Capacitive assembly and power supply system

Abstract

A capacitor assembly and a power supply system are provided. The capacitor assembly comprises: a first carrier plate and a second carrier plate, which are arranged in a stacking manner along a first direction and are spaced apart from each other, and the first carrier plate is electrically connected with the second carrier plate; a first layer of capacitors, which are arranged on a side of the first carrier plate facing the second carrier plate and are electrically connected with the first carrier plate; and a second layer of capacitors, which are arranged on a side of the second carrier plate facing away from the first carrier plate and are electrically connected with the second carrier plate, wherein along the first direction, a projection of the second layer of capacitors at least partially overlaps a projection of the first layer of capacitors. The capacitor density per unit area is improved by a three-dimensional stacking structure, thereby improving the power integrity of the power supply system.

Description

Technical Field

[0001] The examples in this article generally relate to the field of electrical equipment, and more particularly to a capacitor assembly and a power supply system. Background Technology

[0002] Power supply systems typically use planar capacitor placement on a printed circuit board (PCB) to meet power integrity requirements. However, with increasing chip current density and ever-increasing demands for chip integration density on individual boards, traditional power supply architectures face challenges in terms of power integrity. While methods such as increasing the capacitance density of individual capacitors, increasing the number of capacitors, using higher-performance capacitors, and embedding capacitors within the PCB can improve capacitance density per unit area, these approaches have limitations. Summary of the Invention

[0003] In one embodiment, a capacitor assembly is provided. The capacitor assembly includes a first carrier plate and a second carrier plate, stacked and spaced apart from each other along a first direction, with the first carrier plate and the second carrier plate electrically connected. The capacitor assembly also includes a first layer capacitor disposed on the side of the first carrier plate facing the second carrier plate and electrically connected to the first carrier plate. The capacitor assembly further includes a second layer capacitor disposed on the side of the second carrier plate facing away from the first carrier plate and electrically connected to the second carrier plate, wherein along the first direction, the projection of the second layer capacitor at least partially overlaps with the projection of the first layer capacitor.

[0004] In another scenario, a power supply system is provided. This power supply system includes a third carrier board and the aforementioned capacitor assembly, wherein the side of the first carrier board facing away from the second carrier board is connected to the third carrier board.

[0005] It should be understood that the content described in this section is not intended to limit the key or important features of the examples in this paper, nor is it intended to restrict the scope of the solutions described herein. Other features of this paper will become readily apparent from the following description. Attached Figure Description

[0006] The above and other features, advantages, and aspects of the examples herein will become more apparent when taken in conjunction with the accompanying drawings and the following detailed description. In the accompanying drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 An example usage environment for the capacitor assembly is shown; Figure 2 A front view of the capacitor assembly is shown; Figure 3 A right view of the capacitor assembly is shown; Figure 4 A left view of the capacitor assembly is shown; Figure 5 A top view of the capacitor assembly is shown; Figure 6 A top view of a first layer capacitor in a capacitor assembly is shown, wherein multiple first capacitors with the same capacitance value are shown. Figure 7 A bottom view of the first carrier board of the capacitor assembly is shown, in which multiple third pads are shown; Figure 8 A top view of another first-layer capacitor assembly is shown, illustrating multiple first capacitors comprising at least two sets of first sub-capacitors with different capacitance values; and Figure 9 The front view of the power supply system is shown.

[0007] Explanation of reference numerals in the attached figures: X, first direction; Y, second direction; Z, third direction; 1000. Environment; 100. Capacitor assembly; 101. First layer capacitor; 102. Second layer capacitor; 11. First capacitor; 111. First sub-capacitor; 12. Second capacitor; 121. First electrode; 122. Second electrode; 21. First carrier board; 211. First pad; 2111. First sub-pad; 212. Second pad; 2121. Second sub-pad; 213. Third pad; 22. Second carrier board; 30. Conductive component; 31. First conductive component; 311. First sub-conductive component; 32. Second conductive component; 321. Second sub-conductive component; 400. Power supply system; 410. Third carrier plate; 420. Third capacitor; 421. Third sub-capacitor; 430. Chip; 500. Server equipment; 510. Server rack; 511. Air intake vent; 520. Cooling system; 530. Control system; 540. Power supply module; 550. Communication interface. Detailed Implementation

[0008] The examples described herein will now be described in more detail with reference to the accompanying drawings. While examples of this document are shown in the drawings, it should be understood that this document can be implemented in various forms and should not be limited to the examples set forth herein. Rather, these examples are provided to make this document more thorough and complete, and to fully convey the scope of this document to those skilled in the art.

[0009] The term “comprising” and its variations, as used herein, signify open inclusion, i.e., “including but not limited to.” Unless otherwise stated, the term “or” means “and / or.” The term “based on” means “at least partially based on.” The term “one example” means “at least one example.” The term “another example” means “at least one additional example.” The terms “first,” “second,” etc., may refer to different or the same objects.

[0010] As chip current density continues to increase, and products place increasingly higher demands on chip integration density on single boards, traditional power supply architectures face challenges in terms of power integrity. Methods such as increasing the capacitance density of individual capacitors, increasing the number of capacitors, using higher-performance capacitors, and embedding capacitors in the PCB have limitations in improving capacitance density per unit area.

[0011] Example Environment Chip current density is constantly increasing. At the same time, products are demanding higher chip integration density on single boards; for example, several to dozens of chips need to be integrated into a chassis with a standard rack height (Unit, U) and a depth of 1 meter. This demand for high current density and high integration poses a challenge to the power integrity of traditional power supply architectures.

[0012] Reference Figure 1 The illustration shows an example usage environment 1000 for capacitor assembly 100. In one scenario, in a high-power chip power supply application, the power supply system 400 is integrated inside the server device 500, working in conjunction with other components of the server device 500 to ensure the stable operation of the entire server device 500. Capacitor assembly 100, as an energy storage and filtering component of the power supply system 400, is mounted on the carrier board of the power supply system 400. It can establish a circuit connection with the chip 430 on the carrier board, thereby providing stable power supply support for the chip 430 and helping to suppress voltage fluctuations to ensure the normal operation of the chip 430 under high load conditions. Currently, the current density of chips is constantly increasing, and several to dozens of chips 430 need to be integrated inside the rack 510 of the server device 500, significantly increasing chip density. This places extremely high demands on the power integrity of the power supply system 400, and the performance and configuration rationality of capacitor assembly 100 directly determine the power integrity of the power supply system 400.

[0013] In addition to the power supply system 400, the server equipment 500 also includes components such as a rack 510, a cooling system 520, a control system 530, a power supply module 540, and a communication interface 550. The rack 510 serves as the mounting platform for the entire server equipment 500, providing installation space for components such as the power supply system 400 and the cooling system 520. In some cases, an air intake vent 511 is provided on one side of the rack 510 to introduce external cool air, providing conditions for the cooling system 520 to dissipate heat. The cooling system 520 works in conjunction with the air intake vent 511 of the rack 510, using the cool air introduced through the vent 511 to specifically dissipate heat from the capacitor assembly 100, the chip 430, and the power supply module 540, preventing overheating of these components during high-power operation and avoiding performance degradation, system downtime, and other problems. In other cases, the cooling system 520 may also include a liquid cooling component. The cooling system 520 can be flexibly configured with cooling methods according to the power requirements of the server equipment 500. The control system 530 is electrically connected to the power supply system 400, heat dissipation system 520, power supply module 540, and capacitor assembly 100. It can monitor the operating status, voltage stability, and energy storage of the capacitor assembly 100 in real time, and simultaneously collect the output voltage of the power supply module 540 and the operating parameters of the heat dissipation system 520. When an anomaly is detected, the power supply parameters are adjusted promptly, and the operating power of the heat dissipation system 520 is controlled to ensure the stability of the entire system. The power supply module 540 converts the externally input high-voltage AC power into the low-voltage DC power required by the chip 430, and then transmits the converted voltage to the power supply system 400. After filtering and energy storage by the capacitor assembly 100, the voltage is delivered to the chip 430, ensuring the stability of the output voltage and reducing the impact of voltage fluctuations on the chip 430. The communication interface 550 is installed on the rack 510, enabling communication with external devices.

