Target device and ion beam deposition system

Abstract

The utility model discloses a target material device and an ion beam deposition system, the target material device is applied to the ion beam deposition system, the ion beam deposition system comprises a process generating device, and a process chamber is formed in the process generating device; the target material device comprises a first carrying table used for installing a target material, and the first carrying table is configured to be capable of being arranged in a process chamber; the protective cover can cover the first carrying table, the protective cover is provided with a sputtering window, and the protective cover is configured to be arranged in the process chamber; the driving mechanism comprises a driving assembly and a driving shaft assembly, the driving shaft assembly comprises an inner shaft and an outer shaft which are connected in a sleeved mode, the driving assembly is connected with the inner shaft and the outer shaft and used for driving the inner shaft and the outer shaft to rotate, the inner shaft is connected with the first carrying table, and the outer shaft is connected with the protective cover. The outer shaft is used for driving the protective cover to be switched between the sputtering station and the protective station. The target material device is not easy to cause pollution of the target material, and is compact in structural design and relatively small in mounting occupied space.

Description

Technical Field

[0001] The utility model relates to the technical field of ion beam deposition, and particularly relates to a target device and an ion beam deposition system. Background Art

[0002] Ion Beam Deposition (IBD) process has been widely applied in the current semiconductor coating field due to its technical advantages such as a wide selection of coating materials and dense film layers.

[0003] Generally speaking, the ion beam deposition process is provided with two ion sources. One is a sputtering ion source for bombarding the target, and the other is an auxiliary ion source for etching the dirt on the surface of the wafer to pre-clean the wafer. When the auxiliary ion source is working, the particles dropped from the wafer surface due to etching may be deposited on the target surface, causing purity pollution of the target, and further affecting the film layer purity on the wafer surface when the sputtering ion source is performing the coating operation normally.

[0004] Therefore, how to provide a solution to overcome or alleviate the above defects is still a technical problem that those skilled in the art need to solve urgently. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a target device and an ion beam deposition system. Among them, the target device is not easy to cause pollution of the target, and has a compact structure design and relatively small installation space occupation.

[0006] To solve the above technical problems, the utility model provides a target device applied to an ion beam deposition system. The ion beam deposition system includes a process generating device, and a process chamber is formed inside the process generating device. The target device includes: a first carrier for installing the target, and the first carrier is configured to be able to be arranged in the process chamber; a protective cover that can cover the first carrier, the protective cover is provided with a sputtering window, and the protective cover is configured to be able to be arranged in the process chamber; a driving mechanism including a driving component and a driving shaft component. The driving shaft component includes an inner shaft and an outer shaft sleeved with each other. The driving component is connected to both the inner shaft and the outer shaft for driving the inner shaft and the outer shaft to rotate. The inner shaft is connected to the first carrier, and the outer shaft is connected to the protective cover. The outer shaft is used to drive the protective cover to switch between a sputtering station and a protection station.

[0007] In specific applications of the above-mentioned target device, if it is necessary to bombard the target with the ion beam of the sputtering ion source, the outer shaft can be driven to rotate by the driving component to switch the protective cover to the sputtering station. At this time, the sputtering products generated by bombarding the target with the ion beam can be deposited on the surface of the workpiece to be processed. If it is not necessary to bombard the target with the ion beam of the sputtering ion source, the outer shaft can be driven to rotate by the driving component to switch the protective cover to the protection station. At this time, the area (solid area) of the protective cover without a sputtering window can protect the target, which can reduce the possibility of the particles falling from the surface of the workpiece to be processed due to etching during the operation of the auxiliary ion source from contaminating the target, that is, it can ensure the purity of the target and the purity of the coating on the surface of the workpiece to be processed. Moreover, through the implementation method of rotating and driving the protective cover for displacement, the situations of vibration and jitter are relatively few, and the stability and reliability during the displacement process are relatively high.

[0008] More importantly, in the embodiment of the present invention, the inner shaft for driving the first stage to rotate and the outer shaft for driving the protective cover to rotate are integrally arranged in a nested shaft manner, which can greatly improve the structural compactness of the drive shaft assembly, reduce the installation occupation space, and facilitate subsequent maintenance.

[0009] Optionally, the driving component is configured to be able to be arranged outside the process chamber, the drive shaft assembly is configured to be able to be hermetically inserted into the chamber wall of the process generating device, and the inner shaft and the outer shaft are rotationally and hermetically arranged.

