Polishing equipment

Abstract

The utility model discloses polishing equipment which comprises a polishing wheel, a magnet, a first driving device and a second driving device. The radial side face of the polishing wheel is a polishing face, the magnetic field generating device comprises a plurality of magnets, the magnets are distributed in the first direction, the first direction is parallel to the axial direction of the polishing wheel, and the magnetic field generating device is arranged in the polishing wheel and used for generating a magnetic field on the polishing face so that the magnetic composite fluid can be attracted to the polishing face. The first driving device is connected with the polishing wheel; the second driving device is connected to the magnet; and the first driving device and the second driving device can enable the polishing wheel and the magnet to rotate at different rotating speeds. The magnetic field generating device can generate a dynamic magnetic field on the polishing surface, so that the magnetic composite fluid on the polishing surface is more uniform, the magnetic composite fluid of each flexible grinding head is more uniform, the polishing effect is improved, meanwhile, the abrasion speed of each flexible grinding head can be reduced, the liquid supplementing frequency is reduced, and the polishing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing, and particularly relates to a polishing device. Background Art

[0002] With the development of modern optical technology applications, higher requirements are also placed on the quality of optical components. Not only are better surface quality and higher surface shape accuracy required for optical components, but also as little subsurface damage as possible. Currently, there are various polishing methods such as chemical mechanical polishing, laser polishing, jet polishing, ion beam polishing, etc. These polishing methods cannot simultaneously take into account polishing accuracy and polishing efficiency, or are not easy to control the polishing removal rate and have high requirements for the accuracy of the machine tool.

[0003] Magnetic compound fluid polishing technology (Magnetic Compound Fluid, MCF) is a technology that uses magnetic compound fluid to form a flexible polishing tool under a magnetic field for polishing. Magnetic compound fluid is a special fluid containing nano-scale iron oxide particles and micro-scale iron powder particles. During polishing, the magnetic field generated by the magnetic poles causes the magnetic compound fluid to change from a Newtonian fluid to a Bingham fluid with a higher viscosity, forming a "flexible grinding head" with a certain shape. During the movement of the workpiece, material removal from the workpiece surface is achieved through hydrodynamic shear.

[0004] In the related art, the magnet used to generate the magnetic field is fixedly connected to the polishing wheel. Therefore, during the polishing process, the "flexible grinding head" moves synchronously with the polishing wheel. After multiple grindings, the grinding head is easily worn, resulting in the need for frequent liquid replenishment, and thus the polishing efficiency is low. Summary of the Utility Model

[0005] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a polishing device that can extend the life of the grinding head, reduce the frequency of liquid replenishment, and thus improve the polishing efficiency.

[0006] The polishing device according to the first aspect embodiment of the utility model includes a polishing wheel, a magnetic field generating device, a first driving device, and a second driving device.

[0007] The polishing wheel has a receiving cavity, and the radial side surface of the polishing wheel is a polishing surface; the magnetic field generating device includes a plurality of magnets, and the plurality of magnets are distributed around a first direction, the first direction being parallel to the axial direction of the polishing wheel, and the magnetic field generating device is disposed in the receiving cavity for generating a magnetic field on the polishing surface to adsorb the magnetic composite fluid to the polishing surface; the first driving device is connected to the polishing wheel for driving the polishing wheel to rotate; the second driving device is connected to the magnet for driving the magnetic field generating device to rotate around the first direction; wherein, the first driving device and the second driving device can make the polishing wheel and the magnetic field generating device rotate at different speeds.

[0008] The polishing equipment according to the embodiment of the present invention has at least the following beneficial effects:

[0009] The magnetic field generating device is disposed in the receiving cavity of the polishing wheel. The magnetic field generating device includes a plurality of magnets evenly distributed around a first direction, and the first direction is parallel to the circumferential direction of the polishing wheel. Therefore, the magnetic field generating device can form a plurality of magnetic field dense regions on the polishing surface. Therefore, when an appropriate amount of magnetic composite fluid is applied to the polishing wheel, a plurality of magnetic clusters will be formed on the polishing line surface, that is, a plurality of raised flexible grinding heads will be formed on the polishing surface. When the rotation speed of the magnetic field generating device is different from that of the polishing wheel, the magnetic field generating device will generate a dynamic magnetic field on the polishing surface, which can not only make the magnetic composite fluid on the polishing surface more uniform, but also make the magnetic composite fluid of each flexible grinding head more uniform, so as to improve the polishing effect. At the same time, it can reduce the wear speed of each flexible grinding head, thereby reducing the frequency of liquid replenishment and improving the polishing efficiency.