[0014] The capacitor assembly 100 serves as an energy storage and filtering component between the power supply system 400 and the chip 430, connecting the power supply module 540 and the chip 430. Under the real-time monitoring and control of the control system 530, it can alleviate the power integrity challenges caused by the high current and high density of the chip, providing stable and reliable power supply support for the chip 430, thereby ensuring the stable operation of the power supply system 400 and even the entire server equipment 500.

[0015] Example capacitor assembly like Figures 2 to 8 As shown, a capacitor assembly 100 is provided, which employs a three-dimensional stacked structure to increase the capacitance density per unit area, thereby improving the power integrity of the power supply system. The following explains the terminology used herein.

[0016] The capacitor assembly 100 described herein refers to a three-dimensional stacked structure comprising multiple carrier plates and multiple capacitors, used to achieve higher capacitance density within a limited planar area. For example, the capacitor assembly 100 may include a first carrier plate 21 and a second carrier plate 22 stacked along a first direction X, and capacitors respectively disposed on the first carrier plate 21 and the second carrier plate 22.

[0017] The carrier board mentioned herein refers to a substrate structure used to carry and electrically connect capacitors. For example, the first carrier board 21 can be used to carry the first layer capacitor 101, the second carrier board 22 can be used to carry the second layer capacitor 102, and the third carrier board 410 can serve as the main carrier board of the power supply system 400.

[0018] The capacitors mentioned herein refer to energy storage and filtering structures disposed in the power supply system 400 for providing charge storage and voltage stabilization in the circuit. For example, the capacitors may include a first layer capacitor 101 and a second layer capacitor 102.

[0019] The projection described herein refers to the outline projection area formed by an object on a reference plane perpendicular to a specific direction, used to characterize the spatial arrangement of the object. For example, along the first direction X, the projection of the second layer capacitor 102 at least partially overlaps with the projection of the first layer capacitor 101.

[0020] The conductive element 30 described herein refers to a conductive structure disposed between adjacent carrier plates, used to provide electrical connection and structural support between the carrier plates. For example, the conductive element 30 may include a first conductive element 31 and a second conductive element 32, respectively used to connect electrodes of different polarities.

[0021] The pads mentioned herein refer to conductive areas disposed on the surface of a carrier board, used to achieve electrical connections between the capacitor and the carrier board or between the carrier board and external circuits. For example, the first pad 211 and the second pad 212 can be disposed on the first carrier board 21 for electrical connection with the conductive component 30; the third pad 213 can be disposed on the side of the first carrier board 21 opposite to the second carrier board 22 for electrical connection with the third carrier board 410 of the power supply system 400.

[0022] In this paper, the first direction X, the second direction Y, and the third direction Z refer to three mutually perpendicular spatial directions, which can correspond to the three coordinate axes in a Cartesian coordinate system. For example, the first direction X is the vertical direction, the second direction Y is the longitudinal direction, and the third direction Z is the horizontal direction. It should be noted that these three directions are not limited to the Cartesian coordinate system and can also be applied to other types of coordinate systems. This paper uses the Cartesian coordinate system as an example to explain in detail the structure and working principle of the capacitor assembly 100.

[0023] Reference Figure 2 , Figure 2A front view of the capacitor assembly 100 is shown. The capacitor assembly 100 may include a first carrier plate 21 and a second carrier plate 22. The first carrier plate 21 and the second carrier plate 22 may be stacked along a first direction X. The first carrier plate 21 may be located above the second carrier plate 22. A gap may be provided between the first carrier plate 21 and the second carrier plate 22, such that the first carrier plate 21 and the second carrier plate 22 are spaced apart from each other. The first carrier plate 21 may be electrically connected to the second carrier plate 22 to realize the transmission of electrical signals inside the capacitor assembly 100.

[0024] Continue to refer to Figure 2 The capacitor assembly 100 may include a first capacitor layer 101 and a second capacitor layer 102. The first capacitor layer 101 may be disposed on the side of the first carrier plate 21 facing the second carrier plate 22. The first capacitor layer 101 may be electrically connected to the first carrier plate 21. The second capacitor layer 102 may be disposed on the side of the second carrier plate 22 facing away from the first carrier plate 21. The second capacitor layer 102 may be electrically connected to the second carrier plate 22. Along a first direction X, the projection of the second capacitor layer 102 at least partially overlaps with the projection of the first capacitor layer 101. In this way, the first capacitor layer 101 and the second capacitor layer 102 can form a three-dimensional stacked structure along the first direction X, thereby achieving higher capacitance density within a limited planar area.

[0025] like Figure 2 As shown, the first layer capacitor 101 may include one or more first capacitors 11. The first capacitors 11 may be disposed within the space between the first carrier plate 21 and the second carrier plate 22. The second layer capacitor 102 may include one or more second capacitors 12. The second capacitors 12 may be disposed on the upper surface of the second carrier plate 22. Each second capacitor 12 may include a first electrode 121 and a second electrode 122. The first electrode 121 and the second electrode 122 may be disposed on opposite sides of the second capacitor 12.

[0026] In some cases, the capacitance of the first capacitor 11 is smaller than that of the second capacitor 12. The parasitic parameters of the first capacitor 11 are relatively small, making it suitable for handling higher frequency noise. The capacitance of the second capacitor 12 is larger, and its parasitic parameters are relatively larger, making it suitable for handling lower frequency noise. The first carrier plate 21 of the capacitor assembly 100 can be mounted on the third carrier plate 410 of the power supply system 400. Since the first capacitor 11 is located close to the third carrier plate 410 of the power supply system 400, it can quickly suppress high-frequency noise. The second capacitor 12 is located further away and is mainly responsible for suppressing low-frequency noise. In this way, by placing capacitors with different characteristics at different levels, the capacitor assembly 100 can achieve filtering function over a wide frequency range.

[0027] Reference Figure 3 and Figure 4 , Figure 3 A right view of capacitor assembly 100 is shown. Figure 4 A left view of the capacitor assembly 100 is shown. An electrical connection and structural support can be achieved between the first carrier plate 21 and the second carrier plate 22 via a conductive structure. The first carrier plate 21 can be mounted above the second carrier plate 22 via this conductive structure, thereby forming a space between the first carrier plate 21 and the second carrier plate 22 to accommodate the first layer of capacitors 101.

[0028] Reference Figure 5 , Figure 5 A top view of the capacitor assembly 100 is shown. A second capacitor 12 can be disposed on a second carrier plate 22. A first electrode 121 of the second capacitor 12 can be disposed on one side of the second capacitor 12, and a second electrode 122 can be disposed on the opposite side of the second capacitor 12. The first electrode 121 and the second electrode 122 can extend along the vertical direction of the second capacitor 12. In this way, the second capacitor 12 can be electrically connected to the second carrier plate 22 through the first electrode 121 and the second electrode 122.

[0029] In some cases, the projected area of ​​the second carrier plate 22 in the first direction X can be less than or equal to the projected area of ​​the first carrier plate 21 in the first direction X. In this way, the capacitor assembly 100 can achieve a compact three-dimensional stacked layout within the projection range of the first carrier plate 21.

[0030] In some cases, the capacitors in capacitor assembly 100 may include at least one of polymer capacitors and multilayer ceramic capacitors (MLCCs). Polymer capacitors can have a large capacitance value and are suitable for handling low-frequency noise. Multilayer ceramic capacitors can have lower parasitic parameters and are suitable for handling high-frequency noise. Additionally or alternatively, the capacitors in capacitor assembly 100 may also be other types of capacitors, such as silicon capacitors or tantalum capacitors.

