LED packaging piece and LED lamp bead

Abstract

The utility model relates to the technical field of LED packaging, in particular to an LED packaging piece and an LED lamp bead, the LED packaging piece comprises a hollow bowl cup support forming a containing space, a first glue layer, a second glue layer and a color changing layer arranged between the first glue layer and the second glue layer are arranged in the containing space, and the color changing layer is arranged between the first glue layer and the second glue layer. One side, far away from the color changing layer, of the second adhesive layer sinks towards the color changing layer to form a sunken space. When the LED packaging piece and the LED chip are packaged, the color changing layer can be directly used for cutting, the LED packaging piece is directly attached to the upper portion of the LED chip for color changing, the color consistency of a device is ensured, meanwhile, the situation that a film material makes contact with water vapor and fails is avoided, and therefore the cost of the whole film material is saved.

Description

[Technical field]

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging component and an LED lamp bead. [Background technology]

[0002] As consumer demand for high-resolution, low-energy displays continues to increase, MiniLED backlight technology is also constantly evolving.

[0003] The existing white light solution of MiniLED backlight technology usually encapsulates blue light COB (Chip-on-Board) and color-changing film to obtain white light, but the cost of using blue light COB for color conversion is high. [Utility Model Content]

[0004] In order to solve the problem of high cost of blue light COB color conversion adopted in the existing MiniLED backlight technology, the utility model provides an LED package and an LED lamp bead.

[0005] The solution to the technical problem provided by the utility model is to provide an LED package, which includes 1. An LED package, characterized in that it includes a bowl cup holder which is hollow to form an accommodation space, wherein a first adhesive layer, a second adhesive layer and a color-changing layer arranged between the first adhesive layer and the second adhesive layer are arranged in the accommodation space, and a side of the second adhesive layer away from the color-changing layer is recessed in the direction of the color-changing layer to form a recessed space.

[0006] Preferably, a step is provided on the inner wall of the bowl and cup support, and a side of the color changing layer facing the second adhesive layer abuts against the step.

[0007] Preferably, the LED package further comprises an optical structure, and the optical structure is arranged on a side of the first adhesive layer away from the color conversion layer.

[0008] Preferably, the optical structure is one of a reflective layer, a light-shielding layer, a third adhesive layer and a lens layer.

[0009] Preferably, the reflective layer or the light-shielding layer is arranged in a middle area of ​​a side of the first adhesive layer away from the color transfer layer.

[0010] Preferably, the third adhesive layer covers the first adhesive layer and protrudes in a direction away from the first adhesive layer.

[0011] Preferably, the lens layer is disposed in a middle area of ​​a side of the first adhesive layer away from the color transfer layer.

[0012] Preferably, the thickness of the first adhesive layer and the second adhesive layer are both greater than 0 mm and less than or equal to 10 mm.

[0013] Preferably, the distance between the concave apex of the concave space and the bottom surface of the accommodating space is greater than 0 mm and less than or equal to 5 mm.

[0014] The utility model also provides an LED lamp bead, which includes a substrate, an LED chip arranged on the substrate and an LED package as described in any of the above items, wherein a packaging glue layer is arranged on the LED chip, the LED chip is located in the recessed space, and the packaging glue layer is connected to the second glue layer.

[0015] Compared with the prior art, the LED package and LED lamp beads of the present invention have the following advantages:

[0016] 1. The utility model provides an LED package, including a bowl-cup holder with a hollow accommodating space, wherein a first adhesive layer, a second adhesive layer, and a color-changing layer arranged between the first adhesive layer and the second adhesive layer are arranged in the accommodating space, and a side of the second adhesive layer away from the color-changing layer is recessed in the direction of the color-changing layer to form a recessed space. By arranging the first adhesive layer, the second adhesive layer, and the color-changing layer in the accommodating space of the bowl-cup holder, an LED package independent of the LED chip can be formed, and the recessed space is a reserved placement space for the LED chip, so when the LED package and the LED chip are packaged, the color-changing layer can be directly used for cutting, and the LED package can be directly attached to the top of the LED chip for color-changing, which not only ensures the color consistency of the device, but also avoids the failure of the film material due to contact with water vapor, thereby saving the cost of the entire film material, so as to further significantly reduce the cost of color-changing.

