Heat sink, circulation cooling device, and circulation cooling system

Abstract

To provide a more effective thermal solution which improves the utilization rate of a heat dissipation medium and is advantageous for reducing the energy consumption of a circulation cooling device.SOLUTION: The present disclosure provides a heat sink for dissipating heat from a heating element. The heat dissipation plate includes a heat dissipation body, and the heat dissipation body is provided with a cavity and an inlet and an outlet communicating with the cavity. The heat-dissipating body includes a heat-conducting surface, a heat-dissipating surface, and a lateral surface. The heat-conducting surface and the heat-dissipating surface, or the heat-conducting surface, the heat-dissipating surface, and the lateral surface are arranged to surround the cavity. The inlet is provided on the heat dissipation surface or the side contact surface, and the outlet is provided on the heat dissipation surface and / or the side contact surface. The heat-conducting surface is used for contacting the heat-generating element, the inlet is used for introducing a heat-dissipating medium into the cavity, and the heat-dissipating medium in the cavity absorbs heat and is discharged from the outlet. The present disclosure also provides a loop cooling device and a loop cooling system.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present application relates to the field of heat dissipation for electronic devices, and more particularly to a heat sink, a circulating cooling device, and a circulating cooling system. [Background technology]

[0002] In today's server systems, heat dissipation is becoming increasingly important, leading to the development of circulating cooling technologies that immerse the entire server in a heat dissipation medium. In practical applications, each server typically contains multiple different components, each with different heat dissipation values ​​and heat dissipation requirements. However, if the heat dissipation medium flows uniformly through multiple different components, it will not be able to meet the heat dissipation requirements of the components that generate a large amount of heat, and will result in a certain amount of waste for the components that generate a small amount of heat. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of the above circumstances, the present application aims to provide a heat sink to solve the technical problems of insufficient supply of heat dissipation requirements for the main heating element and low utilization rate of the heat dissipation medium. The present application also provides a circulating cooling device. The present application also provides a circulating cooling system. [Means for solving the problem]

[0004] a heat dissipation plate for use in heat dissipation from a heat-generating element, the heat dissipation plate comprising a heat dissipation body, the heat dissipation body having a cavity and an inlet and an outlet communicating with the cavity; the heat dissipation body having a heat-conducting surface, a heat-dissipating surface and a side-facing surface, the heat-conducting surface, the heat-dissipating surface, the heat-dissipating surface and the side-facing surface being arranged to surround the cavity, the inlet being arranged on the heat-dissipating surface or the side-facing surface, the outlet being arranged on the heat-dissipating surface and / or the side-facing surface, the heat-conducting surface being in contact with the heat-generating element, the inlet being used to introduce a heat dissipating medium into the cavity, the heat-conducting medium in the cavity absorbing heat and dissipating it through the outlet;

[0005] In some possible embodiments, the heat sink further includes a fixing member, the heat sink body has a fixing hole, the fixing hole is offset from the inlet or the outlet, and the fixing member passes through the fixing hole to fix the heat sink to the heat generating element.

[0006] In some possible embodiments, the heat dissipation plate further includes a guide plate, which is movably mounted at the outlet, and which is used to change the direction of the heat dissipation medium flowing out of the cavity.

[0007] A circulating cooling device for use in heat dissipation in electronic devices, the electronic devices including multiple heat-generating elements, includes a tank body, multiple heat sinks, a circulation drive member, and a heat exchanger. The tank body has an accommodation space and an inlet and outlet communicating with the accommodation space. The accommodation space is used to accommodate the electronic devices and a heat dissipation medium, the inlet is used to input the heat dissipation medium into the accommodation space, and the outlet is used to discharge the heat dissipation medium from the accommodation space. The heat sink is located within the accommodation space and is used to connect to the heat-generating elements, and the outlet is connected to the accommodation space. One end of the circulation drive member is connected to the outlet and the other end is connected to the input port and the inlet, and the circulation drive member is used to circulate the heat dissipation medium within the accommodation space. The heat exchanger is connected between the input port and the circulation drive member and between the inlet and the circulation drive member, and is used to reduce the temperature of the heat dissipation medium.

[0008] In some possible embodiments, the circulation cooling device further includes an export pipe and an input pipe, the export pipe communicating the outlet with the circulation drive member, and the input pipe communicating the circulation drive member with the input port and communicating the circulation drive member with the inlet.

