Tungsten filament double-layer electrolytic plating device
By optimizing the tungsten wire electroplating process through a double-layer plating tank design and winding roller structure, the problems of large footprint and high consumption of plating solution in existing equipment have been solved, achieving high-efficiency tungsten wire electroplating, which is suitable for diamond wire production.
Patent Information
- Application Number
- CN202423304285.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing tungsten wire electroplating equipment requires multiple plating tanks, resulting in a large footprint, complicated maintenance, high consumption of plating solution, and low efficiency.
The design employs a double-layer plating tank and incorporates winding rollers at both ends of the tank, allowing the tungsten wire to pass through the electrolytic tank multiple times for electroplating. Combined with a circulation pipeline and tray structure, this optimizes the distribution and flow of the plating solution, reduces the amount of plating solution used, and improves efficiency.
It effectively reduces equipment footprint, lowers costs, improves electroplating efficiency, and ensures coating uniformity and adhesion, making it suitable for diamond wire production.
Smart Images
Figure CN223620511U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electrolysis equipment technology, specifically relating to a tungsten wire double-layer electrolytic plating device. Background Technology
[0002] Currently, in the production of diamond wire or steel cord using tungsten wire, electroplating is required to coat the tungsten wire with a layer of brass alloy to create electroplated brass wire. This wire then undergoes further processing to produce the desired product. The electroplating process includes pretreatment of the tungsten wire, followed by copper plating, zinc plating, and thermal diffusion. Both copper and zinc plating processes require electroplating equipment. Current electroplating equipment typically requires multiple plating tanks to ensure complete copper or zinc plating. Because multiple plating tanks are arranged sequentially, the overall equipment is long, occupies a large area, is difficult to maintain, and requires a large volume of plating solution, resulting in low efficiency. Summary of the Invention
[0003] This invention addresses the problems of existing tungsten wire electroplating processes, which typically require multiple plating tanks to ensure complete copper or zinc plating. The sequential arrangement of these tanks results in a long overall equipment size, large footprint, cumbersome maintenance, and a large volume of plating solution required, leading to low efficiency. The invention provides a double-layer electrolytic plating device for tungsten wires. By using double-layer plating tanks and winding rollers at both ends, the tungsten wire passes through both tanks multiple times after passing through the winding rollers, achieving electroplating. This effectively reduces the size of the plating equipment, decreases the volume of plating solution required, and improves plating efficiency.
[0004] To achieve the above objectives, the technical solution of this utility model is as follows:
[0005] A tungsten wire double-layer electrolytic plating device includes two electrolytic cells arranged vertically. A storage tank is provided on one side of each electrolytic cell. A circulation pipeline is provided between the storage tank and the electrolytic cells for circulating the plating solution between the storage tank and the electrolytic cells. The plating solution for plating is circulated between the storage tank and the electrolytic cells through the circulation pipeline.
[0006] Each electrolytic cell has a first partition at both ends, and two second partitions are arranged between the two first partitions. The first and second partitions are provided with corresponding strip holes. Multiple sets of support blocks are arranged between the two second partitions. Each set of support blocks is provided with a tray. The tray is a tray structure surrounded by a mesh plate. The tray is provided with a plating block lower than the strip holes. The plating block and the plating solution work together as the anode, and the tungsten wire is used as the cathode to apply the anode material to the surface of the tungsten wire.
[0007] Both ends of the electrolytic cell are equipped with winding rollers, and tungsten wires are wound between the two winding rollers. The tungsten wires extending tangentially along the upper side of the winding rollers pass through the strip-shaped holes of the upper electrolytic cell, and the tungsten wires extending tangentially along the lower side of the winding rollers pass through the strip-shaped holes of the lower electrolytic cell. Through the cooperation of the winding rollers with the upper and lower electrolytic cells, the tungsten wires are wound on the winding rollers and pass through the electrolytic cells multiple times to carry out the electroplating process.
