Process for the preparation of an epoxy resin material and the use of an epoxy resin material for winding

Abstract

This invention relates to the field of epoxy resin composite materials technology, and discloses an epoxy resin raw material composition for winding and a method for preparing and applying an epoxy resin material. The composition includes: glycidyl ether epoxy resin, polyvinyl butyral, an active diluent, a coupling agent, a curing agent, and an accelerator; the polyvinyl butyral is selected from polyvinyl butyral with an average molecular weight of 30,000-100,000; the weight ratio of glycidyl ether epoxy resin to polyvinyl butyral is 70-100:5-15. The epoxy resin material prepared using the technical solution of this invention has improved toughness while controlling the glass transition temperature drop rate to within 8%, avoiding a significant reduction in the material's heat resistance, making it particularly suitable for application in the field of high-pressure gas storage containers.

Description

Technical Field

[0001] This invention relates to the field of epoxy resin composite materials technology, specifically to an epoxy resin raw material composition for winding, a method for preparing an epoxy resin material, and an application of an epoxy resin material. Background Technology

[0002] Epoxy resins possess many excellent properties, including low curing shrinkage, low molding pressure, wide curing temperature range, and a wide variety of types (from low-viscosity liquids to non-stick solids). They also exhibit excellent adhesion to various substrates, good chemical resistance, and excellent electrical insulation properties, making them widely used in structural adhesives, protective coatings, composite materials, and resin matrices for electronic chip components. However, the high degree of cross-linking after curing leads to insufficient toughness and susceptibility to fracture, limiting their application in fields requiring high mechanical strength and impact toughness. Therefore, improving the toughness of epoxy resins without significantly affecting their original excellent properties has become a research hotspot for scholars both domestically and internationally.

[0003] Existing technologies for toughening and modifying resin matrices primarily involve adding rubber elastomers, thermoplastic resins such as polyethersulfone and polyetherimide, and inorganic nanoparticles such as nano-silica, carbon nanotubes, graphene, and their derivatives to achieve toughening of epoxy resins. CN105542398B discloses an organic-inorganic core-shell particle and its preparation method for toughening thermosetting resins. This method uses silane coupling agent-modified silica as a core, grafting a hyperbranched polymer with terminal hydroxyl groups onto the surface of the modified silica to obtain core-shell particles for toughening thermosetting resins. This method improves the fracture toughness of the resin matrix, but it sacrifices the unique surface and small-size effects of nanomaterials, resulting in an increase in toughness but not a significant increase in mechanical properties such as strength. CN201310031083.6 discloses a method for improving the toughness of prepregs using polyurethane-modified epoxy resin as a toughening agent. This epoxy resin system utilizes the high bonding strength and impact resistance of the polyurethane-modified epoxy resin to impart high interlaminar shear strength to the prepreg, improving the toughness of the composite material. However, the addition of polyurethane-modified epoxy significantly reduces the heat resistance of the epoxy resin system, causing a significant decrease in the Tg of the cured product. CN104231993A discloses a modified inorganic nanoparticle-toughened epoxy resin potting compound and its preparation method. A layer of polyaniline is modified onto the surface of inorganic nanoparticles (nano-silica, nano-aluminum nitride) through in-situ polymerization to improve the compatibility between the inorganic nanoparticles and epoxy resin, resulting in good adhesion to the resin matrix.

[0004] Adding rubber elastomers, inorganic nanoparticles, thermoplastic resins, or other non-reactive toughening agents to epoxy resin systems to improve the toughness of the cured system presents challenges. The poor compatibility between traditional rubbers and epoxy resins leads to a significant decrease in the modulus and heat resistance of the modified material. Furthermore, the dispersion of nanoparticles in epoxy resins is prone to agglomeration, causing a significant reduction in the mechanical strength of the cured system. Adding thermoplastic resins increases the viscosity of the system, limiting its engineering applications.

