Circuit board module

Abstract

The utility model relates to a circuit board module. The circuit board module comprises a first circuit board, a second circuit board and a connecting piece, a first power device is arranged on the first circuit board; the first circuit board is provided with first heat dissipation holes, and the second circuit board is provided with second heat dissipation holes. The second heat dissipation hole is arranged corresponding to the first power device and is provided with a first heat dissipation piece; the first heat dissipation piece is provided with at least one opening, an inner space is formed among the first circuit board, the second circuit board and the connecting piece, and the opening is communicated with the inner space and the second heat dissipation hole. According to the utility model, the first heat dissipation holes are formed in the first circuit board, the second heat dissipation holes are formed in the second circuit board, and the first heat dissipation piece is arranged at the first power device, so that heat dissipation management is carried out on the internal space, particularly, efficient heat dissipation can be carried out on the first power device, and in the whole test process, the test efficiency is improved. And the working temperature is maintained in a safe range, so that the accuracy of a test result and the overall performance of equipment are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically, to a circuit board module. Background Art

[0002] In modern electronic devices, due to the demand for high integration, multiple PCBAs (printed circuit board assemblies) are often stacked and connected via electronic connectors to form a mother-daughter board structure. In this mother-daughter board structure, components with high power consumption and high heat generation are usually installed on the motherboard and daughterboard, but this leads to challenges in heat management. In the BIB test (burn in borad, aging test), the purpose is to expose potential early failures by running the device under high temperature and high stress conditions for a long time. If a mother-daughter board structure is used in this test, heat can easily accumulate between the boards, causing local overheating, which in turn leads to inaccurate test results or premature failure of components. Utility Model Content

[0003] The technical problem to be solved by the present invention is that the use of a mother-daughter board structure in aging testing easily leads to heat accumulation between the boards, resulting in local overheating, which in turn leads to inaccurate test results or premature failure of components. In response to the above-mentioned defects of the prior art, a circuit board module is provided.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A circuit board module is constructed, which includes a first circuit board, a second circuit board and a connector, wherein the first circuit board and the second circuit board are connected by the connector and are arranged opposite to each other; a first power device is provided on the first circuit board; a first heat dissipation hole is provided on the first circuit board, and a second heat dissipation hole is provided on the second circuit board; the second heat dissipation hole is arranged corresponding to the first power device and is provided with a first heat dissipation member; one end of the first heat dissipation member contacts the first power device, and the other end extends to the second heat dissipation hole; the first heat dissipation member is provided with at least one opening, an internal space is formed between the first circuit board, the second circuit board and the connector, and the opening is connected to the internal space and the second heat dissipation hole.

[0006] Furthermore, an air supply mechanism for accelerating air flow is provided on the outer side of the second circuit board, and the air supply mechanism is provided corresponding to the second heat dissipation hole.

[0007] Furthermore, the second heat dissipation hole passes through the first surface and the second surface of the second circuit board, wherein the first surface faces the first circuit board and the second surface faces away from the first circuit board, and the size of the second heat dissipation hole gradually increases as the first surface approaches the second surface.

[0008] Furthermore, a second power device is provided on the second circuit board, the first heat dissipation hole is arranged corresponding to the second power device, and a second heat dissipation member is provided; one end of the second heat dissipation member contacts the second power device, and the other end extends to the first heat dissipation hole.

[0009] Furthermore, the bottom surface of the first circuit board is provided with a plurality of raised portions; a reserved height is provided between the first heat dissipation hole and the bottom of the raised portion to allow air to flow out from the first heat dissipation hole to the outside of the first circuit board.

[0010] Furthermore, it also includes a first heat dissipation plate and a second heat dissipation plate made of heat-conductive metal, the first heat dissipation plate and the second heat dissipation plate are respectively arranged on the first circuit board and the second circuit board, the first heat dissipation plate and the second heat dissipation plate respectively cover the first circuit board and the second circuit board, and corresponding through holes are opened corresponding to the first heat dissipation holes and the second heat dissipation holes, and the second heat dissipation plate is connected to the first heat dissipation element.

[0011] Furthermore, the connecting member includes a first connecting member, a second connecting member, a third connecting member and a fourth connecting member arranged around the first power device, wherein the first connecting member and the second connecting member are arranged opposite to each other, and the third connecting member and the fourth connecting member are arranged opposite to each other.