[0031] In some cases, the first layer capacitor 101 may include multiple first capacitors 11, and the second layer capacitor 102 may include one or more second capacitors 12. The capacitance value of the first capacitor 11 may be smaller than the capacitance value of the second capacitor 12. In this way, the capacitor assembly 100 can achieve filtering function over a wide frequency range by configuring capacitors with different capacitance values ​​at different layers.

[0032] In some cases, the first capacitor 11 may include a multilayer ceramic capacitor. Multilayer ceramic capacitors can have lower parasitic parameters, making them suitable for handling higher frequency noise. Since capacitors filtering high-frequency noise are sensitive to parasitic parameters, placing the multilayer ceramic capacitor close to the third carrier plate 410 can reduce the impact of parasitic parameters, thereby maintaining the high-frequency filtering effect of the multilayer ceramic capacitor. In this way, the first capacitor 11 can be used to handle higher frequency noise, such as filtering in the frequency range of hundreds of kHz to several MHz.

[0033] In some cases, the second capacitor 12 may include a polymer capacitor. Polymer capacitors can have large capacitance values ​​and large parasitic parameters. Because the parasitic parameters of polymer capacitors are inherently large, when the polymer capacitor is positioned on the upper layer, the additional parasitic parameters introduced by the distance between the polymer capacitor and the third carrier plate 410 have a relatively small impact on the overall performance. In this way, the second capacitor 12 can be used to handle lower frequency noise, such as filtering in the frequency band around 100 kHz.

[0034] By placing a polymer capacitor with a larger parasitic parameter on the upper layer and a multilayer ceramic capacitor with a smaller parasitic parameter on the lower layer near the third carrier plate 410, the capacitor assembly 100 can achieve filtering function over a wide frequency range. Alternatively or additionally, the first capacitor 11 and the second capacitor 12 can also be other types of capacitors, such as silicon capacitors or tantalum capacitors, as long as the configuration principle of the upper capacitor handling low-frequency noise and the lower capacitor handling high-frequency noise is met.

[0035] Reference Figure 6 , Figure 6 A top view of a first layer capacitor 101 of the capacitor assembly 100 is shown. In some cases, multiple first capacitors 11 may have the same capacitance value. The multiple first capacitors 11 may be arranged in an array on the first carrier plate 21. In this way, the multiple first capacitors 11 can form a regular arrangement on the first carrier plate 21, thereby facilitating the manufacture and assembly of the capacitor assembly 100.

[0036] Continue to refer to Figure 6 The first carrier plate 21 may have planes extending along a second direction Y and a third direction Z. The second direction Y may be perpendicular to the first direction X. The third direction Z may be perpendicular to the first direction X. The second direction Y may be perpendicular to the third direction Z. In this way, the first direction X, the second direction Y, and the third direction Z can form a three-dimensional orthogonal coordinate system to describe the spatial positional relationship of the various components in the capacitor assembly 100.

[0037] In some cases, multiple first capacitors 11 can be arranged in multiple rows along the second direction Y. Multiple first capacitors 11 can also be arranged in multiple columns along the third direction Z. In this way, multiple first capacitors 11 can form a two-dimensional array extending along the second direction Y and the third direction Z on the first carrier plate 21. Through this array arrangement, the capacitor assembly 100 can accommodate more first capacitors 11 within the limited area of ​​the first carrier plate 21, thereby increasing the capacitance density per unit area.

[0038] like Figure 6 As shown, a first substrate 21 may be provided with a first pad 211 and a second pad 212. The first pad 211 may be located on one side edge of the first substrate 21. The second pad 212 may be located on the opposite side edge of the first substrate 21. A plurality of first capacitors 11 may be located in the area between the first pad 211 and the second pad 212. In this way, the first substrate 21 can be electrically connected to the second substrate 22 through the first pad 211 and the second pad 212.

[0039] Reference Figure 8 , Figure 8 A top view of another first-layer capacitor 101 of the capacitor assembly 100 is shown. In some cases, the plurality of first capacitors 11 may include at least two sets of first sub-capacitors 111 with different capacitance values. Different sets of first sub-capacitors 111 may have different capacitance values, such as large capacitance value, medium capacitance value, and small capacitance value. In this way, the capacitor assembly 100 can achieve filtering functions in different frequency bands by configuring multiple sets of first sub-capacitors 111 with different capacitance values.

[0040] Continue to refer to Figure 8 Each group of first sub-capacitors 111 can be arranged on the first carrier plate 21 along a second direction Y or a third direction Z perpendicular to the first direction X, and each can be arranged in at least one row. The second direction Y can be perpendicular to the third direction Z. In this way, multiple groups of first sub-capacitors 111 can form a multi-row structure extending along the second direction Y or the third direction Z on the first carrier plate 21.

[0041] In some cases, the first sub-capacitors 111 in adjacent rows can have different capacitance values. For example, in two adjacent rows of first sub-capacitors 111 arranged along the second direction Y, one row can have a larger capacitance value and the other row can have a smaller capacitance value. In this way, first sub-capacitors 111 with different capacitance values ​​can form an alternating arrangement on the first carrier plate 21.

[0042] like Figure 8As shown, a first substrate 21 may be provided with a first pad 211 and a second pad 212. The first pad 211 may include a plurality of first sub-pads 2111. The plurality of first sub-pads 2111 may be arranged along a second direction Y on one side edge of the first substrate 21. The second pad 212 may include a plurality of second sub-pads 2121. The plurality of second sub-pads 2121 may be arranged along a second direction Y on the opposite side edge of the first substrate 21. Multiple sets of first sub-capacitors 111 may be disposed in the area between the first sub-pads 2111 and the second sub-pads 2121.

[0043] In some cases, first sub-capacitors 111 with large, medium, and small capacitance values ​​can be arranged in a mixed configuration on the first carrier plate 21. For example, a first sub-capacitor 111 with a large capacitance value can be arranged adjacent to a first sub-capacitor 111 with a medium or small capacitance value. In this way, first sub-capacitors 111 with different capacitance values ​​can be spatially staggered, thereby achieving multi-band filtering coverage in various regions of the first carrier plate 21.

[0044] In this way, by mixing and alternating the first sub-capacitors 111 with different capacitance values, the capacitor assembly 100 can improve its filtering performance. The first sub-capacitors 111 with larger capacitance values ​​can be used to handle lower frequency noise, while the first sub-capacitors 111 with smaller capacitance values ​​can be used to handle higher frequency noise. Since the first sub-capacitors 111 with different capacitance values ​​have different filtering radii, mixing and alternating the first sub-capacitors 111 with different capacitance values ​​allows the filtering effects of each first sub-capacitor 111 to be superimposed, thereby achieving a flatter impedance curve over a wide frequency range. Alternatively or additionally, the first sub-capacitors 111 can also be arranged in other ways, as long as the principle of alternating the configuration of the first sub-capacitors 111 with different capacitance values ​​is satisfied.

[0045] Reference Figure 2 The capacitor assembly 100 may include a conductive element 30. The conductive element 30 may be disposed between the first carrier plate 21 and the second carrier plate 22. The conductive element 30 can support the first carrier plate 21 and the second carrier plate 22 and electrically connect them. In this way, the conductive element 30 can simultaneously perform structural support and electrical connection functions, thereby forming a stable mechanical and electrical connection between the first carrier plate 21 and the second carrier plate 22.

[0046] Continue to refer to Figure 2In some cases, the conductive element 30 may include a first conductive element 31 and a second conductive element 32. The first conductive element 31 may be disposed on one side of the capacitor assembly 100. The second conductive element 32 may be disposed on the opposite side of the capacitor assembly 100. The first conductive element 31 and the second conductive element 32 may be located at the edges of opposite ends of the first carrier plate 21, respectively. In this way, the first conductive element 31 and the second conductive element 32 can provide support at both edges of the first carrier plate 21, thereby stably mounting the second carrier plate 22 above the first carrier plate 21.

