Audio host and display device

Abstract

The application provides an audio host and a display device, and relates to the technical field of audio; the audio host comprises a plurality of network interfaces, which are used for transmitting audio data signals to external sound pickup and amplification devices; an audio codec unit is connected with the network interfaces and is used for processing the audio data signals into first protocol data; an audio processing unit is connected with the network interfaces and is used for processing the audio data signals into first or second protocol data; a processor unit is respectively connected with the audio codec unit and the audio processing unit, and is used for performing audio effect processing on the audio data signals; and a heat dissipation module is used for flowing air outside a case into the case through an air inlet groove, and sequentially flowing the air along the paths of a second air duct and a first air duct, and discharging the air outside the case through a first fan; the structure of the audio host is more simple in interface type, and can dissipate heat from at least one of a power supply component and an audio processing component in the case.

Description

Technical Field

[0001] This application relates to the field of audio technology, and in particular to audio host and display devices. Background Technology

[0002] In related technologies, audio host units use a variety of interface terminals of different types and specifications for connecting external audio devices to adapt to different types of audio pickup and amplification equipment. For example, one type of audio host in related technologies may simultaneously involve TRS interfaces, RCA interfaces (Lotus connectors), XLR interfaces (XLR connectors), and Phoenix connectors, requiring separate wiring for each type of interface. Since analog audio signals are involved, signal interference must be considered in scenarios with long wiring, resulting in high deployment and debugging costs for audio host units. Given the complexity of system deployment, routine maintenance and troubleshooting require relatively large investments, and high levels of expertise are demanded from deployment and maintenance personnel. Furthermore, improving heat dissipation during audio host operation is a pressing issue that needs to be addressed to ensure the lifespan of the audio host. Summary of the Invention

[0003] Therefore, it is necessary to provide an audio host and display device to address the problem of the numerous audio interface types and complex deployment of audio hosts in related technologies.

[0004] In a first aspect, this application provides an audio host, including a chassis and a power supply assembly installed inside the chassis, and further comprising:

[0005] Multiple network ports are used to transmit audio data signals to the external audio pickup and amplification device;

[0006] An audio processing component includes an audio codec unit, an audio processing unit, and a processor unit. The audio codec unit is connected to each of the network ports and is used to process the received audio data signal into first protocol data. The audio processing unit is connected to each of the network ports and is used to process the received audio data signal into the first protocol data or second protocol data. The processor unit is connected to the audio codec unit and the audio processing unit respectively and is used to perform sound effect processing on the received audio data signal.

[0007] The heat dissipation module includes a first heat sink, a second heat sink, and a first fan; the first heat sink and the second heat sink are connected to the two opposite edges of the power supply assembly and form a first air duct; an air inlet slot is provided through the side of the chassis opposite to the first heat sink and / or the second heat sink, and the air inlet slot forms a second air duct to the air inlet side of the first air duct; the first fan is located on the air outlet side of the first air duct;

[0008] The power supply component is electrically connected to the first fan and is used to control the rotation of the first fan to draw air from outside the chassis into the chassis through the air inlet slot, and to discharge air from inside the chassis to the outside of the chassis through the first fan along the paths of the second air duct and the first air duct, thereby dissipating heat from at least one of the power supply component and the audio processing component inside the chassis.

[0009] In one embodiment, at least a portion of the external pickup and amplification device and the audio codec unit include a preset first codec module; the audio processing unit includes the preset first codec module and / or a preset second codec module;

[0010] The preset first codec module adopts the AES67 codec module;

[0011] The preset second codec module uses the DANTE codec module.

[0012] In one embodiment, it further includes:

[0013] The microcontroller unit is connected to the audio codec unit, the audio processing unit, and the processor unit, respectively, and is used to control the operating logic of the audio host.

[0014] In one embodiment, it further includes:

[0015] The switch module is connected to the microcontroller unit, the network port, the audio codec unit, and the audio processing unit, respectively, and is used to control the transmission path of the received signal.

[0016] In one embodiment, it further includes:

[0017] The USB interface is connected to the microcontroller unit and the processor unit via a hub, and is used to connect to external devices.

[0018] In one embodiment, it further includes:

[0019] A protocol conversion unit, connected between the hub and the processor unit, is used to adjust the protocol type of the received signals.

[0020] In one embodiment, the power supply component further includes:

[0021] The power board has a first heat sink and a second heat sink connected to two far apart sides of the power board, forming the first air duct.

[0022] A power supply module is mounted on the power board and located within the first air duct; the power supply module is connected to each of the network ports and is used to supply power to the external audio pickup and amplification equipment via the network ports; the power supply module is electrically connected to the first fan and is used to control the rotation of the first fan;

[0023] A power supply control unit is installed on the power board and located in the first air duct; the power supply control unit is connected between the power supply module and each of the network ports, and is used to regulate the power supply logic and power distribution to each of the network ports;

[0024] The power interface is electrically connected to the power supply module and is used for connecting the audio host to external AC power.

[0025] In one embodiment, the heat dissipation module further includes a second fan, which is installed on the air inlet side of the first air duct, and the air outlet of the second fan faces the first fan;

[0026] The power supply assembly is electrically connected to the second fan and is used to control the rotation of the second fan so that air outside the chassis flows into the chassis through the air inlet slot, and air inside the chassis is discharged to the outside of the chassis through the first fan along the path of the second air duct, the second fan, and the first air duct.

[0027] And / or, the number of air inlet slots is multiple, and the multiple air inlet slots are spaced apart along the length direction of their respective sides.

[0028] In one embodiment, it further includes:

[0029] The microphone interface is connected to the processor unit via an analog-to-digital converter and is used to receive audio signals from external audio devices and transmit them to the processor unit.

[0030] An audio output interface is connected to the processor unit via a digital-to-analog converter, and is used to receive audio signals transmitted by the processor unit and output them to external devices;

[0031] The microphone interface and the audio output interface are also electrically connected to the power supply module.

[0032] In a second aspect, this application provides a display device including any of the audio hosts in the first aspect;

[0033] The display device also includes a display screen and a communication module;

[0034] The display screen is connected to the processor unit, switch module, hub and microcontroller unit in the audio host through the communication module.