[0010] Optionally, the drive shaft assembly further includes a housing portion, the housing portion is configured to be able to be hermetically inserted into the chamber wall of the process generating device, the outer shaft penetrates through the housing portion, and the outer shaft and the housing portion are rotationally and hermetically arranged.

[0011] Optionally, a magnetic fluid is provided for sealing between the housing portion and the outer shaft; and / or, a magnetic fluid is provided for sealing between the outer shaft and the inner shaft.

[0012] Optionally, the housing portion includes a cylindrical main body portion and an annular wing plate portion, the wing plate portion is located on the outer wall surface of the main body portion, the wing plate portion is configured to be able to be arranged in the process chamber, and the wing plate portion is further configured to be able to abut against the inner wall surface of the process generating device.

[0013] Optionally, the driving component includes a first driving member and a second driving member, the first driving member is connected to the outer shaft and is used to drive the outer shaft to rotate, and the second driving member is connected to the inner shaft and is used to drive the inner shaft to rotate.

[0014] Optionally, it further includes a rotary joint, which includes a stator part and a rotor part. The rotor part is connected to one end of the inner shaft away from the first carrier. The inner shaft is provided with a first flow channel, the rotor part is provided with a second flow channel, the stator part is provided with a flow channel connecting part, and the first flow channel, the second flow channel and the flow channel connecting part are connected and communicated.

[0015] Optionally, the flow channel connecting part includes a joint channel and a transition channel. The joint channel penetrates the shell wall of the stator part, and the transition channel is an annular channel arranged on the inner wall surface of the stator part. The joint channel and the transition channel are connected and communicated, and the transition channel and the second flow channel are connected and communicated.

[0016] Optionally, the first carrier includes a seat part and a mounting table part. The seat part is connected to the inner shaft, the mounting table part is connected to the seat part, and the mounting table part is configured to be able to mount the target.

[0017] Optionally, the number of the mounting table parts is multiple, and each mounting table part is circumferentially spaced and mounted on the seat part.

[0018] Optionally, the seat part is provided with a third flow channel, the mounting table part is provided with a fourth flow channel, and the third flow channel and the fourth flow channel are connected and communicated.

[0019] Optionally, it further includes a protection component, which is configured to be able to be mounted in the process chamber. When the protective cover rotates to the protection station, the protection component can block the sputtering window.

[0020] The present utility model also provides an ion beam deposition system, which includes a process generating device and a target device, and the target device is the above-mentioned target device.

[0021] Optionally, it further includes a sputtering ion source, which is mounted on the process generating device. When the protective cover is in the sputtering station, the sputtering window is opposite to the sputtering ion source; it also includes a second carrier and an auxiliary ion source. The second carrier and the auxiliary ion source are both mounted on the process generating device. The target device includes a protection component, and the protection component is mounted in the process chamber. In the axial direction of the drive shaft assembly, the protection component is arranged between the auxiliary ion source and the protective cover.

[0022] Optionally, the shell wall of the process generating device is provided with an avoidance structure for avoiding the rotation of the protective cover. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of an implementation manner of the ion beam deposition system provided by the present utility model;

[0024] Figure 2 Structural diagram of the target device and the installation of the target provided by the present utility model;

[0025] Figure 3 is Figure 2 Schematic structural diagram of the drive shaft assembly in

[0026] Figure 4 is Figure 2 Schematic structural diagram of the first drive component in

[0027] Figure 5 is Figure 2 Schematic structural diagram of the second drive component in

[0028] Figure 6 Schematic structural diagram of the rotary joint;

[0029] Figure 7 Schematic structural diagram of an implementation manner of the seat part;

[0030] Figure 8 Schematic structural diagram of another implementation manner of the seat part;

[0031] Figure 9 Schematic structural diagram of yet another implementation manner of the seat part.

