Embedded computer backplane meeting openvpx standard

Abstract

This invention belongs to the field of computer communication technology and discloses an embedded computer backplane conforming to the OpenVPX standard. It includes a base plate, a power management module, and multiple load slots disposed on the base plate. The power management module, disposed on the base plate, includes a power management coprocessor and a programmable power distribution unit. The power management coprocessor receives voltage setpoints and current limits determined by an external system management controller based on the power consumption of each load slot, and sends control commands for the voltage setpoints and current limits to the programmable power distribution unit. The programmable power distribution unit outputs the voltage setpoints and current limits to the corresponding load slots according to the control commands. In this invention, the power management module can achieve independent power supply control and dynamic power adjustment for the loads in each load slot, solving the problems of resource waste and insufficient power supply caused by fixed power distribution.

Description

Technical Field

[0001] This invention belongs to the field of computer communication technology, and specifically discloses an embedded computer backplane that meets the OpenVPX standard. Background Technology

[0002] The OpenVPX standard (officially known as VITA 65) is an open modular embedded computing system architecture standard designed to solve the problem of "physical compatibility but functional incompatibility" in VPX (VITA 46) systems and achieve plug-and-play interoperability across vendor hardware.

[0003] Existing OpenVPX-compliant backplanes have significant shortcomings in power management, specifically in their limited and unintelligent power management functionality. Current OpenVPX-compliant embedded computer backplanes only achieve basic power plane distribution via P0 connectors, employing a fixed voltage and power allocation scheme for each load slot, failing to dynamically adjust based on the actual power consumption requirements of the load slots. When a high-power module is inserted into a load slot, insufficient power supply may lead to system instability; conversely, when a low-power module occupies a load slot, power resources are wasted.

[0004] The reason for the above defects is that traditional backplane design follows the mindset of "passive interconnection", focusing only on signal integrity and failing to regard the power supply network as a manageable system resource. Summary of the Invention

[0005] The purpose of this invention is to provide an embedded computer backplane that meets the OpenVPX standard, so as to solve the technical problem that existing backplanes cannot dynamically adjust according to the actual power consumption requirements of the load slots, resulting in system instability or waste of power resources.

[0006] This invention provides an embedded computer backplane that meets the OpenVPX standard, including a base plate, a power management module, and multiple load slots disposed on the base plate;

[0007] The power management module is disposed on the substrate, and the power management module includes a power management coprocessor and a programmable power distribution unit.

[0008] The power management coprocessor is used to receive voltage setpoints and current limits determined by an external system management controller based on the power consumption of each load slot, and to send the control commands for the voltage setpoints and current limits to the programmable power distribution unit.

[0009] The programmable power distribution unit is used to output the voltage setting value and the current limit value to the corresponding load slot according to the control command.

[0010] Preferably, the programmable power distribution unit includes a digitally adjustable voltage regulator, a current-sensing amplifier, an electronic fuse, and a MOSFET switch;

[0011] The digitally adjustable voltage regulator is used to output the voltage setpoint and the current limit to the corresponding load slot according to the control command;

[0012] The current sensing amplifier is used to obtain the load current of the corresponding load slot and send the load current to the electronic fuse;

[0013] The electronic fuse is used to turn off the MOSFET switch of the corresponding load slot when an overcurrent or short circuit occurs in the load slot.

[0014] Preferably, the voltage setting value is in the range of 0.8V to 5V.

[0015] Preferably, it further includes an onboard storage and exchange unit and a reserved slot disposed on the substrate;

[0016] The onboard storage switching unit includes a storage switching chip and an onboard storage interface;

[0017] The storage switching chip is used to receive protocol conversion instructions from the storage controller module in the reserved slot, and to convert between PCIe protocol and SAS / SATA protocol according to the protocol conversion instructions;

[0018] The onboard storage interface is located at the edge of the substrate and is used to connect the storage switching chip and the storage terminal device.

[0019] Preferably, the storage terminal device is an external storage device or an onboard M.2 solid-state drive.

[0020] Preferably, it also includes a distributed monitoring unit;

[0021] The distributed monitoring unit includes a slot status monitoring module and a backplane environment monitoring module;

[0022] The slot status monitoring module is installed at the load slot and connected to the system management controller;

[0023] The backplane environmental monitoring module is located at the heat-generating location and the power input port of the backplane, and is connected to the system management controller.

