An epoxy resin composition, a method for preparing the same, and an application thereof

Abstract

This invention provides an epoxy resin composition, its preparation method, and its application. The epoxy resin composition, by mass fraction, comprises component A and component B; component A comprises: 5-12% epoxy resin, 0.4-2.5% diluent, 40-60% first filler, 0.1-0.5% first coupling agent, 0.1-0.5% first dispersant, and 0.1-0.5% carbon black; component B comprises: 2.5-5% curing agent, 25-40% second filler, 0.1-0.3% second coupling agent, and 0.1-0.3% second dispersant. This invention, by adjusting the proportions of the various substances and using a novel epoxy resin structure and a high-performance diluent, achieves low viscosity, low shrinkage, low modulus, and high resistance to damp heat. In the encapsulation of power module electronic components, motors, capacitors, sensors, transformers, etc., it exhibits excellent potting operability, anti-delamination, and reliability.

Description

Technical Field

[0001] This invention relates to the field of electronic component packaging composition technology, specifically to an epoxy resin composition, its preparation method, and its application. Background Technology

[0002] Epoxy resin possesses many unique advantages, including high insulation performance, high structural strength, and excellent sealing properties, making it widely used in the encapsulation of electronic components, motors, and electrical appliances. In the field of electronic and electrical encapsulation, solid epoxy resins typically require high temperatures of around 175°C, such as in the injection molding of electronic components using epoxy molding compounds, and the thermoforming of copper-clad laminates using epoxy laminates. For complex, large-sized electronic components, motors, and electrical appliances that are not heat-resistant, liquid epoxy resin potting compounds are required for encapsulation in a liquid form at medium to low temperatures.

[0003] Epoxy resin potting compound, as a thermosetting polymer material, plays a crucial structural support role in the packaging of electronic components, motors, and electrical appliances. It exhibits strong adhesion to various substrates, including metals, ceramics, and plastics, effectively blocking the corrosive effects of environmental media such as moisture and grease, significantly improving the long-term reliability and safety of packaged devices. Simultaneously, its excellent electrical insulation properties enable it to form a stable insulating barrier between electronic components, preventing short-circuit failures caused by current leakage. Furthermore, its outstanding chemical stability is lower than that of corrosive substances such as acids, alkalis, and salts, ensuring stable operation of devices under complex conditions.

[0004] With the development of high-performance electronic devices, especially the widespread application of silicon carbide power modules in high-power scenarios such as electric vehicle charging systems, electronic controllers, solar inverters, and high-speed rail traction converters, more stringent requirements have been placed on the comprehensive performance of epoxy potting compounds. Existing epoxy potting compounds mainly have the following limitations: 1) Excessive viscosity and poor flowability make it difficult to meet the requirements of high-efficiency automated potting processes, affecting the consistency of product appearance; 2) Excessive curing shrinkage and excessive modulus can easily cause interface delamination problems, leading to device failure under thermomechanical stress; 3) Significant attenuation of insulation performance in high temperature and high humidity environments makes it difficult to guarantee electrical reliability under extreme working conditions.

[0005] Therefore, there is an urgent need for a new type of epoxy resin composition that combines low viscosity, high fluidity, low shrinkage, low modulus, and high resistance to damp heat, which can easily meet the comprehensive performance requirements of materials in the high-end electronic packaging field. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides an epoxy resin composition, its preparation method, and its application, thus solving the problems mentioned in the background section.

[0007] To achieve the above objectives, the present invention provides the following technical solution: According to a first aspect of the present invention, an epoxy resin composition is provided, comprising component A and component B by mass fraction; Component A comprises: 5-12% epoxy resin, 0.4-2.5% diluent, 40-60% first filler, 0.1-0.5% first coupling agent, 0.1-0.5% first dispersant, and 0.1-0.5% carbon black; Component B comprises: 2.5-5% curing agent, 25-40% second filler, 0.1-0.3% second coupling agent, and 0.1-0.3% second dispersant.

