A laser cutting device for flexible circuit boards with irregular profiles

Abstract

This invention relates to the field of flexible printed circuit board (PCB) processing equipment, specifically to a laser cutting device for irregularly shaped PCB contours. The device includes: a mounting frame for supporting and installing the entire device, comprising a base and a support frame; an adsorption and fixing component installed on top of the base for adsorbing and fixing the PCB; two roller assemblies located on the top sides of the base for guiding the PCB; a bonding assembly located inside the support frame for pressing and bonding the PCB; and a cutting assembly installed inside the support frame via a transmission assembly for cutting the PCB. This invention, through its targeted structural design, effectively solves the technical pain points of misalignment, warping, and inaccurate positioning in the laser cutting of irregularly shaped PCB contours from roll to roll.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board processing equipment technology, specifically to a laser cutting device for irregularly shaped flexible circuit boards. Background Technology

[0002] Flexible printed circuit boards (FPCBs), with their thinness, flexibility, and high wiring density, have become core components of modern electronic devices and are widely used in smartphones, wearable devices, automotive electronics, and other products. In the manufacturing process of FPCBs, irregular contour cutting is a critical step that directly affects the dimensional accuracy, edge quality, and subsequent assembly reliability of the product. Roll-to-roll processing, due to its high efficiency and suitability for mass production, has become the mainstream processing method in the industry.

[0003] Currently, the laser cutting of irregular contours in roll-to-roll flexible circuit boards generally suffers from technical challenges such as low cutting accuracy, easy warping of the cut area, and easy circuit board misalignment. Flexible circuit boards are inherently soft, have low surface tension, and a large coefficient of thermal expansion and contraction. Ultra-thin flexible circuit boards are particularly prone to deformation during processing. Traditional laser cutting equipment uses fixed adsorption or simple pressing and limiting methods, which are difficult to achieve stable positioning of the circuit board. On the one hand, if the adsorption plate is too tightly attached to the circuit board, it can obstruct the roll-to-roll transport of the circuit board, causing the circuit board to deviate during transport, surface wear, and affecting the continuity of processing. On the other hand, if the attachment is too loose, effective adsorption cannot be achieved, and the circuit board is prone to suspension and shaking, resulting in deviation of the cutting trajectory and reduced cutting accuracy. On the other hand, local heat accumulation occurs during laser cutting, causing uneven thermal stress in the material. This can easily lead to problems such as warping and edge cracking at the cut. The fixed pressing structure of traditional equipment cannot dynamically adjust with the movement of the laser blade and cannot limit the perimeter of the cutting area in real time, which further aggravates the warping phenomenon. This not only affects the product yield but may also cause subsequent welding and packaging processes to fail, increasing production costs.

[0004] Furthermore, existing limiting mechanisms for roll-to-roll flexible circuit boards mostly fail to balance "fitting stability" and "smooth transport." Either the limiting is too tight, hindering transport, or the limiting is too loose, causing positioning failure. They are difficult to adapt to the high-precision and high-stability processing requirements of irregular contour cutting and cannot meet the current development needs of miniaturization and precision of flexible circuit boards.

[0005] Therefore, it is necessary to invent a laser cutting device for irregularly shaped flexible circuit boards to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a laser cutting device for irregular contours of flexible circuit boards. Through targeted structural design, this device effectively solves the technical pain points such as offset, warping, and inaccurate positioning in the laser cutting process of irregular contours of roll-to-roll flexible circuit boards.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a laser cutting device for irregular contours of flexible circuit boards, comprising: The mounting frame is used to support and install the entire device, including the base and support frame; Adsorption fastener, installed on top of the base, is used to adsorb and fix the flexible circuit board. Two roller assemblies are located on the top sides of the base to guide the flexible circuit board; The bonding component, located inside the support frame, is used to press and bond the flexible circuit board. The cutting assembly, installed inside the support frame via a transmission assembly, is used to cut flexible circuit boards; The pressing component is located inside the cutting component and is used to press the cutting area.