[0024] Preferably, the slot status monitoring module includes a first temperature sensor, a slot insertion detection circuit, and a connector contact resistance monitoring circuit.

[0025] Preferably, the backplane environmental monitoring module includes a second temperature sensor, a voltage sensor, and a current sensor;

[0026] The second temperature sensor is located at the air inlet, air outlet, and heating area of ​​the back panel;

[0027] Both the voltage sensor and the current sensor are located at the power input port on the back panel.

[0028] This invention provides an embedded computer backplane that meets the OpenVPX standard, and compared to existing technologies, it has the following advantages:

[0029] The power management module of this invention can realize independent power supply control and dynamic power adjustment for each load slot, solving the problems of resource waste and insufficient power supply caused by fixed power distribution.

[0030] This invention integrates storage switching functionality into the backplane layer, providing onboard storage interfaces, reducing the system layers and transmission latency of storage device access, and improving storage integration.

[0031] This invention enables comprehensive and proactive monitoring of the backplane's own operating status, filling the gap in existing systems that rely solely on module-reported status.

[0032] This invention comprehensively enhances the functional integrity and intelligence level of the OpenVPX backplane as a basic platform for embedded systems through a three-in-one design of refined power supply, proactive monitoring, and integrated storage, providing a better solution for high-reliability and high-density application scenarios. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of an embedded computer backplane that meets the OpenVPX standard according to an embodiment of the present invention.

[0034] In the diagram: 1 is the substrate; 2 is the load slot; 3 is the reserved slot; 4 is the power management module. Detailed Implementation

[0035] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0036] This invention provides a 5-slot embedded computer backplane that meets the OpenVPX standard, aiming to solve the problems of crude power management, low integration of high-speed storage, and insufficient health monitoring capabilities in existing technologies. The backplane adopts a 6U form factor and conforms to the VITA 65 OpenVPX standard specification.

[0037] The embedded computer backplane of this invention, which meets the OpenVPX standard, enables refined power supply management for each slot load, improves the integration of onboard information communication and high-speed storage, and provides real-time monitoring and health assessment of the backplane's own operating status. This provides a more complete and intelligent basic platform for highly reliable and high-density embedded applications.

[0038] This invention provides an embedded computer backplane that meets the OpenVPX standard, such as... Figure 1 As shown, it includes a substrate 1, a power management module 4, and multiple load slots 2 disposed on the substrate 1.

[0039] In this embodiment of the invention, the substrate 1 adopts a multilayer high-speed PCB design, and the stack-up structure is optimized according to signal integrity requirements, including a power layer, a ground layer, a high-speed signal layer, and a control management layer.

[0040] The substrate 1 of this embodiment includes a load slot 2 and a reserved slot 3. The slots are arranged according to a standard spacing, and the slots are defined as follows:

[0041] The general-purpose load slot 2 supports the insertion of various functional modules compliant with the OpenVPX standard, such as processor modules, FPGA computing modules, and I / O interface modules. Each slot is equipped with complete P0, P1, and P2 connectors. P0 is used for power supply and system management, P1 is used for communication between the data plane and control plane, and P2 is used for the expansion plane.

[0042] Slot 3 is reserved as a dedicated storage slot or a switching slot, which can be used in conjunction with the subsequent onboard storage switching unit to support the insertion of storage controller modules or high-performance switching modules.

[0043] The slots are interconnected via high-speed differential signal lines. The data plane uses a dual-star topology, the control plane uses a star topology, and the expansion plane uses a daisy-chain topology to ensure the bandwidth and latency requirements of different communication needs.

[0044] In this embodiment of the invention, the power management module 4 is disposed on the substrate 1. The power management module 4 has a multi-channel power input interface to support primary and backup redundant power input. Each channel is independently configured with reverse connection protection and surge suppression circuit.

[0045] The aforementioned power management module 4 includes a power management coprocessor and a programmable power distribution unit.

[0046] The power management coprocessor receives voltage setpoints and current limits determined by the external system management controller based on the power consumption of each load slot 2, and sends control commands for the voltage setpoints and current limits to the programmable power distribution unit. Exemplarily, the power management coprocessor uses a separate microcontroller, connected via I / O... 2 The C bus communicates with the system management controller and is responsible for executing power distribution algorithms, recording power event logs, and monitoring power conversion efficiency.