[0047] Reference Figure 3 and Figure 4 The first conductive element 31 can be electrically connected to the first electrode 121 of the second capacitor 12 via the second carrier plate 22. The second conductive element 32 can be electrically connected to the second electrode 122 of the second capacitor 12 via the second carrier plate 22. The first electrode 121 and the second electrode 122 can correspond to different polarities, such as positive and negative. In this way, the first conductive element 31 and the second conductive element 32 can transmit electrical signals of different polarities, thereby realizing the electrical connection between the first layer capacitor 101 and the second layer capacitor 102.

[0048] like Figure 3 As shown, the first conductive element 31 may include a plurality of first sub-conductive elements 311. The plurality of first sub-conductive elements 311 may be arranged along a second direction Y on one side edge of the first carrier plate 21. Each first sub-conductive element 311 may have a columnar structure and extend along a first direction X. The upper ends of the plurality of first sub-conductive elements 311 may be connected to the first carrier plate 21, and the lower ends of the plurality of first sub-conductive elements 311 may be connected to the second carrier plate 22.

[0049] like Figure 4 As shown, the second conductive element 32 may include a plurality of second sub-conductive elements 321. The plurality of second sub-conductive elements 321 may be arranged along a second direction Y on opposite edges of the first carrier plate 21. Each second sub-conductive element 321 may have a columnar structure and extend along a first direction X. The upper ends of the plurality of second sub-conductive elements 321 may be connected to the first carrier plate 21, and the lower ends of the plurality of second sub-conductive elements 321 may be connected to the second carrier plate 22.

[0050] In some cases, the first sub-conductor 311 and the second sub-conductor 321 can be connected to the first carrier plate 21 and the second carrier plate 22 by soldering. The upper end of the first sub-conductor 311 can be soldered to a corresponding pad on the first carrier plate 21, and the lower end of the first sub-conductor 311 can be soldered to a corresponding pad on the second carrier plate 22. Similarly, the upper end of the second sub-conductor 321 can be soldered to a corresponding pad on the first carrier plate 21, and the lower end of the second sub-conductor 321 can be soldered to a corresponding pad on the second carrier plate 22. In this way, the soldered connection can form a reliable mechanical connection and a low-impedance electrical connection between the first sub-conductor 311, the second sub-conductor 321, and the carrier plate.

[0051] In some cases, the first sub-conductive element 311 and the second sub-conductive element 321 can be disposed at the edge of the first carrier plate 21. Since the first layer capacitor 101 is disposed in the space between the first carrier plate 21 and the second carrier plate 22, placing the first sub-conductive element 311 and the second sub-conductive element 321 at the edge can avoid interference with the first layer capacitor 101. In this way, the middle area of ​​the first carrier plate 21 can be used to accommodate the first layer capacitor 101, while the edge area can be used to house the conductive element 30, thereby achieving efficient use of space.

[0052] In some cases, the number of multiple first sub-conductors 311 and multiple second sub-conductors 321 can be configured according to the current transmission requirements of the capacitor assembly 100. Increasing the number of first sub-conductors 311 and second sub-conductors 321 can reduce the overall impedance of the conductors 30, thereby improving the filtering effect of the capacitor assembly 100. Alternatively or additionally, the first sub-conductors 311 and second sub-conductors 321 can also adopt other conductive structures, such as conductive strips or conductive sheets, as long as they satisfy the function of providing electrical connection and structural support between the first carrier plate 21 and the second carrier plate 22.

[0053] Reference Figure 6 The capacitor assembly 100 may include a first pad 211 and a second pad 212. The first pad 211 and the second pad 212 may be disposed on the side of the first carrier 21 facing the second carrier 22. The first pad 211 and the second pad 212 may be located at opposite ends of the first carrier 21, respectively. In this way, the first pad 211 and the second pad 212 may provide electrical connection interfaces in the edge region of the first carrier 21, while the middle region of the first carrier 21 may be used to accommodate the first layer capacitor 101.

[0054] Continue to refer to Figure 6The first pad 211 can be electrically connected to the first conductive element 31. The second pad 212 can be electrically connected to the second conductive element 32. Since the first conductive element 31 is electrically connected to the first electrode 121 of the second capacitor 12 via the second carrier plate 22, the first pad 211 can transmit an electrical signal of the corresponding polarity to the first electrode 121 through the first conductive element 31. Since the second conductive element 32 is electrically connected to the second electrode 122 of the second capacitor 12 via the second carrier plate 22, the second pad 212 can transmit an electrical signal of the corresponding polarity to the second electrode 122 through the second conductive element 32. In this way, the first pad 211 and the second pad 212 can correspond to different polarities, such as positive and negative, respectively, thereby realizing the electrical connection between the first layer capacitor 101 and the second layer capacitor 102.

[0055] In some cases, such as Figure 6 and Figure 8 As shown, the first pad 211 may include a plurality of first sub-pads 2111. The plurality of first sub-pads 2111 may be arranged along a second direction Y on one side edge of the first carrier board 21. The first conductive element 31 may include a plurality of first sub-conductive elements 311. The plurality of first sub-pads 2111 may be electrically connected to a corresponding first sub-conductive element 311 among the plurality of first sub-conductive elements 311. In this manner, each first sub-pad 2111 can form a one-to-one electrical connection with its corresponding first sub-conductive element 311.

[0056] In some cases, such as Figure 6 and Figure 8 As shown, the second pad 212 may include a plurality of second sub-pads 2121. The plurality of second sub-pads 2121 may be arranged along a second direction Y on opposite edges of the first substrate 21. The second conductive element 32 may include a plurality of second sub-conductive elements 321. The plurality of second sub-pads 2121 may be electrically connected to a corresponding second sub-conductive element 321. In this manner, each second sub-pad 2121 can form a one-to-one electrical connection with its corresponding second sub-conductive element 321.

[0057] By providing multiple first sub-pads 2111 and multiple second sub-pads 2121, the number of positive and negative terminals in the capacitor assembly 100 can be increased. Increasing the number of output terminals reduces the overall parasitic inductance of the capacitor assembly 100, thereby improving high-frequency filtering performance. Alternatively or additionally, the number of first sub-pads 2111 and second sub-pads 2121 can be configured according to the filtering performance requirements of the capacitor assembly 100; more output terminals result in better filtering performance.

[0058] Alternatively or additionally, the plurality of first sub-pads 2111 can be connected to form a continuous elongated structure extending along the second direction Y. In this configuration, the first pad 211 can be formed as a single elongated conductive strip, rather than multiple separate first sub-pads 2111. Correspondingly, the first conductive element 31 can also be configured as a continuous elongated conductive structure extending along the second direction Y, rather than multiple separate first sub-conductive elements 311. In this way, the continuous elongated first pad 211 can form an integral electrical connection with the continuous elongated first conductive element 31.

[0059] Similarly, multiple second sub-pads 2121 can be connected to form a continuous elongated structure extending along the second direction Y. In this configuration, the second pad 212 can be formed as a single elongated conductive strip, rather than multiple separate second sub-pads 2121. Correspondingly, the second conductive element 32 can also be configured as a continuous elongated conductive structure extending along the second direction Y, rather than multiple separate second sub-conductive elements 321. In this way, the continuous elongated second pad 212 can form an integral electrical connection with the continuous elongated second conductive element 32.

[0060] In some cases, the first pad 211 and the first conductive element 31 can be arranged in a continuous strip, while the second pad 212 and the second conductive element 32 can be arranged as multiple discrete sub-elements. Alternatively or additionally, the second pad 212 and the second conductive element 32 can be arranged in a continuous strip, while the first pad 211 and the first conductive element 31 can be arranged as multiple discrete sub-elements. In this way, the pad and conductive element configuration of the capacitor assembly 100 can be flexibly selected according to specific application requirements.

