Laminated copper-based composite material structure

Abstract

The utility model provides a laminated copper-based composite material structure. The laminated copper-based composite material structure sequentially comprises a substrate layer, a transition layer and a mixing layer from bottom to top, the substrate layer is a copper layer; the transition layer is a tungsten layer; the mixed layer is composed of a copper mesh loaded with diamond particles and a copper powder layer; the diamond particles are uniformly dispersed on the copper net and are in contact with the transition layer; and the copper net and the diamond particles are uniformly distributed in the copper powder layer. According to the laminated copper-based composite material structure disclosed by the utility model, the wear-resistant layer containing the diamond particles is formed on the copper layer substrate layer and the transition layer, so that the problems that the cost is higher and the diamond coating is easy to crack in the prior art are solved, and the wear resistance of the laminated copper-based composite material structure is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of metal matrix composite material, concretely relates to laminated copper matrix composite material structure. BACKGROUND

[0002] Copper is a kind of metal material with excellent mechanical processing performance, easy to weld, high thermal conductivity and low price.However, the poor wear resistance of copper surface limits its application in actual production, such as easy oxidation in use process.Diamond has high hardness, and can significantly improve the wear resistance of copper by compounding with copper.

[0003] Currently, the wear resistance of copper is mainly improved by the method of diamond coating and copper compounding, specifically including Cu matrix alloying and Cu surface deposition transition layer method to improve the wear resistance of copper.Cu matrix alloying refers to preparing copper and other metals with good diamond combination performance into alloy to improve the bonding strength of copper matrix and diamond coating.Cu surface deposition transition layer refers to depositing a transition layer with high bonding performance to copper and diamond at the interface between copper and diamond coating to improve the bonding strength of copper matrix and diamond coating.

[0004] However, the above two methods have the problems of high cost and easy cracking of diamond coating. CONTENT OF UTILITY MODEL

[0005] The utility model aims at providing a kind of laminated copper matrix composite material structure to solve the problems of high cost and easy cracking of diamond coating in prior art.

[0006] To achieve the above-mentioned purpose, the technical scheme of a laminated copper matrix composite material structure of the utility model is as follows:

[0007] A laminated copper matrix composite material structure comprises, from bottom to top, a substrate layer, a transition layer and a mixed layer.The substrate layer is a copper layer.The transition layer is a tungsten layer.The mixed layer is composed of a copper mesh loaded with diamond particles and a copper powder layer.The diamond particles are uniformly dispersed on the copper mesh and in contact with the transition layer.The copper mesh and diamond particles are uniformly distributed in the copper powder layer.

[0008] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0009] The utility model discloses a laminated copper base composite material structure, by from bottom to top including substrate layer, transition layer, mixed layer in proper order, the substrate layer is copper layer, the transition layer is tungsten layer, the mixed layer is composed of copper screen of loading diamond particle and copper powder layer, the diamond particle evenly disperses on copper screen and contacts with transition layer, copper screen and diamond particle evenly distribute in copper powder layer, make and form a wear -resisting layer containing diamond particle on copper layer substrate layer and transition layer, solve the problem of higher cost in the prior art, diamond coating is easy to crack, further improve the wear resistance of laminated copper base composite material structure.

[0010] Further, the number of layers of the copper screen is 1 layer; the mesh number of the copper screen is 150-300 meshes; the thickness of the copper screen is 0.01-0.03 mm.

[0011] Beneficial effect: the number of layers of the copper screen is 1 layer, the mesh number of the copper screen is 150-300 meshes, and the thickness of the copper screen is 0.01-0.03 mm, which is beneficial to further improve the wear resistance of the laminated copper base composite material structure.

[0012] Further, the thickness of the copper powder layer is 0.05-0.1 mm; and the thickness of the mixed layer is 0.1-0.2 mm.

[0013] Beneficial effect: the thickness of the copper powder layer is 0.05-0.1 mm, and the thickness of the mixed layer is 0.1-0.2 mm, which is beneficial to further improve the wear resistance of the laminated copper base composite material structure.

[0014] Further, the particle size of the diamond particles is 0.05-0.1 mm.

[0015] Beneficial effect: the particle size of the diamond particles is 0.05-0.1 mm, which is beneficial to further improve the wear resistance of the laminated copper base composite material structure.

[0016] Further, the thickness of the substrate layer is 0.3-0.8 mm, and the thickness of the transition layer is 0.1-0.2 mm.

