Scrapped electronic component destroying device

Abstract

The utility model discloses a scrapped electronic component destroying device which comprises a crushing box, crushing rollers, a sliding rail, a pushing structure, a heating structure and a scraper knife, the top of the crushing box is communicated with a feeding hopper, a partition plate is arranged in the crushing box, and the crushing box is divided into a material guiding chamber and a crushing chamber; the crushing roller pair is arranged in the crushing chamber; the two sliding rails are oppositely arranged in the feeding hopper, and the pushing end of the pushing structure is arranged between the two sliding rails; the heating end of the heating structure is erected above the middle section of the sliding rail; the scraper knife is arranged below the middle section of the sliding rail and connected with the top of the partition plate. According to the utility model, a circuit board is placed on the slide rail, welding spots are melted in the moving process of the circuit board, and components on a substrate are shoveled by the scraper knife, so that the components slide into the material guide chamber and fall into the crushing chamber to be crushed after the circuit board moves to the upper part of the crushing chamber; classified recovery of substrates and components of circuit boards can be realized, and the recovery difficulty is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of waste recycling, in particular to a device for destroying scrapped electronic components. Background Art

[0002] Scrapped electronic components (such as servers, military equipment, and components or circuit boards involving personal information) usually need to be destroyed.

[0003] Destruction is more likely to use physical destruction, that is, the circuit board is put into a crushing roller for coarse crushing, and then the crushed substrate and the components on the substrate are classified and recycled to obtain precious metals (such as gold, silver, copper) and rare metals on the circuit board.

[0004] However, due to the limited crushing accuracy of the crushing roller, some components will be attached to the broken substrate due to soldering, and relevant staff still need to perform secondary separation. In addition, directly crushing the circuit board will cause precious metals and broken materials to mix, increasing the difficulty of recycling. Summary of the invention

[0005] The utility model aims to solve one of the technical problems in the above-mentioned technology at least to a certain extent.

[0006] To achieve the above-mentioned purpose, the first aspect of the utility model proposes a device for destroying scrap electronic components, including a crushing box, a crushing pair of rollers, a slide rail, a pushing structure, a heating structure and a scraper, wherein the top of the crushing box is connected to a feed hopper, the bottom is provided with a discharge port, and a vertical partition is provided in the crushing box to separate the crushing box into a guide chamber and a crushing chamber; the crushing pair of rollers is arranged in the crushing chamber; the two slide rails are relatively arranged in the feed hopper, and the top of the slide rail above the guide chamber is provided with a discharge trough, and the bottom of the slide rail above the crushing chamber is provided with a discharge trough; the back of the circuit board is placed upward between the two discharge troughs; the pushing structure is arranged on the feed hopper, and the pushing end of the pushing structure is arranged between the two slide rails; the heating end of the heating structure is mounted above the middle section of the slide rail; the scraper is arranged below the middle section of the slide rail and connected to the top of the partition, wherein the top of the scraper is inclined toward the direction of the guide chamber.

[0007] In addition, the above-mentioned waste electronic component destruction device according to the utility model may also have the following additional technical features:

[0008] As a further description of the above technical solution: the crushing roller pair includes two crushing roller bodies that are relatively arranged, and each of the crushing roller bodies is externally connected to a driving motor.

[0009] As a further description of the above technical solution: the slide rail is a U-shaped frame, and the opening ends of the two slide rails are arranged opposite to each other, and the two sides of the circuit board move in the opening ends of the two slide rails respectively.

[0010] As a further description of the above technical solution: the pushing structure includes a driving cylinder and a push plate, wherein the driving cylinder is arranged on the feed hopper; the push plate is arranged between the two slide rails and connected to the telescopic end of the driving cylinder.

[0011] As a further description of the above technical solution: sliding blocks are arranged on both sides of the push plate, and the two sliding blocks slide in the two sliding rails respectively.

[0012] As a further description of the above technical solution: the heating structure includes a heating chamber, a connecting pipe and a fan, wherein the heating chamber is mounted on the slide rail through a support column, and a plurality of through holes are opened at the bottom of the heating chamber; the top of the heating chamber is connected to the connecting pipe; the fan is externally arranged and connected to the connecting pipe.