[0032] Reference numerals:

[0033] 100 - Target device; 110 - First carrier; 111 - Seat part; 112 - Installation table part; 120 - Protective cover; 121 - Sputtering window; 130 - Drive mechanism; 131 - Drive assembly; 131A - First drive component; 131A1 - First drive motor; 131A2 - First driving wheel; 131A3 - First driven wheel; 131A4 - First transmission belt; 131B - Second drive component; 131B1 - Second drive motor; 131B2 - Second driving wheel; 131B3 - Second driven wheel; 131B4 - Second transmission belt; 132 - Drive shaft assembly; 132A - Inner shaft; 132A1 - First flow channel; 132B - Outer shaft; 132C - Shell part; 132C1 - Main body part; 132C2 - Wing plate part; 140 - Rotary joint; 141 - Stator part; 141A - Flow channel communication part; 142 - Rotor part; 142A - Second flow channel; 150 - Protective component;

[0034] 200 - Process generating device; 200A - Process chamber; 210 - Avoidance structure;

[0035] 300 - Target;

[0036] 400 - Sputtering ion source;

[0037] 500 - Second carrier stage;

[0038] 600 - Auxiliary ion source. Detailed implementation manners

[0039] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] In the description of the embodiments of the present utility model, the terms "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of such features.

[0041] The orientation terms mentioned in the embodiments of the present utility model, such as "inside", "outside", etc., are only with reference to the direction of the accompanying drawings. Therefore, the orientation terms used are for better and clearer illustration and understanding of the embodiments of the present utility model, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the embodiments of the present utility model. In addition, unless otherwise specified in this application, the "plurality" mentioned in this application refers to two or more.

[0042] In the embodiments of the present utility model, "and / or" is merely a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0043] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of an implementation manner of the ion beam deposition system provided by the present utility model.

[0044] As Figure 1 shown, the embodiments of the present utility model provide an ion beam deposition system, including a process generating device 200, a target device 100, a target 300, a sputtering ion source 400, a second carrier stage 500, and an auxiliary ion source 600.

[0045] The process generating device 200 is the main place where the ion beam deposition process occurs. It is usually of a box structure, and the appearance of the box can be, for example, a cuboid, a cylinder, or other structural forms, etc. This is not limited here as long as it can meet the usage requirements. A process chamber 200A is formed inside the process generating device 200.

[0046] The target device 100 is mainly used to support the target 300, and the target 300 can be located in the process chamber 200A. Here, the embodiments of the present invention do not limit the specific type of the target 300. In practical applications, those skilled in the art can select according to specific needs as long as it can meet the usage requirements.

[0047] The second carrier 500 is mainly used to support the component to be processed (not shown in the figure), and the component to be processed can be, for example, a wafer, etc., so that the component to be processed can be located in the process chamber 200A. As for the second carrier 500 itself, it can be integrally arranged in the process chamber 200A, or only partially located in the process chamber 200A, which specifically needs to be determined in combination with the processing requirements of the component to be processed, etc. In addition, the structural form of the second carrier 500 is not limited here either.

[0048] The sputtering ion source 400 and the auxiliary ion source 600 can both be installed in the process generating device 200 to introduce ion beams into the process chamber 200A. The ion beam introduced by the sputtering ion source 400 can be used to bombard the target 300, so that sputtering can occur on the surface of the target 300, and the sputtering products can be deposited on the surface of the component to be processed, thereby enabling coating on the surface of the component to be processed. The auxiliary ion source 600 can face the component to be processed directly, and the ion beam introduced by it can be directly used to bombard and etch the surface of the component to be processed, so as to achieve the purpose of pre-cleaning the surface of the component to be processed.

[0049] However, during the process of the auxiliary ion source etching and cleaning the component to be processed, the particulate matter dropped during etching may be deposited on the surface of the target, which will contaminate the target, affect the purity of the target, and further affect the purity of the coating on the surface of the component to be processed.

[0050] To solve the above problems, the embodiments of the present invention also provide a target device, which can realize the support of the target 300 inside the process chamber 200A. Specifically, please refer to Figures 2 - 9 , Figure 2 is the installation structure diagram of the target device and the target provided by the present invention, Figure 3 is Figure 2 the structural schematic diagram of the drive shaft assembly in Figure 4 is Figure 2 the structural schematic diagram of the first drive component in Figure 5 is Figure 2 the structural schematic diagram of the second drive component in Figure 6 is the structural schematic diagram of the rotary joint, Figure 7 is the structural schematic diagram of one implementation manner of the seat part, Figure 8 is the structural schematic diagram of another implementation manner of the seat part, Figure 9Schematic structural diagram of another implementation of the seat part.

[0051] As Figure 2 and Figure 3 shown, the target device 100 includes a first carrier 110, a protective cover 120, and a driving mechanism 130.

[0052] The first carrier 110 is used to mount the target 300, and the first carrier 110 is configured to be able to be arranged in the process chamber 200A. Here, the embodiments of the present invention do not limit the specific structural form of the first carrier 110. In practical applications, those skilled in the art can select according to specific needs as long as the requirements of use can be met.

