Visual inspection device

Abstract

The utility model provides a visual inspection device. The visual inspection device comprises a mounting bracket; the detection assembly comprises a CCD (Charge Coupled Device) camera and a movable frame, and the movable frame is movably arranged on the mounting bracket along the longitudinal direction; the CCD camera is movably arranged on the movable frame along the transverse direction; the illuminator is arranged on the mounting bracket and is used for providing a light source; and the light reflecting assembly is arranged in the shooting direction of the CCD camera, the light reflecting assembly comprises a light reflecting plate and a driver, and the driver is in driving connection with the light reflecting plate. The movable frame moves on the mounting support in the longitudinal direction to drive the CCD camera to move in the longitudinal direction, and the CCD camera moves on the movable frame in the transverse direction, so that the center of the CCD camera is calibrated to coincide with the center of the film pasting station; the light reflecting plate is driven by the driver to move along the vertical direction, so that the reflecting surface of the light reflecting plate can reflect the light onto the wafer, and the accuracy of detecting the film pasting position of the wafer is improved.

Description

Technical Field

[0001] The present application belongs to the field of visual inspection technology, and more specifically, relates to a visual inspection device. Background Art

[0002] During the manufacturing process, wafers come into contact with various chemicals and tools, making them susceptible to contamination or scratches. Laminating films protect the wafer surface from environmental influences, ensuring surface quality and stability.

[0003] When the wafer is in the process of film lamination, it is difficult to avoid the film on the wafer being skewed, misplaced or missing. If only manual inspection is used, it is difficult to accurately identify whether the film position on the wafer is correct, resulting in low overall detection accuracy. Utility Model Content

[0004] In order to overcome the deficiencies of the existing technical solutions, an embodiment of the present utility model provides a visual detection device.

[0005] To achieve the above objectives, the technical solution adopted in the embodiment of the present application is to provide a visual inspection device, which includes:

[0006] A visual inspection device, comprising:

[0007] Mounting bracket;

[0008] A detection component, comprising a CCD camera and a movable frame, wherein the movable frame is arranged on the mounting bracket for longitudinal movement; the CCD camera is arranged on the movable frame for transverse movement and is used to detect the condition of the wafer during film attachment;

[0009] an illuminator, the illuminator being arranged on the mounting bracket and being used to provide a light source;

[0010] A light reflecting assembly is provided in the shooting direction of the CCD camera. The light reflecting assembly comprises a light reflecting plate and a driver. The driver is connected to the light reflecting plate and is used to drive the light reflecting plate to move vertically.

[0011] Optionally, the movable frame includes a support frame and a sliding seat, the CCD camera is arranged on the sliding seat, and a waist hole is provided on the sliding seat; a first fixing hole corresponding to and communicating with the waist hole is opened on the support frame;

[0012] The detection assembly further includes a first locking member, which is simultaneously inserted into the waist hole and the first fixing hole to fix the sliding seat.

[0013] A guide rod is provided on the mounting bracket, and the movable frame is movably provided on the guide rod.

[0014] Optionally, the driver includes a driving shaft and a motor, and the motor is drivingly connected to the bottom side of the light reflecting plate through one end of the driving shaft.

[0015] Optionally, the visual inspection device further comprises a support plate and a plurality of support rods, the motor is arranged on the support plate, and the drive shaft is movably arranged through the support plate;

[0016] One end of each support rod is connected to the bottom side of the light reflecting plate, and the other end of each support rod is movably arranged on the support plate.

[0017] Optionally, the illuminator is provided with a through hole for the CCD camera to pass through.

[0018] Optionally, the visual inspection device further includes a blower for cooling the surface of the wafer, and the blower is rotatably disposed on the mounting bracket.

[0019] Optionally, the hair dryer is provided with a rotating shaft for rotating the mounting bracket;

[0020] The visual detection device includes a second locking piece, a second fixing hole is opened on the rotating shaft, a locking hole corresponding to the second fixing hole is passed through the mounting bracket, and the second locking piece is simultaneously passed through the locking hole and the second fixing hole to fix the hair dryer.

[0021] Optionally, the visual inspection device further includes a temperature sensor disposed on the mounting bracket for detecting the surface temperature of the wafer.

