OLED module for improving brightness uniformity and processing method thereof

Abstract

The application discloses an OLED module for improving brightness uniformity and a processing method thereof. The OLED module comprises a cover plate, a substrate, an organic light-emitting diode array arranged on the substrate, a molten glass sealing ring formed by melting low-melting-point glass powder at the edge of the substrate, and a buffer sealing glue ring on the inner side. A micro-particle scattering layer is arranged in a cavity between the cover plate and the substrate. The scattering layer comprises a transparent matrix and scattering micro-particles dispersed in the transparent matrix. The particle size of the micro-particles is 1-10 microns, the haze of the scattering layer is 10%-40%, and the refractive index is 1.45-1.55. A laser etching groove is arranged in a glass powder coating area at the edge of the substrate. High-elasticity silicon resin is filled in the groove to form periodic convex points. The diameter of the convex points is 5-10 microns, the height is 10-20 microns, and the convex points are located between the low-melting-point glass powder and the substrate. The brightness uniformity and the sealing reliability are simultaneously improved through the synergistic optimization of the micro-particle scattering layer and the interface elastic convex point structure.

Description

Technical Field

[0001] This invention relates to the field of OLED module technology, and more specifically to an OLED module with improved brightness uniformity and its processing method. Background Technology

[0002] Organic light-emitting diode (OLED) display technology has been increasingly widely used in smartphones, televisions, wearable devices, and automotive displays due to its superior characteristics such as self-illumination, high contrast, wide viewing angle, fast response speed, and the ability to achieve flexible displays. As consumers' demands for display quality continue to rise, achieving high brightness uniformity across the entire display area of ​​an OLED screen has become one of the key technical challenges that the industry urgently needs to solve.

[0003] In existing technologies, multiple factors affect the brightness uniformity of OLED modules. First, OLED devices are extremely sensitive to moisture and oxygen; once these substances penetrate, they can quickly cause pixel failure, create dark spots, and severely damage display uniformity. Therefore, efficient and reliable encapsulation technology is fundamental to ensuring the stability and lifespan of OLED performance. Current mainstream encapsulation methods, such as using a glass cover with edge-sealed UV adhesive or hot-melt adhesive (such as low-melting-point glass powder), provide a certain degree of barrier effect. However, with long-term use or exposure to temperature and humidity changes, stress concentration or micro-gaps can easily occur at the encapsulation interface, leading to decreased encapsulation reliability and indirectly affecting display uniformity.

[0004] Secondly, slight unevenness in film thickness or material distribution is unavoidable during the fabrication of OLED emissive layers, leading to deviations in the initial brightness of each emitting pixel. More importantly, the light-emitting structure itself is also a significant factor affecting brightness uniformity. For example, when photons generated inside an OLED device pass through different film layer interfaces (such as organic layers, transparent electrodes, and substrates), differences in refractive indices cause phenomena such as total internal reflection, refraction, and interference. This results in a large number of photons being trapped inside the device or absorbed by adjacent pixels, creating an optical waveguide effect. This not only reduces the overall light extraction efficiency but also causes inconsistencies in brightness between the edges and center of the display area. This is particularly pronounced on large-size or high-resolution displays, where edge bright spots (i.e., higher light extraction efficiency at the edges than in the center) are especially noticeable, severely impacting the viewing experience. Summary of the Invention

[0005] The problem to be solved by the present invention is to provide an OLED module and its processing method that improves brightness uniformity by synergistically optimizing the microparticle scattering layer and the interface elastic bump structure, thereby simultaneously improving brightness uniformity and sealing reliability.

[0006] The technical solution provided by the present invention to solve the above problems is: an OLED module with improved brightness uniformity, including a cover plate, a substrate, an organic light-emitting diode array disposed on the substrate, a molten glass sealing ring formed by melting low-melting-point glass powder at the edge of the substrate, and a buffer sealing ring on the inner side. A microparticle scattering layer is provided in the cavity between the cover plate and the substrate. The scattering layer includes a transparent substrate and scattering microparticles dispersed therein. The microparticle size is 1-10 μm, the haze of the scattering layer is 10%-40%, and the refractive index is 1.45-1.55. The glass powder coating area at the edge of the substrate is provided with laser-etched grooves. The grooves are filled with highly elastic silicone resin to form periodic bumps with a diameter of 5-10 μm and a height of 10-20 μm, located between the low-melting-point glass powder and the substrate.

[0007] Preferably, the scattering particles are SiO2, PMMA, PS or BaSO4 microspheres, accounting for 0.1%-20% by mass.

