System

Abstract

The present disclosure relates to a system. There is provided a system comprising: an optical module comprising: one or more optical components; an optical module substrate, in which the optical module substrate protrudes on at least one side of the module, in which a protruding portion of the module substrate includes one or more ground pads; and an EMI shield, where the EMI shield includes at least one shielding member.

Description

Technical Field

[0001] The exemplary embodiments of this disclosure generally relate to grounding of integrated external electromagnetic interference (EMI) shielding. Background Technology

[0002] Electromagnetic interference (EMI) shielding creates a Faraday cage effect, which attenuates electromagnetic (EM) wave radiation and / or prevents EM emissions from circuit components such as optical sensors from being emitted outside the circuit board. Conductive metal cans, typically manufactured by stamping and / or stretching sheets of metal material, create a conductive encapsulation around the main circuit board containing the optical sensor. These conventional manufacturing methods, including circuit board-level metal can shielding, can introduce problems such as an increased overall footprint of the shielding circuit board. Due to the manufacturing process of stamped metal sheet cans, the corners of the cans have a minimum radius, which increases the coverage area of ​​the EMI shield. Additionally, using multiple metal cans to cover irregularly shaped components introduces points where EM waves may leak, especially at higher frequencies. In some examples, circuit board-level metal can shielding does not prevent internal EMI crosstalk between components within the same EMI shield. Furthermore, using circuit board-level shielding incurs costs in terms of quality assurance, ensuring proper assembly and grounding, the process of assembling the shield, and the material cost of the shielding elements.

[0003] The inventors have identified numerous areas for improvement in the prior art and methods, which are the subjects of the embodiments described herein. Many of these deficiencies, challenges, and problems have been addressed through applied effort, inventiveness, and innovation by developing solutions incorporated into the embodiments of this disclosure, some examples of which are described in detail herein. Utility Model Content

[0004] The various embodiments described herein relate to improved assembly and grounding of integrated external EMI shielding (e.g., for optical sensor modules).

[0005] According to some embodiments of this disclosure, an example method for assembling and grounding an integrated external EMI shield is provided. The method may include assembling a module including a module substrate protruding on at least one side of the module, wherein the protruding portion of the module substrate includes one or more grounding pads; and coupling an EMI shield including at least one shielding component to the module.

[0006] In some embodiments, the method may include applying an adhesive to the module for adhering an EMI shield to the module; and curing the adhesive.

[0007] In some embodiments, the module substrate protrudes on one side of the module, wherein the protruding portion of the module substrate includes two or more discrete grounding pads.

[0008] In some embodiments, the EMI shield includes discrete cutouts to prevent the sprayed solder from expanding beyond a desired thickness.

[0009] In some embodiments, the method may include applying sprayed solder to one or more ground pads on a module substrate.

[0010] In some embodiments, the module substrate protrudes on one side of the module, wherein the protruding portion of the module substrate includes an elongated grounding pad.

[0011] In some embodiments, the method may include applying a conductive adhesive to an elongated grounding pad to create a conductive connection between a module substrate and an EMI shield; and curing the conductive adhesive.

[0012] In some embodiments, the method may include applying solder paste to an elongated ground pad to create a conductive connection between the module substrate and the EMI shield; and reflowing the solder paste.

[0013] In some embodiments, the module substrate protrudes on all sides of the periphery of the module, wherein the protruding portion of the module substrate includes a peripheral ground pad.

[0014] In some embodiments, the method may include applying a conductive adhesive to a peripheral ground pad to create a conductive connection between a module substrate and an EMI shield; and curing the conductive adhesive.

[0015] In some embodiments, the method may include applying solder paste to a peripheral ground pad to create a conductive connection between a module substrate and an EMI shield; and reflowing solder paste.

[0016] In some embodiments, the module substrate includes one or more grounding pads on the underside of the module substrate.

[0017] In some embodiments, the method may include applying conductive adhesive to one or more ground pads on the underside of a module substrate; coupling a bottom EMI shielding component to the module via the one or more ground pads; curing the conductive adhesive; and coupling a top EMI shielding component to the bottom EMI shielding component.

[0018] In some embodiments, coupling the top EMI shielding component to the bottom EMI shielding component includes using mechanical coupling.

[0019] In some embodiments, the module substrate includes conductive vias, wherein the conductive vias surround the periphery of the module substrate.

[0020] In some embodiments, the module substrate includes conductive vias, wherein the conductive vias are distributed throughout the module substrate.

[0021] In some implementations, the method may include applying a mask to a defined area to remain uncoated; spraying the EMI shield with a conductive coating such that the conductive coating grounds the EMI shield to the one or more ground pads; removing the mask; and curing the conductive coating.

[0022] In some embodiments, the method may include printing a conductive coating on an EMI shield; applying a conductive adhesive to the one or more grounding pads; and curing the conductive adhesive.

[0023] In some embodiments, the method may include printing a conductive coating on an EMI shield; applying solder paste to the one or more ground pads; and reflowing the solder paste.