[0008] Preferably, the circulation pipeline includes a supply pipe and an outlet pipe. One end of the supply pipe is connected to the lower end of the storage tank, and the other end is connected to the interior of the corresponding electrolytic cell. The bottom of the electrolytic cell between adjacent first and second partitions is provided with a drain port. The drain port is connected to an outlet pipe. The end of the outlet pipe away from the drain port is connected to the upper end of the storage tank. The plating solution enters the electrolytic cell from the supply pipe and flows back to the storage tank through the outlet pipe to achieve the circulation of the plating solution.
[0009] Preferably, each electrolytic cell is provided with at least one liquid inlet pipe. The liquid inlet pipe is connected to the inside of the corresponding electrolytic cell through the liquid inlet pipe. The liquid inlet pipe is lower than the tray in the electrolytic cell and has multiple liquid outlets. The plating solution in the liquid inlet pipe is transported to the liquid inlet pipe and enters the electrolytic cell through the multiple liquid outlets to ensure the uniform distribution and agitation effect of the plating solution in the electrolytic cell.
[0010] The supply pipe is equipped with a delivery pump and a filter. The filter is located on one side of the outlet end of the delivery pump. The delivery pump drives the plating solution to achieve circulation, and the filter removes impurities from the plating solution.
[0011] Preferably, there are gaps between the tray and the inner wall of the electrolytic cell, as well as between multiple trays, to ensure full contact between the tray and the plating solution.
[0012] Preferably, the plating block is a plurality of copper blocks or a plurality of zinc blocks, which dissolve during electroplating and are then plated onto the surface of the tungsten wire.
[0013] The tray is a tray surrounded by a titanium mesh plate. The tray is provided with a partition, and the partition is provided with a plating block. The partition is made of conductive material. The mesh plate structure of the tray can fully contact the plating solution. The partition prevents the plating block from falling into the electrolytic tank, thereby ensuring full contact between the plating block and the plating solution.
[0014] The partition is a layered structure made of polypropylene fibers.
[0015] Preferably, the winding roller has multiple winding grooves, and the tungsten wire is wound sequentially on the multiple winding grooves. The arrangement of multiple winding grooves avoids interference between the tungsten wires.
[0016] A method for double-layer electrolytic plating of tungsten wire, implemented using the aforementioned double-layer electrolytic plating apparatus, includes the following steps:
[0017] Step 1: Wind at least one tungsten wire multiple times on two winding rollers. The minimum distance between two adjacent turns of the same tungsten wire is 4mm, and the minimum distance between two adjacent tungsten wires is 8mm. After winding, control the linear speed at 3-20m / min.
[0018] Step 2: Start the transfer pump, and the plating solution circulates between the storage tank and the electrolytic cell through the circulation pipeline;
[0019] The plating solution level in the electrolytic cell should be at least 0.5 cm higher than the tungsten wire;
[0020] Step 3: Make the tray and tungsten wire conductive and control the line speed at 25±0.5m / min.
[0021] Preferably, it is used for copper or zinc plating on the surface of tungsten wire;
[0022] When copper is plated on the surface of a tungsten wire, the plating block consists of multiple copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphate and pure water, the copper ion concentration is 27±7 g / L, the pH value is 8.3±0.4, the temperature is set at 50±5℃, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005 mm.
[0023] When galvanizing the surface of tungsten wire, the plating block consists of multiple zinc blocks. The plating solution is a zinc sulfate solution made by mixing zinc sulfate and pure water. The concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5℃, and the thickness of the zinc plating layer is 0.00025±0.00005mm.
[0024] Preferably, after the tungsten wire is wound in step one, the tungsten wire speed is controlled to be 3m / min, 11m / min, or 20m / min;
[0025] In step three, after the tray and tungsten wire are made conductive, the line speed is controlled at 25m / min.
[0026] Preferably, when the tungsten wire is wound on the winding roller, the distance between two adjacent turns of the same tungsten wire is 5 mm, and the distance between two adjacent tungsten wires is 10 mm.