[0010] According to some embodiments of the present invention, the polishing wheel rotates about its own axis, and the first direction coincides with the axial direction of the polishing wheel.

[0011] According to some embodiments of the present invention, the polishing equipment further includes a mounting frame, a first connecting shaft and a second connecting shaft. The mounting frame includes a first mounting portion and a second mounting portion arranged opposite to each other;

[0012] The polishing wheel has a first end surface and a second end surface along its own axial direction. One end of the first connecting shaft is rotatably connected to the first mounting portion and connected to the first driving device, and the other end is connected to the first end surface. The receiving cavity extends to the second end surface and forms an opening at the second end surface. One end of the second connecting shaft is rotatably connected to the second mounting portion and connected to the second driving device, and the other end extends into the receiving cavity from the opening and is connected to the magnetic field generating device.

[0013] According to some embodiments of the present invention, the second connecting shaft includes a rotating portion;

[0014] The radial side surface of the rotating part is in sliding contact with the polishing wheel; or,

[0015] The polishing device further includes a rotating member, which is connected to the rotating part and the polishing wheel and is used to rotatably connect the rotating part and the polishing wheel.

[0016] According to some embodiments of the present invention, the second connecting shaft includes at least two rotating parts distributed along its own axis.

[0017] According to some embodiments of the present invention, along the circumferential direction of the second connecting shaft, the magnetic poles of adjacent magnets are arranged in opposite directions.

[0018] According to some embodiments of the present invention, the magnetic field generating device further includes a mounting member, which has a plurality of mounting grooves distributed around the first direction. The size and shape of the mounting grooves are adapted to the magnets, and each magnet is separately arranged in the mounting groove.

[0019] According to some embodiments of the present invention, a sealing connection is provided between the edge of the opening and the second connecting shaft.

[0020] According to some embodiments of the present invention, the polishing device further includes a shielding member, which has a first mounting hole. The shielding member is connected to the polishing wheel and covers the opening, and the second connecting shaft passes through the first mounting hole.

[0021] According to some embodiments of the present invention, the polishing surface is a spherical surface.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0023] The following further describes the present invention with reference to the drawings and embodiments, where:

[0024] Figure 1 is a schematic structural diagram of the polishing device according to the first aspect embodiment of the present invention;

[0025] Figure 2 is Figure 1 a cross-sectional view;

[0026] Figure 3 is Figure 2 a schematic structural diagram of the polishing wheel, the magnetic field generating device, the first connecting shaft and the second connecting shaft in

[0027] Figure 4 is Figure 2 a schematic structural diagram of the magnetic field generating device and the polishing wheel in

[0028] Figure 5 Experimental result diagrams when the dynamic magnetic field and the static magnetic field are idling;

[0029] Figure 6 Experimental structural diagrams of polishing workpieces with a dynamic magnetic field and a static magnetic field;

[0030] Figure 7 Another structural schematic diagram of the magnetic field generating device and the polishing wheel according to the first aspect embodiment of the present utility model;

[0031] Figure 8 For Figure 2 The exploded view of the magnetic field generating device in

[0032] Reference numerals:

[0033] Magnetic composite fluid 1000;

[0034] Polishing wheel 100, accommodation cavity 110, polishing surface 120, first end face 130, second end face 140, opening 150, rotation hole 160;

[0035] Magnetic field generating device 200, magnet 210, mounting member 220, mounting groove 221;

[0036] First driving device 300, second driving device 400;

[0037] Mounting frame 500, first mounting portion 510, second mounting portion 520, third mounting portion 530, mounting cavity 531;

[0038] First connecting shaft 600, first shaft shoulder 610;

[0039] Second connecting shaft 700, rotating portion 710, second shaft shoulder 720;

[0040] Rotating member 800, first bearing 801, second bearing 802;

[0041] Blocking member 900, mounting hole 910. Detailed implementation manners

[0042] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0043] In the description of the present utility model, it should be understood that when it comes to orientation descriptions, such as the orientations or positional relationships indicated by up, down, front, back, left, right, etc., they are based on the orientations or positional relationships shown in the drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0044] In the description of the present utility model, the meaning of "several" is more than one, the meaning of "multiple" is more than two. Understandings such as "greater than", "less than", "exceeding", etc. do not include the present number, and understandings such as "above", "below", "within", etc. include the present number. If there is a description of "first", "second", etc., it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0045] In the description of the present utility model, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0046] In the description of the present utility model, the descriptions with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0047] With the development of the application of modern optical technology, higher requirements are also placed on the quality of optical elements. It is not only required that optical elements have better surface quality and higher surface form accuracy, but also that there be as little subsurface damage as possible. Currently, there are various polishing methods such as chemical mechanical polishing, laser polishing, jet polishing, ion beam polishing, etc. These polishing methods cannot simultaneously take into account polishing accuracy and polishing efficiency, or are not easy to control the polishing removal rate and have high requirements for machine tool accuracy.