[0022] The visual inspection device provided in the embodiments of the present application has at least the following beneficial effects:

[0023] The movable frame is moved longitudinally on the mounting bracket to drive the CCD camera to move longitudinally, and the CCD camera is moved transversely on the movable frame to calibrate the center of the CCD camera to coincide with the center of the film laminating station; the light reflecting plate is driven by a driver to move vertically so that its reflecting surface can reflect light onto the wafer, thereby improving the accuracy of detecting the film laminating position of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] Figure 1 It is a structural diagram of an embodiment of the present utility model.

[0026] Figure 2 It is a structural explosion diagram of the detection component of an embodiment of the utility model.

[0027] Figure 3 It is a structural diagram of the light reflection component of an embodiment of the present utility model.

[0028] Figure 4 It is a structural diagram of a hair dryer according to an embodiment of the present utility model.

[0029] Numbers in the figure

[0030] 1. Mounting bracket; 11. Guide rod;

[0031] 2. Detection assembly; 21. CCD camera; 22. Movable frame; 221. Support frame; 222. First fixing hole; 223. Sliding seat; 224. Waist hole;

[0032] 3. Illuminator; 31. Through-hole;

[0033] 4. Light reflection assembly; 41. Light reflection plate; 42. Driver; 421. Drive shaft; 422. Motor; 43. Support plate; 44. Support rod;

[0034] 5. Hair dryer; 51. Second locking member;

[0035] 6. Temperature sensor. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clear, this application is further described in detail below with reference to the accompanying drawings and embodiments.

[0037] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0038] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it can be directly on the other element or indirectly on the other element.

[0039] When an element is referred to as being “connected to” another element, it can be directly connected to the another element or indirectly connected to the another element.

[0040] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features.

[0042] In the description of the present application, “plurality” means two or more, unless otherwise clearly defined.

[0043] In order to solve the technical problem in the prior art that it is difficult to accurately identify whether the film position on the wafer is correct through manual inspection, thereby resulting in low overall inspection accuracy, an embodiment of the present utility model provides a visual inspection device.

[0044] The following describes in detail the specific structure of a visual inspection device provided by the embodiment of the present invention. Figure 1-4 As shown in , the specific structure of the visual inspection device includes a mounting bracket 1, a detection component 2, an illuminator 3 and a light reflection component 4.

[0045] The mounting bracket 1 is provided in the wafer laminating device, and is used to assemble the detection component 2, the illuminator 3 and the light reflecting component 4 on the mounting bracket 1, thereby supporting the detection component 2, the illuminator 3 and the light reflecting component 4.

[0046] Specifically, the detection component 2 of the embodiment of the present invention includes a CCD camera 21 and a movable frame 22 for detecting the condition of the wafer when the film is attached (such as the CCD camera captures the image of the film, and then uses the image processing algorithm to identify whether the film has problems such as damage or broken edges. Subsequently, the position of the pasting area is fed back to the system to fine-tune the position of the wafer, thereby ensuring that the pasting area can be accurately attached to the surface of the wafer, avoiding poor adhesion of the film to the wafer or misalignment of the film attached to the wafer surface, etc.). The movable frame 22 is arranged on the mounting bracket 1 along the longitudinal movement.

[0047] In order to detect the position of the adhesive film and the adhesive film pasting area, according to the attached Figure 1 As shown, by adjusting the detection position of the CCD camera 21, the needs of different position detections can be met; specifically, since the CCD camera 21 is set on the movable frame 22, the movable frame 22 is moved longitudinally on the mounting bracket 1, thereby synchronously driving the CCD camera 21 to move in the moving direction of the movable frame 22. This arrangement plays a role in adjusting the longitudinal position of the CCD camera 21.

[0048] according to Figure 1 As shown, in a further embodiment, the CCD camera 21 is arranged on the movable frame 22 in a lateral movable manner.

[0049] Specifically, the CCD camera 21 is moved laterally on the movable frame 22 to adjust its lateral position. The CCD camera can be moved laterally and vertically to adjust its position according to wafer sizes, ensuring that multiple wafer surfaces can be fully inspected, avoiding blind spots and missed inspections.