[0012] Furthermore, the first heat sink includes a clamping portion and a heat conducting portion connected to the clamping portion, the clamping portion is arranged opposite to the first power device and is located in the second heat dissipation hole and the through hole, and the heat conducting portion is located in the internal space and in contact with the first power device.

[0013] Furthermore, the heat conducting portion includes a heat conducting surface, the first power device includes an upper surface, and the heat conducting surface contacts the upper surface.

[0014] Furthermore, the shape and size of the heat conducting surface are consistent with those of the upper surface so as to completely cover the upper surface.

[0015] The beneficial effects of the present invention are as follows: by arranging a first heat dissipation hole on the first circuit board, arranging a second heat dissipation hole on the second circuit board, and arranging a first heat sink at the first power device on the first circuit board, heat dissipation management is performed on the internal space formed between the first circuit board, the second circuit board and the connector, and in particular, efficient heat dissipation can be performed on the first power device with higher power, so that the electronic components can maintain the operating temperature within a safe range during the entire test process, preventing failures caused by excessive temperature, thereby improving the accuracy of the test results and the overall performance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0017] Figure 1 This is an overall structural diagram of a circuit board module in one embodiment of the present utility model;

[0018] Figure 2 This is a left side schematic diagram of a circuit board module in one embodiment of the present invention;

[0019] Figure 3 This utility model Figure 2 Schematic cross-sectional view at AA in the middle;

[0020] Figure 4 This is a three-dimensional schematic diagram of a circuit board module in one embodiment of the present invention from another angle;

[0021] Figure 5 This is a three-dimensional schematic diagram of a circuit board module in one embodiment of the present invention from another angle;

[0022] Figure 6 It is a three-dimensional schematic diagram of the first heat dissipation element in one embodiment of the present utility model.

[0023] Explanation of reference numerals: first circuit board 1, second circuit board 2, connector 3, first power device 101, first heat dissipation hole 102, second heat dissipation hole 112, first heat dissipation member 103, opening 104, internal space 105, air supply mechanism 106, first surface 113, second surface 114, second power device 115, second heat dissipation member 116, bottom surface 201, raised portion 202, reserved height H, first heat dissipation plate 203, second heat dissipation plate 204, through hole 205, first connector 301, second connector 302, third connector 303, fourth connector 304, clamping portion 107, heat conducting portion 108, heat conducting surface 109, upper surface 110. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will be described clearly and completely in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] The terms "first," "second," "third," "fourth," and so forth (if any) in the specification and claims of this application and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0026] This application is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of this application, cross-sectional views of device structures may be partially enlarged and not to scale. Furthermore, these schematic diagrams are merely illustrative and should not limit the scope of this application. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0027] Multiple PCBAs (Printed Circuit Board Assemblies) are often stacked into a mother-daughter structure, and the daughter and motherboard structures usually contain components with high power consumption and high heat generation. During aging tests, this stacked daughter and motherboard structure can easily cause heat to accumulate between the boards, resulting in local overheating, which can easily lead to inaccurate test results or premature failure of electronic components.

[0028] Please refer to Figure 1 In one embodiment of the present application, a circuit board module is proposed, including a first circuit board 1, a second circuit board 2 and a connecting member 3, the first circuit board 1 and the second circuit board 2 are connected by the connecting member 3, and the first circuit board 1 and the second circuit board 2 are arranged opposite to each other; a first power device 101 is provided on the first circuit board 1; a first heat dissipation hole 102 is provided on the first circuit board 1, and a second heat dissipation hole 112 is provided on the second circuit board 2; the second heat dissipation hole 112 is arranged corresponding to the first power device 101, and a first heat dissipation member 103 is provided; one end of the first heat dissipation member 103 contacts the first power device 101, and the other end extends to the second heat dissipation hole 112; the first heat dissipation member 103 is provided with at least one opening 104, an internal space 105 is formed between the first circuit board 1, the second circuit board 2 and the connecting member 3, and the opening 104 is connected to the internal space 105 and the second heat dissipation hole 112. By setting a first heat dissipation hole 102 on the first circuit board 1, setting a second heat dissipation hole 112 on the second circuit board 2, and setting a first heat sink 103 at the first power device 101 on the first circuit board 1, heat dissipation management is performed on the internal space 5 formed between the first circuit board 1, the second circuit board 2 and the connector 3. In particular, the first power device 101 can be efficiently dissipated, so that the electronic components can maintain an operating temperature within a safe range during the entire test process, preventing failures caused by excessive temperature, thereby improving the accuracy of the test results and the overall performance of the equipment.