[0048] Magnetic Compound Fluid (MCF) polishing technology is a technique that utilizes magnetic compound fluid to form a flexible polishing tool under a magnetic field for polishing. Magnetic compound fluid is a special fluid containing nanoscale iron oxide (Fe₃O₄) particles and micron-scale iron powder particles. During polishing, the magnetic field generated by the magnetic poles causes the magnetic compound fluid to change from a Newtonian fluid to a Bingham fluid with a higher viscosity, forming a "flexible grinding head" with a certain shape. During the movement of the workpiece, material removal from the workpiece surface is achieved through hydrodynamic shear.

[0049] In related technologies, the magnet used to generate the magnetic field is fixedly connected to the polishing wheel. Therefore, during the polishing process, the "flexible grinding head" moves synchronously with the polishing wheel. After multiple grindings, the grinding head is prone to wear, resulting in a relatively low service life of the polishing equipment.

[0050] Based on the above problems, the present utility model proposes a polishing device that can reduce the wear rate of the flexible grinding head, thereby reducing the replenishment frequency and further improving the polishing efficiency. Refer to Figures 1 to 6 , Figure 1 is a schematic structural diagram of the polishing device according to the first aspect embodiment of the present utility model, Figure 2 is Figure 1 a cross-sectional view of Figure 3 is Figure 2 a schematic structural diagram of the polishing wheel, magnetic field generating device, first connecting shaft, and second connecting shaft in Figure 4 is Figure 2 a schematic structural diagram of the magnetic field generating device and the polishing wheel in Figure 5 is an experimental result diagram of the dynamic magnetic field and static magnetic field during idling, Figure 6 is an experimental structural diagram of the dynamic magnetic field and static magnetic field for polishing the workpiece; the polishing device of this embodiment includes a polishing wheel 100, a magnetic field generating device 200, a first driving device 300, and a second driving device 400.

[0051] Specifically, the polishing wheel 100 has an accommodation cavity 110, and the radial side surface of the polishing wheel 100 is a polishing surface 120 (as shown in Figure 3 ), and the magnetic field generating device 200 includes a plurality of magnets 210 (as shown in Figure 4As shown in the figure, the magnet 210 is, for example, an electromagnet or a permanent magnet 210. A plurality of magnets 210 are distributed around a first direction, and the first direction is parallel to the axial direction of the polishing wheel 100. The magnetic field generating device 200 is disposed in the accommodating cavity 110 and is used to generate a magnetic field on the polishing surface 120 to adsorb the magnetic composite fluid to the polishing surface 120 (not limited to the magnetic composite fluid, and can also be any magnetic fluid such as magnetorheological fluid, as long as it can be adsorbed on the polishing surface 120 to form a flexible grinding head). Specifically, the magnetic field generating device 200 includes a plurality of magnets 210 evenly distributed around the first direction, and the first direction is parallel to the circumferential direction of the polishing wheel 100. Therefore, the magnetic field generating device 200 can form a plurality of magnetic field intensive regions on the polishing surface 120. When an appropriate amount of magnetic composite fluid 1000 is applied to the polishing wheel 100, a plurality of magnetic clusters will be formed on the polishing surface 120, that is, a plurality of raised flexible grinding heads will be formed on the polishing surface 120. The first driving device 300 includes, for example, a motor, and the motor is connected to the polishing wheel 100 through a coupling, a gear or a belt, etc., and is used to drive the polishing wheel 100 to rotate. The second driving device 400 includes, for example, a motor, and the motor is connected to the magnet 210 through a coupling, a gear or a belt, and is used to drive the magnet 210 to rotate. Among them, the first driving device 300 and the second driving device 400 can rotate the polishing wheel 100 and the magnet 210 at different speeds, so that the magnetic field generating device 200 generates a dynamic magnetic field on the polishing surface 120, which can not only make the magnetic composite fluid 1000 on the polishing surface 120 more uniform, but also make the magnetic composite fluid 1000 of each flexible grinding head more uniform, so as to improve the polishing effect. At the same time, it can reduce the wear speed of each flexible grinding head, thereby reducing the frequency of liquid replenishment and improving the polishing efficiency.