[0008] Preferably, the epoxy resin comprises compound I and compound II; The structural formula of compound I is shown in Formula I: Formula I; The structural formula of compound II is shown in Formula II: Formula II, In Formula II, R1 is independently selected from -CH3, -CH2CH3, At least one of them; R2 is independently selected from , , At least one of them.

[0009] The epoxy resin of this invention employs compound I, which reduces the water absorption rate of the epoxy resin composition while increasing the glass transition temperature, thereby improving the moisture and heat resistance of the epoxy resin composition. Combined with compound II, it simultaneously increases the glass transition temperature of the epoxy resin composition while reducing its shrinkage and flexural modulus, thereby reducing the stress in the epoxy resin composition.

[0010] More preferably, compound II is selected from compounds shown in formula III; Formula III.

[0011] Preferably, the mass ratio of compound I to compound II in the epoxy resin is 0.3 to 3:1.

[0012] More preferably, the mass ratio of compound I to compound II in the epoxy resin is 1~2:1.

[0013] By optimizing the ratio of compound I to compound II, epoxy resin compositions can simultaneously possess properties such as low water absorption, low shrinkage, low modulus, and high glass transition temperature, thereby improving the anti-delamination and electrical reliability of epoxy resin compositions.

[0014] Preferably, the epoxy resin further includes compound III, the structural formula of which is shown in formula IV: Formula IV; The mass ratio of compound III to compound I is 0.3 to 1:1.

[0015] The present invention further adds epoxy resin of formula IV, which can increase the crosslinking density and rigidity of the crosslinking network of the epoxy resin composition and improve the heat resistance of the epoxy resin composition.

[0016] Preferably, the diluent is selected from N-(2-methylphenyl)-N-(1,2-epoxypropyl)-epoxyethylene methylamine and 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate; The mass ratio of the diluent to compound I is 0.05 to 1:1.

[0017] More preferably, the diluent is selected from N-(2-methylphenyl)-N-(1,2-epoxypropyl)-epoxyethylene methylamine.

[0018] Preferably, the first filler and the second filler are independently selected from at least one of crystalline silica, spherical fused silica, and alumina.

[0019] More preferably, the first filler and the second filler are independently selected from spherical fused silica, and the particle size is 0.001~75μm; even more preferably, the first filler and the second filler are independently selected from spherical fused silica, and the particle size is 0.001~45μm.

[0020] Preferably, the first coupling agent and the second coupling agent are independently selected from at least one of KH560 and KBM803.

[0021] Preferably, the first dispersant and the second dispersant are independently selected from at least one of the following: DISPERBYK-108, BYK-W907, ADDITAL DX633, and ADDITAL DX 675.

[0022] According to a second aspect of the present invention, a method for preparing an epoxy resin composition is provided, comprising the following steps: Preparation of Component A: Epoxy resin, diluent, first coupling agent and first dispersant are added to a high-speed stirred tank and premixed evenly at room temperature. Then carbon black and first filler are added. The mixture is stirred once at 50~70℃, cooled and ground with a three-roll mill. Then it is stirred a second time at 50~70℃ and degassed under vacuum to obtain Component A. Preparation of Component B: The curing agent, the second coupling agent, and the second dispersant were premixed in a high-speed stirred tank at room temperature. Then the second filler was added, and the mixture was stirred once at 50~70℃. After cooling, it was ground with a three-roll mill and stirred a second time at 50~70℃. Vacuum degassing was performed to obtain Component B.

[0023] According to a third aspect of the invention, an epoxy resin composition is provided for use in power module electronic components, electrodes, capacitors, sensors, or transformers.

[0024] This invention provides an epoxy resin composition, its preparation method, and its application. It has the following beneficial effects: (1) The present invention provides an epoxy resin composition in which the epoxy resin is selected from compounds of formula I and formula II and mixed in a certain proportion, so that the epoxy resin composition has the characteristics of low water absorption, low shrinkage, low modulus and high glass transition temperature, thereby improving the anti-delamination and electrical reliability of the epoxy resin composition.

[0025] (2) The epoxy resin composition provided in this solution, based on containing Formula I and Formula II, further adds a compound of Formula IV, which can further improve the crosslinking density and rigidity of the crosslinking network of the epoxy resin composition, so that the epoxy resin composition has excellent heat resistance.