[0008] As a preferred embodiment of the present invention, an inspection door is provided at the front of the base to facilitate the inspection and maintenance of internal parts. Support feet are installed at the four corners of the bottom of the base to facilitate the support of the device. An observation window is provided on the front side of the support frame to facilitate the observation of the cutting process of the device and to provide cutting protection to prevent workers from accidentally entering and causing injury.

[0009] In a preferred embodiment of the present invention, the adsorption fixing component includes an adsorption plate, a ceramic pad is provided on the top of the adsorption plate, a plurality of adsorption holes are provided inside the ceramic pad, and arc-shaped grooves are provided at both ends of the adsorption plate.

[0010] As a preferred embodiment of the present invention, the roller assembly includes a through-hole and a mounting plate. The through-hole is opened on both sides of the support frame, and a rotating roller is fixedly connected inside the mounting plate. The rotating roller is rotatably connected to the through-hole through a bearing. The flexible circuit board passes through two rotating rollers from below, with the bottom of the rollers 0.5mm above the top of the ceramic pad, making it suitable for flexible circuit boards of most thicknesses.

[0011] In a preferred embodiment of the present invention, the bonding assembly includes a mounting corner plate, which is fixedly installed inside a support frame. A first cylinder is mounted on the top of the mounting corner plate, and a lifting plate is fixedly connected to the output end of the first cylinder. A connecting plate is fixedly connected to both ends of the lifting plate, and a fixing head is fixedly installed at both ends of the connecting plate. A rotating plate is rotatably connected to the inner side of the fixing head, and a pressure roller is connected between the two rotating plates. A rubber layer is fixedly sleeved on the outer side of the pressure roller.

[0012] In a preferred embodiment of the present invention, a movable head is fixedly connected to the outer side of the rotating plate, two movable blocks are fixedly connected to the outer side of the movable head, an arc-shaped rod is fixedly connected between the movable blocks, an elastic element is sleeved on the outer side of the arc-shaped rod, a protruding rod is fixedly connected to the outer side of the movable head, a groove that mates with the protruding rod is provided inside the fixed head, a fixed block that mates with the movable blocks is fixedly connected to the inner side of the fixed head, a slot that mates with the arc-shaped rod is provided inside the fixed block, a slider is fixedly connected to the outer side of the fixed head, and a sliding groove that mates with the slider is provided on the inner side of the support frame.

[0013] In a preferred embodiment of the present invention, the transmission assembly includes a top frame installed at the top of the support frame, a longitudinal motor installed on the side of the top frame, a longitudinal lead screw fixedly connected to the output end of the longitudinal motor and rotatably connected to the top frame, a longitudinal threaded block threaded to the outer side of the longitudinal lead screw, a transverse frame fixedly connected to the bottom of the longitudinal threaded block, a transverse motor installed on the side of the transverse frame, a transverse lead screw fixedly connected to the output end of the transverse motor and rotatably connected to the transverse frame, and a transverse threaded block threaded to the outer side of the transverse lead screw.

[0014] In a preferred embodiment of the present invention, a longitudinal slide rod is fixedly connected inside the top frame, a longitudinal slider is slidably connected to the outside of the longitudinal slide rod, the bottom of the longitudinal slider is fixedly connected to the transverse frame, a transverse slide rod is fixedly connected inside the transverse frame, and the transverse slide rod is slidably connected to the transverse threaded block.

[0015] In a preferred embodiment of the present invention, the cutting assembly includes a movable seat, a second cylinder is installed inside the movable seat, a connecting rod is fixedly connected to the output end of the second cylinder, a lifting frame is fixedly connected to the end of the connecting rod, a laser cutting head is installed at the bottom of the lifting frame, a limit groove is formed in the inner wall of the movable seat, a limit block is fixedly connected to the side of the lifting frame, and the limit block is slidably connected to the movable seat inside the limit groove.

[0016] As a preferred embodiment of the present invention, the pressing assembly includes a pressing rod, and through holes are provided in the inner bottom of the limiting groove and the interior of the limiting block. The pressing rod passes through the interior of the two through holes, and an anti-detachment block is fixedly connected to the top of the pressing rod, and a rotating ball is rotatably connected to the bottom of the pressing rod.