[0052] It should be noted that in this embodiment, the shapes of the magnets 210 are not limited. The magnets 210 can be, for example, any shape such as a rectangle, a triangle or a sector. The magnetization directions of the magnets 210 are also not limited. For example, the magnetization directions of adjacent magnets 210 are the same or opposite. The magnetization direction of the magnet 210 can be perpendicular to the first direction or along the first direction, as long as a dynamic magnetic field can be realized on the polishing surface 120 through the cooperation of the first driving device 300 and the second driving device 400. In addition, the polishing wheel 100 and the magnet 210 rotate at different speeds, which is not limited to different rotation directions, and can also be different sizes. For example, the polishing wheel 100 and the magnetic field generating device 200 rotate in opposite directions, or rotate in the same direction at different speeds.

[0053] Exemplarily, with the rotation speed of the polishing wheel 100 being 200 rpm and the rotation speeds of the magnets 210 being set to 200 rpm and 400 rpm respectively, experiments are carried out. Specifically, the magnetic composite fluid 1000 is injected into the polishing surface 120 of the polishing wheel 100, and a relatively large amount of magnetic composite fluid 1000 is left at one position to form a magnetic composite fluid 1000 aggregation area (such asFigure 5 (the dashed part in the figure), the polishing wheel 100 and the magnet 210 are driven to rotate at the same speed by the first driving device 300 and the second driving device 400 to form a static magnetic field on the polishing surface 120. The experimental results are as follows Figure 5 shown in a. From Figure 5 a, it can be seen that at 1.44 s and 5 s, the magnetic composite fluid 1000 still concentrates in place and does not spread to the surroundings, resulting in uneven distribution of magnetic clusters around the polishing wheel 100.

[0054] The polishing wheel 100 and the magnetic field generating device 200 are rotated at different speeds to form a dynamic magnetic field on the polishing surface 120. The experimental results are as follows Figure 5 shown in b. Under the dynamic magnetic field, the height of the magnetic clusters of the magnetic composite fluid 1000 decreases. At t = 1.44 s, the magnetic composite fluid 1000 is evenly distributed around the polishing surface 120 and remains stable at 5 s. From the above experimental results, it can be seen that the dynamic magnetic field has a significant stirring effect on the magnetic composite fluid 1000, making the magnetic composite fluid 1000 on the polishing surface 120 more uniform.

[0055] Furthermore, the workpiece is polished using the static magnetic field and the dynamic magnetic field respectively. The experimental results are as follows Figure 6 shown. From Figure 6 a, it can be seen that under the static magnetic field, a flexible grinding head is formed on the polishing surface 120 at t = 0 s, and the polishing wheel 100 presses down to polish the workpiece. The flexible grinding head is squeezed. At t = 10 s, the flexible grinding head is flattened (worn) around the polishing wheel 100, and the height of the flexible grinding head does not recover significantly with time. From Figure 6 a, it can be seen that under the dynamic magnetic field, when the magnetic composite fluid 1000 contacts the workpiece at t = 0 s, after rotating for 10 s, the height of the flexible grinding head basically remains unchanged. From the above, it can be seen that under the dynamic magnetic field, the flexible grinding head has better recovery ability.

[0056] In some embodiments, the polishing wheel 100 rotates about its own axis, and the first direction coincides with the axial direction of the polishing wheel 100. Therefore, during operation, regardless of the position of the magnet 210 relative to the polishing wheel 100, the distance between the magnetic pole of the magnet 210 and the polishing surface 120 is the same. For example, the magnet 210 is disposed in the accommodating cavity 110, with the north pole facing the polishing surface 120, and the distance between the north pole and the side surface is L. Since the polishing wheel 100 is a circular structure and the magnet 210 rotates about the axis of the polishing wheel 100, regardless of the position to which the magnet 210 rotates, the distance between the north pole and the side surface corresponding to that position is L. This ensures that the magnetic field strength formed by the magnet 210 on any side surface is the same, forming magnetic clusters of equal size. That is, regardless of the position to which the magnet 210 rotates, the shape and size of the flexible grinding head formed on the side surface of the polishing wheel 100 are close to the same, thereby improving the consistency of the polishing effect on the workpiece and enhancing the polishing effect.

