Semiconductor module turnover device
By using the handling robot arm, positioning platform and flip mechanism in the semiconductor module flip device, combined with the design of the pneumatic module and jaws, the problem of low flip operation accuracy is solved, the flip accuracy and reliability are improved, and the module damage rate is reduced .
Patent Information
- Application Number
- CN202420737140.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-10
AI Technical Summary
The existing semiconductor module flip device has low operating accuracy, resulting in easy damage to the module.
A semiconductor module flip device including a handling robot arm, a positioning platform and a flip mechanism is designed. By positioning first and then flipping, clamping and flipping is achieved using a pneumatic module, a lifting cylinder, a rotating cylinder and a relative opening and closing jaw. Combining guide columns and grooves improves clamping accuracy and stability.
The flip operation accuracy is improved, the damage rate of semiconductor modules is reduced, and efficient movement is achieved through pneumatic control and multi-cylinder cooperation, ensuring the reliability and efficiency of flip operation.
Smart Images
Figure CN222158972U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor module flipping device. Background Art
[0002] In order to improve the integration of electronic devices and reduce the possibility of failure, modular design is increasingly used in the semiconductor field. Semiconductor modules are usually assembled from multiple components, such as single-side direct cooling (SSDC) modules.
[0003] The SSDC module is a special power module design that aims to improve efficiency and reduce thermal resistance by directly dissipating heat on one side of the module. This design is often used in high power density applications such as electric vehicles, data centers, and renewable energy systems. The SSDC module includes a stacked ceramic substrate, tin sheet, and heat sink, and the tin sheet is set between the heat sink and the ceramic substrate to achieve welding, so that the heat sink and the ceramic substrate are reliably, evenly, and tightly fixed.
[0004] Most semiconductor module assembly systems use reverse assembly, that is, each component is flipped over and then assembled in sequence. This requires that the assembled semiconductor module be flipped over as a whole in the end. However, the current flipping device has low operating accuracy, which makes the semiconductor module easy to be damaged during the operation. Utility Model Content
[0005] The purpose of the present application is to solve the problem of low precision in semiconductor module flipping operation in the prior art. Therefore, the present application provides a semiconductor module flipping device, which improves the flipping operation precision by positioning the semiconductor module first and then flipping it.
[0006] The embodiment of the present application provides a semiconductor module flipping device, including a handling robot arm, a positioning platform and a flipping mechanism;
[0007] The positioning platform comprises two positioning platforms arranged at intervals, an avoidance space is formed between the two positioning platforms, and limiting blocks are arranged on the outer edges of the upper surfaces of the two positioning platforms, and a limiting space is formed for accommodating the semiconductor module;
[0008] The transport robot arm is used to transport the semiconductor module to the limited space of the positioning platform;
[0009] The flipping mechanism is used to extend into the avoidance space, and clamp and flip the semiconductor module in the limiting space.
[0010] By adopting the above technical solution, the semiconductor module to be flipped is first transported to the limited space of the positioning platform by the transport robot arm, so as to be positioned first and then flipped by the flipping mechanism, thereby improving the accuracy of the flipping mechanism in grasping the semiconductor module, thereby improving the accuracy of the flipping operation and reducing the damage rate of the semiconductor module; and the positioning platform has a simple structure, and can smoothly cooperate with the transport robot arm and the flipping mechanism through the avoidance space and the limited space, thereby ensuring the efficiency of the flipping operation.
[0011] In some embodiments, the flipping mechanism includes a pneumatic module, a lifting cylinder, a rotating cylinder, and two clamping claws that can open and close relative to each other;
[0012] The pneumatic module is arranged on one side of the positioning platform, the lifting cylinder is arranged on the pneumatic module, the rotating cylinder is arranged on the lifting cylinder, and the two clamps are arranged on the rotating cylinder;
[0013] The pneumatic module is used to drive the two clamps to move toward or away from the positioning platform through the lifting cylinder and the rotating cylinder, and when moving toward the positioning platform, one of the two clamps extends into the avoidance space to cooperate with the other clamp to clamp the semiconductor module located in the limiting space;
[0014] The lifting cylinder is used to drive the semiconductor module clamped by the two clamps to move away from or approach the limiting space of the positioning platform through the rotating cylinder;
[0015] The rotary cylinder is used to drive the two clamping claws to flip.
[0016] By adopting the above technical solution, multiple cylinders are used to realize spatial movement of the grippers in multiple directions, thereby achieving coordination with the positioning platform and improving the reliability of the flipping operation; and pneumatic control can effectively control the volume of the mechanism while realizing efficient reciprocating motion to ensure the efficiency of the flipping operation.