[0008] Preferably, the scattering layer has a thickness of 10-100 μm and is attached to the inner surface of the cover plate or fills the entire cavity.

[0009] Preferably, the protrusion material is polydimethylsiloxane with an elastic modulus of 0.1-1 MPa.

[0010] Preferably, the side of the OLED module is provided with a silicon carbide layer with a thickness of 0.5-5μm.

[0011] Preferably, the width of the molten glass sealing ring and the buffer sealing ring is 0.4-0.6 mm.

[0012] The present invention also discloses a processing method for an OLED module to improve brightness uniformity, the processing method comprising the following steps: S1. In the glass powder pre-coated area at the edge of the substrate, a deep groove array is laser-etched, filled with polydimethylsiloxane and cured to form bumps; S2. Screen print a low-melting-point glass powder ring with a cross-sectional width of 0.5mm on the surface of the convex structure, and apply a low-temperature sealant of the same width on the inner side. S3. Spin-coat a silicone resin slurry containing 5μm SiO2 microspheres onto the inner surface of the cover plate, and pre-cur it at 80℃ to form a 50μm scattering layer; S4. Align and press the cover plate with the substrate, melt the glass powder and sealant, and after cooling, embed the scattering layer into the cavity, and fill the interface gap with the pressure of the elastic protrusions. S5. A 2μm silicon carbide layer is magnetron sputtered onto the side of the OLED module to obtain the finished product; S6. Sample the finished products and put them into the compression testing device for compression testing. After passing the test, pack them into the warehouse.

[0013] Preferably, in S1, the groove depth is 10-20μm, the protrusion diameter is 5-10μm, and the array spacing is 15-25μm.

[0014] Preferably, the compression testing device includes a machine base, a testing component, and several positioning components, wherein the testing component and the positioning components are all mounted on the machine base; The testing assembly includes a shifting mechanism and a pressure test head. The shifting mechanism is used to move the pressure test head on the machine platform. The pressure test head includes a hydraulic cylinder, a mounting block, and several pressure rod modules. The mounting block is located at the output end of the hydraulic block, and several pressure rod modules are located on the mounting block. Each pressure rod module includes an electromagnet, a permanent magnet block, a movable block, and a pressure rod. The mounting block has a mounting cavity one for mounting the electromagnet and a mounting cavity two for mounting the movable block. The pressure rod is located at the lower end of the movable block. The mounting cavity one and the mounting cavity two are connected. The permanent magnet block is mounted on the upper surface of the movable block. When the electromagnet is energized, a repulsive force is generated between the permanent magnet block and the electromagnet. The input current of the electromagnet can be adjusted. By adjusting the input current of the electromagnet, the magnitude of the repulsive force between the permanent magnet block and the electromagnet is adjusted, thereby simulating the pressure resistance test of the OLED module under different buffer conditions.

[0015] Preferably, the pressure rod module further includes a state adjustment mechanism, which includes a second permanent magnet block, a locking rod, a first transmission gear, a second transmission gear, an L-shaped lever, a first spring, a second spring, and a transmission rod. Guide protrusions are provided on both sides of the movable block. A limiting groove that mates with the guide protrusions is provided on the cavity wall of the second mounting cavity. The mounting block has a first movable hole for the transmission rod and a second movable hole for the locking rod. The first and second transmission gears are rotatably mounted within the mounting block. One end of the transmission rod extends out of the first movable hole and connects to the second permanent magnet block located within the first mounting cavity. The other end has several first transmission teeth that mesh with the first transmission gear. The locking rod has teeth that mesh with the first transmission gear. The transmission rod has several meshing transmission teeth 2. One end of the spring 1 is fixedly connected to the bottom of the movable hole 2, and the other end is fixedly connected to the locking rod. One end of the locking rod extends out of the movable hole 2 and engages with the limiting hole on the guide protrusion. The end of the locking rod that engages with the limiting hole is hemispherical, and the limiting hole is a hemispherical hole. The transmission rod is also provided with several transmission teeth 3 that mesh with the transmission gear 2. The mounting block is provided with a movable hole 3 for the L-shaped lever to move. The L-shaped lever is provided with several transmission teeth 4 that mesh with the transmission gear 2. One end of the L-shaped lever extends into the limiting groove and abuts against the upper end face of the guide protrusion. One end of the spring 2 is fixedly connected to the bottom of the movable hole 3, and the other end is fixedly connected to the L-shaped lever.