[0005] In summary, most of the reported additive toughening agents have compatibility issues, with the toughening phase not being well dispersed in the continuous phase. They also suffer from defects such as low elongation at break, poor processability, or poor heat resistance. Summary of the Invention

[0006] This invention provides an epoxy resin raw material composition for winding. The epoxy resin material prepared using this composition has good toughness and heat resistance, and is particularly suitable as a matrix for carbon fiber reinforced composite materials in the field of high-pressure gas storage containers.

[0007] According to a first aspect of the present invention, the present invention provides an epoxy resin raw material composition for winding, the composition comprising: glycidyl ether epoxy resin, polyvinyl butyral, reactive diluent, coupling agent, curing agent, and accelerator; wherein the polyvinyl butyral is selected from polyvinyl butyral with an average molecular weight of 30,000-100,000; and the weight ratio of glycidyl ether epoxy resin to polyvinyl butyral is 70-100:5-15.

[0008] According to a second aspect of the present invention, the present invention provides a method for preparing an epoxy resin material, the method comprising: (1) mixing glycidyl epoxy resin, polyvinyl butyral, reactive diluent and coupling agent to obtain a first mixture; (2) mixing curing agent and accelerator to obtain a second mixture; (3) mixing the first mixture and the second mixture and casting.

[0009] According to a third aspect of the present invention, the present invention provides an epoxy resin material prepared by the preparation method described herein.

[0010] According to a fourth aspect of the present invention, the present invention provides an application of an epoxy resin material prepared by the preparation method described herein in the field of high-pressure gas storage containers.

[0011] The technical solution of this invention can improve the toughness of epoxy resin materials while controlling the glass transition temperature drop rate of the materials to within 8%, thus avoiding a significant reduction in the heat resistance of the materials and improving the overall performance of epoxy resin materials. Detailed Implementation

[0012] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0013] This invention provides an epoxy resin raw material composition for winding, the composition comprising: glycidyl ether epoxy resin, polyvinyl butyral, reactive diluent, coupling agent, curing agent, and accelerator; wherein the polyvinyl butyral is selected from polyvinyl butyral with an average molecular weight of 30,000-100,000; and the weight ratio of glycidyl ether epoxy resin to polyvinyl butyral is 70-100:5-15.

[0014] According to a preferred embodiment of the present invention, the composition comprises, by weight, 70-100 parts of glycidyl epoxy resin, 5-15 parts of polyvinyl butyral, 5-20 parts of reactive diluent, 0.5-3 parts of coupling agent, 80-95 parts of curing agent, and 1-10 parts of accelerator.

[0015] According to a preferred embodiment of the present invention, the polyvinyl butyral comprises polyvinyl butyral a and polyvinyl butyral b, wherein the content of each of the polyvinyl butyral a and polyvinyl butyral b is not less than 18 wt% based on the total weight of the polyvinyl butyral content; wherein the average molecular weight of polyvinyl butyral a is 30,000-60,000, and the average molecular weight of polyvinyl butyral b is 70,000-100,000. The raw material composition satisfying the foregoing characteristics can further improve the toughness of the prepared epoxy resin material.

[0016] According to a preferred embodiment of the present invention, in the polyvinyl butyral, the polyvinyl alcohol hydroxyl content is 10-20 wt%, the polyvinyl butyral group content is 78-88 wt%, and the acetyl group content is 1.5-2.5 wt%. A raw material composition satisfying the foregoing characteristics can prevent a significant reduction in the heat resistance of the prepared epoxy resin material.

[0017] In this invention, there are no special requirements for the type of glycidyl ether epoxy resin. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the glycidyl ether epoxy resin is selected from glycidyl ether epoxy resin and / or glycidyl amine epoxy resin, preferably glycidyl ether epoxy resin, and more preferably one or more of hydrogenated bisphenol A epoxy resin, glycidyl ether epoxy resin Ref170, and glycidyl ether epoxy resin E51.