[0053] In some alternative implementation manners, the first carrier 110 may include a seat part 111 and a mounting table part 112.

[0054] The seat part 111 and the mounting table part 112 may be a split structure, that is, the seat part 111 and the mounting table part 112 can be processed separately; in this way, the forming difficulty of the seat part 111 and the mounting table part 112 can be reduced, especially applicable to the processing and forming of the seat part 111 and the mounting table part 112 with relatively complex structures in some solutions. After being processed separately, the mounting table part 112 can be installed on the seat part 111, and the target 300 can be installed on the mounting table part 112. The installation process between the mounting table part 112 and the seat part 111, and the installation process between the target 300 and the mounting table part 112 may be the same or different, which is not limited herein. As for the types of installation processes, they can be selected from connection methods such as screw connection, welding, riveting, and snap connection, which are also not limited herein as long as the reliability requirements of installation can be ensured.

[0055] In specific applications, the number of targets 300 can be one or multiple.

[0056] When the number of targets 300 is multiple, the number of mounting table parts 112 can also be multiple, and the mounting table parts 112 can be arranged at intervals, specifically, they can be arranged at intervals around the axis of the driving shaft assembly mentioned later. There can be a one-to-one correspondence between each target 300 and each mounting table part 112.

[0057] For different numbers of the mounting table parts 112, the structural form of the seat part 111 can also be different. For example Figure 7 shown, the seat part 111 can be generally an I-shaped structure. At this time, a No. 1 mounting position and a No. 2 mounting position can be respectively configured at both ends of the seat part 111, and both can be provided with the mounting table part 112 to adapt to the assembly of the two mounting table parts 112. Another example Figure 8As shown, the seat portion 111 can be generally in a herringbone structure. At this time, the three ends of the seat portion 111 can be respectively provided with a No. ① mounting position, a No. ② mounting position, and a No. ③ mounting position, and all of them can be provided with a mounting table portion 112 to adapt to the assembly of the three mounting table portions 112. Another example is Figure 9 As shown, the seat portion 111 can be generally in a cross-shaped structure. At this time, the four ends of the seat portion 111 can be respectively provided with a No. ① mounting position, a No. ② mounting position, a No. ③ mounting position, and a No. ④ mounting position, and all of them can be provided with a mounting table portion 112 to adapt to the assembly of the four mounting table portions 112.

[0058] In some alternative implementation manners, a third flow channel (not shown in the figure) can be provided in the seat portion 111, and a fourth flow channel (not shown in the figure) can be provided in the mounting table portion 112, and the third flow channel and the fourth flow channel can be connected. In specific practice, the third flow channel and the fourth flow channel can be used to introduce a coolant, and the coolant can cool the target 300 mounted on the mounting table portion 112 to ensure the working temperature of the target 300.

[0059] The specific type of the coolant is not limited herein. In actual applications, those skilled in the art can select according to specific needs as long as it can meet the usage requirements. For example, the coolant can be water or the like.

[0060] The protective cover 120 can cover the first carrier 110, and correspondingly, it can also cover the target 300 mounted on the first carrier 110. The protective cover 120 can also be arranged in the process chamber 200A. The protective cover 120 can be provided with a sputtering window 121, and the inside of the protective cover 120 can communicate with the outside through the sputtering window 121.

[0061] The driving mechanism 130 includes a driving component 131 and a driving shaft component 132. The driving shaft component 132 includes an inner shaft 132A and an outer shaft 132B sleeved with each other, and the outer shaft 132B is located radially outside the inner shaft 132A. The driving component 131 is connected to both the inner shaft 132A and the outer shaft 132B for driving the inner shaft 132A and the outer shaft 132B to rotate.

[0062] The inner shaft 132A is connected to the first carrier 110 for driving the first carrier 110 and the target 300 mounted on the first carrier 110 to rotate. For the implementation manner in which only one target 300 is provided on the first carrier 110, the rotation of the inner shaft 132A with respect to the first carrier 110 can be used to adjust the position of the target 300 relative to the sputtering ion source 400. For the implementation manner in which multiple targets 300 are provided on the first carrier 110, the rotation of the inner shaft 132A with respect to the first carrier 110 can also be used to adjust different targets 300 for use to adapt to different coating processes.