[0035] The present application provides an audio host and a display device. The audio host includes a chassis and a power supply component installed inside the chassis. The audio host also includes multiple network ports for transmitting audio data signals to external audio pickup and amplification devices. An audio processing component includes an audio codec unit, an audio processing unit, and a processor unit. The audio codec unit is connected to each network port and processes the received audio data signals into first protocol data. The audio processing unit is connected to each network port and processes the received audio data signals into first protocol data or second protocol data. The processor unit is connected to the audio codec unit and the audio processing unit respectively and performs sound effect processing on the received audio data signals. Heat dissipation is also included. The module includes a first heat sink, a second heat sink, and a first fan; the first and second heat sinks are connected to opposite sides of the power supply assembly and form a first air duct; the chassis includes an air inlet slot near the first and / or second heat sinks, and the air inlet slot and the air inlet side of the first air duct form a second air duct; the first fan is located at the air outlet side of the first air duct; the power supply assembly is electrically connected to the first fan and is used to control the rotation of the first fan to draw air from outside the chassis into the chassis through the air inlet slot, and to discharge air from inside the chassis to the outside of the chassis via the second air duct and the first air duct, thereby dissipating heat from at least one of the power supply assembly and the audio processing assembly inside the chassis.

[0036] As can be seen, this application includes multiple network ports in the audio host, which can be used to connect to external audio pickup and amplification devices, realizing communication between the audio host and the external audio pickup and amplification devices. Based on this configuration, audio transmission with multiple external audio pickup and amplification devices can be achieved through multiple network ports of the same structural type. This helps to reduce the types of audio input and output interfaces required in the audio host, thereby reducing the difficulty and time of construction and deployment in scenarios where users use the audio host and external audio pickup and amplification devices. In addition, this application includes an audio codec unit and an audio processing unit connected to the network ports in the audio host. These units are used to process the audio data signals received by the network ports and transmit them to the processor unit, and to process the audio data signals transmitted by the processor unit and transmit them to the network port side. This helps to ensure the transmission effect of audio data signals.

[0037] Furthermore, this application also provides a heat dissipation module disposed inside a chassis, including a first heat sink, a second heat sink connected to two distant edges of a power supply component, and a first fan; the first heat sink, the second heat sink, and the power supply component together form a first air duct, an air inlet slot disposed in the chassis near the first heat sink and / or the second heat sink, and the air inlet side of the first air duct form a second air duct, and the first fan is disposed on the air outlet side of the first air duct, so that after the first fan is turned on, it can drive air from outside the chassis into the chassis through the air inlet slot, and exhaust air from inside the chassis to the outside of the chassis along the path of the second air duct and the first air duct in sequence, through the first fan, for heat dissipation of at least one of the power supply component and the audio processing component inside the chassis; this design increases the heat dissipation effect inside the chassis when the audio host is working, thereby reducing the damage to components caused by heat generated by the audio host during operation, and helping to extend the service life of the audio host. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the structure of an audio host according to a related technology embodiment;

[0039] Figure 2 A schematic diagram of the structure of an audio host provided in an embodiment of this application;

[0040] Figure 3 A schematic diagram of the architecture of an audio host provided in an embodiment of this application;

[0041] Figure 4 A schematic diagram of another architecture of the audio host provided in an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of the internal structure of an audio host chassis provided in an embodiment of this application;

[0043] Figure 6 A schematic diagram of another internal structure of the audio host provided in an embodiment of this application;

[0044] Figure 7 This is a schematic diagram of the architecture of a display device provided in an embodiment of this application. Detailed Implementation

[0045] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0046] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0047] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0050] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0051] In related technologies, in current application scenarios of professional audio pickup and amplification products with traditional architectures (analog audio and digital audio), these products face problems such as difficult wiring, deployment, maintenance, tuning, and use due to the large variety and number of interfaces. Figure 1 As shown, in the existing design, there are many types and specifications of external audio terminals for the audio host, such as TRS interface 91, RCA interface (Lotus head) 92, XLR interface (XLR head) 93 and Phoenix terminal 94. Different types of interfaces are adapted to different types of audio pickup and amplification equipment. This means that each type of interface needs to be wired separately. Since analog audio signals are involved, signal interference also needs to be considered for some long-wire scenarios. This situation results in high deployment and debugging costs. Given the complexity of system deployment, routine maintenance and troubleshooting will require relatively large investments, and there are also high requirements for the professional capabilities of deployment and maintenance personnel.

[0052] The aforementioned TRS connector is a common connector used to connect audio equipment and transmit audio signals. The term is an acronym for its three components: Tip, Ring, and Sleeve. This type of connector is generally used for connecting headphones and microphones. The RCA (Radio Corporation of America) connector (lotus head) is a common audio and video transmission interface, widely used in home entertainment equipment, audio systems, and multimedia equipment. The XLR connector is used to transmit various audio signals in audio systems; commonly known as a Cannon connector, the initial terminals were the "Cannon X" series. Later versions added a spring lock (Latch) to become the "Cannon XL" series. Then, the terminal contact surface was covered with rubber, hence the abbreviation XLR. It should be noted that... Figure 1 This is merely an illustrative example of the terminal types and specifications that may be included in an audio host based on related technologies. It does not represent the actual structural style of the audio host. The terminal (interface) types, specifications, and quantities in the audio host may vary based on actual needs.

[0053] To effectively solve the above technical problems, please refer to Figures 2-6 This application provides an audio host 100, including a chassis 60 and a power supply component installed inside the chassis 60. Further, by providing multiple network ports 11 with the same structure in the audio host 100 to replace several types of audio interfaces in related technologies, the audio signal can be transmitted between the audio host 100 and the external audio pickup / amplification device through the connection of the network ports 11. The audio host 100 also includes an audio processing component connected to the network ports 11. This audio processing component includes an audio codec unit 21, an audio processing unit 22, and a processor unit 23. The audio codec unit 21 and the audio processing unit 22 are each connected to a network port 11 to process the audio data signal received by the network port 11 and transmit it to the processor unit 23, and to process the audio data signal transmitted by the processor unit 23 and transmit it to the network port 11, which helps to ensure the transmission effect of the audio signal. Based on this, the audio host 100 is further configured to include a heat dissipation module consisting of a first heat sink 62, a second heat sink 63, and a first fan 64. The first heat sink 62, the second heat sink 63, and the power supply components form a first air duct 65, and the first fan 64 is installed on the air outlet side of the first air duct 65. Furthermore, based on the air inlet slot 68 in the chassis 60 near the first heat sink 62 and / or the second heat sink 63, a second air duct 66 is formed with the air inlet side of the first air duct 65. This allows air from outside the chassis 60 to flow into the chassis 60 through the air inlet slot 68 when the first fan 64 is rotating, and air inside the chassis 60 to be discharged to the outside of the chassis 60 along the path of the second air duct 66 and the first air duct 65, via the first fan 64. This is used to dissipate heat from at least one of the power supply components and audio processing components inside the chassis 60, thereby reducing component damage caused by heat generated during operation of the audio host 100 and improving the service life of the audio host 100.

