 604, and a return spring 607 is abutted at one end of the piston rod 606. A piston cylinder 608 is abutted at one end of the return spring 607, and the piston cylinder 608 is slidably connected to the piston rod 606. The piston rod 606 is hollow, and one end of the piston rod 606 is connected to the inside of the glue dispensing tube 604 through the roller seat 602. The other end of the piston rod 606 is connected to the piston cylinder through a one-way valve. The interior of 608 is interconnected. The limiting seat 603 is fixedly connected to the tension spring 611 and the damper 612 respectively, and the limiting seat 603 abuts against the piston cylinder 608. A convex ring 609 is fixed on the outer side of the middle part of the piston rod 606. A connecting plate 610 is installed on the outer side of one end of the piston cylinder 608. The tension spring 611 is fixed on the lower side of the connecting plate 610, and the damper 612 is also fixed on the lower side of the connecting plate 610. A glue storage box 613 is installed on the top of the worktable 1, and the glue storage box 613 is connected to the interior of the piston cylinder 608 through a hose and a one-way valve. The specific operation is as follows: the controller activates the first linear module 501, the second linear module 502, the cylinder 503, and the pneumatic suction cup 506 to adjust the product gripping position, and a multi-view camera 507 captures and detects the product. The linear modules and suction cups are commonly used transfer and gripping mechanisms in this field. Furthermore, the detection principle of the multi-view camera 507 is consistent with that of the semiconductor chip processing chip mounting device disclosed in CN119673832B. Therefore, this application will not elaborate on its specific structure and control system. During the placement process, when the cylinder 503 drives the pressure rod 505 downward to place the workpiece, which has been adsorbed by the pneumatic suction cup 506, onto the chip in the positioning slot 4, the connecting seat 504 simultaneously drives the drive plate 601 downward, so that it abuts against the roller seat 602. At this time, the inclined surface of the drive plate 601 applies a horizontal driving force to the roller seat 602, and the roller seat 602 slides within the slot of the limiting seat 603. In this state, the tension spring 611 pulls the connecting plate 610, causing the piston cylinder 608 to press against the chip. The limit seat 603 is located on the side. Since the spring force of the return spring 607 is much smaller than that of the tension spring 611, the limit seat 603 will not move. Instead, the piston rod 606 will move relative to the piston cylinder 608, compressing the return spring 607. The adhesive inside the piston cylinder 608 will then enter through the one-way valve at one end of the piston rod 606, pass through the piston rod 606, the roller seat 602, and the adhesive outlet tube 604, and finally exit from the bottom of the adhesive outlet head 605. This allows for simultaneous placement of the workpiece and chip adhesive application, with the adhesive application completed immediately afterward. The adhesive is applied to the workpiece to prevent long-term exposure to dust and impurities, ensuring the cleanliness of the chip bonding. In addition, after applying the adhesive to a specified distance, the convex ring 609 will abut against the piston cylinder 608 to achieve rigid contact, thereby generating a large thrust to pull the tension spring 611, allowing the piston cylinder 608 to move horizontally along with the piston rod 606. During this process, no adhesive application is performed; instead, the adhesive nozzle 605 is moved away from below the workpiece. Since the width of the adhesive application is smaller than the width of the workpiece to be bonded, excessive adhesive overflow is avoided when the workpiece squeezes the adhesive.