[0017] In some embodiments, the semiconductor module includes a first clamped surface and a second clamped surface that are arranged opposite to each other, and the first clamped surface is provided with a plurality of positioning holes;
[0018] One of the two clamping jaws corresponding to the first clamped surface of the semiconductor module is provided with a plurality of guide posts, the plurality of guide posts are arranged in one-to-one correspondence with the plurality of positioning holes, and the height of the guide posts is smaller than the thickness of the semiconductor module.
[0019] By adopting the above technical solution, through the cooperation between the guide column on the clamp and the positioning hole on the semiconductor module, the position of the semiconductor module can be slightly corrected and maintained in the process of the semiconductor module being separated from the limiting space of the positioning platform to being fully clamped, thereby improving the accuracy of the flipping operation, allowing the semiconductor module to be properly clamped and flipped, and reducing the damage rate of the semiconductor module.
[0020] In some embodiments, the clamping surface of the clamping jaw is provided with a groove matching the semiconductor module, and the groove is used to limit the semiconductor module located on the clamping surface in a first direction.
[0021] By adopting the above technical solution, the contact area between the clamping claw and the semiconductor module is increased, and the movement of the semiconductor module is restricted in the first direction, thereby improving the clamping stability and further improving the accuracy and reliability of the flipping operation.
[0022] In some embodiments, rubber pads are provided at both ends of the groove bottom.
[0023] By adopting the above technical solution, the stability of the clamping claws on the semiconductor module is improved, and the wear on the surface of the semiconductor module is avoided, thereby improving the accuracy and reliability of the flipping operation.
[0024] In some embodiments, the two clamping jaws have a clamping position and a release position;
[0025] When in the clamping position and the releasing position, the two clamping claws drive the semiconductor module to be located above the limiting space.
[0026] The above technical solution can improve the reliability of the flipping operation and avoid the small distance between the clamping claw located above the positioning table and the limiting space of the positioning table, which may cause squeezing damage to the semiconductor module.
[0027] In some embodiments, a detection sensor is disposed between the two positioning platforms, and the detection sensor is used to detect whether the semiconductor module is in the limiting space.
[0028] Other features and corresponding beneficial effects of the present application are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the records in the specification of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 This is a schematic diagram of the semiconductor module flipping device in use of the present application;
[0030] Figure 2 This is a partial structural schematic diagram of the semiconductor module flipping device of the present application;
[0031] Figure 3This is a partial structural schematic diagram of the semiconductor module flipping device of the present application from another angle.
[0032] Description of reference numerals: 1, semiconductor module; 11, first clamped surface; 111, positioning hole; 12, second clamped surface;
[0033] 10. Transporting robot arm;
[0034] 20. Positioning platform; 21. Positioning platform; 211. Limit block; 22. Avoidance space; 23. Limit space; 24. Detection sensor;
[0035] 30. Flipping mechanism; 31. Pneumatic module; 32. Lifting cylinder; 33. Rotating cylinder; 34. Opening and closing cylinder; 35. Clamping claw; 351. Guide column; 352. Groove; 353. Rubber pad. DETAILED DESCRIPTION
[0036] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.
[0037] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0038] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.
[0039] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description created by the present application, unless otherwise specified, "multiple" means two or more.
[0040] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0041] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0042] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the semiconductor module flipping device of the present application in use, wherein the semiconductor module 1 has completed the flipping operation and is placed back into the limiting space 23 of the positioning platform 20; Figure 2 It is a partial structural diagram of the semiconductor module flipping device of the present application, excluding the transport robot arm 10 .
[0043] The flipping device is used to flip a semiconductor module 1, and the semiconductor module 1 includes a first clamped surface 11 and a second clamped surface 12 arranged opposite to each other. Preferably, the first clamped surface 11 of the semiconductor module 1 is provided with a plurality of positioning holes 111.
[0044] It should be noted that the device is usually used in a semiconductor module assembly system, and flips the semiconductor module 1 that has completed a certain assembly process. Therefore, the semiconductor module 1 applicable to the device may include not only the semiconductor module 1 itself, but also various jigs assembled into a whole with the semiconductor module 1 during its assembly process, and flip the whole.
[0045] An embodiment of the present application provides a semiconductor module flipping device, including a transport robot 10 , a positioning platform 20 and a flipping mechanism 30 .