[0054] Please continue to refer to Figures 2-6 In one exemplary embodiment, this application provides an audio host 100, including a chassis 60 and a power supply assembly installed inside the chassis 60. The audio host 100 further includes:

[0055] Multiple network ports 11, each including a socket for connecting an external audio pickup / amplification device via a matching RJ45 connector; any one of the network ports 11 is used to transmit audio data signals to the connected external audio pickup / amplification device;

[0056] The audio processing component includes an audio codec unit 21, an audio processing unit 22, and a processor unit 23. The audio codec unit 21 is connected to each network port 11 and is used to process received audio data signals into first protocol data. The audio processing unit 22 is connected to each network port 11 and is used to process received audio data signals into first protocol data or second protocol data. The processor unit 23 is connected to the audio codec unit 21 and the audio processing unit 22 respectively and is used to perform sound effect processing on the received audio data signals.

[0057] For example, the audio host 100 provided in this application may include multiple network ports 11, each of which is provided with a socket for inserting a crystal head for connecting an external audio pickup device (not shown). The connection between the external audio pickup device and the audio host 100 is realized through the plug-in connection between the crystal head and the socket. That is, the connection between the external audio pickup device and the audio host 100 can be realized through the network port 11, and the transmission of audio data signals between the external audio pickup device and the audio host 100 can be realized. This eliminates the need to set up multiple different types of audio transmission interfaces in the audio host 100, thereby reducing the complexity of interface wiring and avoiding signal interference problems caused by long wiring, thus reducing the system deployment complexity involving the external audio pickup device and the audio host 100.

[0058] The external sound pickup and amplification equipment includes external sound pickup devices and external amplification devices, where the sound pickup device is such as a microphone and the amplification device is such as a loudspeaker or a speaker.

[0059] The audio host 100 provided in this application also has an audio processing component inside, which includes an audio codec unit 21 and an audio processing unit 22. One end of the audio codec unit 21 and the audio processing unit 22 are respectively connected to each network port 11, and the other end is respectively connected to the audio processor unit 23 in the audio processing component.

[0060] The audio codec unit 21 can be used to encode or decode audio data signals based on the corresponding first protocol, so that after the audio data signals are processed into first protocol data, they can be successfully transmitted to the network port 11 or the processor unit 23. This helps to ensure the transmission stability of audio data signals and ensures that after the audio data signals are processed into first protocol data, they can be recognized by the processor unit 23 when transmitted to the processor unit 23, and can be recognized by the external audio pickup and amplification device connected to the network port 11 when transmitted to the network port 11.

[0061] The audio processing unit 22 can be used to process the received audio data signal into first protocol data or into second protocol data based on demand; wherein the first protocol data and the second protocol data correspond to different communication protocols.

[0062] The audio processing unit 22 can be understood as a backup audio codec unit. The audio processing unit 22 can be equipped with a corresponding codec module based on the type of codec module in commonly used external pickup and amplification devices, so as to ensure the stability of audio data signal transmission between the external pickup and amplification device connected through the network port 11 and the audio host 100.

[0063] That is, the processor unit 23 in the audio host 100 provided in this application is used to receive audio data signals transmitted from the network port 11 through the audio codec unit 21 and / or the audio processing unit 22, and to transmit audio data signals to the network port 11 side through the audio codec unit 21 and / or the audio processing unit 22; the processor unit 23 is used for audio effect processing of each audio data signal input to output.

[0064] Considering the power supply components inside the audio host 100 provided in this application, the temperature inside the audio host 100 chassis 60 will increase during operation. Therefore, as Figure 5 and Figure 6 As shown, this application, for the audio host 100, also provides a heat dissipation module disposed inside the chassis 60. The heat dissipation module includes a first heat sink 62, a second heat sink 63, and a first fan 64. The first heat sink 62 and the second heat sink 63 are connected to the two opposite edges of the power supply assembly and form a first air duct 65. An air inlet slot 68 is provided through the side chassis panel of the chassis 60 opposite to the first heat sink 62 and / or the second heat sink 63. The air inlet slot 68 forms a second air duct 66 to the air inlet side of the first air duct 65. The first fan 64 is located on the air outlet side of the first air duct 65.

[0065] The power supply component is electrically connected to the first fan 64 and is used to control the rotation of the first fan 64 to draw air from outside the chassis 60 into the chassis 60 through the air inlet 68, and to exhaust air from inside the chassis 60 to the outside of the chassis 60 through the first fan 64 along the paths of the second air duct 66 and the first air duct 65, thereby dissipating heat from at least one of the power supply component and the audio processing component inside the chassis 60.

[0066] For example, this application provides a heat dissipation module inside the chassis 60 of the audio host 100. The heat dissipation module may include a first heat sink 62 and a second heat sink 63 fixedly connected to the two edges of the power supply assembly that are far from each other. The first heat sink 62, the second heat sink 63 and the power supply assembly together form a "U-shaped" channel, which is the first air duct 65. Further, the heat dissipation module may also include a first fan 64, which may be disposed on the air outlet side of the first air duct 65. The air inlet of the first fan 64 faces the air outlet side of the first air duct 65, and the air outlet of the first fan 64 is away from the air outlet side of the first air duct 65. The air outlet of the first fan 64 may be disposed on one of the side panels of the chassis 60, that is, the air outlet of the first fan 64 may be connected to the outside of the chassis 60 through the side panel of the chassis 60.

[0067] Furthermore, the chassis 60 of the audio host 100 provided in this application also includes an air intake slot 68. The air intake slot 68 can be one or both side panels of the chassis 60. One selectable arrangement is that the air intake slot 68 of the chassis 60 is located near the first heat sink 62 and / or the second heat sink 63. Specifically, the air intake slot 68 can be located on the side of the first heat sink 62 away from the second heat sink 63, or the air intake slot 68 can be located on the side of the second heat sink 63 away from the first heat sink 62, or the side of the first heat sink 62 away from the second heat sink 63 may include the air intake slot 68, and the side of the second heat sink 63 away from the first heat sink 62 also includes the air intake slot 68. Each air intake slot 68 forms a second air duct 66 with the air inlet side of the first air duct 65. The air intake slot 68 is a plurality of through holes provided in the side panel of the chassis for air passage. This application does not specifically limit the shape, size, or arrangement of the through holes (air intake slot 68).

[0068] Furthermore, this application also provides an optional configuration method in which the power supply component is optionally electrically connected to the first fan 64 to provide power to the first fan 64, thereby driving the first fan 64 to operate when needed. When the power supply component drives the first fan 64 to operate, air from outside the chassis 60 can flow into the chassis 60 through the air inlet slot 68, and air from inside the chassis 60 can be discharged to the outside of the chassis 60 via the first fan 64 along the paths of the second air duct 66 and the first air duct 65. Since the air outside the chassis 60 is usually lower in temperature than the air inside the chassis 60, the process of the low-temperature air from outside the chassis 60 being discharged to the outside of the chassis 60 via the paths of the air inlet slot 68, the second air duct 66, and the first air duct 65 through the first fan 64 can dissipate heat from at least one of the power supply component and the audio processing component inside the chassis 60, thereby reducing component damage caused by heat generation during operation of the audio host 100 and thus helping to extend the service life of the audio host 100.