[0057] Reference Figure 2 In some embodiments, the polishing device further includes a mounting frame 500, a first connecting shaft 600, and a second connecting shaft 700. The mounting frame 500 includes a first mounting portion 510 and a second mounting portion 520 disposed opposite to each other. The polishing wheel 100 has a first end face 130 and a second end face 140 along its own axial direction. One end of the first connecting shaft 600 is rotatably connected to the first mounting portion 510 and is connected to the first driving device 300, and the other end is connected to the first end face 130. The accommodating cavity 110 extends to the second end face 140 and forms an opening 150 on the second end face 140. One end of the second connecting shaft 700 is rotatably connected to the second mounting portion 520 and is connected to the second driving device 400. The other end extends from the opening 150 into the accommodating cavity 110 and is connected to the magnetic field generating device 200. Illustratively, the mounting frame 500 has a mounting cavity 531. The first drive device 300 and the second drive device 400 are both disposed within the mounting cavity 531 and distributed vertically to reduce the horizontal size of the polishing apparatus. The second drive device 400 and the second drive device 400 extend in opposite directions and are connected to the first connecting shaft 600 and the second connecting shaft 700, respectively, via belts. Specifically, in this embodiment, the second drive device 400 is disposed outside the accommodating cavity 110, which simplifies the structure of the polishing wheel 100 and reduces processing costs. Furthermore, when the first drive device 300 drives the polishing wheel 100 to rotate, the second drive device 400 can avoid adding an additional load to the first drive device 300, thereby saving energy consumption during operation.

[0058] Reference Figure 3In some embodiments, the first connecting shaft 600 and the polishing wheel 100 are integrally formed to improve the coaxiality between the polishing wheel 100 and the first connecting shaft 600 while simplifying the structure. Specifically, the first connecting shaft 600 and the polishing wheel 100 are integrally formed using a process such as die casting, metal injection molding, or CNC machining, without the need for assembly. This eliminates assembly errors, thereby improving the coaxiality between the first connecting shaft 600 and the polishing wheel 100, and improving the stability of the polishing wheel 100 during rotation, thereby improving the polishing effect of this embodiment.

[0059] Reference Figure 3 In some embodiments, the second connecting shaft 700 includes a rotating portion 710, the radial side surface of which slides against the polishing wheel 100. For example, the polishing wheel 100 further includes a rotating hole 160 communicating with the accommodating cavity 110. The end of the second connecting shaft 700 facing away from the second mounting portion 520 is the rotating portion 710. The rotating portion 710 is inserted into the rotating hole 160 and slides against the radial sidewall of the rotating hole 160. Therefore, both the first connecting shaft 600 and the second connecting shaft 700 have supports at both ends in the axial direction, thereby improving the stability of the polishing wheel 100 and the magnetic field generating device 200. Taking the first connecting shaft 600 as an example, one end of the first connecting shaft 600 is connected to the first mounting portion 510, and the other end is connected to the polishing wheel 100. If there is no contact between the polishing wheel 100 and the second connecting shaft 700, the whole formed by the first connecting shaft 600 and the polishing wheel 100 is similar to a cantilever beam. On the one hand, the first mounting portion 510 will be subjected to a larger bending moment, so higher requirements are put forward for the strength of the first mounting portion 510. On the other hand, during the working process, the polishing wheel 100 may be at risk of vibration. In this embodiment, the polishing wheel 100 is in sliding contact with the second connecting shaft 700. Therefore, as for the whole formed by the first connecting shaft 600 and the polishing wheel 100, support points are formed at both ends, which can not only reduce the bending moment subjected to the first mounting portion 510, but also improve the rotation stability of the polishing wheel 100. Similarly, for the whole formed by the second connecting shaft 700 and the magnet 210, support points are formed at both axial ends, which can not only reduce the bending moment exerted on the second mounting part 520, but also improve the stability of the movement of the magnet 210, thereby improving the polishing effect of the polishing equipment of this embodiment.

[0060] Further, refer to Figure 3, in some embodiments, the polishing device further includes a rotating member 800, which is connected to the rotating part 710 and the polishing wheel 100 to rotatably connect the rotating part 710 and the polishing wheel 100. Specifically, the rotating member 800 is, for example, a bearing, a coupling, or an annular ring with self-lubricating function, so that the connection shaft and the polishing wheel 100 rotate more smoothly, reducing the wear of the polishing wheel 100 and the second connection shaft 700, thereby extending the service life of the polishing device in this embodiment. Exemplarily, the rotating member 800 is a bearing, which includes an inner ring and an outer ring. The polishing wheel 100 further has a rotating hole 160 communicating with the accommodating cavity 110. The outer ring is clamped in the rotating hole 160, and the second connection shaft 700 is inserted into the inner ring, so that the second connection shaft 700 is rotatably connected to the polishing wheel 100. Therefore, for both the first connection shaft 600 and the second connection shaft 700, there are supports at both axial ends, thus improving the rotational stability of the polishing wheel 100 and the magnet 210, and further improving the polishing effect of the polishing device in this embodiment.