[0013] As a further description of the above technical solution: a valve switch is provided at the connection point between the crushing chamber and the feed hopper, and the valve switch is connected to an external actuator.

[0014] As a further description of the above technical solution: receiving boxes are respectively arranged under the material guiding chamber and the crushing chamber.

[0015] According to the waste electronic component destruction device of the utility model, the circuit board is placed on the slide rail, and during the movement of the circuit board, the solder joints are melted, and the components on the substrate are scraped off by a scraper, so that the components slide into the material guide chamber, and after the circuit board moves to the top of the crushing chamber, it falls into the crushing chamber for crushing, so that the substrate and components of the circuit board can be classified and recycled, reducing the difficulty of recycling.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a schematic structural diagram of a device for destroying scrapped electronic components according to an embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of a structure in which a circuit board is placed on a slide rail according to an embodiment of the utility model;

[0020] Figure 3 It is a structural schematic diagram of a slide rail according to an embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the internal structure of a device for destroying scrapped electronic components according to an embodiment of the utility model;

[0022] Figure 5 It is a schematic diagram of the enlarged structure of a local A according to an embodiment of the utility model;

[0023] As shown in the figure:

[0024] 100, crushing box; 101, feed hopper; 102, partition; 110, material guide chamber; 120, crushing chamber; 200, crushing roller; 300, slide rail; 301, discharge trough; 302, discharge trough; 400, pushing structure; 410, driving cylinder; 420, push plate; 500, heating structure; 510, heating chamber; 520, connecting pipe; 501, support column; 600, scraper; 700, circuit board; 701, solder joint. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0026] The following describes a device for destroying scrapped electronic components according to an embodiment of the utility model in conjunction with the accompanying drawings.

[0027] like Figures 1 to 5 As shown, the scrap electronic component destruction device according to the embodiment of the utility model may include a crushing box 100 , a crushing roller 200 , a slide rail 300 , a pushing structure 400 , a heating structure 500 and a scraper 600 .

[0028] Among them, Figure 4 As shown, the top of the crushing box 100 is connected to a feed hopper 101 , the bottom is provided with a discharge port, and a vertical partition 102 is provided inside the crushing box 100 to separate the crushing box 100 into a material guiding chamber 110 and a crushing chamber 120 .

[0029] The crushing roller pair 200 is disposed in the crushing chamber 120 and is used to crush the circuit board 700 .

[0030] like Figure 2 and Figure 3As shown, two slide rails 300 are relatively arranged in the feed hopper 101, and a discharge trough 301 is opened at the top of the slide rail 300 above the guide chamber 110, and a discharge trough 302 is opened at the bottom of the slide rail 300 above the crushing chamber 120.

[0031] It should be noted that the two slide rails 300 are arranged in parallel at the same height and are erected in the feed hopper 101 along a direction perpendicular to the partition 102 .

[0032] The circuit board 700 is placed with its back facing upward between the two material discharging troughs 301, wherein the side where the pin solder joints 701 of the circuit board 700 are located is defined as the back side, and the side where the components are located is the front side. When the circuit board 700 is placed with its back facing upward between the two material discharging troughs 301, the solder joints 701 are exposed on the circuit board 700.

[0033] The pushing structure 400 is arranged on the feed hopper 101, and the pushing end of the pushing structure 400 is arranged between the two slide rails 300. When the pushing structure 400 is started, the circuit board 700 in the discharge trough 301 can be pushed toward the lower trough 302, and when the circuit board 700 is pushed, the circuit board 700 moves in the two slide rails 300.

[0034] The heating end of the heating structure 500 is mounted above the middle section of the slide rail 300 , and the scraper 600 is arranged below the middle section of the slide rail 300 and connected to the top of the partition 102 , wherein the top of the scraper 600 is inclined toward the material guide chamber 110 .

[0035] Specifically, when relevant staff destroy electronic components such as circuit boards 700 in batches, the batch of scrapped circuit boards 700 can be adapted to the scrapped electronic component destruction device of the present invention because of the same model and size.