[0016] Compared with the prior art, the advantages of the present invention are: the particle scattering layer of the present invention can effectively improve the brightness uniformity of the OLED module and eliminate color shift; at the same time, it can effectively improve the interface sealing and impact resistance. Attached Figure Description

[0017] The accompanying drawings, which are provided to further illustrate the invention and constitute a part of this invention, are illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is a top view of the substrate of the present invention; Figure 4 This is a flowchart of the processing method of the present invention; Figure 5 This is a structural diagram of the compressive strength testing device of the present invention; Figure 6 This is a schematic diagram of the positioning component of the compressive strength testing device of the present invention; Figure 7 This is a cross-sectional view of the positioning component of the compressive strength testing device of the present invention; Figure 8 yes Figure 7 Enlarged view of point A in the middle; Figure 9 This is a cross-sectional view of the mounting block of the compressive strength testing device of the present invention; Figure 10 yes Figure 9 Enlarged view of point B in the middle; Figure 11 yes Figure 10 Enlarged view of point C in the middle; Figure 12 The figure shows a schematic diagram of the movable block and the pressure rod of the compressive strength testing device of the present invention.

[0019] Attached diagram labels: 1. Cover plate, 2. Silicon carbide layer, 3. Particle scattering layer, 4. Substrate, 5. Buffer sealing ring, 6. Molten glass sealing ring, 7. OLED module, 8. Machine base, 9. Moving frame, 10. Drive motor one, 11. Drive motor two, 12. Fixed frame, 13. Positioning seat, 14. Hydraulic cylinder, 15. Mounting block, 16. Positioning cavity, 17. Limiting protrusion, 18. Electromagnet, 19. Movable block, 2 0. Pressing rod, 21. Permanent magnet block two, 22. Permanent magnet block one, 23. Mounting cavity two, 24. Transmission rod, 25. Spring two, 26. L-shaped lever, 27. Transmission gear two, 28. Limiting groove, 29. Transmission gear four, 30. Transmission gear three, 31. Locking rod, 32. Transmission gear two, 33. Transmission gear one, 34. Spring one, 35. Transmission gear one, 36. Guide protrusion, 37. Limiting hole, 38. Mounting cavity one. Detailed Implementation

[0020] The following will describe in detail the implementation of the present invention with reference to the accompanying drawings and embodiments, so that the process of how the present invention uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0021] In the description of this invention, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature, and in the description of this invention, "a number" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0025] It should also be understood that the terminology used in this specification of embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. As used in this specification of embodiments of the invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. Example 1

[0026] This embodiment discloses an OLED module 7 for improving brightness uniformity, including a cover plate 1, a substrate 4, an organic light-emitting diode array disposed on the substrate 4, a molten glass sealing ring 6 formed by melting low-melting-point glass powder at the edge of the substrate 4, and a buffer sealing ring 5 on the inner side. The cavity between the cover plate 1 and the substrate 4 is provided with a microparticle scattering layer 3. The scattering layer includes a transparent substrate and scattering microparticles dispersed therein. The microparticles have a particle size of 1-10 μm, the haze of the scattering layer is 10%-40%, and the refractive index is 1.45-1.55. Specifically, the transparent substrate is a phenyl silicone resin substrate.

[0027] The glass powder coating area at the edge of the substrate 4 is provided with laser-etched grooves. The grooves are filled with high-elasticity silicone resin to form periodic bumps with a diameter of 5-10 μm and a height of 10-20 μm, located between the low-melting-point glass powder and the substrate 4.

[0028] The scattering particles are SiO2, PMMA, PS or BaSO4 microspheres, accounting for 0.1%-20% by mass.

[0029] The scattering layer has a thickness of 10-100 μm and is attached to the inner surface of the cover plate 1 or fills the entire cavity.

[0030] The protrusion material is polydimethylsiloxane with an elastic modulus of 0.1-1 MPa.

[0031] The OLED module 7 has a silicon carbide layer 2 with a thickness of 0.5-5μm on its side.

[0032] The width of the molten glass sealing ring 6 and the buffer sealing ring 5 is 0.4-0.6 mm.