[0017] 2. The inner wall of the bowl and cup support of the utility model is provided with a step, and the side of the color-changing layer facing the second adhesive layer abuts against the step. By providing the step, the color-changing layer can be installed smoothly; in addition, it can also prevent the light that has not been changed from leaking out.

[0018] 3. The LED package of the utility model further comprises an optical structure, which is arranged on a side of the first adhesive layer away from the color-changing layer. By arranging the optical structure on the first adhesive layer, the light output angle is increased, thereby improving the light output efficiency.

[0019] 4. The reflective layer or light-shielding layer of the utility model is arranged in the middle area of ​​the side of the first adhesive layer away from the color-changing layer, which can effectively reduce the light emission of the LED chip at the top center after packaging, thereby being more conducive to increasing the light emission angle and making the light emission more uniform.

[0020] 5. The third adhesive layer of the present invention covers the first adhesive layer and protrudes in a direction away from the first adhesive layer, so that the protruding section of the third adhesive layer forms a curved surface structure to further increase the light output angle.

[0021] 6. The lens layer of the utility model is arranged in the middle area of ​​the side of the first adhesive layer away from the color conversion layer, thereby reducing the light emission of the LED chip at the top center after packaging, which is conducive to increasing the angle of light emission.

[0022] 7. The thickness of the first adhesive layer and the second adhesive layer of the utility model are both greater than 0 mm and less than or equal to 10 mm. By controlling the thickness of the first adhesive layer and the second adhesive layer, the LED package and the LED chip can be effectively packaged, thereby improving the effectiveness of the package.

[0023] 8. The distance between the concave vertex of the concave space of the utility model and the bottom surface of the accommodating space is greater than 0 mm and less than or equal to 5 mm. By setting the distance between the concave vertex and the bottom surface of the accommodating space, sufficient concave space can be reserved to accommodate the LED chip and perform the final packaging.

[0024] 9. The utility model also provides an LED lamp bead, which has the same beneficial effects as the above-mentioned LED package, and will not be described in detail here.

Brief Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 It is a schematic cross-sectional view of the LED package provided by the first embodiment of the utility model.

[0027] Figure 2 It is a cross-sectional schematic diagram of the bowl and cup bracket of the LED package provided by the first embodiment of the utility model.

[0028] Figure 3 It is a schematic cross-sectional view of a first implementation manner of an LED package provided by the first embodiment of the utility model.

[0029] Figure 4 It is a cross-sectional schematic diagram of a second implementation manner of the LED package provided by the first embodiment of the utility model.

[0030] Figure 5 It is a schematic cross-sectional view of the optical structure of the LED package provided by the first embodiment of the utility model.

[0031] Figure 6 It is a schematic cross-sectional view of the reflective layer of the LED package provided by the first embodiment of the utility model.

[0032] Figure 7 It is a schematic cross-sectional view of the light shielding layer of the LED package provided by the first embodiment of the utility model.

[0033] Figure 8 It is a cross-sectional schematic diagram of the curved surface of the third adhesive layer of the LED package provided by the first embodiment of the utility model.

[0034] Fig. 9 It is a cross-sectional schematic diagram of the concave curved surface of the third adhesive layer of the LED package provided by the first embodiment of the utility model.

[0035] Fig.10 It is a cross-sectional schematic diagram of a first example of a lens layer of an LED package provided by the first embodiment of the utility model.

[0036] Fig.11 It is a cross-sectional schematic diagram of a second example of the lens layer of the LED package provided by the first embodiment of the utility model.

[0037] Fig.12 It is a cross-sectional schematic diagram of an LED lamp bead provided in the second embodiment of the utility model.

[0038] Fig.13 It is a cross-sectional schematic diagram of other implementations of the LED lamp bead provided in the second embodiment of the utility model.

