Electronic device
By incorporating heat dissipation and heat conduction devices into foldable electronic devices, efficient heat dissipation is achieved by utilizing the overall space, thus solving the overheating problem caused by the concentration of heat-generating components and improving the overall performance of the device.
CN122205801APending Publication Date: 2026-06-12HUAWEI TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2024-12-12
- Publication Date
- 2026-06-12
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Figure CN122205801A_ABST
Abstract
The application relates to an electronic device. The electronic device comprises a first shell, a second shell, a folding mechanism, a flexible display screen, a first heat-generating component, a heat dissipation device and a first heat conduction device. The folding mechanism connects the first shell and the second shell and can unfold or fold the first shell relative to the second shell. The first shell, the second shell and the folding mechanism jointly bear the flexible display screen. The first heat-generating component is located in the first shell. The heat dissipation device is located in the first shell and is used for dissipating part of the heat energy of the first heat-generating component out of the electronic device. The first end of the first heat conduction device is located in the first shell, and the second end of the first heat conduction device is located in the second shell. The first heat conduction device is used for conducting another part of the heat energy of the first heat-generating component into the second shell. The electronic device provided in the application has high heat dissipation efficiency and good heat dissipation effect.
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