[0061] Referring to Figure 3 , based on the above embodiments, the second connection shaft 700 includes at least two rotating parts 710 distributed along its own axis, that is, there are two support points between the polishing wheel 100 and the second connection shaft 700, thereby further improving the stability of the polishing wheel 100 and the magnet 210. Specifically, taking the second connection shaft 700 as an example, multiple connection points can more effectively disperse the load generated during the rotation of the second connection shaft 700, that is, each connection point bears a part of the load, thereby reducing the force on a single connection point and reducing the risk of damage caused by overload. At the same time, multiple connection points increase the stiffness of the overall formed by the first connection shaft 600, the polishing wheel 100, the second connection shaft 700, and the magnetic field generating device 200, making the polishing wheel 100 and the magnetic field generating device 200 more stable during rotation, reducing vibration and swing.

[0062] Referring to Figure 2, in some embodiments, the mounting bracket 500 further includes a third mounting portion 530, and at least one of the first mounting portion 510 and the second mounting portion 520 is a split structure with the third mounting portion 530. Exemplarily, the first mounting portion 510 and the third mounting portion 530 are of a split structure. Therefore, during the installation process, the second connecting shaft 700 can be inserted into the first mounting portion 510 first, and then the first mounting portion 510 can be connected to the third mounting portion 530, so that the installation of the first connecting shaft 600 of the third mounting portion 530 becomes simpler. Specifically, it can be understood that the first mounting portion 510 and the second mounting portion 520 are arranged facing each other, and the polishing wheel 100 is connected to the first connecting shaft 600 to form an integral structure (for the convenience of description, this integral structure is called the first structure), so that the first structure has a structure with one end larger and one end smaller. Therefore, during installation, the first structure needs to be placed between the first mounting portion 510 and the second mounting portion 520 first, and then the first connecting shaft 600 is passed through the first mounting portion 510. Therefore, the size of the first structure cannot be greater than the distance between the first mounting portion 510 and the second mounting portion 520, which limits the size of the polishing wheel 100. For example, the distance between the first mounting portion 510 and the second mounting portion 520 is L1, the length of the first connecting shaft 600 is L2, and the axial dimension of the polishing wheel 100 is L3. Among them, it is necessary to satisfy L2 + L3 ≤ L1, that is, the axial dimension L3 of the polishing wheel 100 ≤ L1 - L2. In this embodiment, since the first mounting portion 510 and the third mounting portion 530 are of a split structure, the first structure can be passed through the first mounting portion 510 first, and then the first mounting portion 510 is connected to the third mounting portion 530. Thus, only L3 ≤ L1 needs to be satisfied. Thus, when the interval between the first mounting portion 510 and the second mounting portion 520 is fixed, this embodiment can enable the polishing wheel 100 to have a larger polishing area 120.

[0063] In addition, during installation, the first structure, the magnetic field generating device 200, and the second connecting shaft 700 can also be installed as an integral structure outside first, and then this integral structure is installed on the first mounting portion 510 and the second mounting portion 520, so that the installation of the polishing equipment in this embodiment becomes simpler and more convenient.

[0064] Refer to Figure 2 and Figure 3 , on the basis of the above embodiments, the first connecting shaft 600 has a first shoulder 610, the first shoulder 610 slidably abuts against the surface of the first mounting portion 510 facing the second mounting portion 520, the second connecting shaft 700 has a second shoulder 720, and the second shoulder 720 slidably abuts against the surface of the second mounting portion 520 facing the first mounting portion 510 to limit the axial movement of the polishing wheel 100, thereby improving the polishing effect of the polishing equipment in this embodiment.

[0065] Refer toFigure 3 , in some embodiments, the polishing device further includes a first bearing 801 and a second bearing 802. The first connecting shaft 600 is inserted into the inner ring of the first bearing 801, and the first shaft shoulder 610 abuts against the inner ring of the first bearing 801, so that the first connecting shaft 600 is rotatably connected to the first mounting portion 510. The second connecting shaft 700 is inserted into the inner ring of the second bearing 802, and the second shaft shoulder 720 abuts against the inner ring of the second bearing 802.