[0039] Description of the accompanying drawings:

[0040] 1. LED package; 2. LED lamp beads;

[0041] 11. Bowl and cup support; 12. First adhesive layer; 13. Second adhesive layer; 14. Color transfer layer; 15. Optical structure; 16. Main adhesive layer; 21. Substrate; 22. LED chip; 23. Encapsulation adhesive layer;

[0042] 111, accommodating space; 112, inner wall; 131, recessed space; 141, accommodating space;

[0043] 151, reflective layer; 152, light shielding layer; 153, third adhesive layer; 154, lens layer;

[0044] 1111, light emitting surface; 1112, bottom surface; 1121, step; 1311, concave apex; 1531, concave center; 1541, first lens structure; 1542, second lens structure. [Specific implementation method]

[0045] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0047] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0048] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0049] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0050] See also Figure 1 and Figure 2 The first embodiment of the utility model provides an LED package 1, including a bowl cup holder 11 which is hollow to form an accommodating space 111, in which a first adhesive layer 12, a second adhesive layer 13 and a color-changing layer 14 arranged between the first adhesive layer 12 and the second adhesive layer 13 are arranged, and a side of the second adhesive layer 13 away from the color-changing layer 14 is recessed in the direction of the color-changing layer 14 to form a recessed space 131.

[0051] Specifically, the cup support 11 is cup-shaped, and the accommodating space 111 formed by the internal hollowness is also cup-shaped as a whole. The accommodating space 111 includes a bottom surface 1112 and a light emitting surface 1111. The width D of the light emitting surface 1111 (e.g. Figure 2 D) is greater than the width d of the bottom surface 1112 (as shown Figure 2 As shown in d), when the width D of the light emitting surface 1111 is greater than the width d of the bottom surface 1112, the best light emitting effect can be achieved after the LED package 1 and the LED chip are packaged. Specifically, the bowl-cup structure can gather light directly above the LED chip, making the center brightness higher and the overall brightness higher. In addition, it is also more suitable for lens matching and reducing the generation of halo.

[0052] It can be understood that the first adhesive layer 12, the color-changing layer 14, and the second adhesive layer 13 can be sequentially arranged in the direction from the light-emitting surface 1111 to the bottom surface 1112 in the accommodating space 111 to form a hierarchical structure, that is, the color-changing layer 14 is located between the first adhesive layer 12 and the second adhesive layer 13, thereby separating the first adhesive layer 12 and the second adhesive layer 13. The side of the second adhesive layer 13 away from the color-changing layer 14 is recessed in the direction of the color-changing layer 14 to form a recessed space 131. The recessed space 131 is opposite to the bottom surface 1112 of the accommodating space 111. The recessed space 131 is specifically a reserved space for bonding the substrate 21 and the LED chip. The recessed space 131 can specifically be a curved surface structure, which is more compatible with the state of the LED chip when it is emitting light. Therefore, by setting the first glue layer 12, the second glue layer 13 and the color change layer 14 in the accommodating space 111 of the bowl cup holder 11, an LED package 1 independent of the LED chip can be formed, and the set recessed space 131 is a reserved placement space for the LED chip. Therefore, when the LED package 1 and the LED chip are packaged, the color change layer 14 can be directly used for cutting, and the LED package 1 can be directly attached to the top of the LED chip for color change, which not only ensures the color consistency of the device, but also avoids the failure of the film material due to contact with water vapor, thereby saving the cost of the entire film material, and further significantly reducing the cost of color change.

[0053] Furthermore, the thickness of the first adhesive layer 12 and the second adhesive layer 13 are both greater than 0 mm and less than or equal to 10 mm.

[0054] It can be understood that by controlling the thickness of the first adhesive layer 12 and the second adhesive layer 13, the first adhesive layer 12 and the second adhesive layer 13 can be effectively and firmly bonded to the cup support 11, so that the LED package 1 and the LED chip can be effectively packaged, and finally the effectiveness of the package is improved. In this embodiment, preferably, the thickness of the first adhesive layer 12 and the second adhesive layer 13 can be 0.1 mm. The first adhesive layer 12 and the second adhesive layer 13 of this thickness can achieve effective bonding with the cup support 11 while achieving the packaging of the LED chip.