[0024] In some embodiments, the method may include using a darkened EMI shield, wherein the darkened EMI shield is composed of at least one of the following: nickel-phosphorus; nickel oxide; graphene; or a dark coating.

[0025] According to some embodiments of this disclosure, a system is provided, including: an optical module, comprising: one or more optical components; an optical module substrate, wherein the optical module substrate protrudes on at least one side of the module, wherein the protruding portion of the module substrate includes one or more ground pads; and an EMI shield, wherein the EMI shield includes at least one shielding component.

[0026] In some embodiments, the EMI shield is coupled to the optical module substrate via at least one of: conductive adhesive; solder paste; or sprayed solder.

[0027] In some embodiments, the optical module substrate includes a grounding conductive via that spans the thickness of the optical module substrate and wherein the conductive via surrounds the periphery of the optical module substrate.

[0028] The above overview is provided merely to outline some exemplary embodiments to provide a basic understanding of some aspects of this disclosure. Therefore, it will be understood that the above embodiments are merely illustrative and should not be construed as limiting the scope or spirit of this invention in any way. It will also be understood that the scope of this disclosure covers many potential embodiments in addition to those outlined herein, some of which will be further described below. Attached Figure Description

[0029] Having thus generally described some exemplary embodiments of this disclosure, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and in which:

[0030] Figure 1AA perspective view of an exemplary EMI shield with cutouts according to one or more embodiments of the present disclosure is shown.

[0031] Figure 1B A front view of an exemplary EMI shield with cutouts according to one or more embodiments of the present disclosure is shown.

[0032] Figure 2 An exemplary method for assembling a module including an EMI shield with cutouts, according to one or more embodiments of the present disclosure, is shown.

[0033] Figure 3A A perspective view is shown of an exemplary module including an EMI shield grounded using an elongated grounding pad, according to one or more embodiments of the present disclosure.

[0034] Figure 3B A cross-sectional view is shown of an exemplary module including an EMI shield grounded using an elongated grounding pad, according to one or more embodiments of the present disclosure.

[0035] Figure 4A An exemplary method for assembling a module including an EMI shielding element, grounded using an elongated grounding pad and conductive adhesive, is shown according to one or more embodiments of the present disclosure.

[0036] Figure 4B An exemplary method for assembling a module comprising an EMI shield using an elongated ground pad and solder grounding, according to one or more embodiments of the present disclosure, is shown.

[0037] Figure 5A An exemplary method for assembling a module comprising a protruding periphery of a module substrate and corresponding peripheral ground pads, according to one or more embodiments of the present disclosure, is shown.

[0038] Figure 5B An exemplary method of assembling a module according to one or more embodiments of the present disclosure is shown. The module includes a protruding periphery of a module substrate and corresponding peripheral ground pads using conductive adhesive.

[0039] Figure 6 An exemplary method for assembling a module including a multi-component EMI shield is shown according to one or more embodiments of the present disclosure.

[0040] Figure 7A A perspective view of an exemplary substrate according to one or more embodiments of the present disclosure is shown, the substrate including conductive vias surrounding its periphery.

[0041] Figure 7BA cross-sectional perspective view of an exemplary substrate according to one or more embodiments of the present disclosure is shown. The exemplary substrate includes a conductive via connected to a ground plane that extends across the thickness of the substrate and surrounds the periphery of the substrate.

[0042] Figure 8 An exemplary method of applying a conductive coating to a module including an elongated ground pad is shown according to one or more embodiments of the present disclosure.

[0043] Figure 9 An exemplary method of applying a conductive coating to a module including an elongated ground pad is shown according to one or more embodiments of the present disclosure.

[0044] Figure 10 A perspective view of an exemplary EMI shield including a coated cap member and an elongated grounding pad, according to one or more embodiments of the present disclosure, is shown.

[0045] Figure 11 A perspective view of an exemplary EMI shielding member including a coated cap member and discrete grounding pads according to one or more embodiments of the present disclosure is shown.

[0046] Figure 12 A perspective view of an exemplary EMI shielding member, including at least a darkened portion, according to one or more embodiments of the present disclosure, is shown.

[0047] Figures 13A to 13K This is an example flowchart illustrating the operation of assembling a module with EMI shielding according to one or more embodiments of the present invention. Detailed Implementation

[0048] Some embodiments of this disclosure will now be described more fully herein with reference to the accompanying drawings, which illustrate some, but not all, of the embodiments of this disclosure. In fact, various embodiments of this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to enable this disclosure to meet applicable legal requirements. The same reference numerals throughout denote the same elements.

[0049] As used herein, the term “comprising” means including but not limited to and should be interpreted in the manner commonly used in the patent context. The use of broader terms, such as including, comprising, and having, should be understood to provide support for narrower terms, such as consisting of, substantially consisting of, and substantially composed of.