[0017] Compared with the prior art, the technical effects and advantages provided by the present invention in the above technical solution are as follows: By combining the roller assembly with the adsorption fixture, the circuit board is brought close to the adsorption fixture while avoiding the ceramic pad from obstructing the conveying of the circuit board. This ensures the bonding between the circuit board and the ceramic pad and the smoothness of roll-to-roll conveying. It reduces the offset of the circuit board caused by conveying obstruction from the root, improves the cutting and positioning accuracy, and adapts to the processing requirements of ultra-thin and easily deformable flexible circuit boards. By combining the bonding component, the roller assembly, and the adsorption fixing component, the pressure rollers gently press the two ends of the circuit board, which can tighten the circuit board and tightly adhere it to the ceramic pad. With the subsequent adsorption operation, the gap between the circuit board and the ceramic pad can be completely eliminated, preventing the circuit board from being suspended or shaking during the cutting process. This ensures that the laser cutting trajectory is completely consistent with the preset contour, significantly improving the cutting accuracy of irregular contours and reducing the occurrence of defects such as edge burrs and dimensional deviations. By setting four pressure bars around the laser cutting head, and the pressure bars can dynamically track and limit the movement of the laser cutting head, the periphery of the laser cutting part can be pressed and limited in real time, effectively offsetting the thermal stress generated by heat accumulation during laser cutting and preventing problems such as warping and edge cracking in the cutting part. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the cross-sectional structure of the support frame of the present invention; Figure 3 This is a schematic diagram of the connection structure between the base and the support frame of the present invention; Figure 4 This is a schematic diagram of the internal structure of the support frame of the present invention; Figure 5 This is a schematic diagram of the bonding component structure of the present invention; Figure 6 This is a partial structural diagram of the bonding component of the present invention; Figure 7 For the present invention Figure 6 Enlarged structural diagram at point A in the middle; Figure 8 For the present invention Figure 6 Enlarged structural diagram at point B; Figure 9 This is a schematic diagram of the transmission component structure of the present invention; Figure 10 This is a partial structural diagram of the transmission component of the present invention; Figure 11 This is a schematic diagram of the cutting component structure of the present invention; Figure 12 This is a schematic diagram of the connection structure between the pressing component and the cutting component of the present invention.

[0020] Explanation of reference numerals in the attached figures: 001. Mounting frame; 002. Adsorption and fixing components; 003. Roller assembly; 004. Lamination assembly; 005. Transmission assembly; 006. Cutting assembly; 007. Pressing assembly; 101. Base; 102. Support frame; 103. Observation window; 104. Inspection door; 105. Support legs; 201. Adsorption plate; 202. Ceramic pad; 203. Adsorption hole; 204. Arc groove; 301. Through-hole; 302. Mounting plate; 303. Rotating roller; 304. Bearing; 401. Angle plate; 402. First cylinder; 403. Lifting plate; 404. Connecting plate; 405. Fixed head; 406. Rotating plate; 407. Pressure roller; 408. Rubber layer; 409. Movable head; 410. Movable block; 411. Arc rod; 412. Elastic element; 413. Protruding rod; 414. Groove; 415. Fixed block; 416. Slot; 417. Slider; 418. Slide groove; 501. Top frame; 502. Longitudinal motor; 503. Longitudinal lead screw; 504. Longitudinal threaded block; 505. Transverse frame; 506. Transverse motor; 507. Transverse lead screw; 508. Transverse threaded block; 509. Longitudinal slide bar; 510. Longitudinal slider; 511. Transverse slide bar; 601. Movable seat; 602. Second cylinder; 603. Connecting rod; 604. Lifting frame; 605. Laser cutting head; 606. Limiting block; 607. Limiting groove; 701. Pressure bar; 702. Anti-detachment block; 703. Rotating ball. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0022] This invention provides, for example Figure 1-12 The laser cutting equipment for irregularly shaped flexible circuit boards shown includes: Mounting frame 001 is used to support and install the entire device, including base 101 and support frame 102; Adsorption fixing component 002 is installed on the top of base 101 and is used to adsorb and fix the flexible circuit board. Two roller assemblies 003 are located on the top sides of the base 101 and are used to guide the flexible circuit board. The bonding component 004 is disposed inside the support frame 102 and is used to press and bond the flexible circuit board. The cutting assembly 006 is installed inside the support frame 102 via the transmission assembly 005 and is used to cut the flexible circuit board; The pressing component 007 is located inside the cutting component 006 and is used to press the cutting part.

