Inductor structure and method of making the same

Abstract

An inductor structure and its manufacturing method include: at least two solder pads; a wound helical coil disposed on the upper surface of the at least two solder pads, and the two ends of the wound helical coil being electrically connected to the at least two solder pads respectively; and a covering layer covering the wound helical coil and the at least two solder pads, and exposing the lower surface of the at least two solder pads.

Description

Technical Field

[0001] This disclosure relates to an inductor, and more particularly to an inductor structure and manufacturing method that does not generate noise under high current / high frequency operation. Background Technology

[0002] like Figure 1 As shown, the existing inductor 1 has a coil 10 embedded in an insulating material 11, with an electrode 12 connected to each end of the coil 10. The electrodes 12 are then bent and attached to the side and bottom surfaces of the insulating material 11. However, when the exposed electrodes 12 are not tightly attached to the insulating material 11, noise will be generated under high current / high frequency operation.

[0003] Therefore, overcoming the problems of the existing technologies has become an urgent issue for the industry. Summary of the Invention

[0004] The purpose of this invention is to provide an inductor structure and its manufacturing method to solve at least one of the above-mentioned problems.

[0005] This disclosure provides a method for manufacturing an inductor structure, comprising: electroplating at least two pads on a carrier plate using a patterned exposure and development process; disposing a wound spiral coil on the upper surface of the at least two pads, wherein the two ends of the wound spiral coil are electrically connected to the at least two pads respectively, wherein the body of the wound spiral coil is a copper wire or a copper alloy wire; forming a cladding layer on the carrier plate to cover the wound spiral coil and the at least two pads; and removing the carrier plate to expose the cladding layer on the lower surface of the at least two pads.

[0006] As described above in the method for manufacturing an inductor structure, after electroplating to form the at least two solder pads and before setting the wound spiral coil, another patterning exposure and development process is performed to electroplat a vertically shaped magnetic pillar on the carrier plate and in the area between the at least two solder pads.

[0007] As described above in the method for manufacturing an inductor structure, after electroplating to form the at least two solder pads and before setting the wound spiral coil, a first insulating layer is first formed to cover the carrier plate and the at least two solder pads, and a portion of the first insulating layer is removed to expose the upper surface of the at least two solder pads.

[0008] As described above in the method for manufacturing an inductor structure, after forming the first insulating layer and exposing the upper surface of the at least two solder pads, another patterning exposure and development process is then performed to electroplate a vertical magnetic pillar on the first insulating layer and in the area between the at least two solder pads.

[0009] As described above in the method of manufacturing an inductor structure, after forming the magnetic post, the wound spiral coil is disposed on the upper surface of the at least two solder pads and the first insulating layer, and the magnetic post is framed thereon. Then, a second insulating layer is formed on the upper surface of the at least two solder pads and the first insulating layer, covering the wound spiral coil and the magnetic post, so that the first insulating layer and the second insulating layer together serve as the covering layer.

[0010] As described above in the method for manufacturing an inductor structure, the covering layer is a magnetic insulating material.

[0011] As described above in the method for manufacturing an inductor structure, after removing the carrier plate, a surface treatment process is performed to form a surface treatment layer on the lower surface of the at least two pads.

[0012] The aforementioned method for manufacturing an inductor structure further includes using a laser spot welding process to weld and fix the two ends of the wound helical coil to the upper surface of the at least two solder pads.

[0013] This disclosure also provides an inductor structure, including: at least two solder pads, each solder pad having an opposing upper surface and a lower surface; a wound spiral coil disposed on the upper surface of the at least two solder pads, wherein the two ends of the wound spiral coil are electrically connected to the at least two solder pads, wherein the body of the wound spiral coil is copper wire or copper alloy wire; and a cladding layer covering the wound spiral coil and the at least two solder pads, and exposing the lower surface of the at least two solder pads.

[0014] The inductor structure described above also includes a magnetic post embedded in the cladding layer and erected between the at least two solder pads, wherein the wound helical coil frame surrounds the magnetic post.