[0050] It can be understood that the CCD camera 21 of the embodiment of the present invention detects the film-sticking condition of the wafer by acquiring images in real time, for example, by image processing algorithm (the image acquired by the CCD camera 21 is processed by the image processing algorithm to achieve image enhancement, filtering and analysis, thereby more clearly displaying the detailed information of the wafer surface) or wafer positioning (the CCD camera 21 identifies the edge of the wafer or specific marking points or lines, and then determines the position of the wafer).

[0051] according to Figure 1 As shown, the illuminator 3 is arranged on the mounting bracket 1, is used to provide a light source and is arranged on the side of the CCD camera 21. When the CCD camera 21 shoots the wafer, the illuminator 3 is used to illuminate the wafer, so that the wafer being inspected can generate reflected light. Subsequently, the CCD camera 21 collects the reflected light to facilitate imaging analysis of the wafer being inspected, thereby further improving the accuracy of wafer detection.

[0052] It can be understood that the illuminator 3 in the embodiment of the present invention is an LED light source.

[0053] In a further embodiment, the illuminator 3 is provided with a through hole 31 for the CCD camera 21 to pass through. This arrangement ensures that light irradiates the wafer and is not blocked by the illuminator 3 itself, thereby ensuring that the CCD camera 21 can obtain a clear image.

[0054] according to Figure 1As shown, the light reflecting assembly 4 is arranged in the shooting direction of the CCD camera 21. Specifically, the light reflecting assembly 4 includes a light reflecting plate 41 and a driver 42. The driver 42 is drivingly connected to the light reflecting plate 41 to drive the light reflecting plate 41 to move vertically.

[0055] Specifically, when the CCD camera 21 is photographing the wafer, in order to adjust the distance between the light reflecting plate 41 and the wafer to adapt to different detection requirements and conditions, the driver 42 is controlled to push the entire reflecting plate up and move to a height that can reflect the light irradiated by the illuminator 3 onto the wafer. Since the reflecting surface of the light reflecting plate 41 is facing the irradiation direction of the wafer and the illuminator 3, the light is reflected onto the wafer through the reflecting surface of the light reflecting plate 41, making the light irradiation more uniform and eliminating the detection error caused by uneven light irradiation. Moreover, when the light is reflected by the reflecting plate, the diffuse reflection of the light can be reduced, so that the light can be more concentrated and accurately irradiated onto the wafer, further improving the accuracy of wafer detection.

[0056] To sum up, the movable frame 22 is moved longitudinally on the mounting bracket 1 to drive the CCD camera 21 to move longitudinally, and the CCD camera 21 is moved transversely on the movable frame 22 to drive the CCD camera 21 to move transversely. The detection position of the CCD camera 21 is adjusted according to wafers of different sizes to ensure that the wafers can be fully detected; the light reflecting plate 41 is driven to move vertically by the driver 42 so that its reflecting surface can reflect light onto the wafer, thereby improving the accuracy of detecting the film position of the wafer.

[0057] according to Figure 2 As shown, in a specific embodiment, the movable frame 22 includes a support frame 221 and a sliding seat 223, the CCD camera 21 is arranged on the sliding seat 223, and a waist hole 224 is provided on the sliding seat 223; a first fixing hole 222 corresponding to the waist hole 224 is opened on the support frame 221; the detection component 2 also includes a first locking piece, which is detachably inserted into the waist hole 224 and the first fixing hole 222 at the same time to fix the sliding seat 223.

[0058] Specifically, in order to be able to accurately position on the inspection area of the wafer, thereby ensuring the precision and accuracy of wafer inspection, for this purpose, when adjusting the shooting direction of the CCD camera 21, it is only necessary to disengage the first locking piece from the waist hole 224 and the first fixing hole 222, and then push the sliding seat 223 to move horizontally to a certain distance, the specific distance being the length of the waist hole 224, that is, the sliding seat 223 is moved horizontally until it is connected with the first fixing hole 222 within the length range of the waist hole 224, and then the first locking piece is simultaneously passed through the waist hole 224 and the first fixing hole 222 until the sliding seat 223 is fixed. In this way, the shooting direction of the CCD camera 21 can be adjusted within the length range of the waist hole 224. By moving the sliding seat 223, the shooting direction of the CCD camera 21 can be adjusted, and the horizontal detection range of the CCD camera 21 can be adjusted, thereby calibrating the center of the CCD camera to coincide with the center of the film-laminating station.