[0009] In some possible embodiments, the input pipe includes a main duct and a branch duct, the main duct communicating between the circulation drive member and the input port, and the branch duct communicating between the main duct and the inlet.

[0010] In some possible embodiments, the branch duct includes a junction and a plurality of branch sections communicating with the junction, the junction section having one end remote from the branch section communicating with the main duct, and each of the branch sections communicating with the inlet of one of the heat sinks.

[0011] In some possible embodiments, the circulation drive member includes a pump. A circulating cooling device system includes the cooling circulation device and a heat dissipation medium, wherein the heat dissipation medium is used to contact an electronic device and absorb heat generated by the electronic device, and the circulating cooling device is used to conduct the heat in the heat dissipation medium to the outside environment.

[0012] In some possible embodiments, the heat dissipation medium comprises a fluoride liquid.

[0013] The heat sink provided by this application introduces a heat dissipation medium into a heat-generating element that generates a large amount of heat, thereby improving the heat dissipation efficiency of the heat-generating element, thereby improving the utilization rate of the heat dissipation medium, which is beneficial to reducing the energy consumption of the circulating cooling device and providing a more effective thermal solution. At the same time, by providing an inlet on one side of the heat sink and an outlet on the other side or heat-dissipating surface of the heat sink, the pressure of the heat dissipation medium in the cavity can be reduced, thereby further reducing the load on the circulating driving member. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic diagram of a circulating cooling system according to an embodiment of the present application; [Figure 2] FIG. 2 is a schematic diagram of the circulating heat dissipation device shown in FIG. [Figure 3] FIG. 2 is a schematic diagram of the heat sink shown in FIG. [Figure 4]FIG. 10 is a schematic diagram of a heat sink according to another embodiment of the present application. [Figure 5] FIG. 10 is a schematic diagram of a heat sink according to yet another embodiment of the present application. [Figure 6] FIG. 10 is a schematic diagram of a heat sink according to yet another embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0015]

[0023] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, and in the drawings, the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are illustrative and are intended to explain the present application, but should not be understood as limiting the present application.

[0016] In the description of this application, terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are based on the orientation or positional relationship shown in the drawings and are intended to facilitate and simplify the description of this application. They do not indicate or imply that a device or element has a particular orientation, or that it is configured and operates in a particular orientation, and should not be understood as limiting this application. Furthermore, terms such as "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or the number of the indicated technical features. Therefore, a feature with a term such as "first" or "second" can explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise expressly limited, "plurality" means two or more.

[0017] In the description of this application, the terms "attach," "couple," "connect," and the like should be understood broadly and may include, for example, fixedly connecting, detachably connecting, or integrally connecting. They may also include mechanically connecting, electrically connecting, or being able to communicate with each other. They may also include directly connecting, indirectly connecting via an intermediate medium, internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art will be able to understand the specific meanings of the terms in this application depending on the specific circumstances.

[0018] The following disclosure provides many different embodiments or examples for realizing different structures of the present application. To simplify the disclosure of the present application, the following describes specific example components and configurations. Of course, these are for illustrative purposes only and are not intended to limit the present application. Furthermore, the present application may duplicate symbols and / or letters in different examples; such duplication is for purposes of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configurations discussed. In addition, while the present application provides examples of various specific processes and materials, those skilled in the art may recognize the application of other processes and / or the use of other materials.

[0019] 1 , one embodiment of the present application provides a circulating cooling system 400, which includes a circulating cooling device 100 and a heat dissipation medium 200 accommodated in the circulating cooling device 100. The circulating cooling system 400 is used to cool a heat-generating electronic device 300, the heat dissipation medium 200 is in contact with the electronic device 300 and is used to absorb heat generated by the electronic device 300, and the circulating cooling device 100 accommodates the electronic device 300 and is used to transfer the heat generated by the electronic device 300 to an external environment. Specifically, the heat dissipation medium 200 is an insulating coolant, and the electronic device 300 is a server. In other embodiments of the present application, the heat dissipation medium 200 may further include a liquid metal, a phase-change material, a superconducting material, a biological medium, etc., and the circulating cooling device 100 may be applied to fields such as nuclear reactors, electronic components, magnetic resonance imaging, particle accelerators, and biomedicine.