[0069] The audio host 100 provided in this application includes a chassis 60 and a power supply assembly installed inside the chassis 60. It also includes multiple network ports 11, each with a socket for connecting to external audio pickup / amplification equipment via a matching RJ45 connector. Each network port 11 is used to transmit audio data signals to the connected external audio pickup / amplification equipment. The audio processing assembly includes an audio codec unit 21, an audio processing unit 22, and a processor unit 23. The audio codec unit 21 is connected to each network port 11 and processes the received audio data signals into first protocol data. The audio processing unit 22 is connected to each network port 11 and processes the received audio data signals into first protocol data or second protocol data. The processor unit 23 is connected to the audio codec unit 21 and the audio processing unit 22 respectively and performs sound effect processing on the received audio data signals. A heat dissipation module is also included. The power supply assembly includes a first heat sink 62, a second heat sink 63, and a first fan 64. The first heat sink 62 and the second heat sink 63 are connected to opposite sides of the power supply assembly and form a first air duct 65. The chassis 60 includes an air inlet slot 68 near the side of the first heat sink 62 and / or the second heat sink 63. The air inlet slot 68 and the air inlet side of the first air duct 65 form a second air duct 66. The first fan 64 is located on the air outlet side of the first air duct 65. The power supply assembly is electrically connected to the first fan 64 and is used to control the rotation of the first fan 64 to draw air from outside the chassis 60 into the chassis 60 through the air inlet slot 68, and to discharge air from inside the chassis 60 to the outside of the chassis 60 through the first fan 64 along the path of the second air duct 66 and the first air duct 65, thereby dissipating heat from at least one of the power supply assembly and the audio processing assembly inside the chassis 60.

[0070] As can be seen, this application enables communication between the audio host 100 and external audio pickup devices by including multiple network ports 11 in the audio host 100 and using the sockets and crystal head plugs included in the network ports 11 for connection with external audio pickup devices. Based on this configuration, audio transmission with multiple external audio pickup devices can be achieved through multiple network ports 11 of the same structural type. This reduces the types of audio input / output interfaces required in the audio host 100, thereby reducing the difficulty and time required for deployment when users use the audio host 100 and external audio pickup devices. In addition, this application includes an audio codec unit 21 and an audio processing unit 22 connected to the network ports 11 in the audio host 100. These units process the audio data signals received by the network ports 11 and transmit them to the processor unit 23, and process the audio data signals transmitted by the processor unit 23 and transmit them to the network ports 11. This helps ensure the transmission effect of the audio data signals.

[0071] Furthermore, considering that the power supply component inside the audio host provided in this application will increase the temperature inside the chassis 60 when the audio host is working, this application also provides a heat dissipation module disposed inside the chassis 60, including a first heat sink 62 and a second heat sink 63 connected to the two distant edges of the power supply component, and a first fan 64; the first heat sink 62, the second heat sink 63 and the power supply component together form a first air duct 65, and an air inlet slot 68 disposed in the chassis 60 near the first heat sink 62 and / or the second heat sink 63, together with the air inlet side of the first air duct 65, forms a second air duct 66. A fan 64 is positioned at the air outlet of the first air duct 65. When the first fan 64 is turned on, it drives air from outside the chassis 60 into the chassis 60 through the air inlet 68, and exhausts air from inside the chassis 60 to the outside of the chassis 60 via the first fan 64 along the path of the second air duct 66 and the first air duct 65. This is used to dissipate heat from at least one of the power supply components and audio processing components inside the chassis 60. This design increases the heat dissipation effect inside the chassis 60 when the audio host is working, thereby reducing damage to components caused by heat generated during audio host operation and improving the service life of the audio host.

[0072] Please continue to refer to Figures 2-6 In one exemplary embodiment, at least part of the external audio pickup and amplification device includes a preset first codec module 211; an audio codec unit 21 including the preset first codec module 211; and an audio processing unit 22 including the preset first codec module 211 and / or a preset second codec module 221; wherein the preset first codec module 211 adopts an AES67 codec module; and the preset second codec module 221 adopts a DANTE codec module.

[0073] For example, the present application may provide a first codec module 211 in both the audio codec unit 21 and the audio processing unit 22 in the audio host 100, and adapt it to connect to an external pickup and amplification device including the first codec module 211. This enables the external pickup and amplification device to automatically configure the network when connected to the network port 11 of the audio host 100, achieving plug-and-play functionality, which helps to reduce the complexity of on-site debugging and the difficulty of use.

[0074] In other words, the audio host 100 provided in this application helps to reduce the types and number of interfaces in the audio host 100, thereby reducing the difficulty and time of on-site construction and deployment for users, and enabling users to use it immediately after powering on, thus improving the efficiency and user experience of the audio host 100.

[0075] Specifically, one alternative implementation is that the audio codec unit 21 may be equipped with a first codec module 211 pre-configured based on requirements. The first codec module is used to encode or decode the audio data signal transmitted to the audio codec unit 21 according to the corresponding first protocol, so that after the audio data signal is processed into the first protocol data, it can be smoothly transmitted to the network port 11 side or the processor unit 23 side. This helps to ensure the transmission stability of the audio data signal, and ensures that after the audio data signal is processed into the first protocol data, it can be recognized by the processor unit 23 when transmitted to the processor unit 23, and can be recognized by the external audio pickup and amplification device connected to the network port 11 when transmitted to the network port 11 side.

[0076] The audio processing unit 22 may be equipped with a first codec module 211 and / or a second codec module 221 pre-configured based on requirements. That is, the audio processing unit 22 may only have the same first codec module 211 as the audio codec unit 21, or it may only have a second codec module 221 different from the first codec module 211, or it may have both the first and second codec modules 211; it may even have three or more different types of codec modules. The first codec module 211 processes the received audio data signal into first protocol data, and the second codec module 221 processes the received audio data signal into second protocol data. The first protocol data and the second protocol data correspond to different communication protocols.

[0077] Furthermore, this application also provides an alternative implementation in which, among a plurality of external pickup and amplification devices used for communication connection with the audio host 100 provided in this application for transmitting audio data signals, at least some of the external pickup and amplification devices are provided with the same first codec module 211 as the audio host 100. The audio host 100 and the external pickup and amplification devices, both equipped with the first codec module 211, have the same data communication protocol. This enables the external pickup and amplification devices to automatically configure their network based on the matching socket in the network port 11, achieving plug-and-play functionality. This significantly reduces the complexity of on-site debugging of the system including the audio host 100 and the external pickup and amplification devices, and also reduces the difficulty for users during operation.

