Low-phosphorus chemical nickel plating solution and nickel plating method of aluminum alloy matrix

By combining glycine, gluconate, polyaspartic acid and iodate, a low-phosphorus electroless nickel plating solution is formed, which solves the problems of decreased deposition rate and stability of low-phosphorus electroless nickel plating solutions on aluminum alloy surfaces, and realizes a high-efficiency and environmentally friendly nickel plating process, which is suitable for electroless nickel plating on aluminum alloy substrates.

CN122169065APending Publication Date: 2026-06-09HANGZHOU WIN WIN TECH CO LTD
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Patent Information

Application Number
CN202610614335.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-07
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing low-phosphorus electroless nickel plating solutions suffer from problems such as decreased deposition rate, roughness, decomposition, or shortened lifespan during deposition on aluminum alloy surfaces. Furthermore, traditional stabilizers increase environmental stress and are difficult to achieve low metal ion load and long-term stability.

Method used

A low-phosphorus electroless nickel plating solution is formed by using glycine + gluconate as the main complexing system, polyaspartic acid as the dispersing complexing component, iodate as the stabilizer, and alkyl glycoside as the wetting agent. The nickel ion concentration is controlled at 1.0~5.0 g/L, hypophosphite at 20~45 g/L, pH at 4.6~5.4, and temperature at 80~92℃. This avoids heavy metals and sulfur-containing organic stabilizers, and improves the uniformity and stability of deposition through dispersion, complexation, and wetting.

Benefits of technology

It maintains a high deposition rate under low nickel ion concentration, improves the tolerance of by-products in the plating bath, extends the life of the electroless nickel plating solution, reduces the metal load of waste liquid and environmental risks, and is suitable for a variety of aluminum alloy substrates.

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Abstract

The invention relates to the technical field of chemical plating, in particular to a low-phosphorus chemical nickel plating solution and a nickel plating method of an aluminum alloy matrix. The low-phosphorus chemical nickel plating solution comprises the following components in mass concentration: 1.0-5.0 g / L of a nickel ion source in terms of Ni < 2 + >; the hypophosphite is 20-45 g / L in terms of H2PO < 2->; 5-40 g / L of glycine and 5-60 g / L of gluconate; 0.2 to 5.0 g / L of polyaspartic acid and / or a salt thereof; 2-25 g / L of a pH buffer agent; the content of alkyl glycoside is 0.05 to 1.0 g / L; the iodate stabilizer is 0.2 to 5.0 mg / L in terms of IO3 <->. Under the condition of low nickel ion concentration, the high deposition rate is still kept, the tolerance of bath solution by-products is remarkably improved, heavy metal and sulfur-containing organic stabilizers are not contained, waste liquid metal loads and environmental risks are reduced, and the method is suitable for various aluminum alloy matrixes subjected to double-zinc replacement treatment.
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