Device for removing copper nodules in PCB holes

Abstract

The utility model relates to the technical field of PCB processing, and discloses a device for removing copper nodules in PCB holes, which comprises a supporting bottom plate, a supporting top plate, a needle gauge assembly and a positioning assembly, the supporting top plate is arranged above the supporting bottom plate in parallel and is connected with the supporting bottom plate, a first end of the needle gauge assembly is fixedly connected with the supporting bottom plate, and a second end of the needle gauge assembly is fixedly connected with the positioning assembly. The second end of the needle gauge assembly extends out of the upper surface of the supporting top plate in the longitudinal direction, the first end of the positioning assembly is fixedly connected with the supporting bottom plate, and the second end of the positioning assembly extends out of the upper surface of the supporting top plate in the longitudinal direction. According to the device provided by the utility model, the needle gauge assembly and the positioning assembly are installed and fixed through the supporting bottom plate and the supporting top plate, the PCB is fixed and positioned through the positioning assembly, and all copper plug holes in the PCB are detected and repaired at a time through the needle gauge assembly. Therefore, the copper nodules in all the micropores in the PCB can be removed at a time, and the removal efficiency and quality of the copper nodules in the micropores are improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of PCB processing, specifically relates to a copper tumor in PCB hole removal device. BACKGROUND

[0002] Current electronic products are showing a trend of miniaturization and multifunctionality, which promotes the packaging form to change to three-dimensional assembly. This change can integrate more functions and components in a smaller space, meeting the market demand for light, thin, high-performance electronic products.

[0003] In order to adapt to three-dimensional assembly, circuit boards need to have more layers and more micro-hole structures. High layer number can provide more wiring space and circuit layer to realize more complex circuit design; micro-hole helps to reduce the size of the circuit board and the signal transmission path, and improve the signal transmission speed and quality. However, these high-layer, micro-hole PCBs face new challenges in the electroplating process. For example, during electroplating, due to the complexity of the process and some uncontrollable factors, copper may deposit too much in the micro-hole, causing the hole to be blocked, i.e. copper plug hole problem. This will affect the electrical performance of the circuit board, such as causing short circuit, open circuit, or affecting signal transmission, thereby reducing the quality and reliability of the circuit board.

[0004] Therefore, traditional factories add a hole inspection link after electroplating, and use tools such as needle gauges to check and repair copper plug holes manually. Needle gauge is a metal rod with a specific diameter, and workers insert it into the micro-hole to judge whether the hole is blocked and the degree of blockage according to the difficulty of insertion.

[0005] However, manual hole inspection is slow, time-consuming and labor-intensive, which seriously affects production efficiency and increases production cost. Manual hole inspection is also prone to oversight, which may miss some blocked holes, causing these defective circuit boards to flow into the next process and affecting the quality of the final product.

[0006] In addition, even if manual hole inspection finds copper plug holes, the precision and consistency of manual repair are difficult to guarantee. It may cause excessive repair, damage to the hole wall or surrounding circuit; or incomplete repair, still causing blockage problems and affecting the performance of the circuit board.

[0007] Finally, when encountering dense holes and copper plug holes in batches, the workload of manual hole inspection is huge, and it is almost impossible to complete the repair task within the specified time. Moreover, due to the above quality problems, the factory has to choose to scrap these products in many cases, which will cause huge economic losses and resource waste. UTILITY MODEL CONTENTS

[0008] The utility model discloses a PCB hole copper tumor removal device which overcomes the problems of the prior art, such as slow speed, large time and labor consumption, serious influence on production efficiency and increased production cost.

[0009] To solve the above technical problems, the technical scheme of the utility model is as follows:

[0010] According to one purpose of the utility model, a PCB hole copper tumor removal device is provided, which comprises a supporting bottom plate, a supporting top plate, a needle gauge assembly and a positioning assembly, the supporting top plate is arranged in parallel above the supporting bottom plate and is connected with the supporting bottom plate, the first end of the needle gauge assembly is fixedly connected with the supporting bottom plate, the second end of the needle gauge assembly extends out of the upper surface of the supporting top plate in the longitudinal direction, the first end of the positioning assembly is fixedly connected with the supporting bottom plate, and the second end of the positioning assembly extends out of the upper surface of the supporting top plate in the longitudinal direction.