[0027] The beneficial effects of this utility model through the above technical solution are as follows:
[0028] 1. This utility model sets up a winding roller and two corresponding electrolytic cells, so that the tungsten wire passes through the electrolytic cells multiple times during the winding process of the two winding rollers and completes the electroplating process in the electrolytic cells. Compared with the existing method of electroplating by connecting multiple electrolytic cells end to end, this effectively reduces the equipment footprint, reduces the amount of plating solution used in the electroplating process, and improves the processing efficiency of electroplated brass. With the plating device of this utility model, the total length of the electrolytic cell is reduced from 40m to about 4m, the number of pumps is greatly reduced, and the equipment cost and electricity cost are reduced by about 80%.
[0029] 2. This utility model effectively avoids interference caused by mutual contact when tungsten wires are wound on the winding roller by opening multiple winding grooves on the winding roller.
[0030] 3. This utility model adopts a tray with a mesh structure, which allows the tray to fully contact the plating solution, effectively increasing the contact area between the tray and the plating solution. At the same time, the tray structure and the partition layer set on it support the plating blocks, preventing them from falling out of the mesh of the tray. In addition, the block structure of the plating blocks increases the contact area between the plating blocks and the plating solution, effectively increasing the electrolysis efficiency and ensuring the plating effect on the surface of the tungsten wire.
[0031] 4. This utility model sets up an inlet pipe in the electrolytic cell and opens multiple outlets on the inlet pipe, so that the plating solution is evenly diffused after entering the electrolytic cell, so that the plating solution is fully and evenly in contact with the tungsten wire, tray, plating block and other materials. At the same time, the plating solution is transported into the electrolytic cell through multiple outlets, which plays a role in disturbing and stirring the plating solution in the electrolytic cell.
[0032] 5. This utility model uses two second partitions to continuously transport the plating solution into the electrolytic cell between the two second partitions, causing the liquid level to rise continuously. When the liquid level reaches the position of the strip hole of the second partition, it overflows into the electrolytic cell between the adjacent first and second partitions and is discharged from the electrolytic cell through the drain port. During this process, the liquid level in the electrolytic cell is maintained to ensure that the plating solution submerges the tungsten wire.
[0033] 6. The coating of this utility model is uniform, and the bonding strength and ductility are improved. After testing, in the subsequent process of drawing tungsten wire from a diameter of 0.06mm to 0.031mm for diamond wire production, 200km of diamond wire were continuously produced without any deviation problems. The diameter of the 200km diamond wire produced using the method of this application was maintained at 0.031±0.0005mm. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 .
[0035] Figure 2This is a schematic diagram of the structure of the present invention. Figure 2 .
[0036] Figure 3 This is a schematic diagram of the distribution structure of the support block and the liquid inlet pipe of this utility model.
[0037] Figure 4 This is a schematic diagram of the structure of this utility model after tungsten wire is wound around it.
[0038] Figure 5 This is a schematic diagram of the structure of this utility model with tungsten wire wound on a winding roller.
[0039] Figure 6 This utility model Figure 5 Enlarged view of point A in the middle.
[0040] The numbers in the attached diagram are as follows: 1 is an electrolytic cell, 2 is a storage tank, 3 is the first partition, 4 is the second partition, 5 is a strip hole, 6 is a support block, 7 is a tray, 8 is a winding roller, 9 is a liquid supply pipe, 10 is a liquid outlet pipe, 11 is a liquid inlet pipe, 12 is a transfer pump, 13 is a liquid drain, 14 is a plating block, 15 is a tungsten wire, and 16 is a winding groove. Detailed Implementation
[0041] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:
[0042] like Figures 1-6 As shown, this embodiment provides a tungsten wire double-layer electrolytic plating device, including two electrolytic cells 1 arranged vertically, and a storage tank 2 is provided on one side of each electrolytic cell 1.
[0043] The storage tank 2 is equipped with a plating solution. When copper is plated onto tungsten wire, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphate and pure water, wherein the copper ion concentration is 27±7 g / L, the pH value is 8.3±0.4, the temperature is set at 50±5℃, and the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1.
[0044] When galvanizing tungsten wire, the plating solution is a zinc sulfate solution made by mixing zinc sulfate and pure water. The concentration of the zinc sulfate solution is 225±75 g / L, the pH value is 1.4-2.2, and the temperature is set at 35±5℃.