[0050] The phrases “in various embodiments,” “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally mean that the specific feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure, and can be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0051] The terms “example” or “exemplary” are used herein to mean “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as being better or more advantageous than other implementations.

[0052] If the specification states that "can," "able," "may," "should," "will," "preferably," "possibly," "typically," "optionally," "for example," "often," or "maybe" (or other such language) is included or has a characteristic, then the particular component or feature is not required to be included or have that characteristic. Such a component or feature may be optionally included in some embodiments or may be excluded.

[0053] Overview

[0054] Various embodiments of this disclosure relate to improved EMI shielding and its grounding. Various embodiments may include EMI shielding, which may be composed of a metal can, a plastic can, and / or other materials. Various embodiments may include EMI shielding for applications such as optical modules.

[0055] Various embodiments may include using a portion of the optical module substrate (different from the circuit board) protruding beyond the optical module as the location of one or more grounding pads to which the EMI shielding is grounded. Various embodiments may include an EMI shielding covering at least a portion of the thickness of the optical module substrate (e.g., using a metal can, injection molding of plastic with embedded conductive filler, using conductive foam sheets, etc.), which can attenuate EM radiation that may leak through the substrate thickness itself. Various embodiments may include multi-component (e.g., at least two-component) metal cans coupled to each other and grounded to the underside of the optical module substrate. In various embodiments, the underside of the optical module substrate is the side opposite to the side including the optical module. Various embodiments may include multiple conductive vias within the periphery of the optical module substrate, which can attenuate EM radiation that may leak through the substrate thickness itself. Various embodiments may include an EMI shielding comprising a sprayed and / or printed conductive coating that can be applied directly to the module and / or can.

[0056] In some examples, this disclosure includes numerous advantages, including forming stronger solder joints through cutouts to prevent solder from spreading beyond the required thickness, attenuating EMI leakage from the substrate thickness itself through overhangs in the EMI shield, grounding the EMI shield to mitigate EMI, attenuating EMI leakage from the substrate thickness itself through plated vias distributed throughout the module substrate (e.g., around the perimeter of the module substrate), reducing optical crosstalk by using a darkened and / or blackened coating, and / or other advantages.

[0057] Exemplary systems and apparatus

[0058] Embodiments of this disclosure herein include systems and apparatuses for improving their EMI shielding and grounding, which are described herein and can be implemented in various embodiments.

[0059] Figure 1A A perspective view of an exemplary EMI shield with cutouts according to one or more embodiments of the present disclosure is shown. Figure 1A Module 100A is shown, which may include an EMI shield 101, an optical module substrate 102, ground pads 103a…N, and cutouts 104a…N. In various embodiments, the EMI shield 101 may be metal. In various embodiments, a protruding portion of the module substrate 102 may include ground pads 103a…N. In various embodiments, the ground pads 103a…N are discrete ground pads. For example, the discrete ground pads may be “small” (e.g., relative to the EMI shield and the module as a whole). For example, the size of the discrete ground pads may be within a range (e.g., preferably, the width and length are about two hundred micrometers). In various embodiments, the cutouts 104a…N are discrete cutouts. For example, the discrete cutouts may correspond in size to the discrete ground pads.

[0060] Figure 1B A front view of an exemplary EMI shield with cutouts according to one or more embodiments of the present disclosure is shown. Figure 1BA front view of module 100B is shown, which may include notches 104a…N and solder 105a…N (e.g., solder balls). Solder 105a…N may be sprayed solder and / or otherwise applied. In various embodiments, the notches 104a…N on the EMI shield 101 may allow local dispersion of the sprayed solder 105a-…N, for example, preventing the sprayed solder from spreading beyond the boundaries of the notches 104a-…N and becoming too thin, thereby mitigating potential solder cracking problems. In various embodiments, the EMI shield 101 may extend downwards at least a portion of the thickness of the module substrate (e.g., overhanging the sides of the module substrate), which may allow the EMI shield to attenuate EMI leakage from the thickness of the substrate itself. For example, the EMI shield may extend downwards along the thickness of the substrate on three of the four sides of the module substrate.

[0061] Figure 2 An exemplary method 200 for assembling a module including an EMI shield with cutouts, according to one or more embodiments of the present disclosure, is shown. Figure 2 A method 200 for assembling a module including an EMI shield with cutouts, such as... Figure 1A-1B The methods shown are as follows. Method 200 shows an assembled module at 201, a module with an attached adhesive (e.g., which can be bonded) at 202, an attached EMI shield at 203, a cured adhesive at 204, solder spraying at 205a, and an enlarged view 205b of the solder spraying at 205a. In various embodiments, cuts 104a…N allow for stronger solder joints by preventing the sprayed solder 105a…N from extending beyond the desired thickness.