[0020] 1 and 2, the circulating cooling device 100 includes a tank body 10, a circulation drive member 20, and a heat exchanger 30. The circulation drive member 20 and the heat exchanger 30 are provided on the outside of the tank body 10, and a heat dissipation medium 200 is provided on the inside of the tank body 10. The tank body 10 is provided with a storage space 11, an inlet 12, and an outlet 13. The inlet 12 is provided at the bottom of the tank body 10 and communicates with the storage space 11. The outlet 13 is provided near the top of the tank body 10 and communicates with the storage space 11. The storage space 11 is used to store electronic devices 300 and the heat dissipation medium 200. The electronic devices 300 are immersed in the heat dissipation medium 200. The circulation drive member 20 is connected to the inlet 12 and the outlet 13 and is used to circulate the heat dissipation medium 200 inside and outside the tank body 10. The heat exchanger 30 is connected between the outlet 13 and the circulation drive member 20, and is used to exchange heat with the heat dissipation medium 200 flowing outside the tank body 10, thereby lowering the temperature of the heat dissipation medium 200. Here, the circulation drive member 20 is a pump. The heat exchanger 30 is one of a plate-type heat exchanger, a shell-type heat exchanger, a double-pipe heat exchanger, and a fin-type heat exchanger.

[0021] Specifically, when the electronic device 300 is in use, heat is generated when it is in operation, and the low-temperature heat dissipation medium 200 flows from bottom to top through the electronic device 300 in the tank body 10, absorbing the heat and thereby becoming high-temperature heat dissipation medium 200. The high-temperature heat dissipation medium 200 is sent to the heat exchanger 30 by the circulation drive member 20, and becomes low-temperature heat dissipation medium 200 again. The low-temperature heat dissipation medium 200 is sent back into the tank body 10 by the circulation drive member 20.

[0022] In this embodiment, the circulating cooling device 100 further includes an export pipe 40 and an input pipe 60. The export pipe 40 communicates between the outlet 13 and the circulation drive member 20. The input pipe 60 communicates between the input port 12 and the circulation drive member 20. The heat exchanger 30 is attached to the input pipe 60. The export pipe 40 is used to allow the high-temperature heat dissipation medium 200 to flow out from the top of the tank 10, a portion of the input pipe 60 is used to allow the low-temperature heat dissipation medium 200 to flow into the bottom of the tank 10, and another portion of the input pipe 60 is used to introduce the heat dissipation medium 200 into the heat exchanger 30 to reduce the temperature.

[0023] Referring to FIG. 3 , in this embodiment, the circulating cooling device 100 further includes a plurality of heat sinks 50, and the electronic device 300 further includes a plurality of heat-generating elements 301, one side of each heat sink 50 being attached to the heat-generating elements 301. Each heat sink 50 is connected to the heat exchanger 30. Specifically, referring to FIG. 4 , the heat sink 50 is provided with a cavity 51 and an inlet 511 and an outlet 512 communicating with the cavity 51. The heat sink 50 includes a heat-conducting surface 52, a heat-dissipating surface 53, and a plurality of side-facing surfaces 54. The heat-conducting surface 52 and the heat-dissipating surface 53 are spaced apart from each other. The multiple side-facing surfaces 54 are connected approximately perpendicularly between the heat-conducting surface 52 and the heat-dissipating surface 53. The heat-conducting surface 52, the heat-dissipating surface 53, and the multiple side-facing surfaces 54 are arranged to surround the periphery of the cavity 51, and the heat-conducting surface 52 is attached to the heat-generating elements 301. An inlet 511 is provided on one side surface 54, and an outlet 512 is provided on the other opposite side surface 54, so that the direction in which the heat dissipating medium 200 flows into the cavity 51 is parallel to the direction in which it flows out of the cavity 51, thereby reducing the pressure within the cavity 51. Each inlet 511 is connected to the heat exchanger 30 and is used to introduce the low-temperature heat dissipating medium 200 processed by the heat exchanger 30 into the cavity 51. Heat generated by the heating element 301 is conducted to the heat dissipating medium 200 in the cavity 51 through the heat-conducting surface 52, raising the temperature of the heat dissipating medium 200, which can then be discharged into the receiving space 11 through the outlet 512. In this way, the heat generated by the heating element 301 is quickly transferred, reducing abnormal temperature increases due to heat accumulation. Here, the heat generating element 301 includes a central processing unit (CPU), a graphics processing unit (GPU), a memory, a solid state drive (SSD), a power supply module (PSU), a network interface card (NIC), etc.