[0055] The material of the first adhesive layer 12 and the second adhesive layer 13 is optional and is not limited in this embodiment, as long as they are transparent and have a bonding effect. Preferably, the first adhesive layer 12 and the second adhesive layer 13 can be transparent silicone layers. The first adhesive layer 12 and the second adhesive layer 13 of a common encapsulation adhesive system such as silicone and epoxy have high bonding performance and are more firmly bonded to the bowl and cup bracket 11. At the same time, they have good light transmittance, which can fully transmit and scatter the light emitted by the LED chip, thereby improving the brightness and uniformity of the light.

[0056] Optionally, the color changing layer 14 is made of a color changing material, and the color changing material is not limited as long as it can change the color of the LED chip. In this embodiment, preferably, the color changing layer 14 can be a color changing film, and the LED chip can be an LED blue light chip, so that white light can be formed after packaging.

[0057] See also Figure 3 As an optional first implementation, the accommodating space 111 may not have a color-changing layer 14, but only has a main adhesive layer 16 composed of a first adhesive layer 12 and a second adhesive layer 13, and the thickness of the main adhesive layer 16 is greater than 0 mm and less than or equal to 20 mm. Thus, through the bowl-shaped bowl-cup bracket 11 and the main adhesive layer 16, after the LED package 1 without the color-changing layer 14 is packaged with the LED chip, the light is gathered directly above the LED chip, so that the center brightness is higher and the overall brightness is higher. That is, the LED package 1 without the color-changing layer 14 is only used as an implementation method for improving brightness.

[0058] See also Figure 4 As another optional second embodiment, the accommodation space 111 may not have the second adhesive layer 13, but only the first adhesive layer 12 and the color-changing layer 14. The color-changing layer 14 and the cup holder 11 form an accommodation space 141 for accommodating other optical products. In the accommodation space 141, the bottom of the cup holder 11 can be directly glued on the LED chip, and the entire LED chip can be covered by the accommodation space 141. The LED package 1 of this embodiment can be adapted to a reliability requirement lower than the reliability requirement of optical products that use blue light COB to convert light into white light, which increases the versatility of the prepared LED package 1.

[0059] See also Figure 1 Furthermore, the distance M between the concave vertex 1311 of the concave space 131 and the bottom surface 1112 of the accommodating space 111 (eg Figure 1 The M) shown is greater than 0 mm and less than or equal to 5 mm.

[0060] Specifically, the side of the second adhesive layer 13 away from the color-changing layer 14, i.e., the side forming the recessed space 131, is a curved surface structure, and the curved surface has a curved surface vertex, and the distance between the curved surface vertex and the side of the second adhesive layer 13 close to the color-changing layer 14 is the shortest, and the distance between the curved surface vertex and the bottom surface 1112 of the accommodating space 111 is also the farthest. The curved surface vertex is also the recessed vertex 1311 of the recessed space 131.

[0061] It can be understood that by setting the distance M between the concave apex 1311 of the concave space 131 and the bottom surface 1112 of the accommodating space 111 to be greater than 0 mm and less than or equal to 5 mm, the height range of the concave space 131 can be controlled, so that the size of the concave space 131 can be limited by controlling the height. Therefore, by reasonably arranging the distance M between the concave apex 1311 of the concave space 131 and the bottom surface 1112 of the accommodating space 111, a sufficiently large concave space 131 is reserved to accommodate the LED chip for the final packaging. In this embodiment, preferably, the distance between the concave apex 1311 of the concave space 131 and the packaged LED chip can be 0.4 mm. Setting 0.4 mm makes it easier to press the glue layer on the LED chip and the second glue layer 13 together to fill the entire concave space 131.

[0062] See also Figure 2 Furthermore, a step 1121 is provided on the inner wall 112 of the cup holder 11 , and a side of the color changing layer 14 facing the second adhesive layer 13 abuts against the step 1121 .