[0033] This solution utilizes a triple innovative structure: "microparticle scattering layer → brightness uniformity" + "elastic bumps → interface stress buffering" + "silicon carbide → sidewall reinforcement". Its scattering layer solves the optical interference problem and replaces traditional brightness enhancement films to reduce costs. The laser-etched grooves and elastic bumps design can actively fill microscopic gaps. It has strong process compatibility, and bump forming and scattering layer coating can be integrated into existing laser packaging production lines simultaneously. Example 2

[0034] This embodiment discloses a processing method for an OLED module 7 to improve brightness uniformity. The processing method includes the following steps: S1. In the glass powder pre-coated area at the edge of substrate 4, a deep groove array is laser-etched, filled with polydimethylsiloxane and cured to form bumps. S2. Screen print a low-melting-point glass powder ring with a cross-sectional width of 0.5mm on the surface of the convex structure, and apply a low-temperature sealant of the same width on the inner side. S3. Spin-coat a silicone resin slurry containing 5μm SiO2 microspheres onto the inner surface of cover plate 1, and pre-cur it at 80℃ to form a 50μm scattering layer. S4. Align and press the cover plate 1 and the substrate 4 together, melt the glass powder and sealant, and after cooling, embed the scattering layer into the cavity, and fill the interface gap with the pressure of the elastic protrusions. S5. A 2μm silicon carbide layer 2 is magnetron sputtered on the side of the OLED module 7 to obtain the finished product; S6. Sample the finished products and put them into the compression testing device for compression testing. After passing the test, pack them into the warehouse.

[0035] In S1, the groove depth is 10-20μm, the protrusion diameter is 5-10μm, and the array spacing is 15-25μm. Example 3

[0036] This embodiment discloses a compression testing device, which is a supporting testing equipment developed specifically for performance verification of the OLED module with a specific microstructure design described in Embodiment 2. This compression testing device aims to simulate various complex stress conditions faced by the OLED module in real-world application scenarios (such as flexible mobile phones and foldable devices), and in particular, to accurately evaluate the deformation behavior, interfacial bonding strength, and failure modes of the fine structures such as the elastic bump array, microsphere scattering layer, and silicon carbide protective layer introduced in the processing method of Embodiment 2 under pressure.

[0037] Specifically, the compression testing device includes a machine base 8 as a support substrate, and a testing component and several positioning components mounted on the machine base 8. The testing component is used to perform pressure application on the OLED module, while the positioning components are used to precisely fix the OLED module to be tested.

[0038] Furthermore, the testing assembly includes a shifting mechanism and a pressing test head. The shifting mechanism is used to drive the pressing test head to move precisely within the plane of the machine tool 8 to align with different testing stations. The pressing test head, as the core execution component, specifically includes a hydraulic cylinder 14, a mounting block 15, and several pressure rod modules. The hydraulic cylinder 14 serves as a power source, with its output end connected to the mounting block 15, for driving the mounting block 15 to move up and down. The several pressure rod modules are arranged in an array or as needed on the lower end face of the mounting block 15, for directly contacting and pressing the OLED module 7.

[0039] In this embodiment, each pressure rod module includes an electromagnet 18, a permanent magnet block 22, a movable block 19, and a pressure rod 20. To achieve precise assembly and coordinated operation of these components, the mounting block 15 has a mounting cavity 38 for accommodating the electromagnet 18 and a mounting cavity 23 for accommodating the movable block 19. The pressure rod 20 is fixedly mounted at the lower end of the movable block 19 and moves synchronously with the movable block 19. The permanent magnet block 22 is mounted on the upper surface of the movable block 19. The mounting cavity 38 and the mounting cavity 23 are interconnected, allowing the electromagnet 18 to exert a magnetic force on the permanent magnet block 22 within the mounting cavity 23. The core working principle is that when the electromagnet 18 is energized, a repulsive magnetic force is generated between the electromagnet 18 and the permanent magnet block 22, and the magnitude of this repulsive force can be precisely controlled by adjusting the input current of the electromagnet 18. This adjustable repulsive force can simulate the pressure resistance test conditions of the OLED module 7 under different buffer materials and different packaging structures.