[0024] The heat sink 50 provided by the present application introduces the heat dissipation medium 200 into the heat-generating element 301, thereby improving the heat dissipation efficiency of the heat-generating element 301 and thereby improving the utilization rate of the heat dissipation medium 200, which is beneficial to reducing the energy consumption of the circulating cooling device 100 and providing a more effective thermal solution. At the same time, an inlet 511 is provided on one side surface 54 of the heat sink 50, and an outlet 512 is provided on the other side surface 54 of the heat sink 50, thereby reducing the pressure of the heat dissipation medium 200 in the cavity 51, thereby further reducing the load on the circulating driving member 20.

[0025] 4 , in another embodiment of the present application, the heat dissipation plate 50 has a substantially rectangular parallelepiped shape, and its four side surfaces 54 are vertically connected in a contiguous manner. An inlet 511 is provided on one of the side surfaces 54, and there are a plurality of outlets 512, which are symmetrically provided on the two side surfaces 54 adjacent to the inlet 511. In this way, the direction in which the heat dissipation medium 200 flows into the cavity 51 and the direction in which it flows out of the cavity 51 are substantially perpendicular to each other, which can further reduce the pressure of the heat dissipation medium 200 in the cavity 51.

[0026] 5, in yet another embodiment of the present application, the heat dissipation plate 50 has a substantially rectangular parallelepiped shape, with four side surfaces 54 that are vertically connected to each other, an inlet 511 provided on one of the side surfaces 54, and a plurality of outlets 512 that are provided on the heat dissipation surface 53. In this manner, the direction in which the heat dissipation medium 200 flows into the cavity 51 is substantially perpendicular to the direction in which it flows out of the cavity 51, thereby reducing the preheating effect on other elements, such as heat-sensitive elements around the heat-generating element 301, such as a central processing unit (CPU) or a graphics processing unit (GPU).

[0027] 6, in yet another embodiment of the present application, the heat dissipation plate 50 further includes a guide plate 57, which is rotatably mounted on the outlet 512 and is used to change the direction of the heat dissipation medium 200 flowing out of the cavity 51. In this way, the heat distribution can be redistributed, and preheating of the thermal element can be further reduced.

[0028] Referring again to FIG. 2 , in this embodiment, the input pipe 60 includes a main duct 61 and branch ducts 62. The main duct 61 is connected to the input port 12 and the circulation driving member 20. The heat exchanger 30 is mounted on the main duct 61. One end of the branch duct 62 is connected to a portion of the main duct 61 between the heat exchanger 30 and the input port 12, and the other end is connected to the inlet 511. Here, the branch duct 62 includes a junction 621 and a plurality of branch portions 622 connected to the junction 621. One end of the junction 621 remote from the branch portion 622 is connected to the main duct 61, and each branch portion 622 is connected to the inlet 511 of one heat sink 50. In this way, the division and distribution capabilities of the heat dissipation medium 200 can be improved, and the uniformity and efficiency of the circulating cooling system 400 can be improved.

[0029] Referring again to FIG. 3 , in this embodiment, the heat sink 50 further includes a heat sink body 55 and a fixing member 56. The heat sink body 55 is substantially rectangular, and the cavity 51, inlet 511, and outlet 512 are all provided in the heat sink body 55. The heat sink body 55 further includes a fixing hole 551, which is offset from the inlet 511 and the outlet 512. The fixing member 56 passes through the fixing hole 551, with one end of the fixing member 56 inserted into the electronic device 300 and the other end abutting the heat sink body 55, thereby ensuring close contact between the heat conducting surface 52 and the heat generating element 301. This improves the efficiency of heat conduction from the heat generating element 301 to the heat conducting surface 52. Specifically, the fixing member 56 is a screw.

[0030] In this embodiment, the material of the heat dissipation medium 200 includes one or more of fluorinated liquid, water, ethylene glycol solution, and mineral oil. Preferably, the fluorinated liquid includes a fully fluorinated organic substance, and the number of carbon atoms in a single molecule is 5 to 18.