[0061] In some cases, the number of the first sub-pad 2111 and the second sub-pad 2121 can be configured according to the filtering performance requirements of the capacitor assembly 100. The more output terminals, the better the filtering effect. Additionally or alternatively, a continuous strip configuration can simplify the manufacturing process of the capacitor assembly 100 while maintaining reliable electrical connection and structural support between the first carrier board 21 and the second carrier board 22.

[0062] Reference Figure 7 , Figure 7 A bottom view of a first carrier board 21 of the capacitor assembly 100 is shown. The capacitor assembly 100 may include a plurality of third pads 213. The plurality of third pads 213 may be disposed on the side of the first carrier board 21 opposite to the second carrier board 22. In this way, the plurality of third pads 213 may be located on the lower surface of the first carrier board 21 for electrical connection with the third carrier board 410 of the power supply system 400.

[0063] Continue to refer to Figure 7Multiple third pads 213 can be arranged in an array on the first carrier board 21. The multiple third pads 213 can be arranged in multiple rows along the second direction Y and in multiple columns along the third direction Z. Each third pad 213 can have a circular structure and be disposed on the surface of the first carrier board 21. In this way, the multiple third pads 213 can form a regular grid distribution on the first carrier board 21, thereby providing multiple electrical connection points.

[0064] In some cases, multiple third pads 213 can be electrically connected to corresponding electrodes of the first layer capacitor 101. The first capacitor 11 in the first layer capacitor 101 can be electrically connected to the corresponding third pad 213 through conductive traces inside the first carrier board 21. In this way, the electrical signals of the first layer capacitor 101 can be transmitted to multiple third pads 213 through the first carrier board 21.

[0065] Reference Figure 9 Multiple third pads 213 can be electrically connected to the third carrier board 410 of the power supply system 400. The third carrier board 410 can serve as the main carrier board of the power supply system 400, used to support and connect various components in the power supply system 400. The capacitor assembly 100 can be electrically and mechanically connected to the third carrier board 410 through the multiple third pads 213. In this way, the capacitor assembly 100 can be integrated into the power supply system 400, thereby providing filtering functionality for the power supply system 400.

[0066] In some cases, the number of third pads 213 can be configured according to the current transfer requirements of the capacitor assembly 100. The more third pads 213 there are, the more current transfer paths there are between the capacitor assembly 100 and the third carrier board 410, thereby reducing overall parasitic inductance. Increasing the number of third pads 213 in this way can improve the high-frequency filtering effect of the capacitor assembly 100.

[0067] In some cases, the multiple third pads 213 may include pads corresponding to the positive electrode and pads corresponding to the negative electrode. The third pad 213 corresponding to the positive electrode can be electrically connected to the first pad 211 through conductive traces inside the first carrier board 21. The third pad 213 corresponding to the negative electrode can be electrically connected to the second pad 212 through conductive traces inside the first carrier board 21. In this way, the electrical signals of the first layer capacitor 101 and the second layer capacitor 102 can be transmitted to the third carrier board 410 of the power supply system 400 through the multiple third pads 213.

[0068] By providing multiple third pads 213, the capacitor assembly 100 can form a reliable electrical and mechanical connection with the third carrier board 410 of the power supply system 400. The array arrangement of multiple third pads 213 can provide multiple parallel current transmission paths, thereby reducing the overall parasitic inductance of the capacitor assembly 100 and improving the filtering performance of the capacitor assembly 100 over a wide frequency range.

[0069] Reference Figure 8 , Figure 8 A top view of another first-layer capacitor 101 of the capacitor assembly 100 is shown. In some cases, the plurality of first capacitors 11 may include at least two sets of first sub-capacitors 111 with different capacitance values. Each set of first sub-capacitors 111 may have different capacitance values, such as large capacitance, medium capacitance, and small capacitance. In this way, the capacitor assembly 100 can achieve filtering functions in different frequency bands by configuring multiple sets of first sub-capacitors 111 with different capacitance values.

[0070] Continue to refer to Figure 8 Each group of first sub-capacitors 111 can be arranged on the first carrier plate 21 along a second direction Y or a third direction Z perpendicular to the first direction X, and each can be arranged in at least one row. The second direction Y can be perpendicular to the third direction Z. In this way, multiple groups of first sub-capacitors 111 can form a multi-row structure extending along the second direction Y or the third direction Z on the first carrier plate 21.

[0071] In some cases, the first sub-capacitors 111 in adjacent rows can have different capacitance values. For example, in two adjacent rows of first sub-capacitors 111 arranged along the third direction Z, one row can have a larger capacitance value and the other row can have a smaller capacitance value. In this way, first sub-capacitors 111 with different capacitance values ​​can form an alternating arrangement on the first carrier plate 21.

[0072] like Figure 8 As shown, a first substrate 21 may be provided with a first pad 211 and a second pad 212. The first pad 211 may include multiple first sub-pads 2111, which are arranged along a second direction Y on one side edge of the first substrate 21. The second pad 212 may include multiple second sub-pads 2121, which are arranged along a second direction Y on the opposite side edge of the first substrate 21. Multiple sets of first sub-capacitors 111 may be disposed in the area between the first sub-pads 2111 and the second sub-pads 2121.

[0073] In some cases, first sub-capacitors 111 with large, medium, and small capacitance values ​​can be arranged in a mixed configuration on the first carrier plate 21. For example, a first sub-capacitor 111 with a large capacitance value can be arranged adjacent to a first sub-capacitor 111 with a medium or small capacitance value. In this way, first sub-capacitors 111 with different capacitance values ​​can be spatially staggered, thereby achieving multi-band filtering coverage in various regions of the first carrier plate 21.

[0074] Continue to refer to Figure 8 The first sub-capacitor 111 with a larger capacitance value can be used to process noise in the lower frequency band, while the first sub-capacitor 111 with a smaller capacitance value can be used to process noise in the higher frequency band. Since the first sub-capacitors 111 with different capacitance values ​​have different filtering radii, mixing and arranging the first sub-capacitors 111 with different capacitance values ​​can allow the filtering effects of each first sub-capacitor 111 to be superimposed, thereby achieving a flatter impedance curve over a wide frequency range.

[0075] In some cases, if the first sub-capacitors 111 with the same capacitance value are concentrated in the same area of ​​the first carrier plate 21, other areas outside that area may not benefit from the filtering effect of the frequency band corresponding to that capacitance value. By mixing and interleaving the first sub-capacitors 111 with different capacitance values, the capacitor assembly 100 can enable each area on the first carrier plate 21 to obtain multi-frequency band filtering coverage, thereby improving the overall filtering performance of the capacitor assembly 100.

[0076] In some cases, the second layer capacitor 102 may include a second capacitor 12. This second capacitor 12 may be disposed on the second carrier plate 22. The second capacitor 12 may have two terminals, corresponding to a positive and a negative terminal, respectively. These two terminals may be electrically connected to the first carrier plate 21 via a first conductive element 31 and a second conductive element 32, respectively. In this way, the capacitor assembly 100 can achieve a three-dimensional stacked structure using a single second capacitor 12.

[0077] In some cases, the second layer capacitor 102 may include two second capacitors 12. These two second capacitors 12 may be arranged side-by-side on the second carrier plate 22 along either the second direction Y or the third direction Z. The two second capacitors 12 are electrically connected via conductive traces inside the second carrier plate 22 and electrically connected to the first carrier plate 21 via a first conductive element 31 and a second conductive element 32. In this way, the capacitor assembly 100 can increase the total capacitance of the second layer capacitor 102 by increasing the number of second capacitors 12.

[0078] In some cases, the second layer capacitor 102 may include four second capacitors 12. These four second capacitors 12 may be arranged in a 2x2 array on the second carrier plate 22. The four second capacitors 12 can be electrically connected via conductive traces within the second carrier plate 22. The terminals of the four second capacitors 12 can be led out through the second carrier plate 22 to its edge and electrically connected to the first carrier plate 21 via a first conductive element 31 and a second conductive element 32. In this way, the capacitor assembly 100 can increase the total capacitance of the second layer capacitor 102 by further increasing the number of second capacitors 12, while maintaining a compact layout of the three-dimensional stacked structure.