[0018] According to a preferred embodiment of the present invention, the glycidyl ether epoxy resin is a mixture of glycidyl ether epoxy resin Ref170 and / or glycidyl ether epoxy resin E51 and hydrogenated bisphenol A epoxy resin; the content of hydrogenated bisphenol A epoxy resin is not less than 20%, preferably not less than 50%, based on the total weight of the glycidyl ether epoxy resin. The epoxy resin material prepared from the raw material composition of the present invention, which satisfies the foregoing characteristics, has superior overall performance.

[0019] In this invention, there are no special requirements for the type of reactive diluent. Commonly used reactive diluents in the art can achieve the purpose of this invention. The following is an illustrative description, but it does not limit the scope of this invention. According to a preferred embodiment of this invention, the reactive diluent is selected from one or more of polypropylene glycol glycidyl ether, n-butyl glycidyl ether and 1,2-cyclohexanediol diglycidyl ether.

[0020] In this invention, there are no special requirements for the type of coupling agent. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the coupling agent is selected from silane coupling agents, preferably one or more of 3-glycidyl etheroxypropyltrimethoxysilane and / or γ-aminopropyltriethoxysilane.

[0021] In this invention, there are no special requirements for the type of curing agent. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the curing agent is selected from one or more of methyltetrahydrophthalic anhydride, methylnadic anhydride and methylhexahydrophthalic anhydride.

[0022] In this invention, there are no special requirements for the type of accelerator. The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the accelerator is selected from imidazole compounds, preferably one or more of 1-imidazole, 2-methylimidazole and 2-ethyl-4-methylimidazole.

[0023] This invention provides a method for preparing epoxy resin materials using the raw material composition described herein. There are no specific requirements for the preparation method. According to a preferred embodiment of this invention, the preparation method includes: (1) mixing glycidyl ether epoxy resin, polyvinyl butyral, an active diluent, and a coupling agent to obtain a first mixture; (2) mixing a curing agent and an accelerator to obtain a second mixture; and (3) mixing and casting the first and second mixtures. The epoxy resin material prepared using the method of this invention can improve toughness while avoiding a significant reduction in heat resistance.

[0024] The materials used in the preparation method of this invention are the raw material composition of this invention, and the types of materials are as described above, and will not be repeated here.

[0025] In this invention, there are no special requirements for the mixing temperature in step (1). The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the mixing temperature is 80-150°C.

[0026] In this invention, there are no special requirements for the mixing time in step (1). The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the mixing time is 30-120 min.

[0027] In this invention, there are no special requirements for the mixing temperature in step (2). The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the mixing temperature is 20-40°C.

[0028] In this invention, there are no special requirements for the mixing time in step (2). The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the mixing time is 10-30 min.

[0029] In this invention, there are no special requirements for the mixing temperature in step (3). The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the mixing temperature is 40-80℃.

[0030] In this invention, there are no special requirements for the mixing time in step (3). The following is an illustrative description, but it does not limit the scope of the invention. According to a preferred embodiment of the invention, the mixing time is 30-60 min.

[0031] In this invention, all materials are mixed and then cast into shape, which is well known to those skilled in the art and will not be described in detail here.

[0032] The epoxy resin material prepared by the preparation method described in this invention can improve toughness while controlling the glass transition temperature drop rate to within 8%, thus avoiding a significant reduction in the heat resistance of the material and improving the overall performance of the epoxy resin material.

[0033] Specifically, the epoxy resin material has a tensile strength of 65-80 MPa, a tensile modulus of 2.9-3.8 GPa, an elongation at break of 4-6%, a flexural strength of 130-150 MPa, a flexural modulus of 3-3.5 GPa, and a glass transition temperature drop rate of no more than 8%. It is particularly suitable as a matrix for carbon fiber reinforced composite materials in the field of high-pressure gas storage containers.

[0034] The present invention will be described in detail below through embodiments.