[0040] To achieve intelligent switching of test modes and overload protection, the pressure bar module also includes a precision state adjustment mechanism. This mechanism consists of a permanent magnet block 21, a locking rod 31, a transmission gear 1 33, a transmission gear 27, an L-shaped lever 26, a spring 1 34, a spring 25, and a transmission rod 24. In terms of structural connection, guide protrusions 36 extend from both sides of the movable block 19. Correspondingly, a limiting groove 28 is provided on the cavity wall of the mounting cavity 23 to slide and engage with the guide protrusions 36. This engagement ensures that the movable block 19 can only move stably in a preset vertical direction. The mounting block 15 has a first movable hole for the transmission rod 24 to pass through and a second movable hole for the locking rod 31 to pass through. Both the first transmission gear 33 and the second transmission gear 27 are rotatably mounted on preset shaft positions inside the mounting block 15. The specific connection relationship is as follows: One end of the transmission rod 24 passes through the movable hole 1 and extends into the mounting cavity 38, and is fixedly connected to the permanent magnet block 21; the other end of the transmission rod 24 is provided with several transmission teeth 35, which mesh with the transmission gear 33. The locking rod 31 is provided with several transmission teeth 32 that mesh with the transmission gear 33. One end of the spring 34 is fixedly connected to the bottom of the movable hole 2, and the other end is fixedly connected to the end of the locking rod 31, applying a spring force to the locking rod 31 so that it always tends to extend out of the movable hole 2. Under the action of the spring 34, one end of the locking rod 31 can extend out of the movable hole 2 and engage with the limiting hole 37 opened on the guide protrusion 36. In order to form a detachable overload protection structure, the end of the locking rod 31 that engages with the limiting hole 37 is designed to be hemispherical, and correspondingly, the limiting hole 37 is also designed to be a matching hemispherical hole. In addition, the transmission rod 24 is provided with several transmission teeth 30, which mesh with the transmission gear 27. The mounting block 15 is also provided with a movable hole 3 for the L-shaped lever 26 to move. The L-shaped lever 26 is provided with several transmission teeth 49 that mesh with the transmission gear 27. One end of the L-shaped lever 26 extends into the limiting groove 28 and is located above the guide protrusion 36, and can abut against the upper end face of the guide protrusion 36. One end of the spring 25 is fixedly connected to the bottom of the movable hole 3, and the other end is fixedly connected to the L-shaped lever 26, applying a spring force to the L-shaped lever 26 so that it always has a downward tendency to move. It should be noted that when the electromagnet 18 is energized, the permanent magnet block 21 located in the mounting cavity 38 will also be subjected to the repulsive force generated by the electromagnet 18, and the direction of this repulsive force is the same as the direction of the repulsive force on the permanent magnet block 22.

[0041] The OLED module 7 described in Example 2 incorporates several sophisticated microstructure designs in its processing method. These include an array of elastic bumps at the substrate edge to absorb stress and fill interface gaps, and a microsphere-containing scattering layer on the inner side of the cover plate to enhance light efficiency. While these structures are designed to improve brightness uniformity and encapsulation strength, they also introduce new mechanical vulnerabilities and complex interface bonding issues. Traditional general-purpose pressure testing equipment, due to its singular loading method, struggles to accurately simulate the progressive deformation and complex failure modes of these microstructures under actual stress. However, the pressure testing device provided in this embodiment, particularly its core pressure bar module with adjustable electromagnetic repulsion, can simulate continuous stress scenarios ranging from rigid impact to flexible buffering. This allows the device to be specifically used to verify the pressure-filling effect of the elastic bumps formed in step S4 of Example 2, the embedding firmness of the scattering layer, and the adhesion strength of the silicon carbide protective layer formed in step S5 under stress. This highly targeted testing approach is essential for comprehensively evaluating the long-term reliability of products under this specific process route.

[0042] Furthermore, in practical applications such as flexible mobile phones and foldable devices, the OLED module 7 faces various complex and non-uniform stress conditions. The testing device in this embodiment, by precisely adjusting the input current of the electromagnet 18, can flexibly change the buffering force during compression, thereby perfectly simulating the actual stress state of the OLED module 7 under different buffering materials and encapsulation structures. Compared to traditional testing equipment that only provides a rigid "pass / fail" result, this device, combined with image acquisition equipment, can record and transmit images of the module's microscopic deformation during compression in real time, thus truly achieving a deep and quantitative evaluation of product performance.

[0043] In summary, the pressure resistance testing device of this embodiment is not an isolated testing tool, but a verification platform "tailor-made" for the OLED module 7 with a specific microstructure created in Embodiment 2. During the R&D phase, it can deeply simulate real-world working conditions and effectively reveal potential failure mechanisms; during the production phase, it can monitor the stability of key processes and strongly guarantee the quality of the final product. Therefore, incorporating this testing step into the processing method of Embodiment 2 constitutes a complete technical closed loop from "creation" to "verification".

[0044] In a more specific implementation, the displacement mechanism for driving the test head can take various forms. In this embodiment, the displacement mechanism specifically includes a drive motor 10, a drive motor 11, a moving frame 9, a lead screw 1 (not shown in the figure), and a lead screw 2 (not shown in the figure). A guide rail 1 is provided on the worktable of the machine base 8, and the moving frame 9 is movably mounted on the guide rail 1 and can slide along it. The drive motor 11 is fixedly mounted on the worktable, and its output end is connected to the lead screw 2. The moving frame 9 is provided with a threaded hole that is threaded to the lead screw 2, thus forming a drive unit in one direction. The moving frame 9 is also provided with a guide rail 2, and a fixed frame 12 for mounting the pressure test head is movably mounted on the guide rail 2. The drive motor 10 is mounted on the moving frame 9, and its output end is connected to the lead screw 1. The fixed frame 12 is provided with a threaded hole that is threaded to the lead screw 1, thus forming a drive unit in another direction. The hydraulic cylinder 14 is fixedly mounted on the fixed frame 12. By working together with drive motor 10 and drive motor 21, the pressure test head can be precisely positioned on the plane.