[0059] It can be understood that the first locking member of the embodiment of the present invention is a bolt, and the first fixing hole 222 is a screw hole. Since the width of the waist hole 224 is larger than the outer diameter of the bolt, the bolt can pass through the waist hole 224 and be threadedly connected to the screw hole.

[0060] according to Figure 1 As shown, in a specific embodiment, a guide rod 11 is provided on the mounting bracket 1 , and the movable frame 22 is movably provided on the guide rod 11 .

[0061] Specifically, in order to further improve the detection range of the CCD camera 21, the movable frame 22 is moved along the axial direction of the guide rod 11 to drive the CCD camera 21 to synchronously follow the moving direction of the movable frame 22, thereby adjusting the longitudinal detection range of the CCD camera 21. With this arrangement, the CCD camera 21 can adjust its horizontal and vertical detection range within a certain range, further improving the flexibility of the CCD camera 21, thereby meeting different detection needs.

[0062] For example, a sliding hole for movably sleeved on the guide rod 11 is penetrated on the movable frame 22. When the movable frame 22 moves, it slides on the side wall of the guide rod 11 through the hole wall of the sliding hole, thereby realizing movement.

[0063] according to Figure 3 As shown, in some specific embodiments, the driver 42 includes a driving shaft 421 and a motor 422 , and the motor 422 is drivingly connected to the bottom side of the light reflection plate 41 through one end of the driving shaft 421 .

[0064] Specifically, when the CCD camera 21 photographs the wafer, the motor 422 drives the drive shaft 421 to rise, so as to push the light reflecting plate 41 to move up to a height at which the light irradiated by the illuminator 3 can be reflected onto the wafer, so that the light reflecting plate 41 is close to the illuminator 3, making the light reflection more uniform, reducing the diffuse reflection of light, and improving the clarity of the image.

[0065] It should be noted that the rotation of the motor 422 is transmitted to the drive shaft 421 through a coupling or a transmission device, etc., and the input current or voltage of the motor 422 is controlled to control the speed and torque of the motor 422. When the motor 422 is working, the electromagnetic force generated is transmitted to the drive shaft 421 through the coupling or the transmission device, causing the drive shaft 421 to rotate. The rotation of the drive shaft 421 will drive the light reflection plate 41 connected thereto to rise or fall.

[0066] according to Figure 3 As shown, in a further embodiment, the visual detection device also includes a support plate 43 and a plurality of support rods 44, the motor 422 is arranged on the support plate 43, for supporting the motor 422, and the drive shaft 421 is movably passed through the support plate 43; one end of each support rod 44 is connected to the bottom side of the light reflecting plate 41, and the other end of each support rod 44 is movably passed through the support plate 43.

[0067] Specifically, when the motor 422 drives the light reflecting plate 41 to move up or down through the driving shaft 421 , the light reflecting plate 41 can move axially under the action of the support rods 44 , thereby improving the stability and smoothness of the light reflecting plate 41 during movement.

[0068] according to Figure 1 As shown, in a specific embodiment, the visual inspection device further includes a blower 5 for cooling the surface of the wafer, and the blower 5 is rotatably disposed on the mounting bracket 1.

[0069] Specifically, after the adhesive film is attached to the surface of the wafer, the base film of the adhesive film needs to be torn off, and the wafer needs to be cooled to a set temperature before tearing off to ensure that the adhesive film will not be lifted up when the base film is torn off. Therefore, the blower 5 is set to blow air towards the wafer to dissipate heat from the wafer, thereby quickly reducing the surface temperature of the wafer.

[0070] It can be understood that the blower 5 in the embodiment of the present invention is an electrostatic dust removal blower 5 or a fan-type blower 5, and the specific type is not limited here.