[0079] In some cases, when the first layer capacitor 101 includes multiple first capacitors 11, the area of ​​the first carrier plate 21 can be increased accordingly to accommodate the multiple first capacitors 11. The first conductive element 31 and the second conductive element 32 can be disposed at the edge of the first carrier plate 21. Since the first capacitors 11 are disposed within the space between the first carrier plate 21 and the second carrier plate 22, placing the first conductive element 31 and the second conductive element 32 at the edge avoids interference with the first capacitors 11. In this way, the middle area of ​​the first carrier plate 21 can be used to accommodate one, two, or four first capacitors 11, while the edge area can be used to accommodate the conductive elements 30, thereby achieving efficient use of space.

[0080] Alternatively or additionally, the first layer capacitor 101 may also include other numbers of first capacitors 11, such as three, five or more first capacitors 11, provided that the area of ​​the first carrier plate 21 is sufficient to accommodate the corresponding number of first capacitors 11.

[0081] Reference Figure 2 In some cases, the projected area of ​​the second carrier plate 22 in the first direction X can be less than or equal to the projected area of ​​the first carrier plate 21 in the first direction X. The second carrier plate 22 can be located above the first carrier plate 21, and the outer contour of the second carrier plate 22 can be within the outer contour range of the first carrier plate 21. In this way, the capacitor assembly 100 can achieve a compact three-dimensional stacked layout within the projection range of the first carrier plate 21, thereby facilitating the docking and installation of the capacitor assembly 100 with the third carrier plate 410 of the power supply system 400.

[0082] Continue to refer to Figure 2 The area of ​​the first carrier board 21 can be approximately 1.1 times the area of ​​the first capacitor 11. The area of ​​the first carrier board 21 needs to be slightly larger than the area of ​​the first capacitor 11 so that the first pad 211, the second pad 212, and the conductive element 30 can be arranged in the edge area of ​​the first carrier board 21. In this way, the first carrier board 21 can accommodate the first capacitor 11 while providing mounting space for the conductive element 30.

[0083] Reference Figure 6 In some cases, multiple first capacitors 11 may be disposed on the first carrier plate 21. These multiple first capacitors 11 may be arranged in an array on the first carrier plate 21. In some cases, 16 first capacitors 11 may be disposed on the first carrier plate 21. These 16 first capacitors 11 may be arranged in a multi-row, multi-column array structure along the second direction Y and the third direction Z. In this way, by configuring multiple first capacitors 11 on the first carrier plate 21, the capacitor assembly 100 can achieve a higher total capacitance value in the first layer capacitor 101.

[0084] Continue to refer to Figure 2 and Figure 6 Since the projected area of ​​the second carrier plate 22 is less than or equal to the projected area of ​​the first carrier plate 21, the 16 first capacitors 11 can be compactly arranged within the limited area of ​​the first carrier plate 21. In this way, the 16 first capacitors 11 can be connected in parallel through the first carrier plate 21, thereby providing a larger total capacitance and a lower equivalent series resistance in the first layer capacitor 101.

[0085] Alternatively or additionally, the number of first capacitors 11 on the first carrier plate 21 can be configured according to the capacitance requirements of the capacitor assembly 100. For example, 8, 12, 20 or other numbers of first capacitors 11 can be provided on the first carrier plate 21, as long as the area of ​​the first carrier plate 21 is sufficient to accommodate the corresponding number of first capacitors 11.

[0086] In some cases, the capacitor assembly 100 may include at least one additional carrier plate and at least one additional capacitor layer. The at least one additional carrier plate may be stacked and spaced apart from the second carrier plate 22 along a first direction X. The at least one additional capacitor layer may be disposed on a corresponding carrier plate within the at least one additional carrier plate. In this way, the capacitor assembly 100 can further increase the capacitance density per unit area by increasing the number of carrier plates and capacitor layers.

[0087] In some cases, the capacitor assembly 100 may include an additional carrier plate. This additional carrier plate may be disposed on the side of the second carrier plate 22 opposite to the first carrier plate 21. A gap may be provided between the additional carrier plate and the second carrier plate 22. An additional capacitor layer may be disposed on this additional carrier plate. In this way, the capacitor assembly 100 can form a stacked structure of three carrier plates and three capacitor layers.

[0088] In some cases, the additional carrier plate can be electrically connected to the second carrier plate 22 via an additional conductive element. The additional conductive element can be disposed between the additional carrier plate and the second carrier plate 22. The additional conductive element can be used to provide both electrical connection and structural support between the additional carrier plate and the second carrier plate 22. In this way, the additional conductive element can simultaneously perform both conductive and support functions, thereby forming a stable mechanical connection and electrical path between the additional carrier plate and the second carrier plate 22.

[0089] In some cases, the additional capacitor may include at least one of polymer capacitors and multilayer ceramic capacitors. Alternatively or additionally, the additional capacitor may also be other types of capacitors, such as silicon capacitors or tantalum capacitors. The type of additional capacitor can be selected based on the filtering requirements of the capacitor assembly 100.

[0090] In some cases, additional capacitors positioned further away from the second carrier plate 22 can have larger parasitic parameters to handle lower frequency noise. Additional capacitors positioned closer to the second carrier plate 22 can have smaller parasitic parameters to handle higher frequency noise. In this way, by configuring capacitors with different characteristics at different levels, the capacitor assembly 100 can achieve filtering functionality over a wide frequency range.

[0091] In some cases, the capacitor assembly 100 may include two or more additional carrier plates. Multiple additional carrier plates may be stacked sequentially along a first direction X. Each additional carrier plate may have a gap between it and an adjacent carrier plate. Each additional carrier plate may have a corresponding additional capacitor. In this way, the capacitor assembly 100 can form a stacked structure of four or more layers, thereby achieving higher capacitance density within a limited planar area.

[0092] In some cases, each of the multiple additional carrier plates can be electrically connected to an adjacent carrier plate via a corresponding additional conductive element. Each additional conductive element may include a conductive structure corresponding to the positive electrode and a conductive structure corresponding to the negative electrode. In this way, the multiple additional carrier plates can form a series electrical connection path, thereby transmitting the electrical signals of each additional capacitor layer to the second carrier plate 22.

[0093] In some cases, the projected area of ​​the additional carrier plate in the first direction X can be less than or equal to the projected area of ​​the second carrier plate 22 in the first direction X. In this way, the capacitor assembly 100 can achieve a compact multi-layer stacked layout within the projected area of ​​the second carrier plate 22. Alternatively or additionally, the projected area of ​​the additional carrier plate can also be greater than the projected area of ​​the second carrier plate 22, as long as the installation space requirements of the capacitor assembly 100 are met.

[0094] By providing at least one additional carrier plate and at least one additional capacitor layer, the capacitor assembly 100 can expand the number of capacitor layers in three-dimensional space. Compared to a two-layer structure that only includes a first carrier plate 21 and a second carrier plate 22, the multi-layer structure including additional carrier plates can accommodate more capacitors in the same planar area, thereby further increasing the capacitance density per unit area and improving the power integrity performance of the power supply system 400.

[0095] Reference Figure 9 , Figure 9 A front view of the power supply system 400 is shown. The power supply system 400 may include a third carrier board 410 and a capacitor assembly 100. The third carrier board 410 can serve as the main carrier board of the power supply system 400, used to carry and connect the various components in the power supply system 400. The capacitor assembly 100 can be disposed on the third carrier board 410, thereby providing filtering functionality for the power supply system 400.

[0096] Continue to refer to Figure 9 The side of the first carrier plate 21 of the capacitor assembly 100 facing away from the second carrier plate 22 can be connected to the third carrier plate 410. Multiple third pads 213 on the first carrier plate 21 can mate with corresponding pads on the third carrier plate 410, thereby achieving electrical and mechanical connections between the capacitor assembly 100 and the third carrier plate 410. In this way, the capacitor assembly 100 can form a stable connection structure with the third carrier plate 410 via the first carrier plate 21.