[0023] The device is placed in a roll-to-roll conveyor for flexible printed circuit boards (FPCBs). This conveyor is a mature existing technology and will not be described in detail here. The FPCBs pass through the roller assembly 003, which works in conjunction with the conveyor. When the FPCB to be cut is conveyed above the adsorption fixing member 002, the conveying stops. Then, the bonding assembly 004 is activated to gently press both ends of the FPCB, causing the bottom of the FPCB to adhere to the adsorption fixing member 002. The adsorption fixing member 002 then further adsorbs and fixes the FPCB. Next, the cutting assembly 006 cuts the FPCB, while the transmission assembly 005 is activated to adjust the position of the cutting assembly 006. The user can set the running trajectory of the cutting assembly 006 according to the characteristics and shape of the FPCB; this is existing technology and will not be described in detail here.

[0024] The base 101 is provided with an inspection door 104 at the front, which facilitates the inspection and maintenance of internal parts. Support feet 105 are installed at the four corners of the bottom of the base 101 to facilitate the support of the device. The support frame 102 is provided with an observation window 103 on the front side, which facilitates the observation of the cutting process of the device and can also be used for cutting protection to prevent personnel from accidentally entering and causing injury.

[0025] To further fix the flexible circuit board, the adsorption fixing component 002 includes an adsorption plate 201, a ceramic pad 202 is provided on the top of the adsorption plate 201, a plurality of adsorption holes 203 are provided inside the ceramic pad 202, and arc grooves 204 are provided at both ends of the adsorption plate 201. During the adsorption and fixation process, the user can start the adsorption machine and use the adsorption holes 203 to adsorb and fix the flexible circuit board.

[0026] The roller assembly 003 includes a through port 301 and a mounting plate 302. The through port 301 is opened on both sides of the support frame 102. A rotating roller 303 is fixedly connected inside the mounting plate 302. The rotating roller 303 is rotatably connected to the through port 301 through a bearing 304. The flexible circuit board passes through two rotating rollers 303 from below. The bottom of the rotating rollers 303 is 0.5mm higher than the top of the ceramic pad 202, which is suitable for flexible circuit boards of most thicknesses. The flexible circuit board provides precise height limiting, allowing the circuit board to be close to the ceramic pad 202 while avoiding the ceramic pad 202 from obstructing the transport of the circuit board. This ensures both the adhesion between the circuit board and the ceramic pad 202 and the smoothness of roll-to-roll transport, thereby reducing the offset of the circuit board caused by transport obstruction and improving the cutting and positioning accuracy.

[0027] The bonding assembly 004 includes a mounting angle plate 401, which is fixedly installed inside the support frame 102. A first cylinder 402 is mounted on the top of the mounting angle plate 401. A lifting plate 403 is fixedly connected to the output end of the first cylinder 402. A connecting plate 404 is fixedly connected to both ends of the lifting plate 403. A fixing head 405 is fixedly installed at both ends of the connecting plate 404. A rotating plate 406 is rotatably connected to the inner side of the fixing head 405. A pressure roller 407 is connected between the two rotating plates 406. A rubber layer 408 is fixedly sleeved on the outer side of the pressure roller 407.