[0071] according to Figure 4As shown, in a further embodiment, a rotating shaft for rotating the mounting bracket 1 is provided on the hair dryer 5; the visual detection device includes a second locking piece 51, a second fixing hole is provided on the rotating shaft, and a locking hole corresponding to the second fixing hole is passed through the mounting bracket 1, and the second locking piece is simultaneously passed through the locking hole and the second fixing hole to fix the hair dryer 5.

[0072] Specifically, in order to be able to adjust the blowing direction of the hair dryer 5, the second locking piece 51 is disengaged from the second fixing hole and the locking hole, and then the blowing direction of the hair dryer 5 is adjusted by the rotating shaft on the hair dryer 5. The second locking piece 51 is detachably inserted into the second fixing hole and the locking hole at the same time, thereby fixing the blowing direction of the hair dryer 5.

[0073] It can be understood that the second locking member 51 of the embodiment of the present invention is a bolt, and the second fixing hole and the locking hole are both threaded holes. The bolt is passed through the two threaded holes and threadedly connected to them, thereby fixing the blowing direction of the hair dryer 5.

[0074] In a further embodiment, the visual inspection device further includes a temperature sensor 6 mounted on the mounting bracket 1 for detecting the surface temperature of the wafer. Specifically, after the wafer is film-attached, the blower 5 cools the wafer by blowing air onto it. The temperature sensor 6 detects the temperature change of the wafer. Once the temperature drops to a set value, the base film can be removed.

[0075] It is understood that the temperature sensor 6 of the embodiment of the present invention is an infrared sensor that emits infrared light to the wafer to obtain the temperature of the wafer surface. Specifically, when the temperature of the wafer surface rises, the infrared sensor can determine the temperature of the wafer surface by measuring the intensity of the received infrared light.

[0076] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A visual inspection device, characterized in that: The visual detection device comprises: Mounting bracket; A detection component, comprising a CCD camera and a movable frame, wherein the movable frame is arranged on the mounting bracket for longitudinal movement; the CCD camera is arranged on the movable frame for transverse movement and is used to detect the condition of the wafer during film attachment; an illuminator, the illuminator being arranged on the mounting bracket and being used to provide a light source; A light reflecting assembly is provided in the shooting direction of the CCD camera. The light reflecting assembly comprises a light reflecting plate and a driver. The driver is connected to the light reflecting plate and is used to drive the light reflecting plate to move vertically.

2. The visual inspection device according to claim 1, characterized in that The movable frame includes a support frame and a sliding seat, the CCD camera is arranged on the sliding seat, and a waist hole is arranged on the sliding seat; a first fixing hole corresponding to and communicating with the waist hole is opened on the support frame; The detection assembly further includes a first locking member, which is simultaneously inserted into the waist hole and the first fixing hole to fix the sliding seat.

3. The visual inspection device according to claim 1, characterized in that A guide rod is provided on the mounting bracket, and the movable frame is movably provided on the guide rod.

4. The visual inspection device according to any one of claims 1 to 3, characterized in that: The driver includes a driving shaft and a motor. The motor is drivingly connected to the bottom side of the light reflection plate through one end of the driving shaft.

5. The visual inspection device according to claim 4, characterized in that: The visual inspection device further includes a support plate and a plurality of support rods, the motor is disposed on the support plate, and the drive shaft is movably disposed through the support plate; One end of each support rod is connected to the bottom side of the light reflecting plate, and the other end of each support rod is movably arranged on the support plate.

6. The visual inspection device according to any one of claims 1 to 3, characterized in that: The illuminator is provided with a through hole for the CCD camera to pass through.

7. The visual inspection device according to any one of claims 1 to 3, characterized in that: The visual inspection device also includes a blower for cooling the surface of the wafer, and the blower is rotatably arranged on the mounting bracket.

8. The visual inspection device according to claim 7, characterized in that: The hair dryer is provided with a rotating shaft for rotating the mounting bracket; The visual detection device includes a second locking piece, a second fixing hole is opened on the rotating shaft, a locking hole corresponding to the second fixing hole is passed through the mounting bracket, and the second locking piece is simultaneously passed through the locking hole and the second fixing hole to fix the hair dryer.

9. The visual inspection device according to claim 7, characterized in that: The visual inspection device further includes a temperature sensor disposed on the mounting bracket for detecting the surface temperature of the wafer.

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