[0063] The outer shaft 132B is connected to the protective cover 120, and the outer shaft 132B is used to drive the protective cover 120 to switch between the sputtering station and the protection station. In this way, when it is necessary to bombard the target 300 with the ion beam of the sputtering ion source 400, the driving assembly 131 can be used to drive the outer shaft 132B to rotate, so as to switch the protective cover 120 to the sputtering station. As shown in Figure 1 , at this time, the sputtering window 121 can be arranged opposite to the sputtering ion source 400, and the sputtering products generated by bombarding the target 300 with the ion beam can be deposited on the surface of the workpiece to be processed. When it is not necessary to bombard the target 300 with the ion beam of the sputtering ion source 400, the driving assembly 131 can be used to drive the outer shaft 132B to rotate, so as to switch the protective cover 120 to the protection station. At this time, the area (solid area) of the protective cover 120 where the sputtering window 121 is not provided can protect the target 300, which can reduce the possibility of the particles falling off the surface of the workpiece to be processed due to etching during the operation of the auxiliary ion source 600 from contaminating the target 300, that is, it can ensure the purity of the target 300 and the purity of the coating on the surface of the workpiece to be processed. Moreover, through the implementation method of rotating and driving the protective cover 120 to displace, the situations of vibration and jitter are relatively few, and the stability and reliability during the displacement process are relatively high.

[0064] More importantly, in the embodiment of the present invention, the inner shaft 132A for driving the first stage 110 to rotate and the outer shaft 132B for driving the protective cover 120 to rotate are integrally arranged in a nested shaft manner, which can greatly improve the structural compactness of the drive shaft assembly 132, reduce the installation occupation space, and facilitate subsequent maintenance.

[0065] In some optional implementation manners, the target device 100 provided by the embodiment of the present invention may further include a protection component 150.

[0066] Combined with Figure 1 , the protection component 150 may specifically be plate-shaped and can be configured to be installed in the process chamber 200A. When the protective cover 120 rotates to the protection station, the protection component 150 can block the sputtering window 121, so as to better protect the target 300 inside the protective cover 120.

[0067] Here, the embodiment of the present invention does not limit the installation position of the protection component 150 in the process chamber 200A. In practical applications, those skilled in the art can select according to specific needs as long as the requirements of use can be met. For example, please refer to Figure 1, in the vertical direction (i.e., the axial direction of the drive shaft assembly 132), the protective member 150 can be disposed between the auxiliary ion source 600 and the protective cover 120; when the protective cover 120 is at the sputtering station (i.e., Figure 1 the position shown in), the protective member 150 does not block the path between the workpiece to be processed and the sputtering window 121; while when the protective cover 120 is at the protection station, for example Figure 1 the position after the protective cover 120 in rotates 180 degrees, the protective member 150 can block the sputtering window 121.

[0068] In addition, the embodiment of the present utility model does not limit the specific position of the protection station of the protective cover 120 either. In actual applications, those skilled in the art can select according to specific needs as long as the usage requirements can be met. Referring to Figure 1 the orientation and positional relationship in, the protection station can be Figure 1 the position after the protective cover 120 in rotates 180 degrees, or, it can also be Figure 1 the position after the protective cover 120 in rotates 90 degrees or other angular values.

[0069] In some alternative implementation manners, as Figure 1 shown, the drive assembly 131 is configured to be able to be disposed outside the process chamber 200A, and the drive shaft assembly 132 is configured to be able to be hermetically inserted into the chamber wall of the process generating device 200.

[0070] In this way, the drive assembly 131 does not occupy the internal space of the process chamber 200A, can reduce the complexity of the internal structure of the process chamber 200A, and is beneficial to the assembly of the components inside the process chamber 200A and subsequent maintenance. At the same time, it is also beneficial to reduce the volume of the process chamber 200A, which is extremely beneficial to the control of the process parameters inside the process chamber 200A during the specific operation process. And, since the drive assembly 131 is located outside the process chamber 200A, it is also convenient for the installation and maintenance of the drive assembly 131.

[0071] In addition, it should be known that there are usually certain process requirements inside the process chamber 200A, such as vacuum degree requirements, atmosphere requirements, etc. Due to the existence of these process requirements, if the drive assembly is directly disposed inside the process chamber 200A, special drive assemblies often need to be used, and the cost of the drive assembly will be relatively high. However, by adopting the above implementation manner, the influence of the internal process requirements of the process chamber 200A on the selection of the drive assembly 131 can be avoided, so that relatively ordinary drive assemblies 131 can also be used, and the usage cost of the drive assembly 131 can be greatly reduced.