[0045] A circulation pipeline is provided between the storage tank 2 and the electrolytic cell 1 for circulating the plating solution between the storage tank 2 and the electrolytic cell 1. The circulation pipeline is equipped with a delivery pump 12 and a filter. In actual use, the delivery pump 12 makes the plating solution circulate between the storage tank 2 and the electrolytic cell 1 through the circulation pipeline. On the one hand, it ensures that the plating solution has sufficient and effective contact with the tungsten wire 15 and ensures the plating quality. On the other hand, during the circulation of the plating solution, the filter removes impurities from the plating solution.
[0046] Each electrolytic cell 1 has a first partition 3 at both ends, and two second partitions 4 are arranged between the two first partitions 3. Corresponding strip-shaped holes 5 are formed on both the first partitions 3 and the second partitions 4. In use, tungsten wires 15 pass through the strip-shaped holes 5 to enter and exit the electrolytic cell 1. Multiple sets of support blocks 6 are arranged between the two second partitions 4, and each set of support blocks 6 has a tray 7. Gaps exist between the tray 7 and the inner wall of the electrolytic cell 1, as well as between the multiple trays 7. The tray 7 is a tray structure formed by a mesh plate, thus effectively... To ensure the contact area between the plating solution and the tray 7, the tray 7 is provided with plating blocks 14 that are lower than the slotted holes 5. The tray 7 is a tray surrounded by a mesh plate made of titanium. The tray 7 is provided with a partition, and the plating blocks 14 are provided on the partition. The plating blocks 14 are multiple copper blocks or multiple zinc blocks. The partition is made of conductive material and is a layered structure made of polypropylene fiber. On the one hand, the partition will not affect the transmission of current. On the other hand, the partition effectively prevents the plating blocks 14 from falling through the mesh of the tray 7.
[0047] When copper plating is performed on tungsten wire, the plating solution and copper block are used as the anode and tungsten wire 15 is used as the cathode. Under the action of electrolysis, copper ions are deposited and plated on the surface of tungsten wire. Pyrophosphate in the plating solution reacts with the copper block, causing the copper block to dissolve into copper ions, thus ensuring that the concentration of copper ions in the plating solution is in dynamic equilibrium.
[0048] When galvanizing tungsten wire, the plating solution and zinc block are used as the anode, and tungsten wire 15 is used as the cathode. Under electrolysis, zinc particles are deposited and plated on the surface of the tungsten wire. Meanwhile, sulfuric acid in the plating solution reacts with the zinc block, causing the zinc block to dissolve into zinc ions, thus ensuring that the concentration of zinc ions in the plating solution is in dynamic equilibrium.
[0049] Both ends of the electrolytic cell 1 are provided with winding rollers 8, and tungsten wires 15 with a diameter of 0.05-0.15 mm are wound between the two winding rollers 8. The winding direction can be clockwise or counterclockwise. The tungsten wires 15 extending tangentially along the upper side of the winding rollers 8 pass through the strip-shaped holes 5 of the upper electrolytic cell 1, and the tungsten wires 15 extending tangentially along the lower side of the winding rollers 8 pass through the strip-shaped holes 5 of the lower electrolytic cell 1. Through the arrangement of the two winding rollers 8, the tungsten wires pass through the electrolytic cell 1 between the two winding rollers 8 during the winding process. The tungsten wires pass through the corresponding electrolytic cell 1 through the strip-shaped holes 5, and the tungsten wires are immersed in the electrolytic cell 1. Without being immersed in the plating solution, the tungsten wire is wound multiple times and then passed through the electrolytic cell 1 multiple times, so that the tungsten wire 15 stays in the plating solution for 60-80 seconds. At the same time, the concentration of copper or zinc ions in the electrolytic cell 1 is in dynamic equilibrium. Thus, by using only two electrolytic cells 1 and winding rollers 8, the plating quality can be guaranteed while effectively reducing the space occupied by the equipment (i.e., two electrolytic cells 1 replace the original dozen or more), effectively reducing costs, and reducing the amount of plating solution used (the volume of plating solution used for copper plating is about 6% of the original, and the volume of plating solution used for zinc plating is about 15% of the original), further reducing costs.
