Heat dissipation structure
By improving the heat dissipation structure, including the main heat sink, extended heat sink, heat pipe, heat sink fins and fixing bracket, the problems of large space occupation and cumbersome operation of the horn heat sink are solved, and efficient and convenient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202423247244.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing horn-shaped heatsinks occupy a large amount of motherboard space, making connector plugging and unplugging inconvenient and the installation and disassembly process cumbersome, which limits their application scope and user experience.
The heat dissipation structure includes a main heat sink, an extended heat sink, heat pipes, heat sink blocks, heat sink fins, and a fixed bracket. The heat sink can be rotated and its angle adjusted through a movable bracket and an adjustment device, which reduces the space occupied by the motherboard and simplifies the installation process.
It improves heat dissipation efficiency, reduces motherboard space occupation, simplifies the installation and removal process of the heatsink, and provides a more convenient heat dissipation solution.