Electroplating solution and method for electroplating articles using same
By using a combination of a nickel ion supply source, alkyl sulfonic acid or hydroxyalkyl sulfonic acid and sodium hydroxide in the electroplating solution to adjust the pH value, the problem of easy corrosion of ceramic electronic components during nickel electroplating is solved, and a higher quality electroplating effect is achieved.
CN122161962APending Publication Date: 2026-06-05DIPSOL CO LTD
5 Cites 0 Cited by
Patent Information
- Application Number
- CN202480071239.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-25
- Filing Date
- 2024-09-27
- Publication Date
- 2026-06-05
AI Technical Summary
Technical Problem
Ceramic electronic components are easily corroded in traditional nickel plating solutions, especially substrates containing zinc oxide, which are more susceptible to corrosion and affect product quality.
Method used
An electroplating solution containing a nickel ion supply source, a specific alkyl sulfonic acid or hydroxyalkyl sulfonic acid or its salt, and sodium hydroxide is used. By adjusting the pH value to 4.5–5.5, the corrosion of ceramic electronic components is suppressed.
Benefits of technology
It effectively inhibits the corrosion of ceramic electronic components and improves the quality of products manufactured by electroplating nickel, especially those containing zinc, forming a good plating film.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention aims to provide the nickel electroplating solution in which a ceramic matrix is not easy to erode. A plating solution according to the present invention comprises: a nickel ion supply source; a sulfonic acid represented by formula 1: R-SO3H (R is an alkyl group or hydroxyalkyl group having 1-5 carbon atoms) or a salt thereof; sodium hydroxide; and a pH buffer.
Need to check novelty before this filing date? Find Prior Art