Single-sided PCB fuse

Abstract

The utility model discloses a single-sided PCB (printed circuit board) fuse, which comprises a PCB substrate, an electroplated layer, a tin layer and a single-sided conductive metal layer, the single-face conductive metal layer is arranged on one face of the PCB base material, the tin layer is arranged in the middle of the face, away from the PCB base material, of the single-face conductive metal layer, and the single-face conductive metal layer is electrically connected with the PCB base material and the tin layer; and the electroplated layer is electroplated on one surface, far away from the PCB substrate, of the single-sided conductive metal layer and is positioned on two sides of the tin layer. The utility model relates to the technical field of fuses, and can solve the problems that in the prior art, a miniaturized PCB fuse cannot pass through a hole and be drilled, and a through hole metal coating is difficult.

Description

Technical Field

[0001] The utility model relates to the technical field of fuses, in particular to a single-sided PCB fuse. Background Art

[0002] Please see attached Figure 1 To Attachment Figure 3 The PCB fuse of the prior art includes a PCB substrate 1, a through hole 2, a metal plating layer 3, an electroplating layer 4 and a tin layer 5. Through holes are drilled in the electroplating layer 4 on both sides of the PCB substrate 1 to form a through hole 2, and the metal plating layer 3 is formed through the through hole 2 to electrically connect with the PCB substrate 1 and the tin layer 5. The through hole 2 needs to pass through the inside and outside of the electroplating layer 4, and a notch is formed on both sides of the PCB fuse to facilitate the arrangement of the metal plating layer 3.

[0003] The via drilling process of the PCB fuse in the prior art is difficult, and is only applicable to the PCB fuse with a double-sided structure (i.e., there is an electroplating layer 4 on both sides of the PCB substrate 1). With the miniaturization design of components, the size of the PCB fuse is getting smaller and smaller. For example, the 0402 PCB fuse with a size of 1×0.5mm and the 0201 PCB fuse with a size of 0.5×0.25mm cannot achieve via drilling, and the process of metal plating in the electroplating layer 4 through the through hole 2 is difficult, the quality of the PCB fuse cannot be guaranteed, and the production cost is also high. Therefore, it is necessary to provide a single-sided PCB fuse that can solve the problem that the miniaturized PCB fuse in the prior art cannot be via-drilled and the metal plating of the through hole is difficult. Summary of the invention

[0004] The utility model aims to provide a single-sided PCB fuse, which can solve the problems in the prior art that miniaturized PCB fuses cannot be drilled through holes and that metal plating of through holes is difficult.

[0005] The utility model is achieved in this way:

[0006] A single-sided PCB fuse comprises a PCB substrate, an electroplating layer, a tin layer and a single-sided conductive metal layer; the single-sided conductive metal layer is arranged on one side of the PCB substrate, the tin layer is arranged in the middle of a side of the single-sided conductive metal layer away from the PCB substrate, the single-sided conductive metal layer is electrically connected to the PCB substrate and the tin layer; the electroplating layer is electroplated on a side of the single-sided conductive metal layer away from the PCB substrate and is located on both sides of the tin layer.

[0007] A recessed portion is formed in the middle of a surface away from the PCB substrate on the single-sided conductive metal layer, the tin layer is located in the recessed portion, and the electroplating layers are located on both sides of the recessed portion.

[0008] A solder resist layer is arranged in the recessed portion, and the solder resist layer covers the tin layer.

[0009] The outer edges of the solder resist layer, PCB substrate, electroplating layer and single-sided conductive metal layer at both ends along the short side of the PCB substrate are flush, and the outer edges of the PCB substrate, electroplating layer and single-sided conductive metal layer at both ends along the long side of the PCB substrate are flush.

[0010] The top surface of the electroplating layer is higher than the top surface of the solder resist layer.

[0011] The electroplating layer is a nickel-gold alloy layer.

[0012] The electroplating layer is a nickel-tin alloy layer.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] 1. The utility model is provided with a single-sided conductive metal layer and an electroplating layer, which are only arranged on one side of the PCB substrate, and the electroplating layer is only arranged on one side of the single-sided conductive metal layer away from the PCB substrate, so as to form a single-sided PCB fuse. There is no need to drill through holes on the electroplating layer, which solves the problem that miniaturized PCB fuses cannot be drilled through holes, and also avoids the problem that the metal plating process in the through hole is difficult and the quality cannot be guaranteed. It can reduce the difficulty and cost of the production process on the basis of ensuring the use function of the PCB fuse.

[0015] 2. Since the utility model is provided with a single-sided conductive metal layer and an electroplating layer, the thickness of the single-sided PCB fuse is smaller, which can meet the requirements of miniaturized design. There are no notches on both sides of the PCB fuse, and the appearance is flat and beautiful. It is particularly suitable for small fuses such as 0402PCB fuses with a size of 1×0.5mm and 0201PCB fuses with a size of 0.5×0.25mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a top view of a double-sided PCB fuse in the prior art;

[0017] Figure 2 It is a main cross-sectional view of a double-sided PCB fuse in the prior art.

[0018] Figure 3 It is a bottom view of a double-sided PCB fuse in the prior art;

[0019] Figure 4 It is a top view of the single-sided PCB fuse of the utility model.

[0020] Figure 5 This is a main cross-sectional view of the single-sided PCB fuse of the utility model;

[0021] Figure 6 It is a top view of the single-sided PCB fuse of the utility model.