[0015] As described above inductor structure, one end face of the magnetic post is exposed outside the cladding layer.

[0016] As described above inductor structure, the covering layer includes a first insulating layer and a second insulating layer. The first insulating layer covers the at least two solder pads and exposes the upper and lower surfaces of the at least two solder pads. The second insulating layer is disposed on the first insulating layer and covers the wound helical coil.

[0017] As described above, the inductor structure further includes a magnetic post embedded in the second insulating layer and erected on the first insulating layer, wherein the wound helical coil frame surrounds the magnetic post.

[0018] The inductor structure described above also includes a surface treatment layer disposed on the lower surface of the at least two solder pads.

[0019] As described above in the inductor structure, the covering layer is a magnetic insulating material.

[0020] In summary, the inductor structure and manufacturing method disclosed herein allow the wound spiral coil and solder pads to be encased in magnetic insulating material. The resulting inductor structure will not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate type of copper wire for winding, which is beneficial for various designs and applications. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of an existing inductor.

[0022] Figures 2A to 2E This is a cross-sectional schematic diagram of the first embodiment of the manufacturing method of the inductor structure disclosed herein.

[0023] Figures 3A to 3F This is a cross-sectional schematic diagram of a second embodiment of the method for manufacturing the inductor structure disclosed herein.

[0024] Figures 4A to 4F This is a cross-sectional schematic diagram of a third embodiment of the method for manufacturing the inductor structure disclosed herein.

[0025] The attached figures are labeled as follows:

[0026] 1. Inductor

[0027] 10 coils

[0028] 11 Insulation materials

[0029] 12 electrodes

[0030] 2,3,4 Inductor Structure

[0031] 20 Load-bearing plate

[0032] 21 solder pads

[0033] 21a Upper surface

[0034] 21b Lower surface

[0035] 22. Wire-wound helical coil

[0036] 221 endpoint

[0037] 23. Coating layer

[0038] 231 First Insulation Layer

[0039] 232 Second Insulation Layer

[0040] 24 Surface treatment layer

[0041] 25 magnetic posts Detailed Implementation

[0042] The following specific embodiments illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification.

[0043] It should be understood that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this disclosure. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effectiveness and purpose of this disclosure, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "below," "first," "second," and "at least two" used in this specification are merely for clarity of description and are not intended to limit the scope of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this disclosure's implementation.

[0044] Figures 2A to 2E This is a cross-sectional schematic diagram of a first embodiment of the manufacturing method of the inductor structure 2 disclosed herein. The manufacturing method of the inductor structure 2 disclosed herein employs IC substrate technology.

[0045] like Figure 2A As shown, a carrier plate 20 is first provided. At least two solder pads 21 are electroplated on the carrier plate 20 using a patterned exposure and development process.

[0046] The carrier plate 20 is a semiconductor packaging carrier material, such as a rigid composite semiconductor packaging carrier material of insulating material and metal material (such as stainless steel, copper, copper alloy, aluminum alloy or combination thereof), but there are no particular restrictions.

[0047] Each of the solder pads 21 has an upper surface 21a and a lower surface 21b, and the lower surface 21b is disposed on the support plate 20. Each of the solder pads 21 may be, for example, copper metal or solder.

[0048] like Figure 2B As shown, a wound helical coil 22 is disposed on the upper surface 21a of the at least two pads 21.

[0049] The wound helical coil 22 has two opposing ends 221, which are electrically connected to at least two solder pads 21. In this embodiment, the two ends 221 of the wound helical coil 22 are first placed on the upper surface 21a of the at least two solder pads 21, and then the two ends 221 of the wound helical coil 22 are welded and fixed to the upper surface 21a of the at least two solder pads 21 by laser spot welding.

[0050] Furthermore, the body of the wound spiral coil 22 is formed of copper wire, copper alloy wire, enameled copper wire, enameled copper alloy wire, enameled aluminum wire, or enameled alloy wire, and the number of turns can be designed according to requirements. Appropriate copper wire can be selected and pre-made by a winding machine according to the resistance / inductance value requirements.