[0062] Figure 3A A perspective view is shown of an exemplary module including an EMI shield grounded using an elongated grounding pad, according to one or more embodiments of the present disclosure. Figure 3A Module 300A is shown, which may include an optical module 301, an EMI shield 302, an adhesive 303, and a grounding pad 304 (e.g., having an adhesive). In various embodiments, the EMI shield 302 may extend downwards along at least a portion of the thickness of the module substrate, which may allow the EMI shield to attenuate EMI leakage from the thickness of the substrate itself. For example, the EMI shield may extend downwards along the thickness of the substrate on three of the four sides of the module substrate. The adhesive 303 may allow the EMI shield 302 to be attached to the optical module 301.

[0063] Figure 3B A cross-sectional view is shown of an exemplary module including an EMI shield grounded using an elongated grounding pad, according to one or more embodiments of the present disclosure. Figure 3BModule 300B is shown, which is a cross-sectional view of module 300A. Module 300B shows protruding portions of optical module 301, EMI shield 302, adhesive 303, ground pad 304, conductive adhesive 306, and module substrate 305. The protruding portion of module substrate 305 may include at least one ground pad (e.g., an elongated ground pad). For example, the elongated ground pad may be "large" relative to the size of the EMI shield and / or the module. For example, the elongated ground pad may approximately correspond in size to the width of the EMI shield. For example, conductive adhesive 306 (e.g., silver-based adhesive, etc.) may be used to electrically couple the EMI shield 302 to the ground pad 304.

[0064] Figure 4A An exemplary method 400A for assembling a module including an EMI shielding element grounded using an elongated grounding pad and conductive adhesive is shown according to one or more embodiments of the present disclosure. Figure 4A A method 400A for assembling a module is shown, the module including an EMI shield and an elongated grounding pad with conductive adhesive, for example... Figures 3A-3B Those shown in the diagram. Method 400A shows the assembled module at 401, the adhesive dispensed in the provided plastic bag for attaching the EMI shield 302 to the top of the module 401 and the conductive adhesive dispensed onto the protruding substrate grounding pad 304 at 402, the attached EMI shield at 403, and the cured adhesive at 404.

[0065] Figure 4B An exemplary method 400B for assembling a module including an EMI shield using an elongated ground pad and solder grounding, according to one or more embodiments of the present disclosure, is shown. Figure 4B A method 400B for assembling a module including an EMI shield and an elongated grounding pad with solder is shown, for example. Figures 3A-3B The methods shown are as follows. Method 400B shows the assembled module at 405, dispensing adhesive for attaching the EMI shield 302 to the top of the module 401 into a provided pouch at 406, dispensing solder paste onto the protruding substrate ground pad 304, attaching the EMI shield at 407, curing the adhesive at 408, and reflowing the dispensed solder paste at 409.

[0066] Figure 5AAn exemplary method 500A is shown for assembling a module including a protruding periphery of a module substrate and corresponding peripheral ground pads using solder paste according to one or more embodiments of the present disclosure. Method 500A shows the assembly of the module having a protruding periphery of a module substrate and corresponding peripheral ground pads at 501, dispensing solder paste onto the ground pads at 502, dispensing adhesive into a bag provided on top of the module at 503 to attach an EMI shield to the module, attaching the EMI shield at 504, curing the adhesive at 505, and reflowing the solder paste at 506.

[0067] Figure 5B An exemplary method 500B for assembling a module according to one or more embodiments of the present disclosure is illustrated. The module includes a protruding periphery of a module substrate and corresponding peripheral ground pads using conductive adhesive. Method 500B shows the assembly module having a protruding periphery of the module substrate and corresponding peripheral ground pads at 507, dispensing conductive adhesive onto the peripheral ground pads at 508, dispensing adhesive into an adhesive pouch on top of the module at 509 for attaching an EMI shield to the module, attaching the EMI shield at 510, and curing the adhesive at 511.

[0068] Figure 6An exemplary method of assembling a module including a multi-component EMI shield according to one or more embodiments of the present disclosure is illustrated. Method 600 shows an assembled module having a ground pad 601a (e.g., at a corner on the underside of a substrate) at 601, dispensing conductive adhesive onto the ground pad 601a at 602, coupling a bottom portion of the EMI shield to the module at 603, curing the conductive adhesive at 604, and coupling a top portion of the EMI shield to the bottom portion at 605. The multi-component EMI shield may include two or more components. In various embodiments, the multi-component EMI shield may consist of two components. In various embodiments, a first portion (e.g., a bottom portion) of the EMI shield may be positioned on the underside of the assembled module. In various embodiments, the underside of the optical module substrate is the side opposite to the side including the optical module. In various embodiments, a second portion (e.g., a top portion) of the EMI shield may be positioned on top of the module, which can form a fully encapsulated EMI shield module. In various embodiments, the top side of the module is the side including the optical module. In various embodiments, two or more portions of the EMI shield can be coupled to each other in various ways, for example, they can be mechanically coupled to each other. In various embodiments, to facilitate grounding of the EMI shield (e.g., a metal can), the optical module substrate can include ground pads, such as ground pad 601a, which can be positioned differently (e.g., on the underside of the module substrate). In various embodiments, conductive adhesive can be applied to ground pad 601a before coupling the module to the first portion of the EMI shield. In various embodiments, the conductive adhesive can make the ground pad 601a of the module substrate contact the EMI shield, which can achieve grounding for EMI mitigation.