[0066] Refer to Figure 4 , in some embodiments, a plurality of magnets 210 are evenly distributed along the circumferential direction of the second connecting shaft 700, thereby improving the rotation stability of the second connecting shaft 700. Specifically, a plurality of magnets 210 are evenly distributed along the circumferential direction of the second connecting shaft 700, so that the center of gravity of the magnetic field generating device 200 is located at the axis of the second connecting shaft 700, thereby improving the rotation stability of the second connecting shaft 700, and further improving the rotation stability of the magnets 210, so as to improve the polishing effect of the polishing device in this embodiment.

[0067] Refer to Figure 7 , Figure 7 FIG. is another structural schematic diagram of the magnetic field generating device and the polishing wheel according to the first aspect embodiment of the present invention. In some embodiments, along the circumferential direction of the second connecting shaft 700, the magnetic poles of adjacent magnets 210 are arranged in opposite directions, so as to form an involute and converging magnetic force line on the polishing surface 120, thereby enhancing the stirring effect on the magnetic composite fluid 1000, and further improving the renewal efficiency of the abrasive grains at the flexible grinding head, so as to enhance the polishing effect of the flexible grinding head and improve the polishing effect of the polishing device in this embodiment. In addition, since the magnetic poles of adjacent magnets 210 are arranged in opposite directions. Therefore, for the end close to the polishing surface 120, the magnetic force line emits from the magnetic pole of one magnet 210 and enters another magnet 210, enhancing the field strength between adjacent magnets 210, thereby improving the polishing effect of the polishing device in this embodiment.

[0068] Refer to Figure 8 , Figure 8 is Figure 2Exploded view of the middle magnetic field generating device. In some embodiments, the polishing device includes a mounting member 220. The mounting member 200 has a plurality of mounting grooves 221 distributed around a first direction. The mounting grooves 221 are adapted to the shape and size of the magnets 210, that is, the mounting grooves 221 are profiling grooves adapted to the shape and size of the magnets 210. Each mounting groove 221 is snap-fitted with a magnet 210, making the installation of the magnets 210 simpler and more convenient. Specifically, it can be understood that due to the mutual force between the magnets 210, the magnets 210 will repel or attract each other, so there is a risk of pinching hands or popping out and hurting people during installation. In this embodiment, the mounting member 220 has mounting grooves 221 adapted to the size and shape of the magnets 210. During installation, the magnets 210 can be snap-fitted into the mounting grooves 221, which can not only prevent the magnets 210 from being pinched by the mutual attraction between them, but also prevent the magnets 210 from popping out and hurting people due to repulsion, thus making the installation of the magnets 210 simpler.

[0069] It should be noted that the size and shape of the mounting grooves 221 being adapted to the size and shape of the magnets 210 should not be interpreted as only the size of the mounting grooves 221 being exactly equal to the size of the magnets 210. For the convenience of installation, the magnets 210 are slightly smaller than the mounting grooves 221. For example, there is a gap of 0.1 mm to 0.5 mm between the side surface of the magnet 210 and the side surface of the mounting groove 221.

[0070] In some embodiments, the edge of the opening 150 is hermetically connected to the second connecting shaft 700 to shield the opening 150 and prevent the magnetic composite fluid 1000 from entering the accommodating cavity 110 during the processing, so as to improve the rotational stability of the polishing wheel 100, thereby improving the polishing device of this embodiment. Specifically, the edge of the opening 150 is hermetically connected to the second connecting shaft 700. For example, a sealing ring is sleeved outside the second connecting shaft 700 and the sealing ring is pressed against the edge of the opening 150, thereby realizing the shielding of the opening 150, and further preventing the magnetic composite fluid 1000 from entering the accommodating cavity 110 from the opening 150 during the polishing process. Thus, it can avoid the wear caused by the magnetic composite fluid 1000 entering the connection shaft and the polishing wheel 100, and at the same time can prevent the magnetic composite fluid 1000 from hindering the rotation of the magnetic field generating device 200, making the rotation of the polishing wheel 100 and the magnetic field generating device 200 more stable.

[0071] It can be understood that the size of the opening 150 determines the size of the magnet 210 extending into the accommodation cavity 110. The larger the opening 150 is, the larger the magnet 210 that can be placed into the opening 150. However, an overly large opening 150 means a larger gap between the edge of the opening 150 and the second connecting shaft 700, which makes it more difficult to seal the opening 150. Based on this, in this embodiment, the polishing device further includes a shielding member 900. As Figure 3 shown, the shielding member 900 has a mounting hole 910. The first connecting shaft 600 passes through the mounting hole 910 and is hermetically connected to the inner wall of the mounting hole 910. The shielding member 900 is connected to the polishing wheel 100 and is hermetically connected to the edge of the opening 150, thereby achieving the sealing of the opening 150. It can be understood that, compared with the gap between the inner wall of the opening 150 and the second connecting shaft 700, in this embodiment, the gap between the inner wall of the opening 150 and the shielding member 900, and the gap between the second connecting shaft 700 and the inner wall of the mounting hole 910 are smaller, which makes the sealing of the opening 150 simpler.