[0021] Please see Figures 3 to 7The top of the limiting seat 603 is connected to a synchronization component 7, which includes a fork sleeve 701. The fork sleeve 701 is mounted on the top of the limiting seat 603, and a ball bearing 702 is fitted into the upper inner side of the fork sleeve 701. A first magnet 703 is fixed to the middle of the inner side of the fork sleeve 701, and a magnetic strip 704 is magnetically connected to one side of the first magnet 703. The magnetic strip 704 is fixedly connected to a pressure rod 505, and the pressure rod 505 abuts against the ball bearing 702. A second magnet 705 is fixedly connected to one side of the limiting seat 603, and a floating frame 706 is slidably connected to the end of the limiting seat 603. A third magnet 707 is fixed on one side of the floating frame 706, and the third magnet 707 corresponds to the second magnet 705. Guide rods 708 are slidably connected inside the four corners of the floating frame 706, and a support spring 709 is sleeved on the lower outer side of the guide rods 708. A steel ball seat 710 is installed at the bottom of the guide rod 708 at one end of the floating frame 706, and the steel ball seat 710 is slidably connected to the feeding tray 3. A slide 711 is installed at the bottom of the guide rod 708 at the other end of the floating frame 706, and a guide frame 712 is slidably connected inside the slide 711, and the guide frame 712 is fixedly connected to the worktable 1. The specific operation is as follows: the first magnet 703 attracts the magnetic strip 704, causing the ball bearing 702 to press against the pressure rod 505. When the first linear module 501 and the second linear module 502 control the placement position, the fork sleeve 701 can also drive the limit seat 603 to slide on the floating frame 706, and simultaneously drive the slide block 711 to slide on the guide frame 712. Moreover, the steel ball seat 710 can also roll in tandem on the feeding tray 3, thereby synchronously and accurately adjusting the gluing position to match the height of the gluing and placement position. When adjusting the position, the drive plate 601 and the roller seat 602 are spaced a certain distance apart, and the support spring 709 will push the floating frame 706 to move the limit seat 603 upward as a whole. Thus, during the position adjustment process, the glue dispensing head 605 will not collide with the placed workpiece due to its low height. Furthermore, during the placement process, when the roller seat 602 is squeezed, the weight of the floating frame 706 and the components above it acts on the support spring 709, and the pressure required for the support spring 709 to deform. The force will be less than that of the return spring 607, so the support spring 709 will be compressed first until the floating frame 706 abuts against the middle shoulder of the guide rod 708. This will drive the dispensing head 605 to automatically and smoothly approach the chip, ensuring accurate matching of the dispensing height and facilitating stable subsequent dispensing operations. After dispensing, when the dispensing head 605 moves away from under the workpiece to be mounted, the rollers on the roller seat 602 will move from the inclined surface of the drive plate 601 to the vertical surface of the drive plate 601. At this time, the support spring 709 will be compressed. Spring 709 can push floating frame 706, causing limit seat 603 to move upward, avoiding collision with the pasted workpiece during the return process. When grabbing the workpiece in material box 2, it will cause limit seat 603 to fit with one end of floating frame 706. At this time, pressure rod 505 can be moved out of fork sleeve 701, realizing the separation of glue application component 6 and patch component 5. It will not interfere with the material picking operation of patch component 5, ensuring that the material picking and glue application processes do not interfere with each other, and improving the overall processing continuity and accuracy of the equipment.

[0022] Please see Figures 4 to 6 The top of the limiting seat 603 is provided with a positioning component 8, and the positioning component 8 includes a torsion spring shaft 801. The top of the limiting seat 603 is provided with a torsion spring shaft 801, and the outside of the torsion spring shaft 801 is provided with a swing plate 802. One end of the swing plate 802 is rotatably connected to a connecting rod 803, and one end of the connecting rod 803 is rotatably connected to a slider 804. One side of the slider 804 is fixed with a stop block 805. One end of the swing plate 802 is rotatably connected to a pulley 806. One end of the floating frame 706 is provided with a baffle 807. One corner of the roller seat 602 is rotatably connected to a roller 808. The lower part of the slider 804 is dovetail-shaped, and the slider 804 is slidably connected to the limiting seat 603. The specific operation is as follows: During the translation process, the roller seat 602 will drive the roller 808 to press against the stop block 805, causing it to slide and avoid it. When the roller seat 602 passes the stop block 805, the torsion spring shaft 801 will drive the swing plate 802 to rotate and reset, causing it to push the slider 804 through the connecting rod 803 and slide in the groove on the limit seat 603. The stop block 805 will then block one side of the roller seat 602, preventing it from moving back and causing the glue dispensing head 605 to collide with the glued workpiece. Relying on the mechanical locking action of the positioning component 8, the risk of back-movement collision is eliminated, protecting the workpiece and the glue dispensing head 605. When gripping the workpiece, after the limit seat 603 is moved to one end of the floating frame 706, the second magnet 705 will attract the third magnet 707, and the pulley 806 will abut against the stop plate 807, causing the swing plate 802 to rotate, thereby passing through Linkage 803 pulls slider 804, causing stop 805 to separate from roller seat 602. At this time, return spring 607 will first push piston rod 606, causing it to slide relative to piston cylinder 608. Then, the glue stored in glue tank 613 can be drawn into piston cylinder 608 through one-way valve and hose, automatically completing glue replenishment without manual intervention, ensuring sufficient glue for continuous application. Subsequently, under the damping action of damper 612, the rebound speed of tension spring 611 is limited, causing it to slowly return to its original position, reducing collision damage. After grabbing the product, limit seat 603 is moved again to remove it from one side of floating frame 706. Swing plate 802 will rotate back to its original position under the drive of torsion spring shaft 801, realizing the cyclic self-locking and unlocking of positioning component 8, ensuring continuous and stable repetitive operation of equipment, and improving overall processing continuity.