[0078] The audio processing unit 22 can be understood as a backup audio codec unit. The audio processing unit 22 can be equipped with corresponding codec modules based on the type of codec modules commonly found in external audio pickup and amplification devices. For example, if a first codec module 211 and a second codec module 221 are used in commonly used external audio pickup and amplification devices, the audio processing unit 22 can be configured to include both the first codec module 211 and the second codec module 221 to ensure the stability of audio data signal transmission between the external audio pickup and amplification devices connected via network port 11 and the audio host 100. This can be achieved by using the first codec module 211 in several external audio pickup and amplification devices and the second codec module 221 in others. Alternatively, depending on the requirements, it can be configured so that a single external audio pickup and amplification device simultaneously contains both the first codec module 211 and the second codec module 221.

[0079] One possible embodiment is that, in the case where multiple external audio pickup and amplification devices connected to the audio host 100 are all equipped with a first codec module 211, if multiple external audio pickup and amplification devices are transmitting audio data signals to the audio host 100 simultaneously, then the audio codec unit 21 in the audio host 100 can be set as the first choice to transmit audio data signals. When the data transmission capacity of the audio codec unit 21 is fully utilized, the audio processing unit 22 can be used in conjunction to assist in the transmission of audio data signals, which is beneficial to ensuring the signal transmission efficiency between multiple external audio pickup and amplification devices and the audio host 100.

[0080] Another possible embodiment is that, in the case where the external pickup and amplification device connected to the audio host 100 is provided with a second codec module 221 but not with a first codec module 211, when the external pickup and amplification device transmits audio data signals to the audio host 100, the audio processing unit 22 (with the second codec module 221) can be used directly to encode or decode the relevant audio data signals, so as to ensure the signal transmission stability between the external pickup and amplification device and the audio host 100.

[0081] For the first codec module 211 that can be configured in the audio codec unit 21 and audio processing unit 22 provided in this application, this application provides an optional configuration method of selecting the AES67 codec module; for the second codec module 221 that can be configured in the audio processing unit 22, this application provides an optional configuration method of selecting the DANTE codec module.

[0082] The AES67 codec module, also known as the AES67 unit, is used for encoding and decoding audio transmission protocols when communicating with connected external AES67 pickup and amplification devices (including external pickup and amplification devices connected to the AES67 codec module). This includes encoding the digital audio output from the processor unit 23 into the AES67 protocol standard and outputting it to the network port 11 by the audio codec unit 21 or audio processing unit 22 within the audio host 100 system, and decoding the AES67 audio data received via the network port 11 into a digital audio signal within the system via the audio codec unit 21 or audio processing unit 22 and sending it to the DSP unit (processor unit 23).

[0083] Similarly, the DANTE codec module is used to encode and decode the audio transmission protocol when communicating with connected external DANTE pickup and amplification devices (including external pickup and amplification devices connected to the DANTE codec module); this includes the audio processing unit 22 in the audio host system encoding the digital audio output by the processor unit 23 into the DANTE protocol standard and outputting it to the network port 11, and decoding the DANTE audio data received through the network port 11 into a digital audio signal within the system via the audio processing unit 22 and sending it to the DSP (Digital Signal Processing) unit, i.e., the processor unit 23.

[0084] It should be noted that the AES67 codec module and DANTE codec module provided in this application are only two types of codec modules that can be selected for audio transmission. However, this application is not limited to these two types and other types of codec modules can be selected based on the requirements.

[0085] It should also be added that, if there is a need to transmit video signals based on the audio host 100, the AES67 codec module and the DANTE codec module can be replaced with modules that can encode and decode audio and video data.

[0086] Please refer to Figures 2-4 In one exemplary embodiment, the audio host 100 further includes:

[0087] The microcontroller unit 24 is connected to the audio codec unit 21, the audio processing unit 22 and the processor unit 23 respectively, and is used to control the operating logic of the audio host 100.

[0088] For example, the audio host 100 provided in this application may include, in addition to the aforementioned network port 11, audio codec unit 21, audio processing unit 22 and processor unit 23, a microcontroller unit 24 (MCU). The microcontroller unit 24 may be connected to the audio codec unit 21, the audio processing unit 22 and the processor unit 23 respectively, so that the microcontroller unit 24 can be used to regulate the operating logic of the audio host 100, which is beneficial to the smoothness and rationality of the transmission of multiple types of signals in the audio host 100, thereby improving the user experience of the audio host 100.

[0089] It should be noted that this application does not limit the specific module unit directly connected to the microcontroller unit 24. When the microcontroller unit 24 is connected to any of the network port 11, audio codec unit 21, audio processing unit 22 and processor unit 23, it can be directly connected or indirectly connected. In addition, the microcontroller unit 24 can also be further connected to other module units when needed to control the operating logic of other module units in the audio host 100.

[0090] In other words, the MCU unit is responsible for the overall logic control of the host, as well as the system services such as wired or wireless desktop microphone daisy-chaining with external cascaded devices, PoE speakers, PSE power supply systems, and various functional modules. Screen driving functions can also be added as needed.

[0091] Please refer to Figures 2-4 In one exemplary embodiment, the audio host 100 further includes:

[0092] The switch module 25 is connected to the microcontroller unit 24, the network port 11, the audio codec unit 21, and the audio processing unit 22, respectively, and is used to control the transmission path of the received signals.

[0093] For example, the audio host 100 provided in this application may also include a switch module 25. The switch module 25 can be configured to be connected to the microcontroller unit 24, network port 11, audio codec unit 21, and audio processing unit 22 inside the audio host 100. This allows the switch module 25 to control the transmission path of signals transmitted through any of the microcontroller unit 24, network port 11, audio codec unit 21, and audio processing unit 22. In other words, it can regulate which module unit(s) the received signals are transmitted to, which is beneficial to the smoothness and rationality of at least some signals in the audio host 100, thereby improving the user experience of the audio host 100.

[0094] It should be noted that this application does not limit the specific module unit directly connected to the switch module 25. When the switch module 25 is connected to any of the microcontroller unit 24, network port 11, audio codec unit 21 and audio processing unit 22, it can be directly connected or indirectly connected. In addition, the switch module 25 can also be further connected to other module units when needed to control the transmission logic of signals transmitted from other module units, and whether to transmit the received signals to other module units.

[0095] Please refer to Figures 2-4 In one exemplary embodiment, the audio host 100 further includes:

[0096] The USB interface 12 is connected to the microcontroller unit 24 and the processor unit 23 via a hub (USB HUB, Universal Serial Bus HUB) 271, respectively, for connecting external devices.