[0050] The winding roller 8 has multiple winding grooves 16 arranged sequentially along the axial direction of the winding roller 8. The tungsten wires 15 are wound sequentially on the multiple winding grooves 16, thereby separating the tungsten wires wound on the winding roller 8 through the winding grooves 16 to avoid them contacting each other and causing interference, thus ensuring the smooth progress of electroplating.
[0051] The circulation pipeline includes a supply pipe 9 and an outlet pipe 10. One end of the supply pipe 9 is connected to the lower end of the storage tank 2, and the other end is connected to the interior of the corresponding electrolytic cell 1. A transfer pump 12 and a filter are installed on the supply pipe 9. The filter is located on one side of the outlet end of the transfer pump 12. The plating solution in the storage tank 2 is transported to the electrolytic cell 1 (between the two second partitions 4 in the electrolytic cell 1) through the supply pipe 9 by the transfer pump 12. As the transfer continues, the liquid level of the plating solution in the electrolytic cell 1 rises to the position of the strip hole 5 on the second partition 4. The plating solution flows into the space between the adjacent first partition 3 and second partition 4 through the slot 5. The bottom of the electrolytic cell 1 between the adjacent first partition 3 and second partition 4 is provided with a drain port 13. The drain port 13 is connected to the outlet pipe 10. The end of the outlet pipe 10 away from the drain port 13 is connected to the upper end of the storage tank 2. The plating solution overflows into the area between the adjacent first partition 3 and second partition 4 through the slot 5 and flows back into the storage tank 2 through the outlet pipe 10. During this process, the plating solution immerses the tungsten wire that passes through the slot 5.
[0052] Each electrolytic cell 1 is equipped with at least one inlet pipe 11. The supply pipe 9 is connected to the interior of the corresponding electrolytic cell 1 through the inlet pipe 11. The inlet pipe 11 is lower than the tray 7 in the electrolytic cell 1 and has multiple outlets. The supply pipe 9 delivers the plating solution to the inlet pipe 11 and enters the electrolytic cell through the multiple outlets. The multiple outlets allow the plating solution to spread rapidly in the electrolytic cell 1 and disturb the plating solution in the electrolytic cell 1. This, combined with the circulation of the plating solution between the electrolytic cell 1 and the storage tank 2, ensures that the plating solution near the tungsten wire is constantly being replaced, maintains the concentration of copper or zinc ions near the tungsten wire, and ensures the plating effect.
[0053] As one possible implementation, the bottom surface of the electrolytic cell 1 between the first partition 3 and the second partition 4 is set as an inclined surface, and the lower end of the inclined surface extends to the drain port 13, thereby allowing the plating solution to flow back into the storage tank 2 quickly.
[0054] As one possible implementation, each of the winding rollers 8 is provided with a spray pipe (not shown in the figure) above it, which is used to spray and rinse the tungsten wire 15 that extends out of the electrolytic tank 1 and is wound on the winding roller 8, to wash away the copper or zinc that was plated on the surface of the tungsten wire 15 during the electroplating process but is attached to the surface of the tungsten wire 15, so as to avoid affecting the subsequent electroplating process.
[0055] A method for double-layer electrolytic plating of tungsten wire, implemented using the aforementioned double-layer electrolytic plating apparatus, includes the following steps:
[0056] Step 1: Wind at least one tungsten wire 15 around two winding rollers 8 for 7-10 turns. The minimum distance between two adjacent turns of the same tungsten wire 15 is 4mm, and the minimum distance between two adjacent tungsten wires 15 is 8mm. After winding, control the linear speed at 3-20m / min.
[0057] After the tungsten wire 15 is wound in step one, the linear speed of the tungsten wire 15 is controlled to be 3m / min, 11m / min, or 20m / min to prevent the tungsten wire 15 from moving suddenly when energized later, which could damage the tungsten wire 15.