[0047] The programmable power distribution unit provides an independent power channel for each load slot 2, which outputs voltage setpoints and current limits to the corresponding load slot 2 according to control commands. Each channel of the programmable power distribution unit includes a digitally adjustable voltage regulator, a current-sensing amplifier, an electronic fuse, and a MOSFET switch. The digitally adjustable voltage regulator outputs voltage setpoints and current limits to the corresponding load slot 2 according to control commands; the current-sensing amplifier acquires the load current of the corresponding load slot 2 in real time and sends the load current to the electronic fuse; the electronic fuse has a programmable overcurrent protection threshold, which shuts off the MOSFET switch of the corresponding load slot 2 when an overcurrent or short circuit occurs in the load slot 2, thereby realizing independent power-on / power-off control for each load slot 2.

[0048] In this embodiment of the invention, the output voltage setting value of the digital adjustable voltage regulator is in the range of 0.8V to 5V, and it supports dynamic voltage adjustment within the range of 0.8V to 5V.

[0049] The working principle of the power management module 4 in this embodiment of the invention is as follows: The system management controller sends the voltage setting value and current limit value to the power management coprocessor through the power management protocol according to the power consumption requirements of each load slot 2; the power management coprocessor controls the digital adjustable voltage regulator of each channel to output the corresponding voltage and maintains the output stability through closed-loop feedback; when an overcurrent or short circuit occurs in a certain load slot 2, the electronic fuse turns off the MOSFET switch to cut off the channel within microseconds and reports the fault information at the same time, without affecting the normal operation of other load slots 2.

[0050] The power management module 4 of this invention can realize independent power supply control and dynamic power adjustment for the loads in each load slot 2, solving the problems of resource waste and insufficient power supply caused by fixed power allocation.

[0051] If external storage devices are used, current technology requires them to be connected to the backplane via a daughter card in load slot 2, increasing system latency and complexity. For applications requiring large-capacity onboard cache or solid-state storage, existing backplanes require additional use of valuable load slot 2 resources, reducing system slot utilization. This deficiency stems from the fact that traditional backplane designs compliant with the OpenVPX standard are primarily geared towards signal processing and general computing scenarios, with insufficient consideration for storage expansion.

[0052] To address the aforementioned issues, the embedded computer backplane conforming to the OpenVPX standard in this embodiment of the invention further includes an onboard storage switching unit; the onboard storage switching unit includes a storage switching chip and an onboard storage interface.

[0053] The storage switching chip receives protocol conversion instructions from the storage controller in reserved slot 3 and performs PCIe protocol to SAS / SATA protocol conversion according to the instructions. For example, the storage switching chip uses a SoC chip integrating PCIe switching and SAS / SATA control functions, supporting:

[0054] Uplink port: Connected to the switching module or dedicated storage controller in reserved slot 3 via a PCIe x4 link.

[0055] Downlink ports: Supports up to 8 independent SAS 3.0 or SATA 3.0 interfaces.

[0056] In this embodiment of the invention, storage management firmware is embedded inside the storage switching chip to achieve (1) basic disk array functions such as RAID 0 / 1 / 10; (2) storage resource pooling, allowing the system to dynamically allocate storage bandwidth and capacity; and (3) hot-swap management and automatic isolation of faulty disks.

[0057] The aforementioned onboard storage interface is located at the edge of substrate 1 and is used to connect the storage switching chip and storage terminal equipment. For example, the onboard storage switching unit includes four SFF-8643 high-speed storage interfaces, supporting connection to an external hard drive backplane or solid-state storage array (i.e., external storage devices); it also includes two M.2 solid-state drive sockets, supporting direct installation of onboard cache disks.

[0058] The working principle of the onboard storage switching unit in this embodiment of the invention is as follows: the storage controller in the reserved slot 3 accesses the storage switching chip through the PCIe link; the storage switching chip converts the PCIe protocol to the SAS / SATA protocol according to the upper layer instructions, and connects to the external storage device or the onboard M.2 solid-state drive through the onboard storage interface; the system can access the storage resources through the standard NVMe or SATA driver without additional adaptation.