[0029] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0030] like Figure 1As shown, in one embodiment, a first circuit board 1, a second circuit board 2 and a connecting member 3 are provided, and the first circuit board 1 and the second circuit board 2 are connected by the connecting member 3, and the first circuit board 1 and the second circuit board 2 are arranged opposite to each other; a first power device 101 is provided on the first circuit board 1; a first heat dissipation hole 102 is provided on the first circuit board 1, and a second heat dissipation hole 112 is provided on the second circuit board 2; the second heat dissipation hole 112 is arranged corresponding to the first power device 101, and a first heat dissipation member 103 is provided; one end of the first heat dissipation member 103 contacts the first power device 101, and the other end extends to the second heat dissipation hole 112; the first heat dissipation member 103 is provided with at least one opening 104, and an internal space 105 is formed between the first circuit board 1, the second circuit board 2 and the connecting member 3, and the opening 104 is connected to the internal space 105 and the second heat dissipation hole 112.

[0031] Specifically, the first circuit board 1 and the second circuit board 2 are arranged relative to each other. In this embodiment, the first circuit board 1 is arranged below and the second circuit board 2 is arranged above the first circuit board 1. The connector 3 is an electronic connector, and the first circuit board 1 and the second circuit board 2 are detachably connected through the electronic connector. In a specific embodiment, the electronic connector is a pin header, which can ensure stable flow of signals and currents and is easy to assemble and replace. Figure 4 As shown, in another specific embodiment, there are four connectors 3, which are vertically arranged above the first circuit board 1 and perpendicular to the first circuit board 1 and the second circuit board 2. At this time, an internal space 105 is formed between the connector 3 and the first circuit board 1 and the second circuit board 2. Since multiple electronic components are arranged in the internal space 105, heat accumulation is likely to occur, resulting in local overheating.

[0032] More specifically, multiple electronic components are provided on both the first circuit board 1 and the second circuit board 2. During the aging test, these electronic components will operate and dissipate heat. Due to the stacked structure of the first circuit board 1 and the second circuit board 2, the generated heat is easily accumulated in the internal space 105 between the first circuit board 1 and the second circuit board 2. In this application, by providing first heat dissipation holes 102 on the first circuit board 1 and second heat dissipation holes 112 on the second circuit board 2, the internal space 105 can dissipate heat through the first heat dissipation holes 102 and the second heat dissipation holes 112.

[0033] At the same time, since the first circuit board 1 is provided with a first power device 101, which is a high-power electronic component and generates a relatively high amount of heat, a second heat dissipation hole 112 is provided on the second circuit board 2 opposite the first power device 101, and a first heat sink 103 is provided at the second heat dissipation hole 112 to dissipate heat from the first power device 101. The first heat sink 103 is made of a heat-conducting metal with a relatively high thermal conductivity, and is in contact with the corresponding first power device 101 to conduct heat.

[0034] In addition, the first heat sink 103 is provided with at least one opening 104, so that the interior of the first heat sink 103 can communicate with the internal space 105 between the first circuit board 1 and the second circuit board 2, and the interior of the first heat sink 103 is also connected to the second heat dissipation holes 112. In one specific embodiment, outside air can enter through the second heat dissipation holes 112 provided on the second circuit board 2, flow into the interior of the first heat sink 103, then flow into the internal space 105 through the openings 104 provided on the first heat sink 103, and finally flow out through the first heat dissipation holes 102 provided on the first circuit board 1, while removing heat from the internal space 105, thereby dissipating heat from the internal space 105.

[0035] In one embodiment, an air supply mechanism 106 for accelerating air flow is provided on the outer side of the second circuit board 2 , and the air supply mechanism 106 is provided corresponding to the second heat dissipation holes 112 .

[0036] Specifically, such as Figure 1 As shown, the air supply mechanism 106 is provided above the second circuit board 2, and the air outlet of the air supply mechanism 106 corresponds to the second heat dissipation hole 112, so that the air supply mechanism 106 can supply air toward the second heat dissipation hole 112, thereby blowing in outside air. After the air supply mechanism 106 is driven to operate, air can be blown into the internal space 105 through the second heat dissipation hole 112, and the flow of air is accelerated, so that air can quickly enter the internal space 105, and air can quickly flow out from the first heat dissipation hole 102 provided on the first circuit board 1. Because the second heat dissipation hole 112 is provided corresponding to the first heat sink 103 and the first power device 101, in addition to being able to blow outside air into the internal space 105, it can also directly blow the first heat sink 103 and the first power device 101 to cool the first heat sink 103 and the first power device 101.