[0069] Figure 7A A perspective view of an exemplary substrate according to one or more embodiments of the present disclosure is shown, the substrate including conductive vias surrounding its periphery. Exemplary substrate 700A shows a module substrate 701 and conductive vias 701a…N surrounding the periphery of the module substrate 701. In various embodiments, the peripheral vias 701a…N may be plated vias. In various embodiments, when coupled to the ground of the module (e.g., a ground pad), the peripheral vias 701a…N can provide a conductive barrier to prevent electromagnetic waves from escaping through the thickness of the module substrate 701 itself. In various embodiments, the peripheral vias can be combined with any other EMI shielding method to provide complete EMI shielding around the module, such as the EMI shielding methods described herein (e.g., Figure 1A-6 and Figure 8-12 EMI shielding methods).

[0070] Figure 7BA cross-sectional perspective view of an exemplary substrate including conductive vias connected to the substrate's ground plane and spanning the substrate's periphery is shown. Exemplary substrate 700B shows a module substrate 702 and conductive vias 702a…N surrounding the periphery of the module substrate 702. In various embodiments, vias 702a…N may be plated vias extending across the entire thickness of the substrate and electrically connected to the substrate's ground. In various embodiments, when vias 702a…N are coupled to the module's ground (e.g., ground pads), a conductive barrier can be provided to prevent electromagnetic waves from escaping through the thickness of the module substrate 702 itself. In various embodiments, vias may be combined with any other EMI shielding method, such as those described herein. In various embodiments, vias 702a…N may be peripheral vias, such as those surrounding the ground plane. Figure 7A Those described above. In various embodiments, electroplated vias can be combined with any other EMI shielding method, such as the EMI shielding methods described herein (e.g., Figure 1A-6 and Figure 8-12 EMI shielding methods).

[0071] Figure 8 An exemplary method 800 is illustrated, according to one or more embodiments of the present disclosure, of applying a conductive coating to a module including an elongated ground pad. Method 800 illustrates an example of spraying and / or printing a conductive coating (e.g., a polymer-based conductive coating) on ​​a module for EMI shielding. Method 800 shows, at 801, an assembled module having an elongated ground pad on a protruding portion of a module substrate, at 802 a masked via, at 803 spraying and / or printing the conductive coating, and at 804 removing the mask and curing the conductive coating. In various embodiments, the conductive coating may be sprayed onto the module and / or onto a separate can. In various embodiments, the conductive coating may be printed onto the module and / or onto a separate can. In various embodiments, the spraying and / or printing of the conductive coating may also cover at least a portion of the thickness of the module substrate, which may allow shielding of electromagnetic waves emitted from the substrate thickness. In various embodiments, when printing the conductive coating, printing may skip printing on vias / desired areas (e.g., instead of using a mask on the vias). In various embodiments, sprayed and / or printed coatings may be applied to elongated ground pads.

[0072] Figure 9An exemplary method 900 is illustrated, according to one or more embodiments of the present disclosure, of applying a conductive coating to a module including an elongated ground pad. Method 900 includes: at 901, illustrating a cover component (e.g., the cover component may be made of plastic); at 903, coating the cover component with a conductive material (e.g., copper-nickel) (e.g., using chemical plating and / or physical vapor deposition (PVD)); assembling the module with the coated cover component (wherein the module substrate includes a protrusion having an elongated ground pad 903a); at 904, applying a conductive adhesive and / or solder to the ground pad such that the conductive adhesive and / or solder also contact the coated cover 904a; and at 905, curing (e.g., oven curing) and / or reflowing to arrange the conductive adhesive and / or solder.

[0073] Figure 10 Perspective view 1000 illustrates an exemplary EMI shielding component including a coated cap assembly and an elongated ground pad according to one or more embodiments of the present disclosure. Perspective view 1000 shows an assembled module 1001 including a coated cap 1002 (e.g., the cap may be coated with a metallic material, such as copper-nickel, via chemical plating and / or PVD, wherein the coating process may involve using a mask to mask optical openings on the module to ensure that the coating does not cover these openings, thereby hindering the performance of the optical module), and solder paste dispensed onto an elongated ground pad 1003 on a protruding portion of the module substrate. In various embodiments, when the module is reflowed, the solder paste couples the coated cap to the ground pad on the module substrate.

[0074] Figure 11 Perspective view 1100 shows an exemplary EMI shielding component including a coated cap member and discrete ground pads according to one or more embodiments of the present disclosure. Perspective view 1100 shows an assembled module 1101 including a coated cap 1102 (e.g., the cap may be coated with a metallic material, such as copper-nickel, by chemical plating and / or PVD), and sprayed solder 1103a…N distributed in the form of balls on discrete ground pads, the ground pads being separated by solder masks on protrusions on the module substrate. In various embodiments, the discrete ground pads may be small ground pads separated by solder masks to prevent the sprayed solder balls from spreading too wide and / or too thin in that area. For example, a small ground pad may be approximately one hundred micrometers.

