A multi-layer structure reference body for infrared heat conduction model validation

Abstract

The present application relates to a kind of multilayer structure reference body for infrared heat conduction model verification, it is related to the field of infrared model calibration verification, including aluminium plate, PVC plate, heating film and thermal barrier layer glued in turn, several sensors are pasted with spacing on the outer surface of aluminium plate by high-temperature-resistant adhesive tape, sensor is inserted between aluminium plate and PVC plate, and between PVC plate and heating film, sensor is thermosensitive sensor, sensor is connected to aviation plug by grouping threading and is electrically connected with control box integrated with sensor controller, heating film controller and power meter, the present application is packaged by the design of the temperature sensor of each layer material regionally laid out, power meter and heating film connection, with the advantages that heating power in test is recorded in real time and the surface temperature of each layer material, provide clear input condition for simulation and accurate model verification data.

Description

Technical Field

[0001] This invention relates to the field of infrared model verification technology, and in particular to a multi-layered reference body for infrared thermal conduction model verification. Background Technology

[0002] With the rapid development of technologies related to target and environmental characteristics, the testing, modeling, and simulation of target optical characteristics are playing an increasingly important supporting role in equipment design, development, and construction. Consequently, the confidence level of target optical characteristic data and models is receiving increasing attention. Therefore, how to evaluate the accuracy of data and models has become an urgent problem to be solved.

[0003] There are two main approaches to obtaining the optical properties of a target: one is through field measurements in an outdoor experiment; the other is through theoretical analysis to establish a theoretical model and calculate the properties. Field experiments are costly and highly susceptible to environmental influences, posing numerous challenges. Theoretical models, on the other hand, overcome these drawbacks and can be used to analyze the optical properties of non-cooperative targets. In recent years, theoretical models for the optical properties of various targets have been established. However, the results of theoretical calculations cannot be directly applied; the accuracy of the model itself must meet application requirements. Therefore, the verification analysis of the model itself is particularly important and urgent. However, to date, especially for the verification of temperature prediction and heat transfer models for multi-layered shell structures, a unified evaluation criterion has not yet been established to evaluate infrared theoretical models of multi-layered structures.

[0004] Therefore, to address the above shortcomings, a multi-layered reference body is needed for the verification of infrared thermal conduction models. Summary of the Invention

[0005] (a) Technical problems to be solved The technical problem to be solved by this invention is to achieve high-precision verification of the theoretical model of infrared heat conduction in multilayer structures.

[0006] (II) Technical Solution To address the aforementioned technical problems, this invention provides a multi-layered reference body for verifying infrared thermal conduction models, comprising an aluminum plate, a PVC plate, a heating film, and a heat insulation layer bonded together sequentially. Several sensors are attached to the outer surface of the aluminum plate at intervals using high-temperature resistant tape. Sensors are inserted between the aluminum plate and the PVC plate, and between the PVC plate and the heating film. The sensors are thermistors. The sensors are connected to an aviation connector via grouped wiring and are electrically connected to a control box that integrates a sensor controller, a heating film controller, and a power meter.

[0007] As a further explanation of the present invention, preferably, each layer is bonded with 705 silicone thermal conductive adhesive, and the thermal conductive adhesive is stacked at multiple points. A press is used to make the thermal conductive adhesive spread evenly and expel air.

[0008] As a further explanation of the present invention, preferably, the bottom end face of the aluminum plate and the upper and lower end faces of the PVC plate are provided with grooves for inserting the sensor and the cable connecting the sensor.

[0009] As a further explanation of the present invention, preferably, five sensors are distributed at intervals on the outer surface of the aluminum plate, between the aluminum plate and the PVC plate, and between the PVC plate and the heating film, respectively located in the middle, lower right, upper right, lower left, and upper left positions. A thermometer is provided at intervals on the sensor side of the PVC plate and the heating film in the middle.

[0010] As a further explanation of the present invention, preferably, the heat insulation layer includes a top cover, a base and a filling layer, wherein the base has a groove for placing the filling layer, and the filling layer is asbestos.

[0011] As a further explanation of the present invention, preferably, both the top cover and the base are made of epoxy resin containing glass fiber, and the top cover and the base are fixed together by polyamide screws.

[0012] As a further explanation of the present invention, preferably, a gimbal is fixed to the side of the heat insulation layer away from the sensor, and a tripod is provided at the bottom of the gimbal to stand the plate on the ground.