[0022] In the figure, PCB substrate 1, through hole 2, metal plating layer 3, electroplating layer 4, tin layer 5, single-sided conductive metal layer 6, recessed portion 601, and solder resist layer 602. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.

[0024] Please see attached Figure 4 To Attachment Figure 6 A single-sided PCB fuse comprises a PCB substrate 1, an electroplating layer 4, a tin layer 5 and a single-sided conductive metal layer 6; the single-sided conductive metal layer 6 is arranged on one surface of the PCB substrate 1, the tin layer 5 is arranged in the middle of a surface of the single-sided conductive metal layer 6 away from the PCB substrate 1, and the single-sided conductive metal layer 6 is electrically connected to the PCB substrate 1 and the tin layer 5; the electroplating layer 4 is electroplated on a surface of the single-sided conductive metal layer 6 away from the PCB substrate 1 and is located on both sides of the tin layer 5.

[0025] By providing the single-sided conductive metal layer 6 on one side of the PCB substrate 1, a single-sided PCB fuse is formed, which not only meets the electrical connection requirements between the tin layer 5 and the PCB substrate 1, but also avoids the process of metal plating in the through hole, reducing the process difficulty. Then, the electroplating layer 4 is electroplated on the single-sided conductive metal layer 6, and there is no need to drill a through hole to form a through hole, thereby meeting the miniaturization design requirements of the PCB fuse and further reducing the process difficulty.

[0026] A recessed portion 601 is formed in the middle of a surface of the single-sided conductive metal layer 6 away from the PCB substrate 1 , the tin layer 5 is located in the recessed portion 601 , and the electroplating layer 4 is located on both sides of the recessed portion 601 .

[0027] The recessed portion 601 is provided to facilitate the downward arrangement of the tin layer 5 , which can provide a certain degree of protection for the tin layer 5 .

[0028] A solder resist layer 602 is disposed in the recessed portion 601 , and the solder resist layer 602 covers the tin layer 5 .

[0029] The solder resist layer 602 is used to isolate the circuits to avoid short circuits and interference of electrical signals.

[0030] The outer edges of the solder resist layer 602, PCB substrate 1, electroplating layer 4 and single-sided conductive metal layer 6 at both ends along the short side direction of the PCB substrate 1 are flush, and the outer edges of the PCB substrate 1, electroplating layer 4 and single-sided conductive metal layer 6 at both ends along the long side direction of the PCB substrate 1 are flush.

[0031] The single-sided PCB fuse forms a rectangular structure with a smooth surface as a whole, without notches on both sides, with a beautiful appearance, easy to assemble in the product later, and can also be made into other shapes of single-sided PCB fuses according to actual design requirements. It is easy to make and helps to reduce production costs.

[0032] The top surface of the electroplating layer 4 is higher than the top surface of the solder resist layer 602 , which can provide a certain degree of protection for the solder resist layer 602 and the tin layer 5 . The height of the electroplating layer 4 can be adaptively adjusted according to actual size requirements.

[0033] As a preferred embodiment, the electroplating layer 4 is a nickel-gold alloy layer.

[0034] As a preferred embodiment, the electroplating layer 4 is a nickel-tin alloy layer.

[0035] The material of the electroplating layer 4 can be adaptively selected according to actual use requirements.

[0036] The single-sided PCB fuse of the utility model can have the same function as the double-sided PCB fuse of the prior art, and can be installed and used by adopting the installation method of the prior art.

[0037] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A single-sided PCB fuse, characterized by: Including PCB A substrate (1), an electroplating layer (4), a tin layer (5) and a single-sided conductive metal layer (6); the single-sided conductive metal layer (6) is arranged on one surface of the PCB substrate (1), the tin layer (5) is arranged in the middle of a surface of the single-sided conductive metal layer (6) away from the PCB substrate (1), and the single-sided conductive metal layer (6) is electrically connected to the PCB substrate (1) and the tin layer (5); the electroplating layer (4) is electroplated on a surface of the single-sided conductive metal layer (6) away from the PCB substrate (1) and is located on both sides of the tin layer (5).

2. The single-sided PCB fuse according to claim 1, characterized in that: A recessed portion (601) is formed in the middle of a surface of the single-sided conductive metal layer (6) away from the PCB substrate (1), the tin layer (5) is located in the recessed portion (601), and the electroplated layer (4) is located on both sides of the recessed portion (601).

3. The single-sided PCB fuse according to claim 2, characterized in that: A solder resist layer (602) is provided in the recessed portion (601), and the solder resist layer (602) covers the tin layer (5).

4. The single-sided PCB fuse according to claim 3 is characterized in that: The outer edges of the solder resist layer (602), the PCB substrate (1), the electroplating layer (4) and the single-sided conductive metal layer (6) at both ends along the short side direction of the PCB substrate (1) are flush, and the outer edges of the PCB substrate (1), the electroplating layer (4) and the single-sided conductive metal layer (6) at both ends along the long side direction of the PCB substrate (1) are flush.

5. The single-sided PCB fuse according to claim 4 is characterized in that: The top surface of the electroplating layer (4) is higher than the top surface of the solder resist layer (602).

6. The single-sided PCB fuse according to claim 1, 2, 4 or 5, characterized in that: The electroplating layer (4) is a nickel-gold alloy layer.

7. The single-sided PCB fuse according to claim 1, 2, 4 or 5, characterized in that: The electroplating layer (4) is a nickel-tin alloy layer.

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