[0011] In some optional implementation manners, a supporting plate assembly is further included, the supporting plate assembly is arranged in parallel between the supporting bottom plate and the supporting top plate, the top surface of the supporting plate assembly is connected with the supporting top plate through first supporting columns, and the bottom surface of the supporting plate assembly is connected with the supporting bottom plate through second supporting columns.

[0012] In some optional implementation manners, the supporting plate assembly comprises a plurality of supporting plates, the plurality of supporting plates are arranged in parallel, adjacent two supporting plates are connected through third supporting columns, the first layer of supporting plates from top to bottom is connected with the supporting top plate through the first supporting columns, and the last layer of supporting plates is connected with the supporting bottom plate through the second supporting columns.

[0013] In some optional implementation manners, the spacing between adjacent two supporting plates is the same or different.

[0014] In some optional implementation manners, the thickness of the supporting plate is smaller than the thickness of the supporting bottom plate and the supporting top plate.

[0015] In some optional implementation manners, the number of the first supporting columns is set to be a plurality of, and the plurality of first supporting columns are distributed along the supporting top plate;

[0016] The number of the second supporting columns is set to be a plurality of, and the plurality of second supporting columns are distributed along the supporting bottom plate;

[0017] The number of the third supporting columns is set to be a plurality of, and the plurality of third supporting columns are distributed along the supporting plate;

[0018] The first supporting column, the second supporting column and the third supporting column at the same position are coaxially arranged.

[0019] In some optional implementation manners, the first support column, the second support column and the third support column are connected through a fixing column penetrating through the support top plate, the first support column, the support plate assembly, the third support column, the second support column and the support bottom plate in sequence;

[0020] The top of the fixing column is locked and fixed with the top surface of the support top plate through a locking piece.

[0021] In some optional implementation manners, the positioning assembly comprises a plurality of positioning needles, and the positions of the plurality of positioning needles are arranged one-to-one corresponding to a plurality of positioning holes on the PCB.

[0022] In some optional implementation manners, the needle gauge assembly comprises a plurality of needle gauges, and the positions of the plurality of needle gauges are arranged one-to-one corresponding to a plurality of micro-holes on the PCB.

[0023] In some optional implementation manners, the needle gauge assembly is arranged in a plurality of groups, the positioning assembly is arranged in a plurality of groups, and one group of the needle gauge assembly and one group of the positioning assembly correspond to one PCB.

[0024] Compared with the prior art, the technical scheme of the utility model has the beneficial effects that:

[0025] The PCB hole copper tumor removal device provided by the utility model is fixed and positioned on the PCB to be detected through the support bottom plate and the support top plate, and all copper plug holes on the PCB are detected and repaired at one time through the needle gauge assembly, so that the copper tumors in all micro-holes of the PCB are removed at one time, and the micro-hole diameter of the PCB can be ensured to be within the range required by the customer. The device has simple structure and operation, and improves the copper tumor removal efficiency and quality.

[0026] The above description is only a summary of the technical scheme of the utility model, and the technical scheme of the utility model can be implemented according to the content of the specification, and the above and other purposes, characteristics and advantages of the utility model can be more obvious and easy to understand. The specific embodiments of the utility model are described below. BRIEF DESCRIPTION OF DRAWINGS

[0027] The drawings are only used to show the embodiments and are not considered as limiting the utility model. Moreover, the same reference signs are used to represent the same parts throughout the drawings. In the drawings:

[0028] Figure 1 The structure diagram of the PCB hole copper tumor removal device provided by the embodiment of the utility model is shown in the drawings.

[0029] Figure 2 is Figure 1 an enlarged schematic view of part A in Fig.

[0030] Figure 3 is Figure 1 an enlarged schematic view of part B in Fig.

[0031] Figure 4 is Figure 1 an A-A sectional view of Fig.