[0023] In summary, this semiconductor chip mounting device for dashcam manufacturing is used as follows: First, the motor drives the feeding tray 3 to rotate via the cam divider, moving the chip in the positioning slot 4 to the placement station. Then, the controller activates the first linear module 501, the second linear module 502, and the cylinder 503 to move the pressure rod 505 out of the fork sleeve 701. Next, the pneumatic suction cup 506 and the multi-view camera 507 accurately grasp the product in the material box 2. Then, the pressure rod 505 is moved back into the fork sleeve 701. At this time, the first magnet 703 attracts the magnetic strip 704, causing the ball bearing 702 to press against the pressure rod 505. When the first linear module 501 and the second linear module... When controlling the patch position, the fork sleeve 701 can also drive the limit seat 603 to slide on the floating frame 706, and at the same time drive the slide 711 to slide on the guide frame 712. Moreover, the steel ball seat 710 can also roll on the feeding tray 3 in coordination, so that the glue application position can be adjusted synchronously and accurately. When adjusting the position, the drive plate 601 and the roller seat 602 are spaced a certain distance apart, and the support spring 709 will push the floating frame 706 to move the limit seat 603 upward as a whole. Thus, during the adjustment of the position, the glue dispensing head 605 will not collide with the glued workpiece due to its low height. Secondly, when the cylinder 503 drives the pressure rod 505 to move down and place the workpiece after being adsorbed by the pneumatic suction cup 506 onto the chip in the positioning slot 4, the connecting seat 504 will simultaneously drive the drive plate 601 to move down so that it abuts against the roller seat 602. When the roller seat 602 is squeezed, the weight of the floating frame 706 and the components above it acts on the support spring 709. The pressure required for the support spring 709 to deform will be less than the elastic force of the return spring 607. Therefore, the support spring 709 will be compressed first until the floating frame 706 abuts against the middle shoulder of the guide rod 708, which will drive the glue dispensing head 605 to automatically and smoothly approach the chip, ensuring accurate matching of the glue application height. Next, the roller seat 602 will slide horizontally within the slot of the limiting seat 603. In this state, the tension spring 611 will pull the connecting plate 610, causing the piston cylinder 608 to press against the side of the limiting seat 603. Simultaneously, since the elastic force of the return spring 607 is much smaller than that of the tension spring 611, the limiting seat 603 will not move, while the piston rod 606 will move relative to the piston cylinder 608 and compress the return spring 607. The adhesive inside the piston cylinder 608 will then enter through the one-way valve at one end of the piston rod 606, pass through the piston rod 606, the roller seat 602, and the inside of the dispensing tube 604, and finally exit from the dispensing head 605. The bottom discharge allows for simultaneous placement of the workpiece and chip adhesive application. The workpiece is bonded immediately after the adhesive is applied, preventing long-term exposure of the adhesive to dust and impurities and ensuring the cleanliness of the chip bonding. In addition, after applying the adhesive to a specified distance, the convex ring 609 will abut against the piston cylinder 608 to achieve rigid contact, thereby generating a large thrust to pull the tension spring 611, allowing the piston cylinder 608 to move horizontally along with the piston rod 606. During this process, no adhesive application is performed; instead, the adhesive outlet 605 is moved away from below the workpiece. Since the width of the adhesive application is smaller than the width of the workpiece to be bonded, excessive adhesive overflow is avoided when the workpiece squeezes the adhesive. Then, after the dispensing head 605 moves away from under the workpiece to be bonded, the rollers on the roller seat 602 will move from the inclined surface of the drive plate 601 to the vertical surface of the drive plate 601. At this time, the support spring 709 can push the floating frame 706, causing the limit seat 603 to move upward, avoiding collision with the bonded workpiece during the return movement. During the translation process, the roller seat 602 will cause the roller 808 to press the stop block 805, causing it to slide and avoid collision. When the roller seat 602 passes the stop block 805, the torsion spring shaft 801 will cause the swing plate 802 to rotate and reset, causing it to push the slider 804 through the connecting rod 803 and slide in the groove on the limit seat 603. The stop block 805 will then block one side of the roller seat 602, preventing it from moving back and causing the dispensing head 605 to collide with the bonded workpiece. Finally, when the workpiece is gripped again, after the limiting seat 603 is moved to one end of the floating frame 706, the second magnet 705 will attract the third magnet 707, and the pulley 806 will abut against the baffle 807, causing the swing plate 802 to rotate. This, in turn, pulls the slider 804 through the connecting rod 803, causing the stop 805 to separate from the roller seat 602. At this time, the return spring 607 will first push the piston rod 606, causing it to slide relative to the piston cylinder 608. This allows the adhesive stored in the adhesive tank 613 to be drawn into the piston cylinder 608 through the one-way valve and hose, automatically completing the adhesive replenishment without manual intervention and ensuring continuous adhesive application. With sufficient adhesive, the damper 612 then limits the rebound speed of the tension spring 611, causing it to slowly return to its original position, reducing collision damage. At this point, the pressure rod 505 can be moved out of the fork sleeve 701, separating the adhesive application assembly 6 from the patch assembly 5 without interfering with the pick-up operation of the patch assembly 5. After picking up the product, the limit seat 603 is moved again to remove it from one side of the floating frame 706. The swing plate 802 will then rotate back to its original position under the drive of the torsion spring shaft 801, realizing the cyclic self-locking and unlocking of the positioning assembly 8, ensuring continuous and stable repetitive operation of the equipment, and improving the overall processing continuity.