[0059] This invention integrates storage switching functionality into the backplane layer, providing onboard storage interfaces, reducing the system layers and transmission latency of storage device access, and improving storage integration.

[0060] The existing backplane only supports basic IPMB system management bus communication, capable of transmitting simple status information between the chassis management controller and the slot modules. However, it lacks the ability to actively monitor the backplane's own operating parameters, such as real-time monitoring of voltage and current on critical power rails, connector temperature distribution, and slot insertion status identification. This results in the system being unable to provide early warnings before faults occur and making it difficult to pinpoint the exact location of intermittent faults. The reason for this deficiency is that traditional designs completely entrust health monitoring functions to an independent chassis management module, with the backplane merely serving as a passive transmission medium, neglecting the autonomous monitoring capabilities that the backplane, as a fundamental system platform, should possess.

[0061] To address the aforementioned issues, the embedded computer backplane conforming to the OpenVPX standard in this embodiment of the invention further includes a distributed monitoring unit; the distributed monitoring unit includes a slot status monitoring module and a backplane environment monitoring module.

[0062] The aforementioned slot status monitoring module is located at load slot 2, specifically near the P0 connector of load slot 2, and is connected to the system management controller; the backplane environment monitoring module is located at the heat-generating location and the power input port of the backplane, and is connected to the system management controller.

[0063] The slot status monitoring module includes a first temperature sensor, a slot insertion detection circuit, and a connector contact resistance monitoring circuit. The first temperature sensor is mounted near the P0 connector pads to monitor the temperature rise at the connection point; the slot insertion detection circuit uses a dual detection module of mechanical switch and optocoupler to detect the insertion status; and the connector contact resistance monitoring circuit uses a four-wire Kelvin detection method to evaluate the connection reliability in real time.

[0064] The backplane environmental monitoring module includes a second temperature sensor, a voltage sensor, and a current sensor. The second temperature sensor is located at the air inlet, air outlet, and heat-generating area of ​​the backplane, especially in the critical heat-generating area. The voltage sensor and the current sensor are both located at the power input port of the backplane.

[0065] The distributed monitoring unit of this invention is connected to the system management controller, and all monitoring nodes are connected via dual-redundant I / O. 2 The C bus is connected to the system management controller. The bus adopts a segmented isolation design to ensure that a single point of failure does not affect the entire network communication.

[0066] The system management controller in this embodiment of the invention adopts a dedicated baseboard management controller, runs an embedded real-time operating system, and is responsible for:

[0067] A. Poll each monitoring node 10 times per second to collect data such as voltage, current, temperature, and insertion status.

[0068] B. Store the collected data locally and perform trend analysis to establish a health baseline model.

[0069] C. When the monitored parameters exceed the preset threshold or the trend is abnormal, an alarm message is generated and reported to the chassis management unit via the IPMB bus.

[0070] D supports remote querying and configuration of monitoring parameters.

[0071] In this embodiment of the invention, multiple sensors are deployed at the connector and key heat points in the load slot 2, enabling comprehensive active monitoring of the backplane's own operating status and filling the blind spot of existing technologies that rely solely on module-reported status.

[0072] The system management controller of this invention serves as the management core of the backplane, and communicates via dedicated I / O pins. 2 The C-bus is connected to the power management module 4 and the distributed monitoring unit, and at the same time communicates with the IPMC of each slot module through the IPMB bus, forming a complete system management architecture.

[0073] The power management module 4 of this invention supplies power to each load slot 2 via independent power lines. The power lines and high-speed signal lines are strictly separated to avoid electromagnetic interference. The sensors of the distributed monitoring unit are mounted in key locations, and their data lines are routed through the inner layer of the backplane to the system management controller.

[0074] The onboard storage switching unit is connected to the P1 connector in the reserved slot 3 via high-speed SerDes traces to achieve communication with the storage controller module; at the same time, it is connected to external storage devices via the SFF-8643 interface on the edge of the backplane. The storage signal traces are designed with impedance matching and length compensation according to the SAS 3.0 standard.

[0075] The above-mentioned technical features of this invention work together to form a fully functional and intelligent embedded computer backplane that meets the OpenVPX standard. It realizes refined power supply management, high-integration storage support and all-round health monitoring, significantly improving the functional integrity and intelligence level of the backplane as a system basic platform.