[0051] like Figure 2C As shown, a covering layer 23 is formed on the carrier plate 20 to cover the wound spiral coil 22 and the at least two solder pads 21.

[0052] The coating layer 23 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0053] Furthermore, the coating layer 23 is formed on the support plate 20 by molding, coating or pressing.

[0054] like Figure 2D As shown, the carrier plate 20 is removed, exposing the lower surface 21b of the at least two solder pads 21 through the cladding layer 23.

[0055] like Figure 2E As shown, a surface treatment process is performed to form a surface treatment layer 24 on the lower surface 21b of the at least two pads 21, and a dicing process is performed to obtain the inductor structure 2 of this disclosure.

[0056] The surface treatment layer 24 can be formed on the lower surface 21b of the solder pad 21 by electroplating, and the material of the surface treatment layer 24 can be, for example, nickel / gold (Ni / Au), nickel / silver (Ni / Ag), nickel / tin (Ni / Sn), nickel / palladium / gold (Ni / Pd / Au), solder material or organic solder resist (OSP), etc.

[0057] In summary, the method for manufacturing the inductor structure disclosed herein uses IC substrate technology combined with a wound spiral coil, so that the wound spiral coil and the solder pad are both covered in the coating layer and integrally formed. The resulting inductor structure will not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate copper wire type for winding, which is beneficial to various designs and applications.

[0058] Figures 3A to 3FThis is a cross-sectional schematic diagram of a second embodiment of the manufacturing method of the inductor structure 3 of this disclosure. The technical difference between the second embodiment and the aforementioned first embodiment lies in the magnetic post 25; the same technical content will not be repeated below.

[0059] like Figure 3A As shown, a carrier plate 20 is first provided. At least two solder pads 21 are electroplated on the carrier plate 20 using a patterned exposure and development process.

[0060] The carrier plate 20 is a semiconductor packaging carrier material, such as a rigid composite semiconductor packaging carrier material of insulating material and metal material (such as stainless steel, copper, copper alloy, aluminum alloy or combination thereof), but there are no particular restrictions.

[0061] Each of the solder pads 21 has an upper surface 21a and a lower surface 21b, and the lower surface 21b is disposed on the support plate 20. Each of the solder pads 21 may be, for example, copper metal or solder.

[0062] like Figure 3B As shown, a vertical magnetic pillar 25 is formed by electroplating on the carrier plate 20 and the area between the at least two solder pads 21 using a patterned exposure and development process.

[0063] The magnetic post 25 has a columnar structure and its material can be at least one or a combination of magnetic materials such as iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn) and zinc (Zn), or an alloy metal such as NiFe, NiSe, CoNiFe, etc.

[0064] like Figure 3C As shown, a wound spiral coil 22 is disposed on the upper surface 21a of the at least two pads 21, and the wound spiral coil 22 frames the magnetic post 25.

[0065] The wound helical coil 22 has two opposing ends 221, which are electrically connected to at least two solder pads 21. In this embodiment, the wound helical coil 22 is first framed around the magnetic post 25, and the two ends 221 of the wound helical coil 22 are placed on the upper surfaces 21a of the at least two solder pads 21. Then, the two ends 221 of the wound helical coil 22 are welded and fixed to the upper surfaces 21a of the at least two solder pads 21 by laser spot welding.

[0066] Furthermore, the body of the wound spiral coil 22 is formed of copper wire, copper alloy wire, enameled copper wire, enameled copper alloy wire, enameled aluminum wire, or enameled alloy wire, and the number of turns can be designed according to requirements. Appropriate copper wire can be selected and pre-made by a winding machine according to the resistance / inductance value requirements.

[0067] like Figure 3DAs shown, a covering layer 23 is formed on the carrier plate 20 to cover the wound spiral coil 22, the magnetic post 25 and the at least two solder pads 21.

[0068] The coating layer 23 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0069] Furthermore, the coating layer 23 is formed on the support plate 20 by molding, coating or pressing.

[0070] like Figure 3E As shown, the carrier plate 20 is removed, so that the lower surface 21b of the at least two solder pads 21 and one end face of the magnetic post 25 are exposed on the lower surface of the covering layer 23.