[0063] It can be understood that a step 1121 can be provided on the inner wall 112 of the bowl and cup support 11. The step 1121 can be an integral annular step 1121 or a plurality of steps 1121 spaced apart and distributed in parallel. This embodiment does not limit this. It is sufficient that the side of the color-changing layer 14 facing the second adhesive layer 13 can abut against and abut against the step 1121. That is, the shape of the step 1121 matches the boundary of the color-changing layer 14, thereby supporting the step 1121 and achieving a smooth installation of the color-changing layer 14. In addition, the provision of the step 1121 can also prevent the leakage of light that has not been changed in color, thereby avoiding affecting the emission of white light.

[0064] See also Figure 5 Furthermore, the LED package 1 further includes an optical structure 15 , and the optical structure 15 is disposed on a side of the first adhesive layer 12 away from the color conversion layer 14 .

[0065] It can be understood that in order to increase the light output angle and improve the light output efficiency, an optical structure 15 can be provided on the side of the first adhesive layer 12 away from the color conversion layer 14. The optical structure 15 can increase the light output angle and improve the light output efficiency.

[0066] See also Figure 5-Figure 10Furthermore, the optical structure 15 is one of a reflective layer 151 , a light shielding layer 152 , a third adhesive layer 153 and a lens layer 154 .

[0067] It can be understood that the optical structure 15 can be any one of the reflective layer 151, the shading layer 152, the third adhesive layer 153 and the lens layer 154. By arranging the reflective layer 151 or the shading layer 152 or the third adhesive layer 153 or the lens layer 154 on the side of the first adhesive layer 12 away from the color transfer layer 14, the effect of increasing the light output angle and improving the light output efficiency can be achieved.

[0068] See also Figure 6 and Figure 7 Furthermore, the reflective layer 151 or the light shielding layer 152 is disposed in the middle area of ​​the first adhesive layer 12 away from the color transfer layer 14 .

[0069] It can be understood that the reflective layer 151 and the light shielding layer 152 are arranged at the same position, that is, they are arranged in the middle area of ​​the side of the first adhesive layer 12 away from the color-changing layer 14. Therefore, after the LED package 1 and the LED chip are finally packaged, the LED chip is located in the middle area of ​​the bottom surface 1112 of the accommodating space 111, and the middle area is also the corresponding area of ​​the middle area of ​​the recessed space 131. Therefore, the position of the LED chip is opposite to the reflective layer 151 or the light shielding layer 152, thereby effectively reducing the light emission of the LED chip at the top center after packaging, which is more conducive to increasing the angle of light emission and making the light emission more uniform.

[0070] Specifically, as an optional implementation. Figure 6 , Figure 6 The side of the first adhesive layer 12 away from the color-changing layer 14 is a reflective layer 151. After the LED package 1 and the LED chip are finally packaged, the reflective layer 151 reflects the light emitted by the LED chip at the top center, thereby effectively reducing the light emitted by the LED chip at the top center after packaging, so as to achieve a large-angle light emission of the LED chip on the light-emitting surface 1111 of the bowl-shaped bowl bracket 11.

[0071] As another optional implementation, refer to Figure 7 , Figure 7 A light shielding layer 152 is provided on one side of the first adhesive layer 12 away from the color-changing layer 14. After the LED package 1 and the LED chip are finally packaged, the light shielding layer 152 shields the light emitted from the top center of the LED chip, thereby effectively reducing the light emitted from the top center of the LED chip after packaging, so as to realize the large-angle light emission of the LED chip on the light-emitting surface 1111 of the bowl-shaped bowl bracket 11.

[0072] See also Figure 8 and Fig. 9Further, as another optional implementation, a third adhesive layer 153 is disposed on a side of the first adhesive layer 12 away from the color transfer layer 14 . The third adhesive layer 153 covers the first adhesive layer 12 and protrudes in a direction away from the first adhesive layer 12 .