[0072] Considering that the drive shaft assembly 132 needs to pass through the cavity wall of the process generating device 200, therefore, a sealing structure needs to be provided between the inner shaft 132A and the outer shaft 132B to achieve rotational sealing between the inner shaft 132A and the outer shaft 132B, so as to reduce the possibility of leakage in the process chamber 200A. Here, the embodiments of the present utility model do not limit the specific type of the sealing structure between the inner shaft 132A and the outer shaft 132B. In practical applications, those skilled in the art can select according to specific needs as long as the requirements of use can be met. For example, magnetic fluid can be filled between the inner shaft 132A and the outer shaft 132B to achieve rotational sealing between the inner shaft 132A and the outer shaft 132B through the magnetic fluid. For another example, the sealing structure can include a slip ring and a sealing ring. The slip ring can be specifically prepared from polytetrafluoroethylene, etc., and in this way, rotational sealing can also be achieved.

[0073] Combined with Figure 3 , the drive shaft assembly 132 may further include a housing portion 132C. The housing portion 132C can generally be presented in a cylindrical shape, and the housing portion 132C can be configured to be hermetically inserted into the cavity wall of the process generating device 200. The outer shaft 132B can pass through the housing portion 132C, and the outer shaft 132B and the housing portion 132C can also be rotationally sealed. The specific rotational sealing method can refer to the above description and will not be repeated here.

[0074] The housing portion 132C does not need to rotate. Therefore, a static sealing member in the form of a sealing ring or the like can be used for sealing between it and the cavity wall of the process generating device 200, and the sealing design can be relatively simple. Of course, in some other implementation manners of the embodiments of the present utility model, the drive shaft assembly 132 may also only include the aforementioned inner shaft 132A and outer shaft 132B, that is, the above-mentioned housing portion 132C may not be included. At this time, the outer shaft 132B and the cavity wall can be rotationally sealed. The specific rotational sealing method can refer to the above description and will not be repeated here.

[0075] Still taking the implementation manner configured with the housing portion 132C as an example for description. As Figure 3 shown, the housing portion 132C can include a cylindrical main body portion 132C1 and an annular wing plate portion 132C2. The outer shaft 132B can be hermetically inserted into the main body portion 132C1. The wing plate portion 132C2 can be located on the outer wall surface of the main body portion 132C1. During specific assembly, the wing plate portion 132C2 can be configured to be disposed in the process chamber 200A, and the wing plate portion 132C2 can also be configured to be abutted against the inner wall surface of the process generating device 200 to be used for defining the axial installation position of the housing portion 132C relative to the process chamber 200A, which is beneficial to improving the installation reliability of the housing portion 132C. The installation method between the housing portion 132C and the cavity wall includes but is not limited to screw connection, welding, clamping, riveting, etc., and is not limited here.

[0076] In addition, for the implementation mode of arranging the driving component 131 outside the process chamber 200A, in the embodiment of the present invention, the scheme of integrally arranging the inner shaft 132A and the outer shaft 132B can also reduce the number of openings on the process generating device 200, and thus can reduce the potential sealing leakage points on the process generating device 200, which is more conducive to ensuring the reliability of the seal.

[0077] It should be understood that the above implementation mode of arranging the driving component 131 outside the process chamber 200A is only a preferred scheme of the embodiment of the present invention, but it cannot be used as a limitation on the implementation scope of the target device 100 provided by the present invention; in fact, the above driving component 131 can also be arranged inside the process chamber 200A, which will not affect the function realization of the target device 100 provided by the embodiment of the present invention.

[0078] Please continue to refer to Figure 3 , a first flow channel 132A1 can also be arranged inside the inner shaft 132A, and the first flow channel 132A1 can be communicated with the third flow channel in the aforementioned seat portion 111. The number of the first flow channels 132A1 can be two, one of which can be used as the first liquid inlet flow channel, and the other can be used as the first liquid outlet flow channel to realize the circulation of the cooling liquid.

[0079] In some optional implementation modes, the driving component 131 can include a first driving part 131A and a second driving part 131B. The first driving part 131A can be connected to the outer shaft 132B to drive the outer shaft 132B to rotate. The second driving part 131B can be connected to the inner shaft 132A to drive the inner shaft 132A to rotate. In this way, the separate rotation of the inner shaft 132A and the outer shaft 132B can be conveniently realized.