[0035] In the following embodiments, Tensile properties, elongation at break, and flexural properties were measured according to the method in GB / T2567-2008. The glass transition temperature was determined according to the method in GB / T 19466.2—2004. Using the glass transition temperature of the material obtained in Comparative Example 1 as a benchmark, the rate of decrease in glass transition temperature was calculated. Hydrogenated bisphenol A epoxy resin is a commercially available product of Wuhan Lanabai Pharmaceutical Chemical Co., Ltd. E51 epoxy resin is a commercially available product of Jiangsu Sanmu Chemical Co., Ltd. Ref170 epoxy resin is a commercially available product from Kunshan Guodu Chemical Co., Ltd. Carboxyl-terminated liquid nitrile rubber is a commercially available product of Wuhan Kemike Biomedical Technology Co., Ltd. Polypropylene glycol glycidyl ether is a commercially available product of Jiangsu Runfeng Synthetic Technology Co., Ltd., with a molecular weight of 3000-7000. Polyvinyl butyral a is produced by Shanghai Hans Chemical Co., Ltd., with a molecular weight of 40,000. In polyvinyl butyral a, the polyvinyl alcohol hydroxyl content is 17.5 wt%, the polyvinyl butyral group content ranges from 80 wt%, and the acetyl group content ranges from 2.5 wt%. Polyvinyl butyral b is produced by Shanghai Hansi Chemical Co., Ltd., with a molecular weight of 90,000. In polyvinyl butyral b, the content of polyvinyl alcohol hydroxyl groups is 10.5 wt%, the content of polyvinyl butyral groups ranges from 88 wt%, and the content of acetyl groups ranges from 1.5 wt%.

[0036] Example 1 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 15 parts of polyvinyl butyral b, 10 parts of 1,2-cyclohexanediol diglycidyl ether and 3 parts of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 130°C for 100 min and cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0037] Example 2 (1) 70 parts by weight of hydrogenated bisphenol A epoxy resin, 30 parts by weight of glycidyl ether epoxy resin Ref170, 12 parts by weight of polyvinyl butyral a, 10 parts by weight of n-butyl glycidyl ether and 1 part by weight of γ-aminopropyltriethoxysilane were mixed at 150°C for 60 min and then cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 4 parts by weight of 1-imidazole at 25°C for 15 min to obtain component B; (3) Mix components A and B at 60°C for 50 minutes and then pour to obtain epoxy resin material.

[0038] Example 3 (1) Mix 50 parts by weight of hydrogenated bisphenol A epoxy resin, 50 parts by weight of glycidyl ether epoxy resin Ref170, 10 parts by weight of polyvinyl butyral b, 15 parts by weight of 1,2-cyclohexanediol diglycidyl ether and 2 parts by weight of coupling agent γ-aminopropyltriethoxysilane at 100°C for 60 min, and obtain component A after cooling. (2) Mix 100 parts by weight of methyltetrahydrophthalic anhydride and 6 parts by weight of 2-methylimidazole at 25°C for 20 min to obtain component B; (3) Mix components A and B at 80°C for 30 minutes and then pour the mixture to obtain epoxy resin material.

[0039] Example 4 (1) Mix 80 parts by weight of glycidyl ether epoxy resin E51, 20 parts of hydrogenated bisphenol A epoxy resin, 5 parts of polyvinyl butyral a, 20 parts of polypropylene glycol glycidyl ether and 2.5 parts of coupling agent 3-glycidyl ether oxypropyltrimethoxysilane at 100°C for 120 min, and obtain component A after cooling; (2) Mix 100 parts by weight of methylhexahydrophthalic anhydride and 10 parts by weight of diethyltetramethylimidazolium at 25°C for 30 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0040] Example 5 (1) 100 parts by weight of glycidyl ether epoxy resin Ref170, 7 parts of polyvinyl butyral b, 5 parts of n-butyl glycidyl ether and 0.5 parts of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 80°C for 120 min and then cooled to obtain component A. (2) Mix 100 parts by weight of methylhexahydrophthalic anhydride and 6 parts by weight of diethyltetramethylimidazole at 25°C for 20 min to obtain component B; (3) Mix components A and B at 80°C for 30 minutes and then pour the mixture to obtain epoxy resin material.