[0073] Specifically, the third adhesive layer 153 needs to cover the side of the first adhesive layer 12 away from the color-changing layer 14 and the boundary of the cup support 11, so that the third adhesive layer 153 can completely cover the light emitted by the LED chip 22 through the first adhesive layer 12 to avoid omission. In addition, the third adhesive layer 153 needs to protrude in the direction away from the first adhesive layer 12, that is, the side of the third adhesive layer 153 away from the first adhesive layer 12 needs to be curved, and the curved third adhesive layer 153 expands the angle and area of ​​the light emitted by the LED chip through the first adhesive layer 12.

[0074] It should be noted that the third adhesive layer 153 can be formed on the first adhesive layer 12 by dispensing. Specifically, the third adhesive layer 153 can be formed by dispensing on the side of the first adhesive layer 12 away from the color transfer layer 14 by ordinary dispensing or optical dispensing. The present embodiment does not limit the dispensing method of the third adhesive layer 153, as long as the third adhesive layer 153 covers the first adhesive layer 12 and protrudes in a direction away from the first adhesive layer 12.

[0075] See also Figure 8 Optionally, the convex surface of the third adhesive layer 153 can be an integral curved surface, so that the light emitted by the LED chip through the first adhesive layer 12 can be emitted more evenly after passing through the third adhesive layer 153 .

[0076] See also Fig. 9 Optionally, the convex shape of the third adhesive layer 153 can be a concave curved surface, and the depressed center 1531 of the concave curved surface corresponds to the center of the side of the first adhesive layer 12 away from the color-changing layer 14, that is, the center directly opposite to the packaged LED chip. Through the setting of the depressed center 1531, the light emitted from the top center of the LED chip can be emitted from the curved surface beside the depressed center 1531 when passing through the depressed center 1531, instead of directly emitting light from the depressed center 1531, thereby reducing the direct light emission of the LED chip 22 at the top center after packaging, which is beneficial to increase the overall light emission angle.

[0077] See also Fig.10 and Fig.11 Furthermore, as another optional implementation, the lens layer 154 is disposed in the middle area of ​​the side of the first adhesive layer 12 away from the color transfer layer 14 .

[0078] Specifically, the lens layer 154 includes an internal first lens structure 1541 and an external second lens structure 1542 that wraps the first lens structure 1541. The first lens structure 1541 is arranged in the middle area of ​​the side of the first adhesive layer 12 away from the color-changing layer 14. The second lens structure 1542 wraps the first lens structure 1541 and makes the first lens structure 1541 at the center of the second lens structure 1542. Therefore, after the LED package 1 is used to package the LED chip, the position of the first lens structure 1541 corresponds to the position of the LED chip on the bottom surface 1112 of the accommodating space 111. The correspondence is vertically relative. Therefore, the light emitted from the top center of the LED chip can be refracted by the first lens structure 1541 first, and the refracted light is then emitted through the light-shielded second lens structure 1542. Therefore, through the refraction of the internal focusing lens of the first lens structure 1541 and the light-shielded second lens structure 1542, the light output from the top center of the LED chip is opened, thereby achieving control of the light output from the top center of the LED chip to expand the light output angle of the top center of the LED chip and reduce the direct light output of the LED chip at the top center after packaging, which is beneficial to increase the overall light output angle.

[0079] It should be noted that the size of the lens layer 154 is not limited in this embodiment, and can be larger than the size of the side of the bowl and cup holder 11 away from the recessed space 131, or smaller than or equal to the size of the side of the bowl and cup holder 11 away from the recessed space 131, as long as the lens layer 154 can correspond to the position of the encapsulated LED chip, that is, it can be set along the middle area of ​​the side of the first adhesive layer 12 away from the color-changing layer 14. In this embodiment, preferably, the size of the lens layer 154 must be set in the middle area of ​​the side of the first adhesive layer 12 away from the color-changing layer 14, and cover the side of the first adhesive layer 12 away from the color-changing layer 14, so as to avoid the omission of the light emitting from the LED chip at the top center after encapsulation, so as to maximize the light emitting angle of the LED chip at the top center. For details, please refer to Fig.10 and Fig.11 , Fig.10 This is a first exemplary diagram showing that the size of the lens layer 154 is smaller than the size of the side of the bowl and cup holder 11 away from the recessed space 131 . Fig.11 This is a second exemplary diagram showing that the size of the lens layer 154 is larger than the size of the side of the bowl and cup holder 11 away from the recessed space 131 .