[0097] In some cases, the first carrier board 21 and the third carrier board 410 can be connected by soldering. Multiple third pads 213 can be soldered to corresponding pads on the third carrier board 410, thereby forming multiple parallel current transmission paths between the first carrier board 21 and the third carrier board 410. In this way, the soldered connection can provide a reliable mechanical connection and a low-impedance electrical connection between the capacitor assembly 100 and the third carrier board 410.

[0098] like Figure 9 As shown, the power supply system 400 may include a third capacitor 420. The third capacitor 420 may be connected to the third carrier plate 410. The third capacitor 420 may be disposed on the surface of the third carrier plate 410, arranged adjacent to the capacitor assembly 100. In this way, the power supply system 400 can achieve filtering function over a wide frequency range through the combination of the third capacitor 420 and the capacitor assembly 100.

[0099] In some cases, the third capacitor 420 may include at least two sets of third sub-capacitors 421 with different capacitance values. Different sets of third sub-capacitors 421 may have different capacitance values, such as large, medium, and small capacitance values. In this way, the power supply system 400 can achieve filtering functions in different frequency bands by configuring multiple sets of third sub-capacitors 421 with different capacitance values.

[0100] Continue to refer to Figure 9 Multiple third sub-capacitors 421 can be arranged in an array on the third carrier plate 410. Third sub-capacitors 421 with different capacitance values ​​can be arranged in a mixed and staggered manner on the third carrier plate 410. For example, a third sub-capacitor 421 with a large capacitance value can be arranged adjacent to a third sub-capacitor 421 with a medium or small capacitance value. In this way, third sub-capacitors 421 with different capacitance values ​​can be spatially interleaved, thereby achieving multi-band filtering coverage in all areas of the third carrier plate 410.

[0101] In some cases, a third sub-capacitor 421 with a larger capacitance value can be used to handle lower frequency noise, while a third sub-capacitor 421 with a smaller capacitance value can be used to handle higher frequency noise. Since third sub-capacitors 421 with different capacitance values ​​have different filtering radii, arranging them in a mixed configuration allows the filtering effects of each third sub-capacitor 421 to be superimposed, thereby achieving a flatter impedance curve over a wide frequency range.

[0102] In some cases, the third capacitor 420 may include at least one of a polymer capacitor or a multilayer ceramic capacitor. Alternatively or alternatively, the third capacitor 420 may also be other types of capacitors, such as silicon capacitors or tantalum capacitors. The type of the third capacitor 420 can be selected according to the filtering requirements of the power supply system 400.

[0103] By combining capacitor assembly 100 with third capacitor 420 on third carrier plate 410, power supply system 400 can achieve higher capacitor density within a limited planar area. The three-dimensional stacked structure of capacitor assembly 100 can expand the arrangement space of capacitors in the vertical direction, while third capacitor 420 can provide additional filtering function in the planar direction of third carrier plate 410. In this way, power supply system 400 can improve power integrity performance and meet the filtering requirements in high current density application scenarios.

[0104] Reference Figure 2 and Figure 6 The three-dimensional stacked structure of the capacitor assembly 100 can increase the capacitance density per unit area. The technical effects and performance improvements of the capacitor assembly 100 are explained below.

[0105] In some cases, the capacitance density of capacitor assembly 100 can be calculated as follows. Let the capacitance of the first capacitor 11 be C1, and the capacitance of the second capacitor 12 be C2. The effective capacitance of the first capacitor 11 can take into account the DC characteristic factor of the capacitor; for example, C1 is approximately 0.64 times the nominal capacitance. Let the area of ​​the first capacitor 11 be S1, and the area of ​​the second capacitor 12 be S2.

[0106] Continue to refer to Figure 2 and Figure 6 The module area of ​​capacitor assembly 100 can be set to S3. In some cases, 16 first capacitors 11 can be disposed on the first carrier plate 21. The total capacitance value of capacitor assembly 100 can be C2 plus 16 times C1. The area S3 of the first carrier plate 21 can be approximately 1.1 times the area S1 of the first capacitor 11. In this way, the capacitance-to-area ratio of capacitor assembly 100 can be expressed as: (C2 + 16 × C1) ÷ (1.1 × S1).

[0107] In some cases, according to the capacitor specifications of server products, the capacitance-to-area ratio C1 / S1 of the first capacitor 11 can be approximately 32 uf / mm². The capacitance-to-area ratio C2 / S2 of the second capacitor 12 can be approximately 23 uf / mm². The capacitance value C1 of the first capacitor 11 can be approximately 0.1 times the capacitance value C2 of the second capacitor 12. Based on the above parameters, the capacitance-to-area ratio of the capacitor assembly 100 can be approximately 39.6 uf / mm². Compared to the traditional single-layer capacitor arrangement, the capacitance density of the capacitor assembly 100 can be increased by approximately 23.7%.

[0108] Reference Figure 9 The path impedance of the power distribution network (PDN) of the power supply system 400 can be expressed as: Where j is the imaginary unit, ω is the angular frequency, L is the parasitic inductance, C is the capacitance, and R is the equivalent series resistance.

[0109] In the frequency range of 100kHz to 2MHz, the capacitive reactance term 1 / jωC can dominate. Through the three-dimensional stacked structure of capacitor assembly 100, the power supply system 400 can improve the impedance of the power distribution network (PDN) within this frequency range. In some cases, capacitor assembly 100 can reduce capacitive impedance by configuring various combinations of capacitors with different capacitance values. In this way, the PDN impedance of the power supply system 400 can be improved by approximately 10% in the 100kHz to 2MHz frequency range.

[0110] In some cases, the capacitor assembly 100 can employ a first heterogeneous capacitor module configuration to achieve an increase in capacitance density. In this configuration, the second capacitor 12 may include a polymer capacitor, and the first capacitor 11 may include a multilayer ceramic capacitor. Through a three-dimensional stacked structure, the capacitor assembly 100 can achieve an approximately 25% increase in capacitance density within the same planar area.

[0111] In some cases, capacitor assembly 100 can employ a second heterogeneous capacitor module configuration to improve the impedance of the power distribution network. In this configuration, the first layer capacitor 101 may include multiple sets of first sub-capacitors 111 with different capacitance values, and the second layer capacitor 102 may include multiple second capacitors 12. By integrating capacitors with different capacitance values ​​and different parasitic parameters in capacitor assembly 100, power supply system 400 can achieve a flatter impedance profile over a wide frequency range. In this way, the second heterogeneous capacitor module configuration can achieve an improved impedance characteristic by sacrificing a portion of the capacitance-to-area ratio, thereby achieving an impedance increase of approximately 10% in the capacitive region.

[0112] Through the aforementioned three-dimensional stacked structure, the capacitor assembly 100 can achieve higher capacitance density and lower power distribution network impedance within a limited planar area, thereby improving the power integrity support of the power supply system 400 for the high current density chip 430.

[0113] In some cases, the capacitor assembly includes a first carrier plate, a second carrier plate, a first layer capacitor, and a second layer capacitor. The first and second carrier plates are stacked and spaced apart from each other along a first direction. The first and second carrier plates are electrically connected.

[0114] A first layer capacitor is disposed on the side of the first carrier plate facing the second carrier plate and is electrically connected to the first carrier plate. A second layer capacitor is disposed on the side of the second carrier plate away from the first carrier plate and is electrically connected to the second carrier plate, wherein the projection of the second layer capacitor at least partially overlaps with the projection of the first layer capacitor along a first direction.

[0115] In some cases, the first layer of capacitors includes multiple first capacitors. The second layer of capacitors includes one or more second capacitors.

[0116] In some cases, the capacitance of the first capacitor is less than that of the second capacitor.