[0045] As a further improvement, the positioning assembly includes a positioning base 13, which has multiple positioning cavities 16 for placing OLED modules 7, enabling continuous or batch testing of multiple products. Each positioning cavity 16 has a limiting protrusion 17 on its inner bottom wall. When the OLED module 7 is placed in the positioning cavity 16, the limiting protrusion 17 abuts against the lower edge of the module, providing vertical support and initial positioning to ensure the module is in the correct initial position before testing. Furthermore, an image acquisition device can be integrated into the bottom of each positioning cavity 16. This device can acquire and transmit images of the deformation of the pressure surface of the OLED module 7 during testing in real time for subsequent analysis.

[0046] The typical working process and state switching logic of this compressive strength testing device are as follows: At the start of the test, the operator first places the OLED module 7 to be tested into the corresponding positioning cavity 16 of the positioning seat 13, where it is stably supported by the limiting protrusion 17, and then starts the image acquisition equipment. Subsequently, the shifting mechanism (drive motor 10 and drive motor 21) precisely drives the pressure test head to move directly above the target OLED module 7 according to the preset program. Then, the hydraulic cylinder 14 is activated, pushing the mounting block 15 and all the pressure rod modules to slowly descend, so that the end of the pressure rod 20 approaches the surface of the OLED module 7. When it is necessary to perform a test simulating a flexible buffer component, the control system energizes the electromagnet 18. At the moment of energization, the electromagnet 18 simultaneously generates a repulsive force on both permanent magnet block 22 and permanent magnet block 21. The repulsive force on the permanent magnet block 21 drives the transmission rod 24 to move. The transmission gear 35 on the transmission rod 24 then drives the transmission gear 33 to rotate. The rotation of the transmission gear 33, in turn, drives the locking rod 31 to retract into the movable hole 2 through the transmission gear 32, overcoming the elastic force of the spring 34. This causes the hemispherical end of the locking rod 31 to completely disengage from the hemispherical limiting hole 37 of the guide protrusion 36. At the same time, the transmission gear 30 on the transmission rod 24 also drives the transmission gear 27 to rotate. The transmission gear 27, through the transmission gear 29, drives the L-shaped lever 26 to move upward against the elastic force of the spring 25, causing its end to disengage from the upper end face of the guide protrusion 36. At this point, the movable block 19 is completely released and is in a freely floating state. At this time, the pressing rod 20 contacts the surface of the OLED module 7 under the continued drive of the hydraulic cylinder 14. By precisely adjusting the input current of the electromagnet 18, the intensity of the repulsive force between it and the permanent magnet block 22 can be changed in real time. When the OLED module 7 exerts an upward reaction force on the pressing rod 20, this force causes the pressing rod 20 and the movable block 19 to have a slight upward tendency. This tendency is balanced by an adjustable electromagnetic repulsion force, thus forming a dynamic buffer loading effect. When it is necessary to perform a test simulating a rigid component, the control system de-energizes the electromagnet 18. The magnetic force of the electromagnet 18 disappears, and the repulsion force on the permanent magnet block 21 also disappears. At this time, the elastic force of the spring 34 is released, pushing the locking rod 31 to extend forward quickly. Its hemispherical end re-engages in the hemispherical limiting hole 37 of the guide protrusion 36, achieving rigid locking of the movable block 19. At the same time, the elastic force of the spring 25 is also released, pushing the L-shaped lever 26 to reset downward, so that its end abuts against the upper surface of the guide protrusion 36 again, helping to ensure that the movable block 19 is in a stable reference position. In the locked state, the driving force of the hydraulic cylinder 14 is directly transmitted to the movable block 19 through the mounting block 15 and the locking rod 31, so that the pressing rod 20 presses the OLED module 7 in a purely rigid state.

[0047] In both test modes described above, the image acquisition device at the bottom of the positioning cavity 16 operates continuously, recording and transmitting deformation image data of the module surface in real time. After a single test is completed, the hydraulic cylinder 14 drives the mounting block 15 and the pressing rod 20 to retract. During the retraction process, if in rigid test mode, the hemispherical end of the locking rod 31 can be smoothly held within the limiting hole 37 without external force. Subsequently, the shifting mechanism moves the pressing test head to the position of the next module to be tested, entering the next test cycle.