[0080] See also Fig.12 The second embodiment of the utility model provides an LED lamp bead 2, which includes a substrate 21, an LED chip 22 arranged on the substrate 21 and an LED package 1 of any one of the second embodiments, a packaging glue layer 23 is arranged on the LED chip 22, the LED chip 22 is located in the recessed space 131, and the packaging glue layer 23 is connected to the second glue layer 13.

[0081] It can be understood that since the LED package 1 in the first embodiment is an independent LED package 1 relative to the LED chip 22, when the LED package 1 and the LED chip 22 are used for packaging, the color change layer 14 can be directly used for cutting, and the LED package 1 can be directly attached to the top of the LED chip 22 for color change, which not only ensures the color consistency of the device, but also avoids the failure of the film material due to contact with water vapor, thereby saving the cost of the entire film material, so as to further significantly reduce the cost. In addition, the bowl-cup structure presented by the LED package 1 as a whole can gather light to the top of the LED chip 22, making the center brightness higher and the overall brightness higher. In addition, it is also more suitable for lens matching and reducing the generation of halos.

[0082] The specific packaging process is as follows: first, place the LED chip 22 on the substrate 21; apply glue on the LED to form a packaging glue layer 23; cover the LED package 1 directly above the LED chip 22 with the packaging glue layer 23 and press it downward to make the packaging glue layer 23 and the second glue layer 13 reach a state of complete contact, and then bake and cure to make the packaging glue layer 23 and the second glue layer 13 complete the mutual bonding between the contact surfaces to complete the packaging.

[0083] Optionally, the material of the encapsulation adhesive layer 23 is not limited in this embodiment, and can be the same as the material of the first adhesive layer 12 and the second adhesive layer 13, as long as it is transparent and has a bonding effect. Preferably, the encapsulation adhesive layer 23 can be a transparent silicone layer. The encapsulation adhesive layer 23 using a common encapsulation adhesive system such as silicone and epoxy has high bonding performance, and is more firmly bonded to the LED chip 22 and the second adhesive layer 13. At the same time, it has good light transmittance, which can enable the light emitted by the LED chip 22 to be fully transmitted and scattered, thereby improving the brightness and uniformity of the light.

[0084] See also Fig.13 As an optional embodiment, the LED package 1 may not have the second adhesive layer 13, and the LED chip 22 is located in the accommodation space 141 formed by the color-changing layer 14 and the cup support 11, and the entire LED chip is covered by the accommodation space 141. The LED package 1 of this embodiment can be adapted to a reliability requirement lower than the reliability requirement of an optical product that uses blue light COB to convert light into white light, thereby increasing the versatility of the prepared LED package 1.

[0085] Compared with the prior art, the LED package and LED lamp beads of the present invention have the following advantages:

[0086] 1. The utility model provides an LED package, including a bowl-cup holder with a hollow accommodating space, wherein a first adhesive layer, a second adhesive layer, and a color-changing layer arranged between the first adhesive layer and the second adhesive layer are arranged in the accommodating space, and a side of the second adhesive layer away from the color-changing layer is recessed in the direction of the color-changing layer to form a recessed space. By arranging the first adhesive layer, the second adhesive layer, and the color-changing layer in the accommodating space of the bowl-cup holder, an LED package independent of the LED chip can be formed, and the recessed space is a reserved placement space for the LED chip, so when the LED package and the LED chip are packaged, the color-changing layer can be directly used for cutting, and the LED package can be directly attached to the top of the LED chip for color-changing, which not only ensures the color consistency of the device, but also avoids the failure of the film material due to contact with water vapor, thereby saving the cost of the entire film material, and further significantly reducing the cost of color-changing.