[0017] Beneficial effect: the thickness of the substrate layer is 0.3-0.8 mm, and the thickness of the transition layer is 0.1-0.2 mm, which is beneficial to further improve the wear resistance of the laminated copper base composite material structure.

[0018] The laminated copper base composite material structure of the utility model is prepared through the process sequence placement of the substrate layer, the transition layer, the diamond particles, the copper screen and the copper powder layer, and is prepared through the processes of upsetting, welding and hot pressing treatment. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is structure schematic view of the laminated copper base composite material structure of the utility model embodiment 1.

[0020] Figure 2 This is a schematic diagram of the stacked copper-based composite material structure of Embodiment 2 of this utility model.

[0021] Explanation of reference numerals in the attached figures: 1-Base layer; 2-Transition layer; 3-Mixed layer; 31-Copper mesh; 32-Diamond particles; 33-Copper powder layer. Detailed Implementation

[0022] The embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

[0023] Specific embodiment 1 of the multilayer copper-based composite material structure of this utility model:

[0024] like Figure 1 As shown, the layered copper-based composite structure comprises, from bottom to top, a base layer 1, a transition layer 2, and a hybrid layer 3; the base layer 1 is a copper layer; the transition layer 2 is a tungsten layer; the hybrid layer 3 consists of a copper mesh 31 loaded with diamond particles 32 and a copper powder layer 33; the diamond particles 32 are uniformly dispersed on the copper mesh 31 and in contact with the transition layer 2; the copper mesh 31 and the diamond particles 32 are uniformly distributed in the copper powder layer 33; the copper mesh 31 has one layer; the mesh size of the copper mesh 31 is 300 mesh; the thickness of the copper mesh 31 is 0.01 mm; the thickness of the copper powder layer 33 is 0.1 mm; the thickness of the hybrid layer 3 is 0.2 mm; the particle size of the diamond particles 32 is 0.1 mm; the thickness of the base layer 1 is 0.3 mm, and the thickness of the transition layer 2 is 0.1 mm.

[0025] Copper layer, copper mesh, copper powder, tungsten layer, and diamond particles are all existing technology products and commercially available goods can be used.

[0026] This utility model discloses a layered copper-based composite material structure, comprising, from bottom to top, a base layer, a transition layer, and a hybrid layer. The base layer is a copper layer; the transition layer is a tungsten layer; and the hybrid layer consists of a copper mesh loaded with diamond particles and a copper powder layer. The diamond particles are uniformly dispersed on the copper mesh and in contact with the transition layer. The copper mesh and diamond particles are uniformly distributed in the copper powder layer, thereby forming a wear-resistant layer containing diamond particles on the copper base layer and the transition layer. This solves the problems of high cost and easy cracking of diamond coatings in the prior art, and further improves the wear resistance of the layered copper-based composite material structure.

[0027] Specific embodiment 2 of the stacked copper-based composite material structure of this utility model:

[0028] like Figure 2The difference from Example 1 is that the mesh number of the copper mesh 31 is 150 mesh; the thickness of the copper mesh 31 is 0.03 mm; the thickness of the copper powder layer 33 is 0.05 mm; the thickness of the mixed layer is 0.1 mm; the particle size of the diamond particles 32 is 0.05 mm; the thickness of the base layer 1 is 0.8 mm, and the thickness of the transition layer 2 is 0.2 mm.

Claims

1. A layered copper-based composite material structure, characterized in that: From bottom to top, it includes a base layer, a transition layer, and a hybrid layer; the base layer is a copper layer; the transition layer is a tungsten layer; the hybrid layer consists of a copper mesh loaded with diamond particles and a copper powder layer; the diamond particles are uniformly dispersed on the copper mesh and in contact with the transition layer; the copper mesh and diamond particles are uniformly distributed in the copper powder layer.

2. The laminated copper-based composite material structure as described in claim 1, characterized in that: The copper mesh has one layer; the mesh count is 150-300; and the thickness is 0.01-0.03 mm.

3. The laminated copper-based composite material structure as described in claim 1, characterized in that: The thickness of the copper powder layer is 0.05-0.1 mm; the thickness of the mixed layer is 0.1-0.2 mm.

4. The laminated copper-based composite material structure as described in claim 1, characterized in that: The diamond particles have a particle size of 0.05-0.1 mm.

5. The laminated copper-based composite material structure according to any one of claims 1 to 4, characterized in that: The thickness of the base layer is 0.3-0.8 mm, and the thickness of the transition layer is 0.1-0.2 mm.

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