Chip pick-and-place manipulator of full-automatic die bonder

Abstract

The present application relates to chip production technical field, especially a kind of chip pick-and-place manipulator of full-automatic die bonder, including workbench, the workbench upper end is provided with suction pump, the workbench one end is fixedly connected with motor, the output shaft of motor is fixedly connected with runner, the lateral wall of workbench both sides are rotatably provided with runner, and transmission belt is connected between two runners, the lateral wall of the end of workbench away from motor is bolted with link frame, sliding table is fixedly connected on the transmission belt.The chip pick-and-place manipulator of full-automatic die bonder provided in the present application, when the gas extracted by suction pump is sprayed inward, the chip can be quickly cleaned, when the gas extracted by suction pump is sprayed outward, the chuck can be used to adsorb the chip, and the gas extracted can quickly detect that the chuck is not located directly above the chip, and is extracted, effectively reduce the load during transportation, and the setting of link frame can balance relative to motor.

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