[0117] In some cases, multiple first capacitors have the same capacitance value.

[0118] In some cases, multiple first capacitors are arranged in an array on the first carrier plate.

[0119] In some cases, multiple first capacitors include at least two sets of first sub-capacitors with different capacitance values.

[0120] In some cases, each group of first sub-capacitors is arranged on the first carrier plate along a second direction or a third direction perpendicular to the first direction, and each is arranged in at least one row, wherein the second direction is perpendicular to the third direction.

[0121] In some cases, the first sub-capacitors in adjacent rows have different capacitance values.

[0122] In some cases, the capacitor assembly also includes a conductive element. The conductive element is disposed between the first carrier plate and the second carrier plate to support the first carrier plate and the second carrier plate and electrically connect the first carrier plate and the second carrier plate.

[0123] In some cases, the conductive element includes a first conductive element and a second conductive element. The first conductive element is electrically connected to the first electrode of the second capacitor via a second carrier plate. The second conductive element is electrically connected to the second electrode of the second capacitor via the second carrier plate. The capacitor assembly also includes a first pad and a second pad, which are disposed on the side of the first carrier plate facing the second carrier plate. The first pad and the second pad are located at opposite ends of the first carrier plate, respectively. The first pad is electrically connected to the first conductive element, and the second pad is electrically connected to the second conductive element.

[0124] In some cases, the first pad includes multiple first sub-pads, the first conductive element includes multiple first sub-conductive elements, and the multiple first sub-pads are electrically connected to corresponding first sub-conductive elements among the multiple first sub-conductive elements.

[0125] In some cases, the second pad includes multiple second sub-pads, and the second conductive element includes multiple second sub-conductive elements, with the multiple second sub-pads being electrically connected to corresponding second sub-conductive elements among the multiple second sub-conductive elements.

[0126] In some cases, the capacitor assembly also includes multiple third pads. These third pads are disposed on the side of the first carrier board opposite to the second carrier board, and are electrically connected to corresponding electrodes of the first layer capacitor. Furthermore, the third pads are adapted to be electrically connected to a third carrier board of the power supply system.

[0127] In some cases, the projected area of ​​the second carrier plate in the first direction is less than or equal to the projected area of ​​the first carrier plate in the first direction.

[0128] In some cases, each of the first and second layer capacitors includes at least one of polymer capacitors and multilayer ceramic capacitors.

[0129] In some cases, the capacitor assembly further includes at least one additional carrier plate and at least one additional capacitor layer, wherein the at least one additional carrier plate is stacked and spaced apart from the second carrier plate along a first direction, and the at least one additional capacitor layer is disposed on a respective carrier plate in the at least one additional carrier plate.

[0130] In some cases, the power supply system includes a third carrier board and a capacitor assembly of any of the above, wherein the side of the first carrier board facing away from the second carrier board is connected to the third carrier board.

[0131] In some cases, the power supply system also includes a third capacitor. The third capacitor is connected to a third carrier board.

[0132] In some cases, the third capacitor includes at least two sets of third sub-capacitors with different capacitance values.

[0133] The examples described above are exemplary and not exhaustive, nor are they limited to the disclosed examples. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the illustrated examples. The terminology used herein is chosen to best explain the principles, practical applications, or technological improvements to the examples in the market, or to enable others skilled in the art to understand the examples disclosed herein.

Claims

1. A capacitor assembly (100), comprising: A first carrier plate (21) and a second carrier plate (22) are stacked and spaced apart from each other along a first direction (X), and the first carrier plate (21) and the second carrier plate (22) are electrically connected. The first layer capacitor (101) is disposed on the side of the first carrier plate (21) facing the second carrier plate (22) and is electrically connected to the first carrier plate (21); as well as The second layer capacitor (102) is disposed on the side of the second carrier plate (22) away from the first carrier plate (21) and is electrically connected to the second carrier plate (22), wherein the projection of the second layer capacitor (102) at least partially overlaps with the projection of the first layer capacitor (101) along the first direction (X).

2. The capacitor assembly (100) according to claim 1, wherein the first layer capacitor (101) comprises a plurality of first capacitors (11) and the second layer capacitor (102) comprises one or more second capacitors (12).

3. The capacitor assembly (100) according to claim 2, wherein the capacitance value of the first capacitor (11) is less than the capacitance value of the second capacitor (12).

4. The capacitor assembly (100) according to claim 2, wherein the plurality of first capacitors (11) have the same capacitance value.

5. The capacitor assembly (100) according to any one of claims 2 to 4, wherein the plurality of first capacitors (11) are arranged in an array on the first carrier plate (21).

6. The capacitor assembly (100) according to claim 2, wherein the plurality of first capacitors (11) comprises at least two sets of first sub-capacitors (111) having different capacitance values.

7. The capacitor assembly (100) according to claim 2 further includes a conductive element (30) disposed between the first carrier plate (21) and the second carrier plate (22) to support the first carrier plate (21) and the second carrier plate (22) and electrically connect the first carrier plate (21) and the second carrier plate (22).

8. The capacitor assembly (100) according to claim 7, wherein the conductive element (30) comprises a first conductive element (31) and a second conductive element (32), the first conductive element (31) being electrically connected to a first electrode (121) of the second capacitor (12) via the second carrier plate (22), and the second conductive element (32) being electrically connected to a second electrode (122) of the second capacitor (12) via the second carrier plate (22), and The capacitor assembly (100) further includes a first pad (211) and a second pad (212). The first pad (211) and the second pad (212) are disposed on the side of the first carrier plate (21) facing the second carrier plate (22). The first pad (211) and the second pad (212) are respectively located at opposite ends of the first carrier plate (21). The first pad (211) is electrically connected to the first conductive element (31), and the second pad (212) is electrically connected to the second conductive element (32).

9. The capacitor assembly (100) according to claim 8, wherein the first pad (211) comprises a plurality of first sub-pads (2111), the first conductive element (31) comprises a plurality of first sub-conductive elements (311), and the plurality of first sub-pads (2111) are electrically connected to a corresponding first sub-conductive element (311) among the plurality of first sub-conductive elements (311); and / or The second pad (212) includes a plurality of second sub-pads (2121), and the second conductive element (32) includes a plurality of second sub-conductive elements (321). The plurality of second sub-pads (2121) are electrically connected to the corresponding second sub-conductive elements (321) among the plurality of second sub-conductive elements (321).

10. The capacitor assembly (100) according to claim 1 further includes a plurality of third pads (213) disposed on the side of the first carrier plate (21) away from the second carrier plate (22), the plurality of third pads (213) being electrically connected to the corresponding electrodes of the first layer capacitor (101), and the plurality of third pads (213) being adapted to be electrically connected to the third carrier plate (410) of the power supply system (400).

11. The capacitor assembly (100) according to claim 1, wherein the projected area of ​​the second carrier plate (22) in the first direction (X) is less than or equal to the projected area of ​​the first carrier plate (21) in the first direction (X).

12. The capacitor assembly (100) according to claim 1, wherein each of the first layer capacitor (101) and the second layer capacitor (102) comprises at least one of a polymer capacitor and a multilayer ceramic capacitor.

13. The capacitor assembly (100) of claim 1 further includes at least one additional carrier plate and at least one additional capacitor layer. The at least one additional carrier plate is stacked and spaced apart from the second carrier plate (22) along a first direction (X), and the at least one additional capacitor is disposed on a corresponding carrier plate in the at least one additional carrier plate.

14. A power supply system (400), comprising: Third carrier plate (410); as well as The capacitor assembly (100) according to any one of claims 1 to 13, wherein the first carrier plate (21) is connected to the third carrier plate (410) on the side opposite to the second carrier plate (22).

15. The power supply system (400) according to claim 14 further includes a third capacitor (420) connected to the third carrier plate (410).

16. The power supply system (400) according to claim 15, wherein the third capacitor (420) comprises at least two sets of third sub-capacitors (421) with different capacitance values.

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