[0072] Referring to Figure 2 , in some embodiments, the polishing surface 120 is a spherical surface. Specifically, due to its shape characteristics, the spherical polishing surface 120 can better adapt to various complex curved surfaces and irregularly shaped workpieces, so that the polishing device of this embodiment can not only be used for polishing flat surfaces, but also for polishing curved surfaces, thereby improving the practicality of the polishing device of this embodiment.

[0073] Furthermore, in some embodiments, the polishing device has a plurality of polishing wheels 100, and each polishing wheel 100 has different sizes and shapes. The polishing wheels 100 are detachably connected to the first mounting portion 510, and each polishing wheel 100 can be individually mounted on the first mounting portion 510, so that the polishing device of this embodiment has multiple working states, improving the practicality of this embodiment. Exemplarily, the polishing device has two polishing wheels 100. The polishing surface 120 of one polishing wheel 100 is a cylindrical surface, and the polishing surface 120 of the other polishing wheel 100 is a spherical surface. When a large flat surface needs to be polished, the polishing wheel 100 with a cylindrical surface can be used to improve the polishing efficiency. When a curved surface needs to be polished, the polishing wheel 100 with a spherical surface is replaced to improve the polishing accuracy of the spherical surface.

[0074] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art to which the present invention pertains, various changes can be made without departing from the gist of the present invention. In addition, without conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

Claims

1. A polishing device, characterized in that, Comprising: A polishing wheel having a receiving cavity, and the radial side surface of the polishing wheel is a polishing surface; A magnetic field generating device including a plurality of magnets, the plurality of magnets being distributed around a first direction, the first direction being parallel to the axial direction of the polishing wheel, and the magnetic field generating device being disposed in the receiving cavity for generating a magnetic field on the polishing surface to adsorb a magnetic composite fluid to the polishing surface; A first driving device connected to the polishing wheel for driving the polishing wheel to rotate; A second driving device connected to the magnet for driving the magnetic field generating device to rotate around the first direction; Wherein, the first driving device and the second driving device can rotate the polishing wheel and the magnetic field generating device at different rotation speeds.

2. The polishing device according to claim 1, wherein The polishing wheel rotates about its own axis, and the first direction coincides with the axial direction of the polishing wheel.

3. The polishing apparatus according to claim 1 or 2, characterized in that, The polishing device further includes a mounting frame, a first connecting shaft and a second connecting shaft, and the mounting frame includes a first mounting portion and a second mounting portion arranged opposite to each other; The polishing wheel has a first end surface and a second end surface along its own axial direction. One end of the first connecting shaft is rotatably connected to the first mounting portion and connected to the first driving device, and the other end is connected to the first end surface. The receiving cavity extends to the second end surface and forms an opening at the second end surface. One end of the second connecting shaft is rotatably connected to the second mounting portion and connected to the second driving device, and the other end extends into the receiving cavity from the opening and is connected to the magnetic field generating device.

4. The polishing device according to claim 3, characterized in that, The second connecting shaft includes a rotating portion; The radial side surface of the rotating portion is in sliding contact with the polishing wheel; or, The polishing device further includes a rotating member, and the rotating member is connected to the rotating portion and the polishing wheel for rotatably connecting the rotating portion and the polishing wheel.

5. The polishing apparatus according to claim 4, characterized in that, The second connecting shaft includes at least two rotating portions distributed along its own axial direction.

6. The polishing apparatus according to claim 5, wherein Along the circumferential direction of the second connecting shaft, the magnetic poles of adjacent magnets are arranged in opposite directions.

7. The polishing apparatus according to claim 1, wherein The magnetic field generating device further includes a mounting member having a plurality of mounting grooves distributed around the first direction, the size and shape of the mounting grooves being adapted to the magnets, and each magnet being separately disposed in the mounting groove.

8. The polishing apparatus according to claim 3, wherein A sealing connection is provided between the edge of the opening and the second connecting shaft.

9. The polishing apparatus according to claim 8, wherein, The polishing device further includes a shielding member having a first mounting hole, the shielding member being connected to the polishing wheel and covering the opening, and the second connecting shaft passing through the first mounting hole.

10. The polishing device according to claim 1, wherein, The polishing surface is a spherical surface.

Images