[0013] (III) Beneficial Effects The above-described technical solution of the present invention has the following advantages: This invention employs four materials with significantly different thermal conductivity in four layers. The temperature sensors for each material are arranged in different areas, and the power meter is connected and packaged with the heating film. Combined with the real-time recording of heating power and surface temperature of each material layer during the experiment, the maximum difference between the measured temperature and the simulated temperature is less than 2℃, the minimum difference is only 0.01℃, and the average error is about 0.99℃. This provides clear input conditions and accurate verification data for the simulation. Attached Figure Description

[0014] Figure 1 This is a simplified structural diagram of the present invention; Figure 2 This is an exploded view of the structure of the present invention; Figure 3 This is a diagram showing the location of the slots in this invention; Figure 4 This is a structural diagram of the heat insulation layer of the present invention; Figure 5 These are physical images of the present invention; Figure 6 This is an assembly effect diagram of the present invention; Figure 7 This is a simulation result diagram of the present invention.

[0015] In the diagram: 1. Aluminum plate; 2. PVC plate; 3. Heating film; 4. Insulation layer; 41. Top cover; 42. Base; 43. Filling layer; 5. Sensor; 6. Gimbal. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] A multilayer structure reference body for infrared thermal conduction model verification, combined with Figure 1 , Figure 2 It includes an aluminum plate 1, a PVC plate 2, a heating film 3 and a heat insulation layer 4, which are glued together in sequence. Five sensors 5 are attached to the outer surface of the aluminum plate 1 at intervals by high-temperature resistant tape. Sensors 5 are also inserted between the aluminum plate 1 and the PVC plate 2, and between the PVC plate 2 and the heating film 3. All sensors 5 are thermal sensors.

[0018] Combination Figure 1 , Figure 2 The aluminum plate 1 is a square metal plate, preferably 25cm in length and width, and 5mm in thickness. The sensors 5, which are attached to the upper surface of the aluminum plate 1 with tape, are located in the middle, lower right, upper right, lower left, and upper left positions. At the same position on the bottom surface of the aluminum plate 1, a groove with the same shape as the sensor 5 and the cable connecting the sensor 5 is opened. The groove on the aluminum plate 1 can reduce the groove depth of the PVC plate 2, so as to avoid excessive material removal from the PVC plate 2.

[0019] Combination Figure 2 , Figure 3 PVC plate 2 is also a square plate, with the same length and width dimensions as aluminum plate 1, and a thickness of 10mm. PVC plate 2 uses a wiring exit method from all four sides, and grooves with the same shape as sensor 5 and the cable connecting sensor 5 are cut on its upper and lower surfaces at the same positions as aluminum plate 1, minimizing damage to the plate and thus ensuring more uniform heat conduction. Heating film 3 is a square film, with the same length and width dimensions as aluminum plate 1, and a thickness of only 0.5mm. A thermometer is spaced apart on the side of sensor 5 in the middle of PVC plate 2 and heating film 3, sharing a wiring exit groove with the central sensor 5.

[0020] Combination Figure 1 , Figure 4The insulation layer 4 is also a square plate with the same length and width dimensions as the aluminum plate 1, and its thickness is 16mm. The insulation layer 4 includes a top cover 41, a base 42, and a filling layer 43. Both the top cover 41 and the base 42 are made of epoxy resin containing glass fiber. The base 42 has a groove to hold the filling layer 43, which is made of asbestos for insulation, achieving a lower thermal conductivity and allowing heat to concentrate and diffuse towards the PVC plate 2. The top cover 41 and the base 42 are fixed together with polyamide screws. This ensures efficient heat transfer between the PVC plate 2 and the aluminum plate 1 during the heating process of the heating film 3, reducing heat loss. Testing showed that the thermal conductivity of the insulation board is below 0.1W / mK, effectively optimizing the simulation conditions during the verification process.

[0021] Combination Figure 1 , Figure 2 Each layer of the board is bonded with 705 silicone thermal conductive adhesive, and the thermal conductive adhesive is stacked at multiple points. A press is used to spread the thermal conductive adhesive evenly and remove air to avoid cavities between different layers after sealing, thus ensuring the heat transfer efficiency between layers during heating.