[0037] In one embodiment, the second heat dissipation hole 112 passes through the first surface 113 and the second surface 114 of the second circuit board 2, wherein the first surface 113 faces the first circuit board 1 and the second surface 114 faces away from the first circuit board 1, and the size of the second heat dissipation hole 112 gradually increases as the first surface 113 approaches the second surface 114.

[0038] Specifically, such as Figure 2 and Figure 3 As shown, the first surface 113 of the second circuit board 2 is arranged toward the first circuit board 1, and the second surface 114 is away from the first circuit board 1; the size of the second heat dissipation hole 112 gradually increases as the first surface 113 approaches the second surface 114, that is, it decreases from the second surface 114 to the first surface 113, that is, it is funnel-shaped, which can increase the wind pressure and wind speed of the air supply mechanism 106 after passing through the second heat dissipation hole 112; it is beneficial to supply air and dissipate heat to the internal space 105 and the first power device 101. The greater the wind speed, the faster the air flows, and the faster the heat is carried away by the air, thereby achieving the purpose of efficient heat dissipation.

[0039] In one embodiment, the second heat dissipation hole 112 , the opening 104 , the inner space 105 and the first heat dissipation hole 102 form a heat dissipation channel.

[0040] Specifically, if Figure 3 As shown, outside air can enter the first heat sink 103 from the second heat dissipation hole 112 provided on the second circuit board 2, and then flow into the internal space 105 from the opening 104 provided on the first heat sink 103, and take away the heat generated by the first power device 101, and then flow out from the first heat dissipation hole 102 provided on the first circuit board 1, and drive the heat accumulated in the internal space 105 to the outside of the first circuit board 1. At this time, a heat dissipation channel is formed between the second heat dissipation hole 112, the opening 104, the internal space 105 and the first heat dissipation hole 102.

[0041] In one embodiment, a second power device 115 is provided on the second circuit board 2, the first heat dissipation hole 102 is arranged corresponding to the second power device 115, and a second heat dissipation member 116 is provided; one end of the second heat dissipation member 116 contacts the second power device 115, and the other end extends to the first heat dissipation hole 102.

[0042] like Figure 3 As shown, specifically, a first heat dissipation hole 102 is provided on a first circuit board 1, and a second power device 115 is provided above the first heat dissipation hole 102 and located on a second circuit board 2 opposite the first heat dissipation hole 102. A second heat dissipation member 116 is provided in the first heat dissipation hole 102. The second heat dissipation member 116 is placed in an opposite direction to the first heat dissipation member 103. One end of the first heat dissipation member 103 contacts the first power device 101, and the other end extends into the second heat dissipation hole 112. The second heat dissipation member 116, on the other hand, contacts the second power device 115, and the other end extends into the first heat dissipation hole 102.

[0043] In one embodiment, the bottom surface 201 of the first circuit board 1 is provided with a plurality of raised portions 202 ; a reserved height H is provided between the first heat dissipation holes 102 and the bottom of the raised portions 202 to allow air to flow out of the first heat dissipation holes 102 to the outside of the first circuit board 1 .

[0044] like Figure 2 As shown, specifically, the bottom surface 201 is provided with a plurality of raised portions 202, which are provided on the left and right sides of the bottom surface 201, and a reserved height H is provided between the bottom surface 201 and the bottom of the raised portion 202, which can raise the first circuit board 1 to avoid the first heat dissipation hole 102 being blocked, and facilitate air to flow out of the first heat dissipation hole 102 to the outside of the second circuit board 2 and connect with the outside air.

[0045] In one embodiment, a first heat dissipation plate 203 and a second heat dissipation plate 204 made of heat-conductive metal are further included. The first heat dissipation plate 203 and the second heat dissipation plate 204 are respectively arranged on the first circuit board 1 and the second circuit board 2. The first heat dissipation plate 203 and the second heat dissipation plate 204 respectively cover the first circuit board 1 and the second circuit board 2, and corresponding through holes 205 are opened corresponding to the first heat dissipation holes 102 and the second heat dissipation holes 112, and the second heat dissipation plate 204 is connected to the first heat dissipation element 103.