[0036] The relevant staff places the circuit board 700 with the back side facing up in the discharge trough 301, and preheats the heating structure 500, and then starts the pushing structure 400, so that the pushing structure 400 can push the circuit board 700 from the placement trough to the lower trough 302. When the circuit board 700 passes through the heating structure 500, the heating end of the heating structure 500 melts the welding on the circuit board 700, so that the electronic components (such as resistors, capacitors, etc.) welded at the solder joint 701 are loosened, and after the front side of the circuit board 700 passes through the scraper 600, the scraper 600 scrapes the electronic components from the circuit board 700, so that the electronic components fall into the material guide chamber 110 and are discharged from the discharge port.

[0037] As the circuit board 700 continues to move, when the circuit board 700 reaches the discharge chute 302 , it falls into the crushing chamber 120 due to its own gravity and is crushed by the crushing roller 200 .

[0038] By removing the electronic devices on the circuit board 700 in advance, it is possible to avoid direct crushing. The electronic devices are connected to the broken substrate due to the solder joints 701, and there is no need for relevant staff to perform secondary separation. The electronic devices will not be crushed during the whole process, which not only reduces the difficulty of subsequent recycling, but also reduces environmental pollution and other problems caused by the crushing of electronic devices.

[0039] In one embodiment of the present invention, the crushing roller pair 200 includes two crushing roller bodies arranged opposite to each other, and each crushing roller body is externally connected to a driving motor.

[0040] It should be noted that the two crushing rollers rotate relative to each other and can crush the circuit board 700 through shearing action.

[0041] In one embodiment of the present invention, the slide rail 300 is a U-shaped frame, and the opening ends of the two slide rails 300 are arranged opposite to each other, and the two sides of the circuit board 700 move in the opening ends of the two slide rails 300 respectively.

[0042] It should be noted that since space is usually required at the edge of the circuit board 700 to facilitate grabbing and fixing during assembly, as well as clamping during welding, when the two sides of the circuit board 700 move in the slide rail 300 respectively, the electronic components on the circuit board 700 will not interfere with the slide rail 300.

[0043] As a possible situation, the two slide rails 300 can be movably arranged on the feed hopper 101 respectively and locked by a damping knob. Specifically, a through groove is opened on the feed hopper 101, and the end of the slide rail 300 slides along the through groove, and after sliding to the appropriate position, it is locked by turning the damping knob. By adjusting the position of the two slide rails 300, more circuit boards 700 of different sizes can be adapted, thereby improving the adaptability of the entire device.

[0044] In one embodiment of the present invention, Figure 2 As shown, the pushing structure 400 includes a driving cylinder 410 and a pushing plate 420 .

[0045] The driving cylinder 410 is disposed on the feed hopper 101 , and the push plate 420 is disposed between the two slide rails 300 and connected to the telescopic end of the driving cylinder 410 .

[0046] In order to further improve the stability during pushing and moving, sliding blocks are provided on both sides of the push plate 420 , and the two sliding blocks slide in the two slide rails 300 respectively.

[0047] It should be noted that when the relevant staff pushes the circuit board 700, by starting the driving cylinder 410, the driving cylinder 410 can push the push plate 420, and the push plate 420 pushes the circuit board 700, so that the circuit board 700 can move in the slide rail 300, and due to the limit stops on both sides of the slide rail 300 and the limit stops in the up and down directions, the circuit board 700 can only move along the slide rail 300.

[0048] In one embodiment of the present invention, Figure 5 As shown, the heating structure 500 includes a heating chamber 510, a connecting pipe 520 and a fan (not shown in the figure).

[0049] The heating chamber 510 is mounted on the slide rail 300 through a support column 501 , and a plurality of through holes are provided at the bottom of the heating chamber 510 . The top of the heating chamber 510 is connected to the connecting pipe 520 , and the fan is externally arranged and connected to the connecting pipe 520 .

[0050] It should be noted that the hot air blower transmits the hot air to the heating chamber 510 through the connecting pipe 520, and discharges it from the through hole to the solder joint 701 on the back of the circuit board 700. Since the solder joint 701 is mainly composed of solder, its melting point is much lower than the heat resistance temperature of the circuit board 700 material, so the heating structure 500 can only melt the solder joint 701. After the solder is melted, the electronic components on the front of the circuit board 700 become loose and can be separated from the circuit board 700 under the pushing action of the scraper 600 and fall into the material guide chamber 110.

[0051] In one embodiment of the present invention, a valve switch is provided at the connection point between the crushing chamber 120 and the feed hopper 101, and the valve switch is connected to an external actuator.