[0046] The positioning platform 20 includes two positioning platforms 21 spaced apart from each other, with an avoidance space 22 formed between the two positioning platforms 21 . Limiting blocks 211 are provided on the outer edges of the upper surfaces of the two positioning platforms 21 , and a limiting space 23 for accommodating the semiconductor module 1 is formed.
[0047] The transport robot 10 is used to transport the semiconductor module 1 to the limiting space 23 of the positioning platform 20 .
[0048] The flipping mechanism 30 is used to extend into the avoidance space 22 and clamp and flip the semiconductor module 1 in the limiting space 23 .
[0049] In this method, the semiconductor module 1 to be flipped is first transported to the limit space 23 of the positioning platform 20 by the transport robot 10, and is first positioned, and then flipped by the flipping mechanism 30, thereby improving the accuracy of the flipping mechanism 30 in grasping the semiconductor module 1, thereby improving the accuracy of the flipping operation and reducing the damage rate of the semiconductor module 1.
[0050] In addition, the positioning platform 20 has a simple structure and can smoothly cooperate with the transport robot arm 10 and the turning mechanism 30 through the avoidance space 22 and the limiting space 23, thereby ensuring the turning operation efficiency.
[0051] In one embodiment, the flipping mechanism 30 includes a pneumatic module 31, a lifting cylinder 32, a rotating cylinder 33, and two clamping jaws 35 that can open and close relative to each other.
[0052] The pneumatic module 31 is disposed on one side of the positioning platform 20 , the lifting cylinder 32 is disposed on the pneumatic module 31 , the rotating cylinder 33 is disposed on the lifting cylinder 32 , and two clamping claws 35 are disposed on the rotating cylinder 33 .
[0053] It should be noted that the pneumatic module 31 is a linear drive mechanism directly driven by a cylinder.
[0054] The pneumatic module 31 is used to drive the two clamps 35 to move toward or away from the positioning platform 20 through the lifting cylinder 32 and the rotating cylinder 33, and when moving toward the positioning platform 20, one of the two clamps 35 extends into the avoidance space 22 to cooperate with the other clamp 35 to clamp the semiconductor module 1 located in the limiting space 23.
[0055] It is understandable that when the transport robot arm 10 is operating, the pneumatic module 31 can drive the two clamping claws 35 away from the positioning platform 20 to provide an operating space for the transport robot arm 10 .
[0056] The lifting cylinder 32 is used to drive the semiconductor module 1 clamped by the two clamps 35 to move away from or close to the limiting space 23 of the positioning platform 20 through the rotating cylinder 33. That is, when moving away, it can provide an operating space for the rotating cylinder 33 to drive the clamps 35 to flip, and when moving close, it can put the semiconductor module 1 back to the positioning platform 20.
[0057] The rotating cylinder 33 is used to drive the two clamping claws 35 to flip.
[0058] In this method, multiple cylinders are used to realize spatial movement of the clamping claw 35 in multiple directions, thereby achieving coordination with the positioning platform 20 and improving the reliability of the flipping operation.
[0059] In addition, pneumatic control can effectively control the volume of the mechanism while achieving efficient reciprocating motion to ensure the efficiency of the flipping operation.
[0060] In one embodiment, the two clamping jaws 35 are connected to an opening and closing cylinder 34 , and the opening and closing cylinder 34 drives the two clamping jaws 35 to move relative to each other to achieve opening and closing.
[0061] In other alternative embodiments, the flipping mechanism 30 includes an electric linear module, a lifting motor, a rotating motor, and two clamping jaws 35 that can be opened and closed relative to each other and controlled by an opening and closing motor.
[0062] See also Figure 3 , Figure 3 This is a partial structural schematic diagram of the semiconductor module flipping device of the present application from another angle.
[0063] In one embodiment, the semiconductor module 1 includes a first clamped surface 11 and a second clamped surface 12 that are oppositely disposed, and the first clamped surface 11 is provided with a plurality of positioning holes 111 .
[0064] In order to improve the positioning accuracy of the semiconductor module 1, one of the two clamping jaws 35 corresponding to the first clamped surface 11 of the semiconductor module 1 is provided with a plurality of guide posts 351, and the plurality of guide posts 351 are arranged in a one-to-one correspondence with the plurality of positioning holes 111, and the height of the guide posts 351 is less than the thickness of the semiconductor module 1, so that the guide posts 351 on the clamping jaws 35 cooperate with the positioning holes 111 on the semiconductor module 1, so that the position of the semiconductor module 1 can be slightly corrected and maintained in the process of the semiconductor module 1 being separated from the limiting space 23 of the positioning platform 20 to being completely clamped, thereby improving the accuracy of the flipping operation, allowing the semiconductor module 1 to be properly clamped and flipped, and reducing the damage rate of the semiconductor module 1.