[0080] As Figure 4 shown, the first driving part 131A can include a first driving motor 131A1. The rotating shaft of the first driving motor 131A1 can be connected with a first driving wheel 131A2, the outer shaft 132B can be connected with a first driven wheel 131A3, and a first transmission belt 131A4 can be wound between the first driving wheel 131A2 and the first driven wheel 131A3. Through the first transmission belt 131A4, the power transmission between the first driving wheel 131A2 and the first driven wheel 131A3 can be realized, and the distance between the first driving motor 131A1 and the outer shaft 132B can be conveniently adjusted.

[0081] In addition to the above connection mode, the first driving motor 131A1 and the outer shaft 132B can also be connected by means of sprocket connection, gear connection, coupling connection, etc., which is not limited herein as long as the power transmission between the two can be realized.

[0082] As Figure 5 shown, the second driving component 131B may include a second driving motor 131B1. A rotating shaft of the second driving motor 131B1 may be connected with a second driving wheel 131B2, an inner shaft 132A may be connected with a second driven wheel 131B3, and a second transmission belt 131B4 may be wound between the second driving wheel 131B2 and the second driven wheel 131B3. Through the second transmission belt 131B4, power transmission between the second driving wheel 131B2 and the second driven wheel 131B3 may be achieved, and the distance between the second driving motor 131B1 and the inner shaft 132A may be conveniently adjusted.

[0083] In addition to the above connection method, the second driving motor 131B1 and the inner shaft 132A may also be connected by means of a sprocket connection, a gear connection, a coupling connection, etc., which is not limited herein as long as power transmission between the two can be achieved.

[0084] It should be understood that in some other implementation manners of the embodiments of the present invention, the driving assembly 131 may also include only one driving component. At this time, two clutches may be configured, and the driving component may be connected to the inner shaft 132A and the outer shaft 132B respectively through the two clutches. In this way, by adjusting the engaging and disengaging states of the two clutches, the inner shaft 132A or the outer shaft 132B may be driven respectively by one driving component.

[0085] In some optional implementation manners, the target device 100 provided by the embodiments of the present invention may further include a rotary joint 140.

[0086] As Figure 6 shown, the rotary joint 140 may include a stator part 141 and a rotor part 142. The rotor part 142 may be connected to an end of the inner shaft 132A far from the first carrier 110. In this way, the rotor part 142 may rotate synchronously with the inner shaft 132A. The rotor part 142 may be provided with a second flow channel 142A, and the second flow channel 142A may be communicated with the first flow channel 132A1 in the aforementioned inner shaft 132A. Consistent with the first flow channel 132A1, the number of the second flow channels 142A may also be two, one of which may be used as a second liquid inlet channel and the other may be used as a second liquid outlet channel to realize the circulation of the coolant.

[0087] The stator part 141 may be fixedly arranged. The stator part 141 may be provided with a flow channel connection part 141A. The flow channel connection part 141A may be connected to an external liquid inlet and outlet pipe and the aforementioned second flow channel 142A for introducing or leading out the coolant.

[0088] The flow channel connecting part 141A may include a connector channel and a transition channel. The connector channel is a through-hole structure penetrating the shell wall of the stator part 141. The transition channel is an annular channel provided on the inner wall surface of the stator part 141. The connector channel is used to connect with the external liquid inlet and outlet pipes, and the connector channel can communicate with the transition channel, while the transition channel can communicate with the second flow channel 142A. In this implementation manner, since the transition channel is an annular channel, no matter what position the rotor part 142 rotates to, the second flow channel 142A in the rotor part 142 can communicate with the transition channel, which can effectively ensure the communication state between the flow channel connecting part 141A and the second flow channel 142A.

[0089] In some alternative implementation manners, an avoidance structure 210 may be provided on the shell wall of the process generating device 200. As Figure 1 shown, the above-mentioned avoidance structure 210 may be a locally protruding structure of the shell wall of the process generating device 200, and this locally protruding structure is equivalent to an expansion of the internal space of the process chamber 200A, and is used to avoid the rotation of the protective cover 120.

[0090] It should be understood that this avoidance structure 210 is not an essential structural member. If the process chamber 200A of the process generating device 200 is large enough, that is, the protective cover 120 will not interfere with the inner wall surface of the process chamber 200A, then the above-mentioned avoidance structure 210 may not be provided.