[0041] Example 6 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 5 parts of polyvinyl butyral b, 15 parts of polypropylene glycol glycidyl ether and 1.5 parts of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 100°C for 100 min and then cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 8 parts by weight of 1-imidazole at 25°C for 25 min to obtain component B; (3) Mix components A and B at 70°C for 40 minutes and then pour the mixture to obtain epoxy resin material.

[0042] Example 7 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 5 parts of polyvinyl butyral a and 10 parts of polyvinyl butyral b, 10 parts of 1,2-cyclohexanediol diglycidyl ether and 3 parts of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 130°C for 100 min and cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min, pour the mixture, and then obtain epoxy resin material.

[0043] Example 8 (1) Mix 80 parts by weight of glycidyl ether epoxy resin E51, 20 parts of hydrogenated bisphenol A epoxy resin, 15 parts of polyvinyl butyral b, 10 parts of 1,2-cyclohexanediol diglycidyl ether and 3 parts of 3-glycidyl ether oxypropyltrimethoxysilane at 130°C for 100 min, and obtain component A after cooling. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0044] Example 9 (1) Mix 50 parts by weight of hydrogenated bisphenol A epoxy resin, 50 parts by weight of glycidyl ether epoxy resin Ref170, 15 parts by weight of polyvinyl butyral b, 10 parts by weight of 1,2-cyclohexanediol diglycidyl ether and 3 parts by weight of 3-glycidyl ether oxypropyltrimethoxysilane at 130°C for 100 min, and obtain component A after cooling. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0045] Example 10 (1) Mix 50 parts by weight of hydrogenated bisphenol A epoxy resin, 50 parts by weight of glycidyl ether epoxy resin Ref170, 5 parts by weight of polyvinyl butyral a, 10 parts by weight of polyvinyl butyral b, 10 parts by weight of 1,2-cyclohexanediol diglycidyl ether and 3 parts by weight of 3-glycidyl ether oxypropyltrimethoxysilane at 130°C for 100 min, and then cool to obtain component A; (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0046] Comparative Example 1 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 10 parts by weight of 1,2-cyclohexanediol diglycidyl ether and 3 parts by weight of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 130°C for 100 min and cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0047] Comparative Example 2 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 18 parts of polyvinyl butyral b, 10 parts of 1,2-cyclohexanediol diglycidyl ether and 3 parts of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 130°C for 100 min and cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0048] Comparative Example 3 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 3 parts of polyvinyl butyral b, 10 parts of 1,2-cyclohexanediol diglycidyl ether and 3 parts of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 130°C for 100 min and cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0049] Comparative Example 4 (1) 100 parts by weight of hydrogenated bisphenol A epoxy resin, 15 parts by weight of carboxyl-terminated liquid nitrile rubber, 10 parts by weight of 1,2-cyclohexanediol diglycidyl ether and 3 parts by weight of 3-glycidyl ether oxypropyltrimethoxysilane were mixed at 130°C for 100 min and then cooled to obtain component A. (2) Mix 100 parts by weight of methylnadic anhydride and 1 part by weight of 1-imidazole at 25°C for 10 min to obtain component B; (3) Mix components A and B at 40°C for 60 min and then pour to obtain epoxy resin material.

[0050] Performance testing methods: Castings were prepared according to the above proportions. The glass transition temperature (Tg) of the epoxy resin materials prepared in the examples and comparative examples was tested using a differential scanning calorimeter (DSC). Mechanical properties were tested using an electronic universal testing machine. The tensile test followed the standard GB / T 2567—2008, with a test rate of 2 mm / min. The experimental results are shown in Table 1.