[0065] In one embodiment, the clamping surface of the clamp 35 is provided with a groove 352 matching the semiconductor module 1, and the groove 352 is used to limit the semiconductor module 1 located on the clamping surface in the first direction, thereby increasing the contact area between the clamp 35 and the semiconductor module 1 while limiting the movement of the semiconductor module 1 in the first direction, thereby improving the clamping stability, and further improving the accuracy and reliability of the flipping operation.
[0066] In one embodiment, rubber pads 353 are provided at both ends of the bottom of the groove 352 to improve the stability of the clamping jaws 35 on the semiconductor module 1 and avoid wear on the surface of the semiconductor module 1, thereby improving the accuracy and reliability of the flipping operation.
[0067] In one embodiment, the two clamping jaws 35 have a clamping position and a release position.
[0068] Furthermore, when in the clamping position and the releasing position, the two clamping jaws 35 drive the semiconductor module 1 to be located above the limiting space 23, thereby improving the reliability of the flipping operation and avoiding the situation where the distance between the clamping jaws 35 located above the positioning platform 21 and the limiting space 23 of the positioning platform 21 is too small, causing squeezing damage to the semiconductor module 1.
[0069] In one embodiment, a detection sensor 24 is disposed between the two positioning platforms 21, and the detection sensor 24 is used to detect whether there is a semiconductor module 1 in the limiting space 23. The detection sensor 24 can be, but is not limited to, an infrared sensor, a laser sensor, and the like.
[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A semiconductor module flipping device, It is characterized in that It includes a handling robot arm, a positioning platform and a flipping mechanism; The positioning platform comprises two positioning platforms arranged at intervals, an avoidance space is formed between the two positioning platforms, and limiting blocks are arranged on the outer edges of the upper surfaces of the two positioning platforms, and a limiting space is formed for accommodating the semiconductor module; The transport robot arm is used to transport the semiconductor module to the limited space of the positioning platform; The flipping mechanism is used to extend into the avoidance space, and clamp and flip the semiconductor module in the limiting space.
2. The semiconductor module flipping device according to claim 1, It is characterized in that The flipping mechanism includes a pneumatic module, a lifting cylinder, a rotating cylinder and two clamping claws that can open and close relative to each other; The pneumatic module is arranged on one side of the positioning platform, the lifting cylinder is arranged on the pneumatic module, the rotating cylinder is arranged on the lifting cylinder, and the two clamps are arranged on the rotating cylinder; The pneumatic module is used to drive the two clamps to move toward or away from the positioning platform through the lifting cylinder and the rotating cylinder, and when moving toward the positioning platform, one of the two clamps extends into the avoidance space to cooperate with the other clamp to clamp the semiconductor module located in the limiting space; The lifting cylinder is used to drive the semiconductor module clamped by the two clamps to move away from or approach the limiting space of the positioning platform through the rotating cylinder; The rotary cylinder is used to drive the two clamping claws to flip.
3. The semiconductor module flipping device according to claim 2, It is characterized in that The semiconductor module comprises a first clamped surface and a second clamped surface which are arranged opposite to each other, and the first clamped surface is provided with a plurality of positioning holes; One of the two clamping jaws corresponding to the first clamped surface of the semiconductor module is provided with a plurality of guide posts, the plurality of guide posts are arranged in one-to-one correspondence with the plurality of positioning holes, and the height of the guide posts is smaller than the thickness of the semiconductor module.
4. The semiconductor module flipping device according to claim 2, It is characterized in that The clamping surface of the clamping jaw is provided with a groove matching the semiconductor module, and the groove is used to limit the semiconductor module located on the clamping surface in a first direction.
5. The semiconductor module flipping device according to claim 4, It is characterized in that Rubber pads are arranged at both ends of the groove bottom.
6. The semiconductor module flipping device according to any one of claims 2 to 5, It is characterized in that The two clamping jaws have a clamping position and a release position; When in the clamping position and the releasing position, the two clamping claws drive the semiconductor module to be located above the limiting space.
7. The semiconductor module flipping device according to any one of claims 1 to 6, It is characterized in that A detection sensor is disposed between the two positioning platforms, and the detection sensor is used to detect whether the semiconductor module is in the limiting space.