[0071] like Figure 3F As shown, a surface treatment process is performed to form a surface treatment layer 24 on the lower surface 21b of the at least two pads 21, and a dicing process is performed to obtain the inductor structure 3 of this disclosure.

[0072] The surface treatment layer 24 can be formed on the lower surface 21b of the at least two solder pads 21 by electroplating, and the material of the surface treatment layer 24 can be, for example, nickel / gold (Ni / Au), nickel / silver (Ni / Ag), nickel / tin (Ni / Sn), nickel / palladium / gold (Ni / Pd / Au), solder material or organic solder resist (OSP), etc.

[0073] In summary, the method for manufacturing the inductor structure disclosed herein employs IC substrate technology combined with a wound spiral coil, in which the wound spiral coil, magnetic pillars, and solder pads are all encapsulated within a coating layer and integrally formed. The resulting inductor structure does not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate type of copper wire for winding, which is beneficial for various designs and applications.

[0074] Figures 4A to 4F This is a cross-sectional schematic diagram of a third embodiment of the manufacturing method of the inductor structure 4 of this disclosure. The technical difference between the third embodiment of this disclosure and the aforementioned first or second embodiment lies in the formation method of the coating layer 23; the same technical content will not be repeated below.

[0075] like Figure 4A As shown, a carrier plate 20 is first provided. At least two solder pads 21 are electroplated onto the carrier plate 20 using a patterned exposure and development process. Next, a first insulating layer 231 is formed on the carrier plate 20, covering the carrier plate 20 and the at least two solder pads 21. Then, a portion of the first insulating layer 231 is removed, exposing the upper surface 21a of the at least two solder pads 21.

[0076] The carrier plate 20 is a semiconductor packaging carrier material, such as a rigid composite semiconductor packaging carrier material of insulating material and metal material (such as stainless steel, copper, copper alloy, aluminum alloy or combination thereof), but there are no particular restrictions.

[0077] Each of the solder pads 21 has an upper surface 21a and a lower surface 21b, and the lower surface 21b is disposed on the support plate 20. Each of the solder pads 21 may be, for example, copper metal or solder.

[0078] The first insulating layer 231 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0079] The above embodiment is illustrated by first forming the solder pad 21 and then forming the first insulating layer 231. However, this disclosure is not limited to this. Alternatively, the first insulating layer 231 can be formed first, and then the solder pad 21 can be formed by electroplating in the opening of the first insulating layer 231.

[0080] like Figure 4B As shown, a vertical magnetic pillar 25 is formed by electroplating on the first insulating layer 231 and the area between the at least two solder pads 21 using a patterned exposure and development process.

[0081] The magnetic post 25 has a columnar structure and its material can be at least one or a combination of magnetic materials such as iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn) and zinc (Zn), or an alloy metal such as NiFe, NiSe, CoNiFe, etc.

[0082] like Figure 4CAs shown, a wound spiral coil 22 is disposed on the upper surface 21a of the first insulating layer 231 and the at least two solder pads 21, and the wound spiral coil 22 frames the magnetic post 25.

[0083] The wound helical coil 22 has two opposing ends 221, which are electrically connected to the at least two solder pads 21 respectively. In this embodiment, the wound helical coil 22 is first placed on the first insulating layer 231 and framed around the magnetic post 25, and the two ends 221 of the wound helical coil 22 are respectively placed on the upper surface 21a of the at least two solder pads 21. Then, the two ends 221 of the wound helical coil 22 are welded and fixed to the upper surface 21a of the at least two solder pads 21 by laser spot welding.

[0084] Furthermore, the body of the wound spiral coil 22 is formed of copper wire, copper alloy wire, enameled copper wire, enameled copper alloy wire, enameled aluminum wire, or enameled alloy wire, and the number of turns can be designed according to requirements. Appropriate copper wire can be selected and pre-made by a winding machine according to the resistance / inductance value requirements.