[0052] As a possible situation, the relevant staff can remove and separate the electronic components of the circuit board 700 one by one, and make the circuit board 700 fall into the crushing chamber 120 one by one to be crushed.

[0053] As another possible situation, the relevant staff may first carry out centralized processing of the circuit boards 700, and then control the number of circuit boards 700 entering the pulverizing chamber for pulverization by opening and closing the valve switch.

[0054] In one embodiment of the present invention, receiving boxes are respectively provided under the guide chamber 110 and the crushing chamber 120 to receive the removed electronic components and the crushed substrates, respectively, so as to facilitate subsequent recycling and classification.

[0055] In summary, according to the device for destroying scrapped electronic components of the embodiment of the utility model, the circuit board 700 is placed on the slide rail 300, and during the movement of the circuit board 700, the solder joint 701 is melted, and the components on the circuit board 700 are scraped off by the scraper 600, so that the components slide into the material guide chamber 110, and after the circuit board 700 moves to above the crushing chamber 120, it falls into the crushing chamber 120 for crushing, so that the substrate and components of the circuit board 700 can be classified and recycled, reducing the difficulty of recycling.

[0056] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0058] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A device for destroying scrapped electronic components, characterized in that: include: A crushing box (100), a crushing roller (200), a slide rail (300), a pushing structure (400), a heating structure (500) and a scraper (600), wherein: The top of the crushing box (100) is connected to a feed hopper (101), the bottom is provided with a discharge port, and a vertical partition (102) is arranged inside the crushing box (100) to separate the crushing box (100) into a material guide chamber (110) and a crushing chamber (120); The crushing roller pair (200) is arranged in the crushing chamber (120); The two slide rails (300) are arranged opposite to each other in the feed hopper (101), and a discharge trough (301) is provided at the top of the slide rail (300) above the material guide chamber (110), and a discharge trough (302) is provided at the bottom of the slide rail (300) above the crushing chamber (120); The circuit board (700) is placed between the two material discharging troughs (301) with the back side facing upward; The pushing structure (400) is arranged on the feeding hopper (101), and the pushing end of the pushing structure (400) is arranged between the two slide rails (300); The heating end of the heating structure (500) is mounted above the middle section of the slide rail (300); The scraper (600) is arranged below the middle section of the slide rail (300) and is connected to the top of the partition (102), wherein the top of the scraper (600) is inclined toward the material guide chamber (110).

2. The device for destroying scrapped electronic components according to claim 1, characterized in that: The crushing roller pair (200) comprises two crushing roller bodies which are arranged opposite to each other, and each crushing roller body is externally connected to a driving motor.

3. The device for destroying scrapped electronic components according to claim 1, characterized in that: The slide rail (300) is a U-shaped frame, and the opening ends of the two slide rails (300) are arranged opposite to each other, and the two sides of the circuit board (700) move in the opening ends of the two slide rails (300) respectively.

4. The device for destroying scrapped electronic components according to claim 1, characterized in that: The pushing structure (400) comprises a driving cylinder (410) and a pushing plate (420), wherein: The driving cylinder (410) is arranged on the feeding hopper (101); The push plate (420) is arranged between the two slide rails (300) and is connected to the telescopic end of the driving cylinder (410).

5. The device for destroying scrapped electronic components according to claim 4, characterized in that: Sliding blocks are provided on both sides of the push plate (420), and the two sliding blocks slide in the two slide rails (300) respectively.

6. The device for destroying scrapped electronic components according to claim 1, characterized in that: The heating structure (500) comprises a heating chamber (510), a connecting pipe (520) and a fan, wherein: The heating chamber (510) is mounted on the slide rail (300) via a support column (501), and a plurality of through holes are provided at the bottom of the heating chamber (510); The top of the heating chamber (510) is in communication with the connecting pipe (520); The fan is externally arranged and connected to the connecting pipe (520).

7. The device for destroying scrapped electronic components according to claim 1, characterized in that: A valve switch is provided at the connection point between the crushing chamber (120) and the feed hopper (101), and the valve switch is connected to an external actuator.

8. The device for destroying scrapped electronic components according to claim 1, characterized in that: A receiving box is respectively arranged below the material guiding chamber (110) and the crushing chamber (120).

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