[0031] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. Accordingly, the embodiments are to be considered in all respects as illustrative and not restrictive. The scope of the present application is indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

[0032] Finally, the above embodiments are for illustrating the technical solution of the present application, but are not intended to limit it. Although the present application has been described in detail with reference to preferred embodiments, those skilled in the art may modify or substitute equivalents for the technical solution of the present application, and may make such modifications or substitute equivalents without departing from the spirit and scope of the technical solution of the present application. [Explanation of symbols]

[0033] 400 Circulating Cooling System 100 Circulating cooling device 200 Heat dissipation medium 300 Electronic equipment 301 Heating element 10 Tank body 11 Containment Space 12 Input port 13 Outlet 20 Circulation drive member 30 heat exchanger 40 Export pipe 50 Heat sink 51 Cavity 511 Entrance 512 Exit 52 Heat conductive surface 53 Heat radiation surface 54 Side surface 55 Heat sink body 551 Fixed hole 56 Fixing member 57 Guide plate 60 input tube 61 Main Duct 62 Branch Duct 621 Junction 622 Branch

Claims

1. A heat sink used to dissipate heat from a heat generating element, Including the heat sink body, The heat dissipation body is provided with a cavity and an inlet and an outlet communicating with the cavity; The heat dissipation body includes a heat conduction surface, a heat dissipation surface, and a side surface, and the heat conduction surface, the heat dissipation surface, the heat conduction surface, the heat dissipation surface, and the side surface are arranged to surround the cavity, the inlet is provided on the side surface, the outlet is provided on the heat dissipation surface and / or the side surface, and the heat conduction surface is used to contact the heat generating element; the inlet is used to introduce a heat dissipation medium into the cavity; A heat sink, characterized in that the heat dissipation medium in the cavity absorbs heat and is discharged from the outlet.

2. The heat sink further includes a fixing member, The heat sink body is provided with a fixing hole; The fixing hole is provided offset from the inlet or the outlet, The heat sink according to claim 1 , wherein the fixing member passes through the fixing hole to fix the heat sink to the heat generating element.

3. The heat sink further includes a guide plate, The guide plate is movably provided at the outlet, The heat sink according to claim 1 , wherein the guide plate is used to change the direction of the heat sink medium flowing out of the cavity.

4. A circulating cooling device used for heat dissipation of electronic equipment, the electronic device includes a plurality of heat generating elements; The circulating cooling device is An accommodation space and an input port and an outlet port communicating with the accommodation space are provided, the accommodation space is used to accommodate an electronic device and a heat dissipation medium; the inlet is used for the heat dissipation medium to enter the accommodation space, the outlet is a tank body used for discharging the heat dissipation medium from the accommodation space; 4. A plurality of heat sinks according to claim 1, wherein the heat sinks are provided in the accommodation space, are used to connect to the heat generating element, and the outlets are in communication with the accommodation space; a circulation drive member, one end of which is connected to the discharge port and the other end of which is connected to the input port and the inlet port, and which is used to cause the heat dissipation medium to flow within the accommodation space; a heat exchanger that is in communication between the input port and the circulation drive member, and also in communication between the inlet port and the circulation drive member, and is used to reduce the temperature of the heat dissipation medium.

5. the circulating cooling device further includes an export pipe and an input pipe; the export pipe communicates the outlet with the circulation drive member; The circulating cooling device according to claim 4 , wherein the input pipe connects the circulation drive member to the input port and also connects the circulation drive member to the inlet.

6. the input pipe includes a main duct and a branch duct; the main duct communicates the circulation drive member with the input port; The circulating cooling system according to claim 5 , wherein the branch duct communicates the main duct with the inlet.

7. the branch duct includes a junction and a plurality of branch portions communicating with the junction, an end of the junction portion farther from the branch portion communicates with the main duct; The circulating cooling device according to claim 6 , wherein each of the branched portions communicates with the inlet of one of the heat sinks.

8. The circulating cooling device of claim 4 , wherein the circulating drive member includes a pump.

9. 1. A circulating cooling system comprising: A heat dissipation medium and the circulating cooling device according to any one of claims 5 to 8, the heat dissipation medium is in contact with an electronic device and is used to absorb heat generated by the electronic device; A circulating cooling system, characterized in that the circulating cooling device is used to conduct heat in the heat dissipation medium to an external environment.

10. The circulating cooling system of claim 9 , wherein the heat dissipation medium includes a fluoride liquid.

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