[0097] For example, the audio host 100 provided in this application may further include a USB (Universal Serial Bus) interface. The internal module unit of the audio host 100 may further include a hub 271. One end of the hub 271 may be connected to the USB interface 12, and the other end of the hub 271 may be connected to the microcontroller unit 24 and the processor unit 23 respectively, so as to realize the connection between the USB interface 12 and the microcontroller unit 24 and the processor unit 23 respectively. The USB interface 12 is used to realize the communication connection between some external devices and the audio host 100. For example, it can realize the communication connection between external devices such as mobile phones and tablets and the audio host 100, thereby realizing data communication between the audio host 100 and external devices, which is conducive to expanding the functions of the audio host 100 and improving the user experience of the audio host 100.

[0098] Please refer to Figures 2-4In one exemplary embodiment, the audio host 100 further includes:

[0099] Protocol conversion unit 28, connected between hub 271 and processor unit 23, is used to adjust the protocol type of the received signal.

[0100] For example, the audio host 100 provided in this application may also include a protocol conversion unit 28. The protocol conversion unit 28 can be selectively connected between the hub 271 and the processor unit 23, so that the protocol conversion unit 28 can be used to convert the data protocol type of the data signal transmitted via the USB interface 12 and the hub 271, and then send the data signal after protocol type conversion to the processor unit 23, so that the processor unit 23 can recognize the data signal. At the same time, the protocol conversion unit 28 can be used to convert the data protocol type of the data signal output by the processor unit 23, and then transmit the data signal after protocol type conversion to the external device connected via the USB interface 12 through the hub 271 and the USB interface 12, so that the external device can receive and recognize the data signal. It is evident that the protocol conversion unit 28 is designed to ensure that when various different signals are transmitted to the processor unit 23, the processor unit 23 can receive data signals of the protocol type that it can recognize; and to ensure that the data signals output by the processor unit 23 via the USB interface 12 are data signals of the protocol type that can be recognized by the external devices connected to the USB interface 12.

[0101] The protocol conversion unit is called USB Audio Class, or UAC for short. From a user function perspective, UAC mainly includes the function control and interface standard for USB microphones, USB sound cards, and other audio devices. It can realize audio input and output, as well as audio volume control.

[0102] Please refer to Figures 2-4 In one exemplary embodiment, the power supply component includes:

[0103] The power board 61, the first heat sink 62 and the second heat sink 63 are connected to the two far sides of the power board 61 and form a first air duct 65.

[0104] The power supply module 26 is mounted on the power board 61 and located inside the first air duct 65; the power supply module 26 is connected to each network port 11 and is used to supply power to external audio pickup and amplification equipment through the network port 11; the power supply module 26 is electrically connected to the first fan 64 and is used to control the rotation of the first fan 64.

[0105] The power supply control unit 29 is installed on the power board 61 and located in the first air duct 65. The power supply control unit 29 is connected between the power supply module 26 and each network port 11 and is used to regulate the power supply logic and power distribution to each network port 11.

[0106] That is, in addition to setting the audio host 100 to include multiple network ports 11 and audio processing components, the audio host 100 can be further configured to include a power supply board 61, as well as a power supply module 26 and a power supply control unit 29 installed on the power supply board 61. The power supply module 26 is connected to each network port 11 and is used to supply power to external audio pickup and amplification equipment based on the network port 11.

[0107] For example, the audio host 100 provided in this application may also include a power supply module 26. The power supply module 26 can be connected to at least some of the network ports 11 to provide power to the external audio pickup devices connected to the network ports 11. This enables the network ports 11 to transmit audio data signals and, when needed, to transmit power to the connected external audio pickup devices to charge them.

[0108] Specifically, the first air duct 65 mentioned above in this application is actually a "U-shaped" channel formed by the first heat sink 62, the second heat sink 63 and the power supply board 61; the power supply module 26 is located inside the first air duct 65, that is, the power supply module 26 is located on the side surface of the power supply board 61 facing the first heat sink 62.

[0109] For example, the audio host 100 provided in this application may also include a power supply control unit 29 adapted to the power supply module 26. The power supply control unit 29 is installed on the side surface of the power board 61 facing the first heat sink 62 and is located in the first air duct 65. The power supply control unit 29 can be connected between the power supply module 26 and each network port 11. The power supply control unit 29 can be used to provide different power to the network ports 11 with different power requirements based on the set working power of each network port 11. Specifically, the power supply control unit 29 can be used to regulate the power supply logic and power distribution to each network port 11 so that the power output is more reasonable.

[0110] Among them, for example Figure 2As shown, the audio host 100 may include seven network ports 11, with each port having a power rating of, for example, 90W and 45W. Among the multiple network ports 11, at least one port 11 may be selected for powering an externally connected audio pickup / amplification device; however, all ports 11 may also be configured to simultaneously provide power and transmit audio signals. This application does not impose a specific limitation on this. The audio host 100 may further include a network cable interface (LAN) 16; the structure of the network cable interface 16 and the network ports 11 may be identical.

[0111] Please refer to Figures 2-4 In one exemplary embodiment, the power supply component further includes:

[0112] The power interface (AC IN, Alternating Current Input) 13 is electrically connected to the power supply module 26 for connecting the audio host 100 to external AC power.

[0113] For example, the power supply component of the audio host 100 provided in this application may also include a power interface 13, which is used to enable the audio host 100 to be connected to external AC power. The power interface 13 is electrically connected to the power supply module 26 and can transmit the received AC power to the power supply module 26 to enable power supply to the audio host 100, and further power supply to the connected external pickup and amplification equipment through the network port 11.

[0114] Please refer to Figures 2-6 In an exemplary embodiment, the heat dissipation module in the audio host 100 may further include a second fan 67, which is installed on the air inlet side of the first air duct 65 and the air outlet of the second fan 67 faces the first fan 64.

[0115] The power supply assembly is electrically connected to the second fan 67 and is used to control the rotation of the second fan 67 so that the air outside the chassis 60 flows into the chassis 60 through the air inlet 68, and the air inside the chassis 60 is discharged to the outside of the chassis 60 through the first fan 64 along the path of the second air duct 66, the second fan 67 and the first air duct 65.

[0116] For example, this application adds a second fan 67 to the heat dissipation module, located on the air inlet side of the first air duct 65 away from the air outlet side. The air outlet of the second fan 67 faces the first air duct 65, and the air inlet of the second fan 67 faces away from the air outlet side. Simultaneously, a gap space is provided between the side of the second fan 67 away from the first air duct 65 and a side panel of the chassis 60. This arrangement allows air in the gap space on the air inlet side of the second fan 67 to flow towards the first air duct 65 when the second fan 67 is operating. For example, the size of the gap space between the side of the second fan 67 away from the first air duct 65 and a side panel of the chassis 60 can be selected to be at least approximately 10mm. For example, the size of the gap space can be selected to be 8mm, 9mm, 10mm, 11mm, 12mm, etc., so that the gap space is sufficient for air to flow through the chassis 60.