[0022] Combination Figure 5 , Figure 6 A gimbal 6 is fixed to the side of the heat insulation layer 4 away from the sensor 5 to reduce the influence of the metal structure of the gimbal 6 on heat transfer during the heating process, preventing the sensor 5 from reaching the predetermined temperature. A tripod is provided at the bottom of the gimbal 6 to stand the plate upright on the ground. The sensor 5 is connected to an aviation plug through grouped wiring and is electrically connected to a control box that integrates a sensor controller, a heating film controller, and a power meter.

[0023] The theoretical model of infrared heat conduction in multilayer structures was verified using the reference body of this invention. Simulation calculations of heat transfer between multilayer structures under indoor self-heating conditions were conducted. The results of cross-comparison between the measured temperature of the aluminum plate surface temperature sensor and the simulated temperature under indoor self-heating conditions are as follows: Figure 7 As shown, the maximum difference between the measured temperature and the simulated temperature is 1.95℃, the minimum difference is only 0.01℃, and the mean error is 0.99℃. The verification accuracy of the infrared heat conduction theoretical model is better than 2℃.

[0024] In summary, this invention employs four materials with significantly different thermal conductivity, which better highlights the heat conduction process between materials and facilitates the verification of infrared heat conduction models between different materials. Each layer is sealed with 705 silicone thermally conductive adhesive using a point-stacking and uniformly pressurized method, effectively avoiding the influence of air during heat conduction and improving the consistency of experimental and simulation conditions. Furthermore, the sensors 5 are arranged in groups, with wires exiting from the periphery as close as possible, minimizing the processing of the board material, ensuring the symmetry of the wire slots, and guaranteeing uniform heat conduction in different areas during heating, thus improving the accuracy of model verification. By recording the heating power and the surface temperature of each material layer in real time during the experiment, clear input conditions and accurate model verification data are provided for the simulation.

[0025] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multilayer structure reference body for verifying infrared thermal conduction models, characterized in that: The device includes an aluminum plate (1), a PVC plate (2), a heating film (3), and a heat insulation layer (4) that are glued together in sequence. Several sensors (5) are attached to the outer surface of the aluminum plate (1) at intervals by high-temperature resistant tape. Sensors (5) are inserted between the aluminum plate (1) and the PVC plate (2), and between the PVC plate (2) and the heating film (3). The sensors (5) are thermal sensors. The sensors (5) are connected to the aviation plug through grouped wiring and are electrically connected to the control box that integrates the sensor controller, the heating film controller, and the power meter.

2. The multilayer structure reference body for infrared thermal conduction model verification according to claim 1, characterized in that: Each layer of the board is bonded together with 705 silicone thermal conductive adhesive, and the thermal conductive adhesive is piled up at multiple points. A press is used to make the thermal conductive adhesive spread evenly and expel air.

3. The multilayer structure reference body for infrared thermal conduction model verification according to claim 2, characterized in that: The bottom surface of the aluminum plate (1) and the top and bottom surfaces of the PVC plate (2) are provided with slots for inserting the sensor (5) and the cable connecting the sensor (5).

4. A multilayer structure reference body for infrared thermal conduction model verification according to claim 3, characterized in that: Five sensors (5) are distributed at intervals on the outer surface of the aluminum plate (1), between the aluminum plate (1) and the PVC plate (2), and between the PVC plate (2) and the heating film (3). They are located in the middle, lower right, upper right, lower left and upper left positions respectively. A thermometer is provided at intervals on one side of the sensor (5) in the middle of the PVC plate (2) and the heating film (3).

5. A multilayer structure reference body for infrared thermal conduction model verification according to claim 4, characterized in that: The insulation layer (4) includes a top cover (41), a base (42) and a filling layer (43). The base (42) has a groove for placing the filling layer (43), and the filling layer (43) is asbestos.

6. A multilayer structure reference body for infrared thermal conduction model verification according to claim 5, characterized in that: The top cover (41) and the base (42) are both made of epoxy resin containing glass fiber, and the top cover (41) and the base (42) are fixed together by polyamide screws.

7. A multilayer structure reference body for infrared thermal conduction model verification according to claim 6, characterized in that: A gimbal (6) is fixed to the side of the heat insulation layer (4) away from the sensor (5), and a tripod is provided at the bottom of the gimbal (6) to stand the plate on the ground.

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