[0076] The embedded computer backplane of this invention, which meets the OpenVPX standard, has the following beneficial effects:

[0077] (i) Power supply management dimension: Achieve refined power allocation and dynamic adjustment to improve system power supply reliability and energy efficiency.

[0078] Compared to the crude approach of existing technologies that rely solely on a fixed power plane for power distribution, the programmable power distribution unit employed in this invention offers the following advantages:

[0079] First, the utilization rate of power supply resources is significantly improved. Each load slot 2 is equipped with an independent digitally adjustable voltage regulator, and the system management controller can dynamically adjust the output voltage and current limits according to the actual power consumption requirements of the inserted modules. For example, when a low-power I / O module is inserted into the slot, the power supply margin is automatically reduced; when a high-performance computing module is inserted, sufficient power support is provided in a timely manner. This on-demand allocation mechanism avoids the resource waste caused by the "one-size-fits-all" power supply in existing technologies. Actual measurements show that in scenarios with mixed insertion of multiple types of modules, the overall power consumption of the board can be reduced by 15% to 20%.

[0080] Second, fault isolation capability is significantly enhanced. The independently configured electronic fuses and programmable overcurrent protection thresholds in each load slot 2 achieve microsecond-level fault isolation. When a short circuit or overcurrent occurs in a load slot 2, only the power supply to that load slot 2 is cut off, while the remaining load slots 2 continue to operate normally, completely solving the reliability problem of single-point faults potentially causing the entire board to lose power in existing technologies. This feature is particularly important for high-reliability applications such as aerospace and industrial control.

[0081] Third, power status visualization and traceability. The power management coprocessor continuously records voltage, current, and power data, as well as event logs for each slot, providing a data foundation for system-level power management and fault analysis. Maintenance personnel can query historical power data through a remote management interface to accurately locate intermittent power supply faults, significantly reducing system maintenance difficulty.

[0082] (ii) Health monitoring dimension: Construct a comprehensive proactive sensing network to improve system maintainability and early warning capabilities.

[0083] Compared to existing technologies that rely solely on the IPMC module to report basic status and lack monitoring of the backplane itself, the distributed monitoring unit deployed in this invention achieves the following breakthroughs:

[0084] First, comprehensive coverage of monitoring blind spots. Temperature sensors deployed near the connector pads in load slot 2 directly monitor contact point temperature rise, promptly identifying potential localized overheating due to poor contact. The connector contact resistance monitoring circuit can identify decreased contact reliability caused by early oxidation or loosening. Multiple ambient temperature sensors can plot backplane temperature distribution, providing a basis for optimizing heat dissipation design. This monitoring data gives the system a comprehensive understanding of the backplane's health status.

[0085] Second, fault early warning shifts from passive response to proactive prevention. The system management controller collects monitoring data 10 times per second and establishes a health baseline model through a built-in trend analysis algorithm. When the temperature change rate of a certain load slot 2 increases abnormally or the contact resistance continues to increase, the system can issue an early warning hours or even days before the fault occurs, prompting maintenance personnel to take preventive measures. This predictive maintenance capability is impossible to achieve in existing technologies and can effectively avoid losses caused by unplanned downtime.

[0086] Third, the accuracy of fault location is significantly improved. Traditional fault diagnosis requires replacing modules one by one, which is time-consuming and complex. This invention, through slot insertion detection circuit and connector status monitoring, can quickly distinguish whether the fault source is the daughter card module or the backplane itself; through voltage and current monitoring data, it can accurately locate abnormal points in the power supply link. Actual tests show that the average fault location time can be reduced from hours to minutes.

[0087] (III) System Integration Dimension: Optimize onboard resource layout to improve overall space utilization efficiency and system performance.

[0088] The technical solution of this invention produces the following synergistic effects at the system level:

[0089] First, slot utilization is significantly improved. The onboard storage switching unit integrates the storage interface functions that originally required occupying load slots onto the backplane, freeing up valuable slot resources. Taking a typical configuration as an example, the traditional solution requires two slots for the switching module and the storage controller respectively, while this invention only requires one slot to achieve the same function, improving slot utilization by approximately 20%.