[0087] 2. The inner wall of the bowl and cup support of the utility model is provided with a step, and the side of the color-changing layer facing the second adhesive layer abuts against the step. By providing the step, the color-changing layer can be installed smoothly; in addition, it can also prevent the light that has not been changed from leaking out.

[0088] 3. The LED package of the utility model further comprises an optical structure, which is arranged on a side of the first adhesive layer away from the color-changing layer. By arranging the optical structure on the first adhesive layer, the light output angle is increased, thereby improving the light output efficiency.

[0089] 4. The reflective layer or light-shielding layer of the utility model is arranged in the middle area of ​​the side of the first adhesive layer away from the color-changing layer, which can effectively reduce the light emission of the LED chip at the top center after packaging, thereby being more conducive to increasing the light emission angle and making the light emission more uniform.

[0090] 5. The third adhesive layer of the present invention covers the first adhesive layer and protrudes in a direction away from the first adhesive layer, so that the protruding section of the third adhesive layer forms a curved surface structure to further increase the light output angle.

[0091] 6. The lens layer of the utility model is arranged in the middle area of ​​the side of the first adhesive layer away from the color conversion layer, thereby reducing the light emission of the LED chip at the top center after packaging, which is conducive to increasing the angle of light emission.

[0092] 7. The thickness of the first adhesive layer and the second adhesive layer of the utility model are both greater than 0 mm and less than or equal to 10 mm. By controlling the thickness of the first adhesive layer and the second adhesive layer, the LED package and the LED chip can be effectively packaged, thereby improving the effectiveness of the package.

[0093] 8. The distance between the concave vertex of the concave space of the utility model and the bottom surface of the accommodating space is greater than 0 mm and less than or equal to 5 mm. By setting the distance between the concave vertex and the bottom surface of the accommodating space, sufficient concave space can be reserved to accommodate the LED chip and perform the final packaging.

[0094] 9. The utility model also provides an LED lamp bead, which has the same beneficial effects as the above-mentioned LED package, and will not be described in detail here.

[0095] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED package, characterized in that: A bowl and cup stand is provided with a hollow accommodating space, wherein a first adhesive layer, a second adhesive layer and a color-changing layer arranged between the first adhesive layer and the second adhesive layer are provided in the accommodating space, and a side of the second adhesive layer away from the color-changing layer is recessed in the direction of the color-changing layer to form a recessed space.

2. The LED package according to claim 1, wherein: A step is arranged on the inner wall of the bowl and cup support, and a side of the color-changing layer facing the second adhesive layer abuts against the step.

3. The LED package according to claim 1, wherein: The LED package further comprises an optical structure, and the optical structure is arranged on a side of the first adhesive layer away from the color conversion layer.

4. The LED package as claimed in claim 3, characterized in that: The optical structure is one of a reflective layer, a light shielding layer, a third adhesive layer and a lens layer.

5. The LED package as claimed in claim 4, characterized in that: The reflective layer or the light shielding layer is arranged in a middle area of ​​a side of the first adhesive layer away from the color transfer layer.

6. The LED package according to claim 4, wherein: The third adhesive layer covers the first adhesive layer and protrudes in a direction away from the first adhesive layer.

7. The LED package according to claim 4, wherein: The lens layer is disposed in a middle area of ​​a side of the first adhesive layer away from the color-changing layer.

8. The LED package according to claim 1, wherein: The thickness of the first adhesive layer and the second adhesive layer are both greater than 0 mm and less than or equal to 10 mm.

9. The LED package according to claim 1, wherein: The distance between the concave vertex of the concave space and the bottom surface of the accommodating space is greater than 0 mm and less than or equal to 5 mm.

10. An LED lamp bead, characterized in that: The LED lamp bead includes a substrate, an LED chip arranged on the substrate and an LED package as described in any one of claims 1-9, a packaging adhesive layer is arranged on the LED chip, the LED chip is located in the recessed space, and the packaging adhesive layer is connected to the second adhesive layer.

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