[0048] In summary, this solution has the following beneficial effects: 1. This solution, through its unique pressure bar module design, achieves high-precision simulation and testing of the compressive strength of OLED modules. In particular, by utilizing the precisely adjustable repulsive force between electromagnet 18 and permanent magnet 22, it can flexibly and accurately simulate the stress conditions of OLED modules under different buffer materials or structures. By simply adjusting the input current of electromagnet 18, the buffering effect during pressure application can be continuously changed. This allows the device to cover a wide range of testing scenarios, from extremely flexible to extremely rigid, providing richer and more realistic simulation data for product development and quality inspection.

[0049] 2. The integrated state adjustment mechanism within the device enables intelligent switching between "flexible buffering" and "rigid locking" test modes. When the electromagnet 18 is energized, the precise linkage of a series of transmission components, including permanent magnet 21, transmission rod 24, transmission gear 1 33, transmission gear 2 27, and L-shaped lever 26, automatically releases all constraints on the movable block 19, ensuring smooth flexible testing. Conversely, after the electromagnet 18 is de-energized, the rigid locking state is quickly restored through the elasticity of springs 1 34 and 2 25, allowing for traditional pressure testing. This design not only simplifies the operation process and improves testing efficiency, but more importantly, its precise transmission and locking mechanism ensures the stability of the test state and the absolute reliability of switching between the two modes.

[0050] 3. The hemispherical structure at the end of the locking rod 31 and the matching design of the hemispherical limiting hole 37, along with the reset energy storage structure formed by the second spring 25 and the L-shaped lever 26, together constitute an effective overload protection mechanism. When the device is accidentally rigidly contacted with the machine platform 8 or other hard objects due to misoperation, program error, or encounter with hard foreign objects, the hemispherical locking structure can automatically disengage, thereby effectively preventing damage to precision transmission components and test heads due to excessive force, significantly improving the service life and operational safety of the equipment. At the same time, when the electromagnet 18 is energized, the L-shaped lever 26 compresses the second spring 25 to store energy. After the electromagnet 18 is de-energized, it can generate a downward pushing force on the movable block 19, ensuring that the movable block 19 can be completely and reliably reset to the initial position. This allows the locking rod 31 to smoothly and accurately re-engage into the limiting hole 37, effectively preventing the movable block 19 from failing to reset normally, test interruption, or data errors due to sudden power failure of the electromagnet or other emergencies.

[0051] 4. This solution utilizes a precision shifting mechanism comprised of a drive motor and a lead screw to quickly and accurately position the test components above each positioning cavity 16, enabling continuous and automated batch testing of multiple OLED modules 7. Combined with optional image acquisition equipment within the positioning cavity 16, it can record and transmit microscopic deformation images of the module surface in real time during the testing process, providing intuitive, accurate, and quantifiable data support for subsequent failure analysis, performance evaluation, and process improvement.

[0052] The above description only illustrates the preferred embodiments of the present invention and should not be construed as limiting the scope of the claims. The present invention is not limited to the above embodiments, and variations in its specific structure are permitted. All modifications made within the scope of the independent claims of this invention are also within the scope of protection of this invention.

Claims

1. An OLED module for improving brightness uniformity, characterized in that, It includes a cover plate, a substrate, an organic light-emitting diode array disposed on the substrate, a molten glass sealing ring formed by melting low-melting-point glass powder at the edge of the substrate, and an inner buffer sealing ring. A particle scattering layer is provided in the cavity between the cover plate and the substrate. The particle scattering layer includes a transparent substrate and scattering particles dispersed therein. The particle size is 1-10 μm, the haze of the scattering layer is 10%-40%, and the refractive index is 1.45-1.

55. The glass powder coating area at the edge of the substrate is provided with laser-etched grooves. The grooves are filled with highly elastic silicone resin to form periodic bumps with a diameter of 5-10 μm and a height of 10-20 μm, located between the low-melting-point glass powder and the substrate.

2. The OLED module for improving brightness uniformity according to claim 1, characterized in that, The scattering particles are SiO2, PMMA, PS or BaSO4 microspheres, accounting for 0.1%-20% by mass.

3. The OLED module for improving brightness uniformity according to claim 1, characterized in that, The scattering layer has a thickness of 10-100 μm and is attached to the inner surface of the cover plate or fills the entire cavity.