[0024] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0025] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A semiconductor chip mounting device for processing dashcams, characterized in that, The assembly includes a workbench (1) and a gluing assembly (6). A material box (2) is mounted on the top of the workbench (1), and a feeding tray (3) is rotatably connected to the top of the workbench (1). A positioning groove (4) is provided on the top of the feeding tray (3). A patch assembly (5) is mounted on one end of the top of the workbench (1). The gluing assembly (6) is located at one end of the patch assembly (5). The gluing assembly (6) includes a drive plate (601). A roller seat (602) is provided below the drive plate (601), and a limit seat (603) is slidably connected to the outer side of the roller seat (602). A glue outlet pipe (604) is connected to the lower part of one side of the roller seat (602), and a glue outlet head (605) is provided at one end of the glue outlet pipe (604). 4) A piston rod (606) is fixed on the upper part of the other side, and a return spring (607) is abutted at one end of the piston rod (606). A piston cylinder (608) is abutted at one end of the return spring (607), and the piston cylinder (608) is slidably connected to the piston rod (606). A convex ring (609) is fixed on the outer side of the middle part of the piston rod (606). A connecting plate (610) is placed on the outer side of one end of the piston cylinder (608), and a tension spring (611) is fixed on the lower side of the connecting plate (610). A damper (612) is also fixed on the lower side of the connecting plate (610). A glue storage tank (613) is placed on the top of the workbench (1), and the glue storage tank (613) is connected to the inside of the piston cylinder (608) through a hose and a one-way valve.