[0028] When the circuit board needs to be adsorbed, the mounting angle plate 401 is activated first. The mounting angle plate 401 drives the lifting plate 403 and the connecting plate 404 to descend as a whole, so that the pressure roller 407 contacts the circuit board and presses down. The pressure roller 407 is located between the arc groove 204 and the rotating roller 303. Due to the arc shape of the arc groove 204, it can prevent damage to the circuit board. Under the pressure of the rubber layer 408, the circuit board is attached to the ceramic pad 202, which facilitates the adsorption fixing component 002 to adsorb it. The rubber layer 408 can protect the circuit board.

[0029] A movable head 409 is fixedly connected to the outer side of the rotating plate 406. Two movable blocks 410 are fixedly connected to the outer side of the movable head 409. An arc-shaped rod 411 is fixedly connected between the movable blocks 410. An elastic element 412 is sleeved on the outer side of the arc-shaped rod 411. A protruding rod 413 is fixedly connected to the outer side of the movable head 409. A groove 414 that mates with the protruding rod 413 is opened inside the fixed head 405. A fixed block 415 that mates with the movable block 410 is fixedly connected to the inner side of the fixed head 405. A slot 416 that mates with the arc-shaped rod 411 is opened inside the fixed block 415. A slider 417 is fixedly connected to the outer side of the fixed head 405. A groove 418 that mates with the slider 417 is opened on the inner side of the support frame 102.

[0030] To tighten the circuit board and prevent wrinkles caused by loosening, the pressure roller 407 can adaptively adjust according to the tension of the circuit board. The rubber layer 408 can rotate, thereby slightly adjusting the height of the pressure roller 407. In the initial state, the rotating plate 406 is tilted outward. When the circuit board is too tight, the rubber layer 408 is lifted, causing the rotating plate 406 to rotate. The rotating plate 406 drives the movable head 409 to rotate outward. The protruding rod 413 rotates inside the groove 414, which facilitates the limiting of the movable head 409. The arc-shaped rod 411 slides inside the fixed block 415 to avoid interference with the fixed block 415 and squeezes the elastic element 412. Under the action of the elastic element 412, the pressure roller 407 is reset, which facilitates the tightening of the circuit board under the action of the protruding rod 413. This prevents wrinkles and also prevents the circuit board from tearing due to excessive tightness. The arc-shaped rod 411 can limit the elastic element 412 to prevent it from bending and falling off under pressure.

[0031] The bonding component 004 can completely eliminate the gap between the circuit board and the ceramic pad 202, preventing the circuit board from being suspended or shaking during the cutting process, ensuring that the laser cutting trajectory is completely consistent with the preset contour, and improving the cutting accuracy of irregular contours.

[0032] The transmission assembly 005 includes a top frame 501 installed at the top of the support frame 102. A longitudinal motor 502 is installed on the side of the top frame 501. A longitudinal lead screw 503, which is rotatably connected to the output end of the longitudinal motor 502, is fixedly connected to the output end of the longitudinal motor 502. A longitudinal threaded block 504 is threadedly connected to the outer side of the longitudinal lead screw 503. A transverse frame 505 is fixedly connected to the bottom of the longitudinal threaded block 504. A transverse motor 506 is installed on the side of the transverse frame 505. A transverse lead screw 507, which is rotatably connected to the output end of the transverse motor 506, is fixedly connected to the output end of the transverse motor 506. A transverse threaded block 508 is threadedly connected to the outer side of the transverse lead screw 507. A longitudinal slide rod 509 is fixedly connected inside the top frame 501. A longitudinal slider 510 is slidably connected to the outer side of the longitudinal slide rod 509. The bottom of the longitudinal slider 510 is fixedly connected to the transverse frame 505. A transverse slide rod 511 is fixedly connected inside the transverse frame 505. The transverse slide rod 511 is slidably connected to the transverse threaded block 508. When the position of the cutting component 006 needs to be adjusted, the longitudinal motor 502 is started, which drives the longitudinal lead screw 503 to rotate. The longitudinal lead screw 503 drives the longitudinal threaded block 504 to move, and the longitudinal threaded block 504 drives the transverse frame 505 to move synchronously. The longitudinal slider 510 slides outside the longitudinal slide bar 509, which facilitates the limiting of the transverse frame 505. The transverse motor 506 is started, which drives the transverse lead screw 507 to rotate. The transverse lead screw 507 drives the transverse threaded block 508 to move, so that the transverse threaded block 508 slides outside the transverse slide bar 511, thereby limiting the transverse threaded block 508. This achieves multi-directional position adjustment of the cutting component 006.