[0058] When the tungsten wire 15 is wound on the winding roller 8, the distance between two adjacent turns of the same tungsten wire 15 is 5mm, and they are located in two adjacent winding grooves 16 respectively. The distance between two adjacent tungsten wires is 10mm, that is, the two closest turns of two tungsten wires 15 are separated by a winding groove 16 (e.g., Figure 6 (As shown).
[0059] Step 2: Start the transfer pump 12, and the plating solution circulates between the storage tank 2 and the electrolytic cell 1 through the circulation pipeline;
[0060] The plating solution level in electrolytic cell 1 should be at least 0.5 cm higher than the tungsten wire.
[0061] Step 3: Make the tray and tungsten wire conductive and control the line speed at 25±0.5m / min.
[0062] In step three, the tray and tungsten wire are made conductive, and the line speed is controlled at 24.5 m / min, 25 m / min, or 25.5 m / min to ensure that the residence time of the tungsten wire 15 in the plating solution is 60s, 70s, or 80s.
[0063] When copper is plated on the surface of a tungsten wire, the plating block consists of multiple copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphate and pure water, the copper ion concentration is 27±7 g / L, the pH value is 8.3±0.4, the temperature is set at 50±5℃, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005 mm.
[0064] In actual use, the copper ion concentration in the solution is maintained at 27±7 g / L by mixing copper pyrophosphate with pure water, the pH of the plating solution is adjusted to 8.3±0.4 by adding pyrophosphate, and the concentration ratio of copper ions to pyrophosphate ions in the plating solution is adjusted to 1:7.5±1 by adding potassium pyrophosphate.
[0065] When zinc is plated on the surface of tungsten wire, the plating block consists of multiple zinc blocks. The plating solution is a zinc sulfate solution made by mixing zinc sulfate and pure water. The concentration of the zinc sulfate solution is 225±75 g / L, the pH value is 1.4-2.2, the temperature is set at 35±5℃, and the thickness of the zinc plating layer is 0.00025±0.00005 mm.
[0066] In actual use, the pH value of the plating solution is adjusted to 1.4-2.2 by adding sulfuric acid to the plating solution.
[0067] like Figure 4 As shown in the figure, the arrows indicate the winding direction of the tungsten wire 15. The tungsten wire 15 is wound on two winding rollers 8 and passes through two electrolytic cells 1. That is, the tungsten wire 15 passes through one of the electrolytic cells 1 tangentially along the winding roller 8 (passing through the strip holes 5 on the first partition 3 and the second partition 4 in each electrolytic cell 1), and then wound on the other winding roller 8 (the tungsten wire 15 is wound in the corresponding winding groove 16 on the winding roller 8, and each time it is wound in a different winding groove 16). Then, it passes through the other electrolytic cell 1 tangentially along the other winding roller 8. Subsequently, the tungsten wire 15 is wound through the winding roller 8 and through the electrolytic cell 1 multiple times (the tungsten wire 15 is wound on the winding roller 8 7-10 times), ensuring that the tungsten wire 15 stays in the plating solution for 60s, 70s or 80s, thereby ensuring the thickness of the copper or zinc layer plated on the surface of the tungsten wire 15.
[0068] Plating solution circulation process: The transfer pump 12 delivers the plating solution in the storage tank 2 through the filter and then through the supply pipe 9 to the inlet pipe 11. The solution then enters the electrolytic cell 1 between the two second partitions 4 through multiple outlets on the inlet pipe 11. As the plating solution continues to enter, its liquid level gradually rises. When the plating solution submerges the tungsten wire 15, its liquid level corresponds to the height of the strip hole 5. The plating solution then overflows into the electrolytic cell 1 between the two second partitions 4 on the opposite side (i.e., between the adjacent first partition 3 and second partition 4). Subsequently, the plating solution flows back into the storage tank 2 from the drain port 13 through the outlet pipe 10. Thus, the plating solution in the electrolytic cell 1 is in dynamic equilibrium.