[0085] like Figure 4D As shown, a second insulating layer 232 is formed on the first insulating layer 231, and the second insulating layer 232 covers the wound spiral coil 22 and the magnetic post 25.

[0086] The second insulating layer 232 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0087] Furthermore, the second insulating layer 232 is formed on the first insulating layer 231 by molding, coating or pressing, and the first insulating layer 231 and the second insulating layer 232 can together serve as the covering layer 23. In addition, the materials of the first insulating layer 231 and the second insulating layer 232 can be the same or different, and this disclosure is not limited thereto.

[0088] like Figure 4E As shown, the carrier plate 20 is removed, so that the lower surface 21b of the at least two solder pads 21 is exposed to the lower surface of the first insulating layer 231.

[0089] like Figure 4FAs shown, a surface treatment process is performed to form a surface treatment layer 24 on the lower surface 21b of the at least two pads 21, and a dicing process is performed to obtain the inductor structure 4 of this disclosure.

[0090] The surface treatment layer 24 can be formed on the lower surface 21b of the at least two solder pads 21 by electroplating, and the material of the surface treatment layer 24 can be, for example, nickel / gold (Ni / Au), nickel / silver (Ni / Ag), nickel / tin (Ni / Sn), nickel / palladium / gold (Ni / Pd / Au), solder material or organic solder resist (OSP), etc.

[0091] In summary, the method for manufacturing the inductor structure disclosed herein employs IC substrate technology combined with a wound spiral coil, in which the wound spiral coil, magnetic post, and solder pad are respectively covered by a first insulating layer and a second insulating layer to form an integral structure. The resulting inductor structure will not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate type of copper wire for winding, which is beneficial for various designs and applications.

[0092] This disclosure also provides an inductor structure 2, including at least two pads 21, a wound spiral coil 22, a covering layer 23 and a surface treatment layer 24.

[0093] Each of the solder pads 21 has an opposing upper surface 21a and a lower surface 21b, and each of the solder pads 21 may be, for example, a copper metal or a solder material.

[0094] The wound helical coil 22 has two opposing ends 221, which are respectively welded and fixed to the upper surface 21a of the at least two solder pads 21 and electrically connected thereto. The wound helical coil 22 is formed of copper wire, copper alloy wire, enameled copper wire, enameled copper alloy wire, enameled aluminum wire, or enameled alloy wire, and its number of turns can be designed according to requirements. Appropriate copper wire can be selected and pre-made by a winding machine according to the resistance / inductance value requirements.

[0095] The covering layer 23 covers the wound spiral coil 22 and the at least two solder pads 21, and exposes the lower surface 21b of the at least two solder pads 21. The covering layer 23 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0096] The surface treatment layer 24 is bonded to the lower surface 21b of the at least two solder pads 21. The material of the surface treatment layer 24 may be, for example, nickel / gold (Ni / Au), nickel / silver (Ni / Ag), nickel / tin (Ni / Sn), nickel / palladium / gold (Ni / Pd / Au), solder material, or organic solder resist (OSP).

[0097] In summary, the inductor structure disclosed herein allows the wound spiral coil and solder pads to be encased within the cladding layer and integrally formed. The resulting inductor structure does not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate type of copper wire for winding, which is beneficial for various designs and applications.

[0098] This disclosure also provides an inductor structure 3, including at least two pads 21, a magnetic post 25, a wound spiral coil 22, a covering layer 23 and a surface treatment layer 24.

[0099] The solder pad 21 has an upper surface 21a and a lower surface 21b, and the solder pad 21 may be, for example, a copper metal or a solder material.

[0100] The magnetic post 25 is vertically disposed between the at least two solder pads 21. The magnetic post 25 is a columnar structure and its material can be a magnetically conductive material such as at least one or a combination of iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn) and zinc (Zn), or an alloy metal such as NiFe, NiSe, CoNiFe, etc.

