Component carrier and method of manufacturing a component carrier
By employing a stacked component structure and encapsulating materials in the component carrier, the problems of embedding and thermal removal of multiple electronic components are solved, achieving efficient and reliable mechanical stability and electrical reliability, and adapting to the trend of miniaturization and densification of electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-16
- Publication Date
- 2026-07-17
AI Technical Summary
In component carriers, how to efficiently and reliably embed multiple electronic components, especially components of different heights, is a key challenge. In particular, how to solve the problems of thermal removal and mechanical stability that have not been effectively addressed in existing technologies, especially in the context of miniaturization and densification of electronic components.
The stacked component structure includes multiple electrically conductive and electrically insulating layers, forming a cavity bottom wall with multiple parts. The components and the opposite surfaces of the cavity bottom wall are vertically positioned within the same external layer structure and encapsulated using encapsulation material.
It enables effective embedding and reliable encapsulation of components of different heights, reduces the amount of encapsulation material used, improves mechanical stability and electrical reliability, and adapts to operation under harsh conditions.
Smart Images
Figure CN122421179A_ABST