[0069] Electroplating process: Electricity is supplied to the tungsten wire 15 and tray 7 in the electrolytic cell 1 through the rectifier. Under the action of electrolysis, copper or zinc ions near the tungsten wire 15 are precipitated and electrolytically plated onto the surface of the tungsten wire 15. The copper or zinc blocks in the electrolytic cell 1 dissolve into copper or zinc ions, ensuring that the concentration of copper or zinc ions in the plating solution is in dynamic equilibrium. As the reaction continues, a copper or zinc layer is plated onto the surface of the tungsten wire 15.
[0070] In actual production, copper is first plated on the surface of tungsten wire 15 using a plating device of this invention, and then zinc is plated on the surface of tungsten wire 15 using another plating device. Then, thermal diffusion is performed to complete the electroplating of brass.
[0071] The embodiments described above are merely preferred embodiments of this utility model and are not intended to limit the scope of implementation of this utility model. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the patent claims of this utility model should be included within the scope of the patent application of this utility model.
Claims
1. A tungsten wire double-layer electrolytic plating device, characterized in that, It includes two electrolytic cells (1) arranged vertically, and a storage tank (2) is provided on one side of the electrolytic cell (1). A circulation pipeline is provided between the storage tank (2) and the electrolytic cell (1) for the circulation of plating solution between the storage tank (2) and the electrolytic cell (1). Each electrolytic cell (1) has a first partition (3) at both ends, and two second partitions (4) are provided between the two first partitions (3). The first partitions (3) and the second partitions (4) are provided with corresponding strip holes (5). Multiple sets of support blocks (6) are provided between the two second partitions (4). Each set of support blocks (6) is provided with a tray (7). The tray (7) is a tray structure surrounded by a mesh plate. The tray (7) is provided with a plating block (14) lower than the strip hole (5). Both ends of the electrolytic cell (1) are provided with winding rollers (8), and tungsten wires (15) are wound between the two winding rollers (8). The tungsten wires (15) extending tangentially along the upper side of the winding rollers (8) pass through the strip hole (5) of the upper electrolytic cell (1), and the tungsten wires (15) extending tangentially along the lower side of the winding rollers (8) pass through the strip hole (5) of the lower electrolytic cell (1).
2. The tungsten wire double-layer electrolytic plating device according to claim 1, characterized in that, The circulation pipeline includes a supply pipe (9) and an outlet pipe (10). One end of the supply pipe (9) is connected to the lower end of the storage tank (2), and the other end is connected to the interior of the corresponding electrolytic cell (1). The bottom of the electrolytic cell (1) between the adjacent first partition (3) and second partition (4) is provided with a drain port (13). The drain port (13) is connected to the outlet pipe (10). The end of the outlet pipe (10) away from the drain port (13) is connected to the upper end of the storage tank (2).
3. The tungsten wire double-layer electrolytic plating device according to claim 2, characterized in that, Each electrolytic cell (1) is provided with at least one liquid inlet pipe (11). The liquid supply pipe (9) is connected to the interior of the corresponding electrolytic cell (1) through the liquid inlet pipe (11). The liquid inlet pipe (11) is lower than the tray (7) in the electrolytic cell (1) and has multiple liquid outlets. The liquid supply pipe (9) is equipped with a delivery pump (12) and a filter, with the filter located on one side of the outlet end of the delivery pump (12).
4. The tungsten wire double-layer electrolytic plating apparatus according to claim 1, characterized in that, There are gaps between the tray (7) and the inner wall of the electrolytic cell (1) and between multiple trays (7).
5. The tungsten wire double-layer electrolytic plating apparatus according to claim 1, characterized in that, The plating block (14) is a plurality of copper blocks or a plurality of zinc blocks; The tray (7) is a tray surrounded by a mesh plate made of titanium. The tray (7) is provided with a partition, and the partition is provided with a plated block (14). The partition is made of conductive material. The partition is a layered structure made of polypropylene fibers.
6. The tungsten wire double-layer electrolytic plating apparatus according to claim 1, characterized in that, The winding roller (8) has multiple winding grooves (16), and the tungsten wire (15) is wound sequentially on the multiple winding grooves (16).