A method for accurate measurement of thickness and modulus of soft solid materials
By employing a multi-gradient combined loading and parameter decoupling fitting method, combined with a rotational rheometer and a neo-Hookean constitutive model, the problems of slip interference and environmental stability in the measurement of soft solid modulus were solved, enabling accurate measurement of the thickness and modulus of soft solid materials and improving measurement accuracy and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SOUTH CHINA UNIV OF TECH
- Filing Date
- 2026-04-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing methods for measuring the modulus of soft solids suffer from problems such as slip interference, poor environmental stability, and insufficient accuracy due to parameter coupling. In particular, the lack of mechanical response data for swollen soft solid materials and under multiple conditions leads to inaccurate and unreliable measurement results.
A multi-gradient combined loading-parameter decoupling fitting-controllable environment control method was adopted. Combined loading stress relaxation test was carried out using a rotational rheometer. Combined with the neo-Hookean constitutive model, the undeformed thickness and intrinsic shear modulus were independently solved by multiple sets of independent mechanical response data. Anti-slip medium was used to suppress sample slip, and an integrated solvent pool was used to maintain the stability of the test environment.
It achieves accurate measurement of the thickness and modulus of soft solid materials, with thorough parameter separation, strong measurement independence, high environmental stability, reliable results supported by multiple sets of data, and wide applicability, breaking through the application limitations of traditional methods.
Smart Images
Figure CN122409353A_ABST