[0046] like Figure 2 Specifically, a first heat sink 203 covers the outside of the first circuit board and is connected to the second heat sink; a second heat sink covers the outside of the second circuit board and is connected to the first heat sink. Both the first and second heat sinks are made of copper or an alloy containing copper. The first heat sink contacts the first circuit board and the second heat sink, while the second heat sink contacts the second circuit board and the first heat sink 103. This increases the contact area, dissipating heat and improving heat dissipation.

[0047] The first heat sink 203 and the second heat sink 204 are provided with through holes 205 corresponding to the first heat dissipation holes 102 and the second heat dissipation holes 112, respectively. The through holes 205 are connected to the first heat dissipation holes 102 and the second heat dissipation holes, respectively. The first heat sink 103 is connected to the through holes 205 provided on the second heat sink 204, so that the first heat sink 103 and the second heat sink 204 are in contact, and heat can be transferred to the second heat sink 204, and then the heat is discharged through the second heat sink 204. The second heat sink 116 is connected to the through holes 205 provided on the first heat sink 203, so that the second heat sink 116 and the first heat sink 203 are in contact and heat can be transferred to the first heat sink 203 for discharge.

[0048] In one embodiment, the connector 3 includes a first connector 301, a second connector 302, a third connector 303 and a fourth connector 304 arranged around the first power device 101, wherein the first connector 301 and the second connector 302 are arranged opposite to each other, and the third connector 303 and the fourth connector 304 are arranged opposite to each other.

[0049] like Figure 4 and Figure 5 As shown, specifically, the first connector 301 and the second connector 302 are arranged opposite each other. More specifically, the first connector 301 is arranged on the left side of the first circuit board 1, and the second connector 302 is arranged on the right side. The third connector 303 and the fourth connector 304 are arranged opposite each other. More specifically, the third connector 303 is arranged on the front side of the first circuit board 1, and the fourth connector 304 is placed on the back side of the first circuit board 1. The first connector 301, the second connector 302, the third connector 303, and the fourth connector 304 form an internal space 105 with the first circuit board 1 and the second circuit board 2.

[0050] In one embodiment, the first heat sink 103 includes a clamping portion 107 and a heat conducting portion 108 connected to the clamping portion 107. The clamping portion 107 is arranged opposite to the first power device 101 and is located in the second heat dissipation hole 112 and the through hole 205. The heat conducting portion 108 is located in the internal space 105 and is in contact with the first power device 101.

[0051] like Figure 3 and Figure 6 Specifically, the first heat sinks 103 are provided in correspondence with the first power devices 101, with each first power device 101 having a first heat sink 103. The second heat sinks are provided in correspondence with the second power devices 115, with each second power device 115 having a second heat sink 116. The first heat sink 103 comprises a clamping portion 107 and a heat conducting portion 108. The clamping portion 107 is located within the second heat dissipation holes and the through-hole 205. The heat conducting portion 108 is located within the internal space 105 and contacts the first power device 101 to conduct heat thereto. The heat conducting portion 108 is connected to the clamping portion 107, and the connection method can be a detachable threaded connection or an integral molding method. The clamping portion 107 and the heat conducting portion 108 are both hollow structures, allowing air to enter the clamping portion 107 and the heat conducting portion 108 in sequence from the outside, and the heat conducting portion 108 is provided with an opening 104. Air can enter the first heat dissipation component 103 through the second heat dissipation hole 112, and flow into the internal space 105 through the opening 104 provided in the heat conducting portion 108, and then enter the second heat dissipation component 116 through the opening 104, and flow out to the outside of the internal space 105 through the first heat dissipation hole 102.

[0052] like Figure 3As shown, in a specific embodiment, air is blown by the air supply mechanism 106 and enters from the second heat dissipation hole 112 provided on the right side of the second circuit board 2, and flows into the first heat dissipation member 103 connected thereto, and then the air flows out from the opening 104 provided on the first heat dissipation member 103 to the internal space 105. At this time, the heat will flow with the air. Under the action of the air supply mechanism 106, the air enters from the opening 104 of the second heat dissipation member 116 provided on the left side, and finally flows out from the first heat dissipation hole 102 connected thereto.

[0053] In one embodiment, the heat conducting portion 108 includes a heat conducting surface 109 , the first power device 101 includes an upper surface 110 , and the heat conducting surface 109 contacts the upper surface 110 .