2. The semiconductor chip mounting device for processing a vehicle recorder according to claim 1, characterized in that, The piston rod (606) is hollow, and one end of the piston rod (606) is connected to the inside of the dispensing tube (604) through the roller seat (602), and the other end of the piston rod (606) is connected to the inside of the piston cylinder (608) through the one-way valve.

3. The semiconductor chip mounting device for processing a vehicle recorder according to claim 1, characterized in that, The limiting seat (603) is fixedly connected to the tension spring (611) and the damper (612) respectively, and the limiting seat (603) abuts against the piston cylinder (608).

4. The semiconductor chip mounting device for processing a vehicle recorder according to claim 1, characterized in that, The patch assembly (5) includes a first linear module (501), the top of the workbench (1) is equipped with the first linear module (501), and the output end of the first linear module (501) is connected to a second linear module (502). The output end of the second linear module (502) is fixed with a cylinder (503), and the output end of the cylinder (503) is equipped with a connecting seat (504). The bottom of the connecting seat (504) is connected with a pressure rod (505), and a pneumatic suction cup (506) is installed in the center of the bottom of the pressure rod (505). A multi-view camera (507) is fixed to the outer periphery of the bottom of the pressure rod (505).

5. A semiconductor chip mounting device for processing a vehicle recorder according to claim 4, characterized in that, The connecting seat (504) is fixedly connected to the drive plate (601), and the drive plate (601) is a right trapezoid.

6. A semiconductor chip mounting device for processing vehicle recorders according to claim 1, characterized in that, The top of the limiting seat (603) is connected to a synchronization component (7), and the synchronization component (7) includes a fork sleeve (701). The top of the limiting seat (603) is provided with a fork sleeve (701), and a ball (702) is fitted into the upper inner side of the fork sleeve (701). A first magnet (703) is fixed in the middle of the inner side of the fork sleeve (701), and a magnetic strip (704) is magnetically connected to one side of the first magnet (703).

7. A semiconductor chip mounting device for processing a vehicle recorder according to claim 6, characterized in that, The magnetic strip (704) is fixedly connected to the pressure rod (505), and the pressure rod (505) abuts against the ball (702).

8. A semiconductor chip mounting device for processing a vehicle recorder according to claim 6, characterized in that, A second magnet (705) is fixedly connected to one side of the limiting seat (603), and a floating frame (706) is slidably connected to the end of the limiting seat (603). A third magnet (707) is fixed to one side of the floating frame (706), and the third magnet (707) corresponds to the second magnet (705). Guide rods (708) are slidably connected inside the four corners of the floating frame (706), and a support spring (709) is sleeved on the lower outer side of the guide rod (708). A steel ball seat (710) is placed at the bottom of the guide rod (708) at one end of the floating frame (706), and the steel ball seat (710) is slidably connected to the feeding tray (3). A slide seat (711) is placed at the bottom of the guide rod (708) at the other end of the floating frame (706), and a guide frame (712) is slidably connected inside the slide seat (711), and the guide frame (712) is fixedly connected to the worktable (1).

9. A semiconductor chip mounting device for processing a vehicle recorder according to claim 8, characterized in that, The top of the limiting seat (603) is provided with a positioning component (8), and the positioning component (8) includes a torsion spring shaft (801). The top of the limiting seat (603) is provided with a torsion spring shaft (801), and a swing plate (802) is provided on the outside of the torsion spring shaft (801). One end of the swing plate (802) is rotatably connected to a connecting rod (803), and one end of the connecting rod (803) is rotatably connected to a slider (804). One side of the slider (804) is fixed with a stop block (805). One end of the swing plate (802) is rotatably connected to a pulley (806). One end of the floating frame (706) is provided with a baffle (807), and one corner of the roller seat (602) is rotatably connected to a roller (808).

10. A semiconductor chip mounting device for processing a vehicle recorder according to claim 9, characterized in that, The lower part of the slider (804) is dovetail-shaped, and the slider (804) is slidably connected to the limiting seat (603).

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