[0026] (3) The epoxy resin composition provided in this solution reduces the viscosity of the epoxy resin composition and the glass transition temperature while maintaining other properties through the synergistic effect of epoxy resin and diluent. Detailed Implementation

[0027] To better illustrate the content of this invention, the following description is provided in conjunction with specific embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0029] Unless otherwise specified, all raw materials used in this invention were purchased through market channels.

[0030] Compound I has the brand name JS2806 and was purchased from Hubei Jusheng Technology Co., Ltd. Compound II is designated KR-470 and was purchased from Shin-Etsu Chemical Co., Ltd. Compound IV is designated AG-601 and was purchased from Shanghai Huayi Resin Co., Ltd. Diluent N-(2-methylphenyl)-N-(1,2-epoxypropyl)-epoxyethylene methylamine, brand name GOT, manufacturer: purchased from Nippon Kayaku Co., Ltd. The curing agent, diethyltoluene diamine, brand name DETDA, was purchased from Jiangsu Runfeng Synthetic Technology Co., Ltd.

[0031] The dispersant brand is BYK-W 907, and the manufacturer is BYK Additives (Shanghai) Co., Ltd. The dispersant brands were also selected from ADDITAL DX633 and ADDITAL DX 675, and the manufacturer was Yihua High-Tech (Nanjing) Co., Ltd. The filler spherical fused silica was selected from grade NQ1130F, and the manufacturer was Jiangsu Lianrui New Materials Co., Ltd. The coupling agent was selected from brand KH560, manufactured by Anhui Sibao Organosilicon New Materials Co., Ltd. The carbon black was selected from grade N700 and was purchased from Suzhou Baohua Carbon Black Co., Ltd.

[0032] The epoxy resin composition of the present invention will be described in more detail below with reference to specific embodiments.

[0033] Example 1 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 5.7% epoxy resin of type JS2806, 5.7% epoxy resin of type KR-470, 50.95% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type BYK-W 907; component B comprises 3.8% curing agent of type DETDA, 33.05% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type BYK-W 907.

[0034] Example 2 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 5.5% epoxy resin of type JS2806, 5.5% epoxy resin of type KR-470, 0.5% diluent of type GOT, 50.85% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type BYK-W 907; component B comprises 3.7% curing agent of type DETDA, 33.15% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type BYK-W 907.

[0035] Example 3 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 5.5% epoxy resin of type JS2806, 5.5% epoxy resin of type KR-470, 0.5% diluent of type GOT, 47.9% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type BYK-W 907; component B comprises 3.7% curing agent of type DETDA, 36.10% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type BYK-W 907.

[0036] Example 4 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 7.8% epoxy resin of type JS2806, 2.6% epoxy resin of type KR-470, 0.5% diluent of type GOT, 51.45% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX633; component B comprises 4.3% curing agent of type DETDA, 32.55% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX633.

[0037] Example 5 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 7.2% epoxy resin of type JS2806, 3.6% epoxy resin of type KR-470, 0.5% diluent of type GOT, 51.05% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.9% curing agent of type DETDA, 32.95% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0038] Example 6 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 2.9% epoxy resin of type JS2806, 8.7% epoxy resin of type KR-470, 0.5% diluent of type GOT, 51.25% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.1% curing agent of type DETDA, 33.75% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0039] Example 7 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 3.8% epoxy resin of type JS2806, 7.6% epoxy resin of type KR-470, 0.5% diluent of type GOT, 50.45% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.3% curing agent of type DETDA, 33.55% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0040] Example 8 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 3.2% epoxy resin of type JS2806, 6.4% epoxy resin of type KR-470, 1.6% epoxy resin of type AG-601, 0.5% diluent of type GOT, 50.65% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.5% curing agent of type DETDA, 33.35% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0041] Example 9 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 2.8% epoxy resin of type JS2806, 5.6% epoxy resin of type KR-470, 2.8% epoxy resin of type AG-601, 0.5% diluent of type GOT, 49.25% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.5% curing agent of type DETDA, 34.75% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0042] Example 10 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 2.4% epoxy resin of type JS2806, 4.8% epoxy resin of type KR-470, 2.4% epoxy resin of type AG-601, 2.4% diluent of type CELLOXIDE2021P, 50.35% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.2% curing agent of type DETDA, 33.65% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0043] Example 11 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 2.3% epoxy resin of type JS2806, 4.6% epoxy resin of type KR-470, 2.3% epoxy resin of type AG-601, 2.3% diluent of type GOT, 50.85% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.7% curing agent of type DETDA, 33.15% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type ADDITAL DX 675.