[0117] Alternatively, the power supply module 26 in the power supply assembly can be electrically connected to the second fan 67 to provide driving power for the second fan 67 and control its rotation. When the second fan 67 rotates, it can work in conjunction with the first fan 64 to drive air from outside the chassis 60 into the chassis 60 through the air inlet slot 68, and then exhaust the air inside the chassis 60 to the outside of the chassis 60 through the first fan 64 along the path of the second air duct 66, the second fan 67, and the first air duct 65. This is used to cool at least one of the power supply assembly and audio processing assembly inside the chassis 60, further reducing component damage caused by heat generated during operation of the audio host 100, thereby helping to extend the service life of the audio host 100.

[0118] The second fan 67 can be driven when the first fan 64 fails to meet the heat dissipation requirements, thereby accelerating heat dissipation. The first fan 64 can be optionally configured to start operating when the audio host is powered on. One alternative implementation allows the starting and stopping of the second fan 67 to be controlled based on a temperature sensor installed in the audio host. This temperature sensor can be configured to detect the operating temperature of at least one of the power supply module 26 and the audio processing component in real time. If the operating temperature of either component exceeds a preset temperature, the second fan 67 can be turned on; if the operating temperatures of both the power supply module 26 and the audio processing component are below the preset temperatures, the second fan 67 can be turned off; or, if the operating temperatures of both the power supply module 26 and the audio processing component are below the preset temperatures for a preset time, the second fan 67 can be turned off.

[0119] In addition, please refer to Figure 4 and Figure 5In one alternative embodiment, at least one of the first heat sink 62 and the second heat sink 63 may include a through-hole penetrating the surface of the plate. This allows air inside the chassis 60 to flow into the first air duct 65 via the first heat sink 62 and / or the second heat sink 63, and then be exhausted from the chassis 60 by the first fan 64. If the distance between one of the first heat sink 62 and the second heat sink 63 and the air inlet slot 68 adjacent to the chassis 60 is very small, the through-hole in the heat sink may be configured to match the air inlet slot 68. For example, the through-holes on both plates (the through-hole in the second heat sink 63 and the one adjacent to the air inlet slot 68) may have the same specifications. In a feasible case, at least part of the chassis side panel where the air inlet slot 68 is located may be directly reused as either the first heat sink 62 or the second heat sink 63.

[0120] One alternative implementation is that there are multiple air inlet slots 68, which are spaced apart along the length of their respective sides.

[0121] Another alternative implementation method is provided, such as... Figure 4 and Figure 5 As shown, the first fan 64 can be installed in the side panel of the chassis 60 where the network port 11 is located. By operating the first fan 64, the operating temperature of the side panel of the chassis 60 on the side of the network port 11 can be reduced, which helps to avoid damage to the network port due to excessive temperature during operation.

[0122] Another alternative implementation is provided in which at least one of the power board 61, the first heat sink 62, and the second heat sink 63 used to enclose the first air duct 65 is made of a material with good thermal conductivity, such as aluminum, to serve as a protective and heat sink for the power supply module 26.

[0123] Please refer to Figures 2-4 In one exemplary embodiment, the audio host 100 further includes:

[0124] The microphone interface (MIC IN, Microphone Input) 14 is connected to the processor unit 23 via the analog-to-digital converter (ADC) and is used to receive audio signals from external audio devices and transmit them to the processor unit 23.

[0125] The audio output interface (LINE OUT) 15 is connected to the processor unit 23 via a digital-to-analog converter (DAC) and is used to receive audio signals transmitted by the processor unit 23 and output them to external devices.

[0126] The microphone interface 14 and the audio output interface 15 are also electrically connected to the power supply module 26.

[0127] The external audio device connected to the microphone interface 14 can be, for example, a microphone or other sound pickup device.

[0128] For example, the audio host 100 provided in this application may also include a microphone interface 14 and an audio output interface 15. The structure of the microphone interface 14 and the audio output interface 15 is different from that of the network port 11. Specifically, the microphone interface 14 and the audio output interface 15 can be set to an interface structure that already exists in the related technology based on the requirements. For example, a multi-channel analog audio interface IN (input) / OUT (output) formed by a unified specification Phoenix terminal can be selected to adapt to common audio cable terminals in the related technology.

[0129] For example, the microphone interface 14 and audio output interface 15 can be configured to include at least one of the following interfaces in the related technology: TRS interface, RCA interface (lotus connector), XLR interface (cannon connector), and Phoenix connector; or the microphone interface 14 and audio output interface 15 can be configured to be Phoenix connector type interfaces, thereby eliminating the TRS interface, RCA interface and XLR interface in the related technology, and replacing them with the network port 11 to realize the transmission of audio signals.

[0130] The microphone interface 14 and the audio output interface 15 can also be electrically connected to the power supply module 26 so that the power supply module 26 can transmit power to external devices electrically connected to it via the microphone interface 14 and / or the audio output interface 15 to charge the external devices. Figure 4 The "*4" shown in the microphone interface 14 and audio output interface 15 means 4 groups.

[0131] In addition, such as Figure 4 As shown, the interfaces in the audio host 100 provided in this application may further include an RS232 interface 17 and an RS485 interface 18. The RS232 interface 17 and RS485 interface 18 are respectively connected to the MCU through conversion circuits. The RS232 interface 17 and RS485 interface 18 can be used to connect to the required external devices.

[0132] The audio host 100 provided in this application includes an optional embodiment in which the analog audio interfaces such as TRS, RCA, and XLR interfaces in the related technology are removed, and the microphone input and speaker output can all be selected to use digital network ports 11. It also has PoE (Power over Ethernet) power supply capability, and can achieve the sound pickup and amplification function using only Cat 5e network cables. At the same time, it only retains the Phoenix terminals (14 / 15) for backward compatibility with existing analog audio devices.

[0133] The AES67 unit is mainly responsible for the encoding and decoding of audio transmission protocols when communicating with connected external AES67 audio pickup and amplification devices. It encodes digital audio data within the system into the AES67 protocol standard output and receives AES67 audio data, then decodes and converts it into digital audio signals within the system for the DSP unit.

[0134] The extended AES67 / DANTE unit is mainly used for future functional expansion, and can be connected to standard network devices such as AES67 or DANTE in the industry to increase product compatibility and functional expansion.

[0135] The ADC / DAC unit is mainly used for the conversion between digital audio and analog audio, and is backward compatible with traditional analog audio pickup and amplification devices, increasing scalability.

[0136] The switching unit, since AES67 / DANTE is based on network transmission, connects various functional modules within the host system. It can meet the needs of AES67 / DANTE audio data transmission and also meet the networking needs of functional modules that require networking.

[0137] The PSE (Power Sourcing Equipment) unit mainly serves as the logic for power supply to the seven RJ45 network cards and the allocation of power supply. It can cascade multiple devices in a daisy-chain configuration within the power range of a single network port, based on the power of the connected devices.