[0090] Secondly, the system architecture is simplified, and transmission latency is reduced. The storage switching unit is directly integrated into the backplane, and storage devices can be accessed nearby via onboard interfaces, avoiding the multi-level path required by traditional solutions where stored data must be transferred through a daughter card and then through the backplane. The signal transmission path is shortened, the protocol conversion layers are reduced, and the measured storage access latency is reduced by approximately 30%, effectively improving the system response speed of data-intensive applications.

[0091] Third, electromagnetic compatibility (EMC) performance has been optimized. The partitioned layout of the power management module 4 and high-speed signal traces reduces the impact of power supply noise on signal integrity; the dual-redundant bus design of the distributed monitoring unit enhances the system's reliability in complex electromagnetic environments. The overall system's ability to pass CE and FCC Class A EMC tests has been improved, shortening the certification cycle for system integrators.

[0092] In summary, this invention comprehensively enhances the functional integrity and intelligence level of the OpenVPX backplane as a basic platform for embedded systems through a three-in-one design of refined power supply, proactive monitoring, and integrated storage, providing a better solution for high-reliability, high-density application scenarios.

[0093] The above descriptions are merely a few embodiments of the present invention and are not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any modifications or alterations made by those skilled in the art without departing from the scope of the technical solution of the present invention using the disclosed technical content are equivalent to equivalent implementation cases and fall within the scope of the technical solution.

Claims

1. An embedded computer backplane conforming to the OpenVPX standard, characterized in that, It includes a substrate, a power management module, and multiple load slots disposed on the substrate; The power management module is disposed on the substrate, and the power management module includes a power management coprocessor and a programmable power distribution unit. The power management coprocessor is used to receive voltage setpoints and current limits determined by an external system management controller based on the power consumption of each load slot, and to send the control commands for the voltage setpoints and current limits to the programmable power distribution unit. The programmable power distribution unit is used to output the voltage setting value and the current limit value to the corresponding load slot according to the control command.

2. The embedded computer backplane conforming to the OpenVPX standard according to claim 1, characterized in that, The programmable power distribution unit includes a digitally adjustable voltage regulator, a current-sensing amplifier, an electronic fuse, and a MOSFET switch. The digitally adjustable voltage regulator is used to output the voltage setpoint and the current limit to the corresponding load slot according to the control command; The current sensing amplifier is used to obtain the load current of the corresponding load slot and send the load current to the electronic fuse; The electronic fuse is used to turn off the MOSFET switch of the corresponding load slot when an overcurrent or short circuit occurs in the load slot.

3. The embedded computer backplane conforming to the OpenVPX standard according to claim 2, characterized in that, The voltage setting value is in the range of 0.8V to 5V.

4. The embedded computer backplane conforming to the OpenVPX standard according to claim 1, characterized in that, It also includes an onboard storage and exchange unit and a reserved slot on the substrate; The onboard storage switching unit includes a storage switching chip and an onboard storage interface; The storage switching chip is used to receive protocol conversion instructions from the storage controller module in the reserved slot, and to convert between PCIe protocol and SAS / SATA protocol according to the protocol conversion instructions; The onboard storage interface is located at the edge of the substrate and is used to connect the storage switching chip and the storage terminal device.

5. The embedded computer backplane conforming to the OpenVPX standard according to claim 4, characterized in that, The storage terminal device is an external storage device or an onboard M.2 solid-state drive.

6. The embedded computer backplane conforming to the OpenVPX standard according to claim 1, characterized in that, It also includes distributed monitoring units; The distributed monitoring unit includes a slot status monitoring module and a backplane environment monitoring module; The slot status monitoring module is installed at the load slot and connected to the system management controller; The backplane environmental monitoring module is located at the heat-generating location and the power input port of the backplane, and is connected to the system management controller.

7. The embedded computer backplane conforming to the OpenVPX standard according to claim 6, characterized in that, The slot status monitoring module includes a first temperature sensor, a slot insertion detection circuit, and a connector contact resistance monitoring circuit.

8. The embedded computer backplane conforming to the OpenVPX standard according to claim 6, characterized in that, The backplane environmental monitoring module includes a second temperature sensor, a voltage sensor, and a current sensor; The second temperature sensor is located at the air inlet, air outlet, and heating area of ​​the back panel; Both the voltage sensor and the current sensor are located at the power input port on the back panel.

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