[0033] The cutting assembly 006 includes a movable seat 601, a second cylinder 602 is installed inside the movable seat 601, a connecting rod 603 is fixedly connected to the output end of the second cylinder 602, a lifting frame 604 is fixedly connected to the end of the connecting rod 603, a laser cutting head 605 is installed at the bottom of the lifting frame 604, a limiting groove 607 is opened on the inner wall of the movable seat 601, a limiting block 606 is fixedly connected to the side of the lifting frame 604, and the limiting block 606 is slidably connected to the movable seat 601 inside the limiting groove 607. When cutting is required, the user activates the second cylinder 602 to lift the lifting frame 604, which in turn lifts the laser cutting head 605 to bring it close to the circuit board for cutting. The limiting block 606 slides inside the limiting groove 607 to limit the lifting frame 604 and further improve the stability of the device.

[0034] The pressing assembly 007 includes a pressing rod 701. The inner bottom of the limiting groove 607 and the interior of the limiting block 606 are both provided with through holes. The pressing rod 701 passes through the interior of the two through holes. The top of the pressing rod 701 is fixedly connected to an anti-detachment block 702, and the bottom of the pressing rod 701 is rotatably connected to a rotating bead 703. When the lifting frame 604 approaches the circuit board for cutting, the bottom of the rotating bead 703 first contacts the circuit board, thereby pressing down on the periphery of the cutting area to prevent warping during local cutting. The rotating bead 703 can slide up and down inside the through hole, so when the lifting frame 604 rises and falls slightly, the pressure rod 701 remains in contact with the circuit board under the action of gravity. The rotating bead 703 can rotate freely to prevent scratching the circuit board, and the top of the pressure rod 701 is equipped with an anti-detachment block 702. After cutting is completed, the lifting frame 604 can move the pressure rod 701 away from the circuit board. The pressing component 007 moves along with the cutting component 006, achieving dynamic tracking and limiting. It can press and limit the periphery of the cutting part in real time, offsetting the thermal stress generated by heat accumulation during laser cutting, preventing problems such as warping and edge cracking at the cutting part, improving product quality stability, reducing rework rate and scrap rate, and thus reducing production costs.

[0035] The overall structural design fits the roll-to-roll processing mode, which can be adapted without major modifications to existing production lines. It is easy to operate and can balance processing accuracy and production efficiency. It can be widely used for irregular contour cutting of flexible circuit boards of different specifications and thicknesses.

[0036] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A laser cutting device for irregular contours of flexible circuit boards, characterized in that: include: The mounting frame (001) is used to support and install the entire device, including a base (101) and a support frame (102). The adsorption fixing component (002) is installed on the top of the base (101) and is used to adsorb and fix the flexible circuit board. Two roller assemblies (003) are disposed on the top sides of the base (101) for guiding the flexible circuit board; The bonding component (004) is disposed inside the support frame (102) and is used to press and bond the flexible circuit board; The cutting assembly (006) is installed inside the support frame (102) via the transmission assembly (005) and is used to cut the flexible circuit board; The pressing component (007) is located inside the cutting component (006) and is used to press the cutting part.

2. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 1, characterized in that: An inspection door (104) is provided at the front of the base (101), and support feet (105) are installed at the four corners of the bottom of the base (101). An observation window (103) is provided on the front side of the support frame (102).

3. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 1, characterized in that: The adsorption fixing component (002) includes an adsorption plate (201), a ceramic pad (202) is provided on the top of the adsorption plate (201), a plurality of adsorption holes (203) are provided inside the ceramic pad (202), and arc grooves (204) are provided at both ends of the adsorption plate (201).

4. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 1, characterized in that: The roller assembly (003) includes a through port (301) and a mounting plate (302). The through port (301) is located on both sides of the support frame (102). A rotating roller (303) is fixedly connected inside the mounting plate (302). The rotating roller (303) is rotatably connected to the through port (301) through a bearing (304).

5. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 1, characterized in that: The bonding assembly (004) includes a mounting angle plate (401), which is fixedly installed inside the support frame (102). A first cylinder (402) is installed on the top of the mounting angle plate (401). A lifting plate (403) is fixedly connected to the output end of the first cylinder (402). A connecting plate (404) is fixedly connected to both ends of the lifting plate (403). A fixing head (405) is fixedly installed at both ends of the connecting plate (404). A rotating plate (406) is rotatably connected to the inner side of the fixing head (405). A pressure roller (407) is connected between the two rotating plates (406). A rubber layer (408) is fixedly sleeved on the outer side of the pressure roller (407).

6. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 5, characterized in that: A movable head (409) is fixedly connected to the outer side of the rotating plate (406). Two movable blocks (410) are fixedly connected to the outer side of the movable head (409). An arc-shaped rod (411) is fixedly connected between the movable blocks (410). An elastic element (412) is sleeved on the outer side of the arc-shaped rod (411). A protruding rod (413) is fixedly connected to the outer side of the movable head (409). A groove (414) that mates with the protruding rod (413) is opened inside the fixed head (405). A fixed block (415) that mates with the movable block (410) is fixedly connected to the inner side of the fixed head (405). A slot (416) that mates with the arc-shaped rod (411) is opened inside the fixed block (415). A slider (417) is fixedly connected to the outer side of the fixed head (405). A sliding groove (418) that mates with the slider (417) is opened on the inner side of the support frame (102).

7. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 1, characterized in that: The transmission assembly (005) includes a top frame (501) installed at the top of the support frame (102). A longitudinal motor (502) is installed on the side of the top frame (501). The output end of the longitudinal motor (502) is fixedly connected to a longitudinal lead screw (503) that is rotatably connected to the top frame (501). A longitudinal threaded block (504) is threadedly connected to the outer side of the longitudinal lead screw (503). A transverse frame (505) is fixedly connected to the bottom of the longitudinal threaded block (504). A transverse motor (506) is installed on the side of the transverse frame (505). The output end of the transverse motor (506) is fixedly connected to a transverse lead screw (507) that is rotatably connected to the transverse frame (505). A transverse threaded block (508) is threadedly connected to the outer side of the transverse lead screw (507).

8. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 7, characterized in that: The top frame (501) is fixedly connected to a longitudinal slide rod (509) inside, and a longitudinal slider (510) is slidably connected to the outside of the longitudinal slide rod (509). The bottom of the longitudinal slider (510) is fixedly connected to a transverse frame (505). A transverse slide rod (511) is fixedly connected to the inside of the transverse frame (505). The transverse slide rod (511) is slidably connected to a transverse threaded block (508).

9. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 8, characterized in that: The cutting assembly (006) includes a movable seat (601), inside which a second cylinder (602) is installed. The output end of the second cylinder (602) is fixedly connected to a connecting rod (603), and the end of the connecting rod (603) is fixedly connected to a lifting frame (604). A laser cutting head (605) is installed at the bottom of the lifting frame (604). A limiting groove (607) is opened on the inner wall of the movable seat (601), and a limiting block (606) is fixedly connected to the side of the lifting frame (604). The limiting block (606) is slidably connected to the movable seat (601) inside the limiting groove (607).

10. The laser cutting equipment for irregular contours of flexible circuit boards according to claim 9, characterized in that: The pressing assembly (007) includes a pressing rod (701). The inner bottom of the limiting groove (607) and the interior of the limiting block (606) are both provided with through holes. The pressing rod (701) passes through the interior of the two through holes. The top of the pressing rod (701) is fixedly connected to an anti-detachment block (702), and the bottom of the pressing rod (701) is rotatably connected to a rotating bead (703).

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