[0054] like Figure 3 and Figure 6 As shown, specifically, the heat conducting surface 109 is a plane, and the heat conducting surface of the first heat sink contacts the upper surface 110 of the first power device 101. Since the first heat sink 103 is made of a heat conducting material, it can conduct heat, thereby reducing the heat of the first power device 101. The heat conducting surface 109 of the second heat sink 116 contacts the surface of the second power device 115 facing the first circuit board 1 to conduct heat.

[0055] In one embodiment, the shape and size of the heat conducting surface 109 are consistent with those of the upper surface 110 so as to completely cover the upper surface 110 .

[0056] like Figure 6 As shown, specifically, the heat conducting portion 108 has a conical structure, that is, the cross section increases from the direction relative to the first power device 101 toward the first power device 101 until it is maximum when in contact with the first power device 101; that is, the contact area between the heat conducting surface 109 and the upper surface 110 is the largest. More specifically, the shape and size of the heat conducting surface 109 are the same as those of the upper surface 110, thereby improving the heat conduction effect.

[0057] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the method embodiments are described briefly because they are generally similar to the structural embodiments. For relevant parts, refer to the description of the structural embodiments.

[0058] The above is a specific implementation of the present application. It should be understood that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board module, characterized in that: The device comprises a first circuit board, a second circuit board and a connector, wherein the first circuit board and the second circuit board are connected via the connector, and the first circuit board and the second circuit board are arranged opposite to each other; A first power device is provided on the first circuit board; The first circuit board is provided with a first heat dissipation hole, and the second circuit board is provided with a second heat dissipation hole; The second heat dissipation hole is arranged corresponding to the first power device and is provided with a first heat dissipation member; one end of the first heat dissipation member contacts the first power device, and the other end extends to the second heat dissipation hole; The first heat dissipation member is provided with at least one opening, an internal space is formed between the first circuit board, the second circuit board and the connecting member, and the opening is communicated with the internal space and the second heat dissipation hole.

2. The circuit board module according to claim 1, wherein: An air supply mechanism for accelerating air flow is provided on the outer side of the second circuit board, and the air supply mechanism is provided corresponding to the second heat dissipation holes.

3. The circuit board module according to claim 1, wherein: The second heat dissipation hole passes through the first surface and the second surface of the second circuit board, wherein the first surface faces the first circuit board and the second surface faces away from the first circuit board, and the size of the second heat dissipation hole gradually increases as the first surface approaches the second surface.

4. The circuit board module according to claim 1, wherein: The second circuit board is provided with a second power device, the first heat dissipation hole is arranged corresponding to the second power device, and a second heat dissipation member is provided; one end of the second heat dissipation member contacts the second power device, and the other end extends to the first heat dissipation hole.

5. The circuit board module according to claim 1, wherein: The bottom surface of the first circuit board is provided with a plurality of raised portions; A reserved height is provided between the first heat dissipation hole and the bottom of the raised portion, so that air can flow out of the first heat dissipation hole to the outside of the first circuit board.

6. The circuit board module according to claim 1, wherein: It also includes a first heat dissipation plate and a second heat dissipation plate made of heat-conductive metal, the first heat dissipation plate and the second heat dissipation plate are respectively arranged on the first circuit board and the second circuit board, the first heat dissipation plate and the second heat dissipation plate respectively cover the first circuit board and the second circuit board, and corresponding through holes are opened corresponding to the first heat dissipation holes and the second heat dissipation holes, and the second heat dissipation plate is connected to the first heat dissipation element.

7. The circuit board module according to claim 1, wherein: The connecting member includes a first connecting member, a second connecting member, a third connecting member and a fourth connecting member arranged around the first power device, wherein the first connecting member and the second connecting member are arranged opposite to each other, and the third connecting member and the fourth connecting member are arranged opposite to each other.

8. The circuit board module according to claim 6, wherein: The first heat sink includes a clamping portion and a heat conducting portion connected to the clamping portion. The clamping portion is arranged opposite to the first power device and is located in the second heat dissipation hole and the through hole. The heat conducting portion is located in the internal space and contacts the first power device.

9. The circuit board module according to claim 8, wherein: The heat conducting portion includes a heat conducting surface, the first power device includes an upper surface, and the heat conducting surface contacts the upper surface.

10. The circuit board module according to claim 9, wherein: The shape and size of the heat conducting surface are consistent with those of the upper surface so as to completely cover the upper surface.

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