[0075] Figure 12A perspective view 1200 is shown of an exemplary EMI shielding member comprising at least a black portion according to one or more embodiments of the present disclosure. Perspective view 1200 shows an assembled module 1201 including a cap having a dark portion extending to a surface 1202, and solder 1203 on an elongated ground pad on a protruding portion of a module substrate. In various embodiments, darkening can be achieved by coating at least a portion of the conductive coated cap 1002 with a dark color (e.g., black), applying a second coating with anti-reflective properties, and / or using a darkening / blackening conductive coating (e.g., nickel oxide, nickel phosphide, graphene, etc.). In various embodiments, the darkened cap can reduce optical crosstalk. The darkened / blackening EMI shielding member can be used in conjunction with one or more embodiments described herein, which may include darkening the top side of the assembled EMI shielding member 101.

[0076] It should be readily understood that, in addition to those explicitly described herein, embodiments of the systems and devices described herein can be configured in a variety of additional and alternative ways.

[0077] Exemplary methods

[0078] Figures 13A to 13K Example flowchart illustrating operations for assembling a module with EMI shielding according to one or more embodiments of the present disclosure.

[0079] Figure 13A Example flowchart 1300A illustrates an operation for assembling a module including an EMI shield with cutouts, according to one or more embodiments of the present disclosure.

[0080] In operation 1301, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0081] In operation 1302, the module can be assembled such that the module substrate protrudes from one side of the module. In various embodiments, the protruding portion of the module substrate may include two or more discrete ground pads (e.g., ground pads 103a…N).

[0082] In operation 1303, an adhesive can be applied to the module. In various embodiments, the adhesive may allow EMI shielding to adhere to the module. In various embodiments, the adhesive can be cured. In various embodiments, curing may include oven curing.

[0083] In operation 1304, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield includes at least one shielding component. In various embodiments, the EMI shield includes discrete cutouts (e.g., cutouts 104a…N) to prevent sprayed solder from spreading beyond a desired thickness.

[0084] In operation 1305, the application of sprayed solder to the two or more discrete ground pads of the module substrate can be performed. In various embodiments, the sprayed solder may be solder balls (e.g., solder balls 105a…N).

[0085] Figure 13B Example flowchart 1300B illustrates the operation of assembling a module comprising an EMI shield grounded using an elongated grounding pad and conductive adhesive, according to one or more embodiments of the present disclosure.

[0086] In operation 1306, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0087] In operation 1307, the module assembly can be performed such that the module substrate protrudes from one side of the module. In various embodiments, the protruding portion of the module substrate (e.g., protrusion 305) may include an elongated ground pad (e.g., ground pad 304).

[0088] In operation 1308, adhesive can be applied to the module to adhere the EMI shielding to the module. In various embodiments, the adhesive can be cured. In various embodiments, curing may include oven curing.

[0089] In operation 1309, conductive adhesive may be applied to the elongated grounding pad to create a conductive connection between the module substrate and the EMI shield.

[0090] In operation 1310, an EMI shield can be coupled to the module. In various embodiments, the EMI shield may include at least one shielding component.

[0091] In operation 1311, the conductive adhesive can be cured. In various embodiments, curing may include oven curing.

[0092] Figure 13C Example flowchart 1300C illustrates the operation of assembling a module comprising an EMI shield grounded using elongated ground pads and solder paste, according to one or more embodiments of the present disclosure.

[0093] In operation 1312, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0094] In operation 1313, the module assembly can be performed such that the module substrate protrudes from one side of the module. In various embodiments, the protruding portion of the module substrate (e.g., protrusion 305) may include an elongated ground pad (e.g., ground pad 304).

[0095] At operation 1314, adhesive can be applied to the module to adhere the EMI shielding to the module.

[0096] In operation 1315, solder paste can be applied to an elongated ground pad to create a conductive connection between the module substrate and the EMI shield.

[0097] At operation 1316, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield may include at least one shielding component.

[0098] In operation 1317, reflow solder paste and curing adhesive can be performed. In various embodiments, curing may include oven curing.

[0099] Figure 13D An example flowchart 1300D is shown for operations of assembling a module according to one or more embodiments of the present disclosure. The module includes a protruding periphery of a module substrate and corresponding peripheral ground pads using conductive adhesive.

[0100] In operation 1318, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0101] In operation 1319, the module is assembled such that the module substrate protrudes on all sides (e.g., all four sides) of the module periphery. In various embodiments, the protruding portions of the module substrate include peripheral ground pads.

[0102] In operation 1320, adhesive can be applied to the module to adhere the EMI shielding to the module. In various embodiments, the adhesive can be cured. In various embodiments, curing may include oven curing.