[0138] like Figure 2 , Figure 3 As shown in one exemplary embodiment, the digital audio section of the audio host 100 may be equipped with, for example, seven RJ45 network ports 11 and one USB interface. The seven RJ45 network ports 11 can be configured to all support PoE functionality and can simultaneously provide power. Each network port 11 supports IEEE 802.3 af / at / bt single-port PoE++, providing a maximum power of 90W. Each port uses four analog audio interfaces (IN / OUT) with a unified Phoenix connector, ensuring backward compatibility with traditional audio pickup and amplification products. RS232 / RS485 (17 and 18) control is implemented using the same Phoenix connector. One RJ45 network port is used for network access. This application allows for automatic network configuration when an AES67 device is inserted, enabling plug-and-play functionality and significantly reducing the complexity of on-site debugging and the difficulty of user operation.

[0139] Please combine Figures 2-4 Reference Figure 7Based on the same inventive concept, this application also provides a display device 200, which includes an audio host 100; the display device 200 also includes a display screen 31 and a communication module 32; wherein the display screen 31 is connected to the processor unit 23, the switch module 25, the hub 271 and the microcontroller unit 24 in the audio host 100 through the communication module 32 respectively.

[0140] For example, the audio host 100, display screen 31 and communication module (WEB / AI) 32 included in the display device 200 provided in this application may be integrated into a large device or may be composed of at least two or three small sub-devices. This application does not make any specific limitation in this regard.

[0141] The display screen 31 in the display device 200 can communicate with the audio host 100 via the communication module 32. For example, it can be connected to the processor unit 23, switch module 25, hub 271 and microcontroller unit 24 in the audio host 100 via the communication module 32 to realize data communication with at least one of these four module units. Thus, the audio data signal input via the network port 11 can be played through the audio playback software in the display screen 31, and the user-selected audio data signal can be transmitted to the external amplification device via the network port 11 through the display screen 31.

[0142] Among them, the communication module (WEB / AI) 32 is mainly responsible for communication and linkage with the host computer on the WEB (World Wide Web). It can also add screen driving function and AI (Artificial Intelligence) noise reduction algorithm execution as needed, including mixing, frequency shifting, and 3A algorithm. The WEB / AI unit can be composed of WEB module and AI module, or it can be executed by a single module, depending on the development method of AI noise reduction algorithm and WEB system program.

[0143] The display screen 31 can be used to display custom UI (User Interface) and interactive logic such as menus. Figure 7 KEY / LED refers to the button indicator light.

[0144] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0145] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An audio host, comprising a chassis and a power supply assembly disposed inside the chassis, characterized in that, Also includes: Multiple network ports are used to transmit audio data signals to external audio pickup and amplification devices; An audio processing component includes an audio codec unit, an audio processing unit, and a processor unit. The audio codec unit is connected to each of the network ports and is used to process the received audio data signal into first protocol data. The audio processing unit is connected to each of the network ports and is used to process the received audio data signal into the first protocol data or second protocol data. The processor unit is connected to the audio codec unit and the audio processing unit respectively and is used to perform sound effect processing on the received audio data signal. The heat dissipation module includes a first heat sink, a second heat sink, and a first fan; the first heat sink and the second heat sink are connected to the two opposite edges of the power supply assembly and form a first air duct; an air inlet slot is provided through the side of the chassis opposite to the first heat sink and / or the second heat sink, and the air inlet slot forms a second air duct to the air inlet side of the first air duct; the first fan is located on the air outlet side of the first air duct; The power supply component is electrically connected to the first fan and is used to control the rotation of the first fan to draw air from outside the chassis into the chassis through the air inlet slot, and to discharge air from inside the chassis to the outside of the chassis through the first fan along the paths of the second air duct and the first air duct, thereby dissipating heat from at least one of the power supply component and the audio processing component inside the chassis.

2. The audio host according to claim 1, characterized in that, At least some of the external sound pickup and amplification devices and the audio codec unit include a preset first codec module; the audio processing unit includes the preset first codec module and / or a preset second codec module; The first preset codec module uses the AES67 codec module; the second preset codec module uses the DANTE codec module.

3. The audio host according to claim 1, characterized in that, Also includes: The microcontroller unit is connected to the audio codec unit, the audio processing unit, and the processor unit, respectively, and is used to control the operating logic of the audio host.

4. The audio host according to claim 3, characterized in that, Also includes: The switch module is connected to the microcontroller unit, the network port, the audio codec unit, and the audio processing unit, respectively, and is used to control the transmission path of the received signal.

5. The audio host according to claim 3, characterized in that, Also includes: The USB interface is connected to the microcontroller unit and the processor unit via a hub, and is used to connect to external devices.

6. The audio host according to claim 5, characterized in that, Also includes: A protocol conversion unit, connected between the hub and the processor unit, is used to adjust the protocol type of the received signals.

7. The audio host according to claim 1, characterized in that, The power supply assembly also includes: The power board has a first heat sink and a second heat sink connected to two far apart sides of the power board, forming the first air duct. A power supply module is mounted on the power board and located within the first air duct; the power supply module is connected to each of the network ports and is used to supply power to the external audio pickup and amplification equipment via the network ports; the power supply module is electrically connected to the first fan and is used to control the rotation of the first fan; A power supply control unit is installed on the power board and located in the first air duct; the power supply control unit is connected between the power supply module and each of the network ports, and is used to regulate the power supply logic and power distribution to each of the network ports; The power interface is electrically connected to the power supply module and is used for connecting the audio host to external AC power.

8. The audio host according to claim 1, characterized in that, The heat dissipation module also includes a second fan, which is installed on the air inlet side of the first air duct, and the air outlet of the second fan faces the first fan. The power supply assembly is electrically connected to the second fan and is used to control the rotation of the second fan so that air outside the chassis flows into the chassis through the air inlet slot, and air inside the chassis is discharged to the outside of the chassis through the first fan along the path of the second air duct, the second fan, and the first air duct. And / or, the number of air inlet slots is multiple, and the multiple air inlet slots are spaced apart along the length direction of their respective sides.

9. The audio host according to claim 1, characterized in that, Also includes: The microphone interface is connected to the processor unit via an analog-to-digital converter and is used to receive audio signals from external audio devices and transmit them to the processor unit. An audio output interface is connected to the processor unit via a digital-to-analog converter, and is used to receive audio signals transmitted by the processor unit and output them to external devices; The microphone interface and the audio output interface are also electrically connected to the power supply module.

10. A display device, characterized in that, Includes the audio host as described in any one of claims 1-9; The display device also includes a display screen and a communication module; The display screen is connected to the processor unit, switch module, hub and microcontroller unit in the audio host through the communication module.

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