[0044] Example 12 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 2.3% of epoxy resin of type JS2806, 4.6% of epoxy resin of type KR-470, 2.3% of epoxy resin of type AG-601, 2.3% of diluent of type GOT, 54.55% of filler of type NQ1130F, 0.2% of carbon black of type N700, 0.2% of coupling agent of type KH560 and 0.2% of dispersant of type ADDITAL DX 675; component B comprises 3.7% of curing agent of type DETDA, 29.45% of filler of type NQ1130F, 0.1% of coupling agent of type KH560 and 0.1% of dispersant of type ADDITAL DX 675.

[0045] Example 13 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 2.0% epoxy resin of type JS2806, 4.0% epoxy resin of type KR-470, 2.0% epoxy resin of type AG-601, 2.0% diluent of type GOT, 52.85% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 3.2% curing agent of type DETDA, 33.15% filler of type NQ1130F, 0.1% coupling agent of type KBM803, and 0.1% dispersant of type ADDITAL DX 675.

[0046] Example 14 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 1.7% epoxy resin of type JS2806, 3.4% epoxy resin of type KR-470, 1.7% epoxy resin of type AG-601, 1.7% diluent of type GOT, 54.85% filler of type NQ1130F, 0.2% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type ADDITAL DX 675; component B comprises 2.7% curing agent of type DETDA, 33.15% filler of type NQ1130F, 0.1% coupling agent of type KBM803, and 0.1% dispersant of type ADDITAL DX 675.

[0047] Comparative Example 1 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 10% bisphenol A epoxy resin, 5% 4,4'-diaminodiphenylmethane epoxy resin, 47.25% filler of type NQ1130F, 0.3% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type BYK-W 907; component B comprises 3.9% curing agent of type DETDA, 32.95% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type BYK-W 907.

[0048] Comparative Example 2 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 9% 4,4'-diaminodiphenylmethane epoxy resin, 2.7% CELLOXIDE 2021P diluent, 50.55% NQ1130F filler, 0.3% N700 carbon black, 0.2% KH560 coupling agent, and 0.2% BYK-W907 dispersant; component B comprises 3.4% DETDA curing agent, 33.45% NQ1130F filler, 0.1% KH560 coupling agent, and 0.1% BYK-W 907 dispersant.

[0049] Comparative Example 3 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 10.4% epoxy resin of type JS2806, 51.85% filler of type NQ1130F, 0.3% carbon black of type N700, 0.2% coupling agent of type KH560, and 0.2% dispersant of type BYK-W 907; component B comprises 4.7% curing agent of type DETDA, 32.15% filler of type NQ1130F, 0.1% coupling agent of type KH560, and 0.1% dispersant of type BYK-W 907.

[0050] Comparative Example 4 An epoxy resin composition, by mass fraction, comprises component A and component B, wherein component A comprises 12.3% of epoxy resin of type KR-470, 49.95% of filler of type NQ1130F, 0.3% of carbon black of type N700, 0.2% of coupling agent of type KH560 and 0.2% of dispersant of type BYK-W 907; component B comprises 2.8% of curing agent of type DETDA, 34.05% of filler of type NQ1130F, 0.1% of coupling agent of type KH560 and 0.1% of dispersant of type BYK-W 907.