[0091] The above are only the preferred implementation manners of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A target device, applied to an ion beam deposition system, wherein the ion beam deposition system comprises a process generating device, wherein a process chamber is formed inside the process generating device, wherein: The target device comprises: A first carrier, the first carrier is used to mount a target material, and the first carrier is configured to be disposed in the process chamber; A protective cover, the protective cover can be covered on the first stage, the protective cover is provided with a sputtering window, and the protective cover is configured to be disposed in the process chamber; The driving mechanism includes a driving assembly and a driving shaft assembly, wherein the driving shaft assembly includes an inner shaft and an outer shaft which are socketed with each other, and the driving assembly is connected to the inner shaft and the outer shaft and is used to drive the inner shaft and the outer shaft to rotate, the inner shaft is connected to the first carrier, and the outer shaft is connected to the protective cover, and the outer shaft is used to drive the protective cover to switch between the sputtering station and the protection station.

2. The target device according to claim 1, characterized in that: The driving assembly is configured to be arranged outside the process chamber, the driving shaft assembly is configured to be sealably inserted into the cavity wall of the process generating device, and the inner shaft and the outer shaft are arranged to rotate in a seal.

3. The target device according to claim 2, characterized in that: The drive shaft assembly also includes a shell portion, which is configured to be sealably inserted into the cavity wall of the process generating device, the outer shaft is inserted into the shell portion, and the outer shaft and the shell portion are rotatably sealed.

4. The target device according to claim 3, characterized in that: A magnetic fluid is provided between the shell and the outer shaft for sealing; and / or a magnetic fluid is provided between the outer shaft and the inner shaft for sealing.

5. The target device according to claim 3, characterized in that: The shell portion includes a cylindrical main body portion and an annular wing portion, wherein the wing portion is located on the outer wall surface of the main body portion, the wing portion is configured to be disposed in the process chamber, and the wing portion is also configured to be able to abut against the inner wall surface of the process generating device.

6. The target device according to claim 1, characterized in that: The driving assembly includes a first driving component and a second driving component. The first driving component is connected to the outer shaft and is used to drive the outer shaft to rotate. The second driving component is connected to the inner shaft and is used to drive the inner shaft to rotate.

7. The target device according to any one of claims 1 to 6, characterized in that: It also includes a rotating joint, which includes a stator part and a rotor part, the rotor part is connected to the end of the inner shaft away from the first carrier, the inner shaft is provided with a first flow channel, the rotor part is provided with a second flow channel, and the stator part is provided with a flow channel connecting part, and the first flow channel, the second flow channel and the flow channel connecting part are connected.

8. The target device according to claim 7, characterized in that: The flow channel connecting portion includes a joint channel and a transition channel, the joint channel passes through the shell wall of the stator part, the transition channel is an annular channel arranged on the inner wall surface of the stator part, the joint channel is connected to the transition channel, and the transition channel is connected to the second flow channel.

9. The target device according to any one of claims 1 to 6, characterized in that: The first carrier includes a seat portion and a mounting platform portion, the seat portion is connected to the inner shaft, the mounting platform portion is connected to the seat portion, and the mounting platform portion is configured to be able to mount the target material.

10. The target device according to claim 9, characterized in that: The number of the mounting platform parts is plural, and the mounting platform parts are mounted on the seat part at intervals along the circumferential direction.

11. The target device according to claim 9, characterized in that: The seat portion is provided with a third flow channel, the mounting platform portion is provided with a fourth flow channel, and the third flow channel is communicated with the fourth flow channel.

12. The target device according to any one of claims 1 to 6, characterized in that: It also includes a protection component, which is configured to be installed in the process chamber. When the protection cover rotates to the protection station, the protection component can shield the sputtering window.

13. An ion beam deposition system, characterized in that: It comprises a process generating device and a target material device, and the target material device is the target material device according to any one of claims 1-12.

14. The ion beam deposition system according to claim 13, characterized in that: It also includes a sputtering ion source, which is installed on the process generating device, and when the protective cover is in the sputtering station, the sputtering window and the sputtering ion source are opposite to each other; It also includes a second carrier and an auxiliary ion source, both of which are installed on the process generating device. The target device includes a protective component, which is installed in the process chamber. In the axial direction of the drive shaft assembly, the protective component is arranged between the auxiliary ion source and the protective cover.

15. The ion beam deposition system according to claim 13, characterized in that: The shell wall of the process generating device is provided with an avoidance structure, and the avoidance structure is used to avoid the rotation of the protective cover.

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