[0103] In operation 1321, conductive adhesive can be applied to the peripheral ground pad to create a conductive connection between the module substrate and the EMI shield.

[0104] In operation 1322, an EMI shield can be coupled to the module. In various embodiments, the EMI shield may include at least one shielding component.

[0105] In operation 1323, the adhesive can be cured. In various embodiments, curing can be oven curing.

[0106] In various embodiments, flowchart 1300D can describe, for example, Figure 5B The method shown.

[0107] Figure 13E An example flowchart 1300E illustrates an operation for assembling a module including a protruding periphery of a module substrate and corresponding peripheral ground pads using solder, according to one or more embodiments of the present disclosure.

[0108] In operation 1324, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0109] In operation 1325, the module is assembled such that the module substrate protrudes on all sides (e.g., all four sides) of the module's periphery. In various embodiments, the protruding portions of the module substrate include peripheral ground pads.

[0110] In operation 1326, adhesive can be applied to the module to adhere the EMI shielding to the module.

[0111] In operation 1327, solder (e.g., solder paste) may be applied to a peripheral ground pad to create a conductive connection between the module substrate and the EMI shield.

[0112] In operation 1328, an EMI shield can be coupled to the module. In various embodiments, the EMI shield may include at least one shielding component.

[0113] In operation 1329, reflow solder and curing adhesive can be performed. In various embodiments, curing may include oven curing.

[0114] Figure 13F Example flowchart 1300F is shown for assembling a module including a multi-component EMI shield according to one or more embodiments of the present disclosure.

[0115] In operation 1330, the assembly of a module, including a module substrate, can be performed.

[0116] In operation 1331, the module assembly can be performed such that the module substrate includes one or more ground pads on the underside of the module substrate.

[0117] At operation 1332, conductive adhesive can be applied to one or more grounding pads on the underside of the module substrate.

[0118] At operation 1333, the bottom EMI shielding component (e.g.,) can be installed via one or more ground pads. Figure 6 The first EMI shielding component is coupled to the module.

[0119] In operation 1334, the conductive adhesive can be cured. In various embodiments, curing may include oven curing.

[0120] In operation 1335, the top EMI shielding component (e.g., Figure 6 The top EMI shielding component is coupled to the bottom EMI shielding component. In various embodiments, coupling the top EMI shielding component to the bottom EMI shielding component may include mechanical coupling.

[0121] Figure 13G An example flowchart 1300G is shown for assembling a module having a substrate, according to one or more embodiments of the present disclosure, the substrate including conductive vias around its periphery.

[0122] At operation 1336, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0123] At operation 1337, the assembly module is performed such that the module substrate includes conductive vias extending through the thickness of the substrate. In various embodiments, the conductive vias may surround the periphery of the module substrate (e.g., as shown in the image). Figure 7A (As shown).

[0124] In operation 1338, adhesive can be applied to the module to adhere the EMI shielding to the module.

[0125] In operation 1339, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield may include at least one shielding component.

[0126] In operation 1340, the adhesive can be cured. In various embodiments, curing may include oven curing.

[0127] Figure 13H An example flowchart 1300I is shown for assembling a module by applying (e.g., spraying) a conductive coating to a module including an elongated ground pad, according to one or more embodiments of the present disclosure.

[0128] At operation 1346, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate includes one or more ground pads.

[0129] At operation 1347, a mask can be applied to areas determined to remain uncoated. For example, a mask can be applied to holes in an optical module to prevent coating from the holes.

[0130] At operation 1348, it is possible to perform the application of a conductive coating to the EMI shielding component (e.g., the module itself, such as regarding...). Figure 8 As described, the conductive coating grounds the EMI shielding to one or more ground pads. In various embodiments, the conductive coating may be sprayed onto the cap component (e.g., as described regarding...). Figure 9 The above).

[0131] At operation 1349, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield may include at least one shielding component.

[0132] In operation 1350, mask removal can be performed.

[0133] In operation 1350, the conductive coating can be cured.

[0134] Figure 13I Example flowchart 1300J is shown for assembling a module by applying (e.g., printing) a conductive coating to a module including an elongated ground pad and using a conductive adhesive, according to one or more embodiments of the present disclosure.

[0135] In operation 1352, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate includes one or more ground pads.

[0136] In operation 1353, a mask may be applied to areas determined to remain uncoated. For example, a mask may be applied to holes in an optical module to prevent coating from being applied to the holes. In various embodiments, such as when printing a conductive coating, the application of a mask may be omitted.

[0137] In operation 1354, the conductive coating can be printed onto the EMI shielding. In various embodiments, the conductive coating can be printed directly onto the module itself (e.g., as per [reference to...]). Figure 8 (As described). In various embodiments, the conductive coating can be printed onto the cap component (e.g., as described in...). Figure 9 The above).

[0138] In operation 1355, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield may include at least one shielding component.

[0139] In operation 1356, conductive adhesive can be applied to one or more ground pads.

[0140] In operation 1357, the conductive adhesive can be cured. In various embodiments, curing may include oven curing.