[0051] The epoxy resin compositions prepared in Examples 1-14 and Comparative Examples 1-4 were subjected to performance tests, and the test methods are as follows: 1. Viscosity test: The viscosity test shall be conducted in accordance with the method of GB / T 22314-2008; 2. Water absorption rate test: The water absorption rate test shall be conducted in accordance with the method of GB / T 1034-2008; 3. Curing shrinkage test: The curing shrinkage rate shall be tested in accordance with the method of ISO 3521:1997; 4. Flexural modulus test: The flexural modulus shall be tested in accordance with the method of ASTM 790D-17; 5. Glass transition temperature (Tg) test: The glass transition temperature shall be tested in accordance with the method of GB / T22567-2008; 6. Coefficient of thermal expansion (CTE1) test: The coefficient of thermal expansion shall be tested in accordance with ASTM E831-12. 7. Dielectric strength test: Dielectric strength test shall be performed in accordance with ASTM D3426-97.

[0052] The test results are shown in Tables 1 and 4.

[0053] Table 1

[0054] Table 2

[0055] Table 3

[0056] Table 4

[0057] As can be seen from the test data in Tables 1 to 4, the present invention uses epoxy resin with a specific structure and high-performance diluent in combination to significantly reduce viscosity, shrinkage rate and modulus, while improving resistance to damp heat. When applied to high-reliability packaging such as power module electronic components, motors, capacitors, sensors, and transformers, it has excellent potting operation, anti-delamination and reliability characteristics.

[0058] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An epoxy resin composition, characterized in that: Measured by mass fraction, including component A and component B; Component A comprises: 5-12% epoxy resin, 0.4-2.5% diluent, 40-60% first filler, 0.1-0.5% first coupling agent, 0.1-0.5% first dispersant, and 0.1-0.5% carbon black; Component B comprises: 2.5-5% curing agent, 25-40% second filler, 0.1-0.3% second coupling agent, and 0.1-0.3% second dispersant; The epoxy resin includes compound I and compound II; The structural formula of compound I is shown in Formula I: Equation I; The structural formula of compound II is shown in Formula II: Formula II, In Formula II, R1 is independently selected from -CH3, -CH2CH3, At least one of them; R2 is independently selected from , , At least one of them.

2. The epoxy resin composition according to claim 1, characterized in that: Compound II is selected from compounds shown in Formula III; Formula III.

3. The epoxy resin composition according to claim 1, characterized in that: The mass ratio of compound I to compound II in the epoxy resin is 0.3 to 3:

1.

4. An epoxy resin composition according to claim 1, characterized in that: The mass ratio of compound I to compound II in the epoxy resin is 1~2:

1.

5. The epoxy resin composition according to claim 1, characterized in that: The epoxy resin also includes compound III, the structural formula of which is shown in formula IV: Formula IV; The mass ratio of compound III to compound I is 0.3 to 1:

1.

6. The epoxy resin composition according to claim 1, characterized in that: The diluent is selected from N-(2-methylphenyl)-N-(1,2-epoxypropyl)-epoxyethylene methylamine and 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate. The mass ratio of the diluent to compound I is 0.05 to 1:

1.

7. The epoxy resin composition according to claim 1, characterized in that: The first filler and the second filler are independently selected from at least one of crystalline silica, spherical fused silica, and alumina; The first coupling agent and the second coupling agent are independently selected from at least one of KH560 and KBM803; The first dispersant and the second dispersant are independently selected from at least one of the following: DISPERBYK-108, BYK-W 907, ADDITALDX633, and ADDITALDX 675.

8. A method for preparing the epoxy resin composition according to any one of claims 1 to 7, characterized in that: Includes the following steps: Preparation of Component A: Epoxy resin, diluent, first coupling agent and first dispersant are premixed, then carbon black and first filler are added, and the mixture is stirred once at 50~70℃, cooled and ground, and then stirred a second time at 50~70℃ and degassed under vacuum to obtain Component A. Preparation of Component B: The curing agent, the second coupling agent, and the second dispersant are premixed, and then the second filler is added. The mixture is first stirred at 50~70℃, cooled, ground, and then stirred a second time at 50~70℃. Vacuum degassing is performed to obtain Component B.

9. The use of an epoxy resin composition according to any one of claims 1 to 7 or an epoxy resin composition obtained by the preparation method according to claim 8 as an encapsulation material in power module electronic components, electrodes, capacitors, sensors or transformers.

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