[0051] Table 1

[0052] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. A composition of epoxy resin raw materials for winding, characterized in that, The composition comprises: glycidyl epoxy resin, polyvinyl butyral, reactive diluent, coupling agent, curing agent, and accelerator; wherein the polyvinyl butyral is selected from polyvinyl butyral with an average molecular weight of 30,000-100,000; and the weight ratio of the glycidyl epoxy resin to polyvinyl butyral is 70-100:5-15.

2. The composition according to claim 1, wherein, The composition contains the following components by weight: 70-100 parts glycidyl epoxy resin, 5-15 parts polyvinyl butyral, 5-20 parts reactive diluent, 0.5-3 parts coupling agent, 80-95 parts curing agent, and 1-10 parts accelerator.

3. The composition according to claim 1 or 2, wherein, The polyvinyl butyral comprises polyvinyl butyral a and polyvinyl butyral b, and the content of each of the polyvinyl butyral a and polyvinyl butyral b is not less than 18 wt% based on the total weight of the polyvinyl butyral content; wherein, the average molecular weight of polyvinyl butyral a is 30,000-60,000, and the average molecular weight of polyvinyl butyral b is 70,000-100,000.

4. The composition according to any one of claims 1-3, wherein, The polyvinyl butyral contains 10-20 wt% polyvinyl alcohol hydroxyl groups, 78-88 wt% polyvinyl butyral groups, and 1.5-2.5 wt% acetyl groups.

5. The composition according to any one of claims 1-4, wherein, The glycidyl type epoxy resin is selected from glycidyl ether epoxy resin and / or glycidylamine epoxy resin, preferably glycidyl ether epoxy resin, and more preferably one or more of hydrogenated bisphenol A epoxy resin, glycidyl ether epoxy resin Ref170, and glycidyl ether epoxy resin E51. Preferably, the glycidyl ether epoxy resin is a mixture of glycidyl ether epoxy resin Ref170 and / or glycidyl ether epoxy resin E51 and hydrogenated bisphenol A epoxy resin; the content of hydrogenated bisphenol A epoxy resin is not less than 20% based on the total weight of the glycidyl ether epoxy resin, preferably not less than 50%.

6. The composition according to any one of claims 1-5, wherein, The reactive diluent is selected from one or more of polypropylene glycol diglycidyl ether, n-butyl glycidyl ether, and 1,2-cyclohexanediol diglycidyl ether; and / or The coupling agent is selected from silane coupling agents, preferably 3-glycidyl etheroxypropyltrimethoxysilane and / or γ-aminopropyltriethoxysilane; and / or The curing agent is selected from one or more of methyltetrahydrophthalic anhydride, methylnadic anhydride, and methylhexahydrophthalic anhydride; and / or The promoter is selected from imidazole compounds, preferably one or more of 1-imidazole, 2-methylimidazole and 2-ethyl-4-methylimidazole.

7. A method for preparing an epoxy resin material, characterized in that, The preparation method comprises using the composition according to any one of claims 1-6, wherein the composition is prepared by: (1) Glycidyl epoxy resin, polyvinyl butyral, reactive diluent and coupling agent are mixed to obtain the first mixture; (2) The curing agent and the accelerator are mixed to obtain a second mixture; (3) Mix the first mixture and the second mixture and pour them into a container.

8. The preparation method according to claim 7, wherein, In step (1), the mixing conditions are: Temperature 80-150℃; and / or time 30-120 min; and / or In step (2), the mixing conditions are: Temperature 20-40℃; and / or time 10-30 min; and / or In step (3), the mixing conditions are: The temperature is 40-80℃; and / or the time is 30-60 min.

9. The epoxy resin material prepared by the preparation method according to claim 7 or 8, preferably, has a tensile strength of 65-80 MPa, a tensile modulus of 2.9-3.8 GPa, an elongation at break of 4-6%, a flexural strength of 130-150 MPa, a flexural modulus of 3-3.5 GPa, and a glass transition temperature decrease rate of not more than 8%.

10. The application of the epoxy resin material of claim 9 in the field of high-pressure gas storage containers.

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