4. An OLED module for improving brightness uniformity according to claim 1, characterized in that, The protrusion material is polydimethylsiloxane with an elastic modulus of 0.1-1 MPa.

5. An OLED module for improving brightness uniformity according to claim 1, characterized in that, The side of the OLED module is provided with a silicon carbide layer with a thickness of 0.5-5μm.

6. An OLED module for improving brightness uniformity according to claim 1, characterized in that, The width of the molten glass sealing ring and the buffer sealing ring is 0.4-0.6 mm.

7. A processing method for an OLED module with improved brightness uniformity according to any one of claims 1-6, characterized in that, The processing method Includes the following steps, S1. In the glass powder pre-coated area at the edge of the substrate, a deep groove array is laser-etched, filled with polydimethylsiloxane and cured to form bumps; S2. Screen print a low-melting-point glass powder ring with a cross-sectional width of 0.5mm on the surface of the convex structure, and apply a low-temperature sealant of the same width on the inner side. S3. Spin-coat a silicone resin slurry containing 5μm SiO2 microspheres onto the inner surface of the cover plate, and pre-cur it at 80℃ to form a 50μm scattering layer; S4. Align and press the cover plate with the substrate, melt the glass powder and sealant, and after cooling, embed the scattering layer into the cavity, and fill the interface gap with the pressure of the elastic protrusions. S5. A 2μm silicon carbide layer is magnetron sputtered onto the side of the OLED module to obtain the finished product; S6. Sample the finished products and put them into the compression testing device for compression testing. After passing the test, pack them into the warehouse.

8. The processing method for an OLED module with improved brightness uniformity according to claim 7, characterized in that, The groove depth in S1 is 10-20μm, the diameter of the protrusion is 5-10μm, and the array spacing is 15-25μm.

9. A processing method for an OLED module with improved brightness uniformity according to claim 7, characterized in that, The compression testing device includes a machine base, a testing component, and several positioning components, wherein the testing component and the positioning components are all mounted on the machine base. The testing assembly includes a shifting mechanism and a pressure test head. The shifting mechanism is used to move the pressure test head on the machine platform. The pressure test head includes a hydraulic cylinder, a mounting block, and several pressure rod modules. The mounting block is located at the output end of the hydraulic block, and several pressure rod modules are located on the mounting block. Each pressure rod module includes an electromagnet, a permanent magnet block, a movable block, and a pressure rod. The mounting block has a mounting cavity one for mounting the electromagnet and a mounting cavity two for mounting the movable block. The pressure rod is located at the lower end of the movable block. The mounting cavity one and the mounting cavity two are connected. The permanent magnet block is mounted on the upper surface of the movable block. When the electromagnet is energized, a repulsive force is generated between the permanent magnet block and the electromagnet. The input current of the electromagnet can be adjusted. By adjusting the input current of the electromagnet, the magnitude of the repulsive force between the permanent magnet block and the electromagnet is adjusted, thereby simulating the pressure resistance test of the OLED module under different buffer conditions.

10. A processing method for an OLED module with improved brightness uniformity according to claim 9, characterized in that, The pressure rod module also includes a state adjustment mechanism, which comprises a second permanent magnet, a locking rod, a first transmission gear, a second transmission gear, an L-shaped lever, a first spring, a second spring, and a transmission rod. Guide protrusions are provided on both sides of the movable block. A limiting groove that mates with the guide protrusions is provided on the cavity wall of the second mounting cavity. The mounting block has a first movable hole for the transmission rod and a second movable hole for the locking rod. The first and second transmission gears are rotatably mounted within the mounting block. One end of the transmission rod extends out of the first movable hole and connects to the second permanent magnet located within the first mounting cavity. The other end has several first transmission teeth that mesh with the first transmission gear. The locking rod has teeth that mesh with the first transmission gear. The transmission rod has several transmission teeth 2. One end of the spring is fixedly connected to the bottom of the movable hole 2, and the other end is fixedly connected to the locking rod. One end of the locking rod extends out of the movable hole 2 and engages with the limiting hole on the guide protrusion. The end of the locking rod that engages with the limiting hole is hemispherical, and the limiting hole is a hemispherical hole. The transmission rod is also provided with several transmission teeth 3 that mesh with the transmission gear 2. The mounting block is provided with a movable hole 3 for the L-shaped lever to move. The L-shaped lever is provided with several transmission teeth 4 that mesh with the transmission gear 2. One end of the L-shaped lever extends into the limiting groove and abuts against the upper end face of the guide protrusion. One end of the spring 2 is fixedly connected to the bottom of the movable hole 3, and the other end is fixedly connected to the L-shaped lever.

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