[0101] The wound helical coil 22 surrounds the magnetic post 25 and has two opposing ends 221. The ends 221 are respectively welded and fixed to the upper surface 21a of the at least two solder pads 21 and electrically connected thereto. The body of the wound helical coil 22 is formed of copper wire, copper alloy wire, enameled copper wire, enameled copper alloy wire, enameled aluminum wire, or enameled alloy wire, and its number of turns can be designed according to requirements. Appropriate copper wire can be selected and pre-made by a winding machine according to the resistance / inductance value requirements.

[0102] The covering layer 23 covers the wound spiral coil 22, the magnetic post 25, and the at least two solder pads 21, and exposes the lower surface 21b of the at least two solder pads 21 and one end face of the magnetic post 25. The covering layer 23 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0103] The surface treatment layer 24 is bonded to the lower surface 21b of the at least two solder pads 21. The material of the surface treatment layer 24 may be, for example, nickel / gold (Ni / Au), nickel / silver (Ni / Ag), nickel / tin (Ni / Sn), nickel / palladium / gold (Ni / Pd / Au), solder material, or organic solder resist (OSP).

[0104] In summary, the inductor structure disclosed herein allows the wound spiral coil, magnetic post, and solder pad to be integrally formed within a covering layer. The resulting inductor structure does not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate type of copper wire for winding, which is beneficial for various designs and applications.

[0105] This disclosure also provides an inductor structure 4, including at least two solder pads 21, a magnetic post 25, a wound spiral coil 22, a first insulating layer 231, a second insulating layer 232, and a surface treatment layer 24.

[0106] The solder pad 21 has an upper surface 21a and a lower surface 21b, and the solder pad 21 may be, for example, a copper metal or a solder material.

[0107] The first insulating layer 231 covers the at least two solder pads 21 and exposes the upper surface 21a and lower surface 21b of the at least two solder pads 21 respectively. The first insulating layer 231 may be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder or iron-nickel alloy powder with a resin material. The resin material may be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber) and epoxy molding compound (EMC), or it may be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto.

[0108] The magnetic post 25 is erected on the first insulating layer 231 and in the area between the at least two solder pads 21. The magnetic post 25 has a columnar structure and its material can be a magnetically conductive material such as at least one or a combination of iron (Fe), nickel (Ni), cobalt (Co), manganese (Mn) and zinc (Zn), or an alloy metal such as NiFe, NiSe, CoNiFe, etc.

[0109] A wound helical coil 22 is disposed on the first insulating layer 231 and frames the magnetic post 25, and has two opposing ends 221. The ends 221 are respectively welded and fixed to the upper surface 21a of the at least two solder pads 21 and electrically connected thereto. The body of the wound helical coil 22 is formed of copper wire, copper alloy wire, enameled copper wire, enameled copper alloy wire, enameled aluminum wire, or enameled alloy wire, and its number of turns can be designed according to requirements. Appropriate copper wire can be selected and pre-made by a winding machine according to the resistance / inductance value requirements.

[0110] The second insulating layer 232 is formed on the first insulating layer 231 and covers the wound helical coil 22 and the magnetic post 25. The second insulating layer 232 can be a magnetic insulating material, such as a magnetically conductive material formed by combining iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder with a resin material. The resin material can be a non-photosensitive dielectric material, such as BT (Bismaleimide Triazine), FR5, ABF (Ajinomoto Build-up Film) (with or without glass fiber), and epoxy molding compound (EMC), or it can be a photosensitive dielectric material, such as solder resist and polyimide (PI), but is not limited thereto. The first insulating layer 231 and the second insulating layer 232 can together serve as the covering layer 23.

[0111] The surface treatment layer 24 is bonded to the lower surface 21b of the at least two solder pads 21. The material of the surface treatment layer 24 may be, for example, nickel / gold (Ni / Au), nickel / silver (Ni / Ag), nickel / tin (Ni / Sn), nickel / palladium / gold (Ni / Pd / Au), solder material, or organic solder resist (OSP).

[0112] In summary, the inductor structure disclosed herein allows the wound spiral coil, magnetic post, and solder pad to be integrally formed by being covered by the first insulating layer and the second insulating layer, respectively. The resulting inductor structure will not generate noise under high current / high frequency operation, and the inductance / resistance values ​​can be selected according to the appropriate type of copper wire for winding, which is beneficial for various designs and applications.