[0141] Figure 13J An example flowchart 1300K is shown for assembling a module by applying (e.g., printing) a conductive coating to a module including an elongated ground pad and using solder, according to one or more embodiments of the present disclosure.

[0142] In operation 1358, assembly of a module including a module substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate includes one or more ground pads.

[0143] In operation 1359, a mask may be applied to areas determined to remain uncoated. For example, a mask may be applied to holes in an optical module to prevent coating from being applied to the holes. In various embodiments, such as when printing a conductive coating, the application of a mask may be omitted.

[0144] In operation 1360, the conductive coating can be printed onto the EMI shielding. In various embodiments, the conductive coating can be printed directly onto the module itself (e.g., as per [reference to...]). Figure 8 (As described). In various embodiments, the conductive coating can be printed onto the cap component (e.g., as described in...). Figure 9 The above).

[0145] In operation 1361, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield may include at least one shielding component.

[0146] In operation 1362, solder (e.g., solder paste) can be applied to one or more ground pads.

[0147] In operation 1363, reflow soldering can be performed.

[0148] Figure 13K An example flowchart 1300L is shown for assembling a module with a darkened EMI shield according to one or more embodiments of the present disclosure.

[0149] At operation 1364, assembly of a module including a substrate can be performed. In various embodiments, the module substrate may protrude on at least one side of the module, wherein the protruding portion of the module substrate may include one or more ground pads.

[0150] In operation 1365, adhesive can be applied to the module to adhere the EMI shielding to the module.

[0151] In operation 1366, coupling an EMI shield to the module can be performed. In various embodiments, the EMI shield may include at least one shielding component. In various embodiments, the EMI shield may be darkened by including at least one of the following: nickel-phosphorus, nickel oxide, graphene, and / or a dark coating material.

[0152] In operation 1367, the adhesive can be cured. In various implementations, curing can be oven curing.

[0153] in conclusion

[0154] The operations and / or functions of this disclosure have been described herein, such as in the flowcharts. As will be understood, computer program instructions may be loaded onto a computer or other programmable means (e.g., hardware) to produce a machine, such that the resulting computer or other programmable means implements the operations and / or functions described in the flowchart blocks herein. These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer, processor, or other programmable means to operate and / or function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of writing, the execution of which implements the operations and / or functions described in the flowchart blocks. Computer program instructions may also be loaded onto a computer, processor, or other programmable means to cause a series of operations to be performed on the computer, processor, or other programmable means to produce a computer-implemented process, such that the instructions, which execute on the computer, processor, or other programmable means, provide operations for implementing the functions and / or operations specified in the flowchart blocks. The flowchart blocks support combinations of means for performing the specified operations and / or functions, and combinations of operations and / or functions for performing the specified operations and / or functions. It will be understood that one or more boxes in a flowchart, as well as combinations of boxes in a flowchart, can be implemented by a computer system based on dedicated hardware or a combination of dedicated hardware and computer instructions that performs the specified operations and / or functions.

[0155] While this specification contains numerous specific embodiments and implementation details, these should not be construed as limiting the scope of any disclosure or claimable content, but rather as descriptions of features specific to particular embodiments of a particular disclosure. Certain features described herein in the context of a single embodiment may also be implemented in combination in that single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, although features may be described above as functioning in certain combinations and even initially claimed in this way, one or more features from a claimed combination may be removed from that combination in some cases, and the claimed combination may be for sub-combinations or variations thereof.

[0156] Although operations and / or functions are shown in a specific order in the accompanying drawings, this should not be construed as requiring such operations and / or functions to be performed in the specific order shown or in a sequential order, or to perform all shown operations to achieve the desired result. In some cases, operations and / or functions in an alternative order may be advantageous. In some cases, the actions recited in the claims can be performed in a different order and still achieve the desired result. Therefore, while specific embodiments of the subject matter have been described, other embodiments are within the scope of the appended claims.

[0157] While this detailed description has illustrated some embodiments of the present invention, the appended claims cover other embodiments of the present invention that differ from the described embodiments, based on various modifications and improvements.

[0158] In the appended claims, unless the specific terms “means for…” or “steps for…” are used in a given claim, it is not to be construed as in section 112, paragraph 6 of the U.S. Patent Act of 35 countries.

Claims

1. A system, characterized by Comprising: an optical module comprising: one or more optical components; an optical module substrate, wherein the optical module substrate protrudes on at least one side of the module, wherein the protruding portion of the module substrate comprises one or more ground pads; and an EMI shield, wherein the EMI shield comprises at least one shielding component.

2. The system of claim 1, wherein, wherein the EMI shield is coupled to the optical module substrate via at least one of: a conductive adhesive; a solder paste; or a jetted solder.

3. The system of claim 1, wherein, wherein the optical module substrate comprises a ground conductive via that spans a thickness of the optical module substrate, and wherein the conductive via surrounds a perimeter of the optical module substrate.

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