[0113] The above embodiments are merely illustrative of the principles and effects of this disclosure and are not intended to limit this disclosure. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure should be as set forth in the claims.

Claims

1. A method for manufacturing an inductor structure, comprising: At least two solder pads are electroplated onto a substrate using a patterned exposure and development process. A wound spiral coil is disposed on the upper surface of at least two solder pads, and the two ends of the wound spiral coil are electrically connected to the at least two solder pads respectively, wherein the body of the wound spiral coil is copper wire or copper alloy wire. A covering layer is formed on the carrier plate to cover the wound helical coil and the at least two solder pads; and Remove the carrier plate to expose the lower surface of the at least two solder pads.

2. The method for manufacturing the inductor structure as described in claim 1, wherein, After the at least two solder pads are formed by electroplating, and before the winding spiral coil is set, another patterning exposure and development process is performed to electroplat a vertical magnetic pillar in the area between the carrier plate and the at least two solder pads.

3. The method for manufacturing the inductor structure as described in claim 1, wherein, After the at least two solder pads are formed by electroplating and before the winding spiral coil is installed, a first insulating layer is formed covering the carrier plate and the at least two solder pads, and a portion of the first insulating layer is removed to expose the upper surface of the at least two solder pads.

4. The method for manufacturing the inductor structure as described in claim 3, wherein, After the first insulating layer is formed and the upper surface of the at least two solder pads is exposed, another patterning exposure and development process is then performed to electroplate a vertical magnetic pillar on the first insulating layer and in the area between the at least two solder pads.

5. The method for manufacturing the inductor structure as described in claim 4, wherein, After the magnetic post is formed, the wound helical coil is placed on the upper surface of the at least two solder pads and the first insulating layer, and the magnetic post is framed. Then, a second insulating layer is formed on the upper surface of the at least two solder pads and the first insulating layer, covering the wound helical coil and the magnetic post, so that the first insulating layer and the second insulating layer together serve as the covering layer.

6. The method for manufacturing the inductor structure as described in claim 1, wherein, The coating layer is a magnetic insulating material.

7. The method for manufacturing the inductor structure as described in claim 1, wherein, After the carrier plate is removed, a surface treatment process is performed to form a surface treatment layer on the lower surface of the at least two pads.

8. The method for manufacturing the inductor structure as described in claim 1, wherein, The manufacturing method also includes using a laser spot welding process to weld and fix the two ends of the wound helical coil to the upper surface of the at least two solder pads.

9. An inductor structure, comprising: At least two solder pads, each having a corresponding upper and lower surface; A wound helical coil is disposed on the upper surface of at least two solder pads, and the two ends of the wound helical coil are electrically connected to the at least two solder pads respectively, wherein the body of the wound helical coil is copper wire or copper alloy wire; and The coating layer covers the wound helical coil and the at least two solder pads, and exposes the lower surface of the at least two solder pads.

10. The inductor structure as claimed in claim 9, wherein, The inductor structure also includes a magnetic post embedded in the cladding layer and erected between the at least two solder pads, wherein the wound helical coil frame surrounds the magnetic post.

11. The inductor structure as claimed in claim 10, wherein, One end face of the magnetic post is exposed outside the cladding layer.

12. The inductor structure as described in claim 9, wherein, The covering layer includes a first insulating layer and a second insulating layer. The first insulating layer covers the at least two solder pads and exposes the upper and lower surfaces of the at least two solder pads. The second insulating layer is disposed on the first insulating layer and covers the wound helical coil.

13. The inductor structure as described in claim 12, wherein, The inductor structure also includes a magnetic post embedded in the second insulating layer and erected on the first insulating layer, wherein the wound helical coil frame surrounds the magnetic post.

14. The inductor structure as claimed in claim 9, wherein, The inductor structure also includes a surface treatment layer disposed on the lower surface of the at least two pads.

15. The inductor structure as described in claim 9, wherein, The coating layer is a magnetic insulating material.

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