[0032] Figure 5 is Figure 4 an enlarged schematic view of part C in Fig.

[0033] wherein,

[0034] 10, support top plate;

[0035] 20, support bottom plate;

[0036] 30, needle gauge assembly;

[0037] 40, positioning assembly;

[0038] 50, support plate assembly;

[0039] 60, first support column;

[0040] 70, second support column;

[0041] 80, third support column;

[0042] 90, fixed column;

[0043] 901, locking piece.

[0044] The drawings are only used for illustrative description and should not be understood as limiting the patent; in order to better illustrate the embodiments, some components in the drawings may be omitted, enlarged or reduced, and do not represent the actual product size; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted; the same or similar reference numerals correspond to the same or similar components; the terms used to describe the positional relationship in the drawings are only used for illustrative description and should not be understood as limiting the patent. DETAILED DESCRIPTION

[0045] It should be noted that the embodiments in the utility model and the technical features in the embodiments can be combined with each other without conflict, and the detailed description in the specific implementation should be understood as the explanation and description of the purpose of the utility model, and should not be regarded as improper limitation of the utility model.

[0046] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the specific technical scheme of the present application will be further described in detail below with reference to the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but not to limit the scope of the present application.

[0047] In the embodiments of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0048] In addition, in the embodiments of the present application, the orientation terms such as "left", "right" are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0049] In the embodiments of the present application, unless otherwise specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium.

[0050] In the embodiments of the present application, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion. Without more limitation, the element limited by the sentence "including one" does not exclude the presence of other same elements in the process, method, article or device including the element.

[0051] In the embodiments of the present application, the words such as "exemplary" or "for example" are used to represent as an example, illustration or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words such as "exemplary" or "for example" are intended to present the relevant concept in a specific manner.

[0052] Embodiment 1

[0053] The embodiments of the present application overcome the problems in the prior art, such as slow manual hole detection, large amount of time and labor, serious influence on production efficiency, and increase of production cost, and provide a PCB hole copper tumor removal device.

[0054] The PCB hole copper tumor removal device provided by the embodiments of the present application is used forFigures 1-3 As shown, it comprises: a support top plate 10, a support bottom plate 20, a needle gauge assembly 30, and a positioning assembly 40, the support top plate 10 is arranged in parallel above the support bottom plate 20 and is connected with the support bottom plate 20, the first end of the needle gauge assembly 30 is fixedly connected with the support bottom plate 20, the second end of the needle gauge assembly 30 extends out of the upper surface of the support top plate 10 in the longitudinal direction, the first end of the positioning assembly 40 is fixedly connected with the support bottom plate 20, and the second end of the positioning assembly 40 extends out of the upper surface of the support top plate 10 in the longitudinal direction.

[0055] In the embodiment, the needle gauge assembly 30 and the positioning assembly 40 are installed and fixed by the support bottom plate 20 and the support top plate 10, and extend out of the top surface of the support top plate 10, when the PCB is inspected and repaired, the positioning assembly 40 realizes the fixation and positioning of the PCB to be inspected, and the needle gauge assembly 30 realizes the one-time inspection and repair of all copper tumors in the micro-holes of the PCB, thereby realizing the one-time removal of all copper tumors in the micro-holes of the PCB, and ensuring that the micro-hole diameter of the PCB is within the range required by the customer, the device has a simple structure, is easy to operate, and improves the removal efficiency and quality of the copper tumors in the holes.

[0056] The PCB hole copper tumor removal device is provided as a preferred embodiment, and further comprises a support plate assembly 50, which is arranged in parallel between the support bottom plate 20 and the support top plate 10, the top surface of the support plate assembly 50 is connected with the support top plate 10 through a first support column 60, and the bottom surface of the support plate assembly 50 is connected with the support bottom plate 20 through a second support column 70.

[0057] The PCB hole copper tumor removal device has the support plate assembly 50 arranged between the support bottom plate 20 and the support top plate 10, so that the needle gauge assembly 30 and the positioning assembly 40 pass through the support plate assembly 50 and then pass through the support top plate 10, thereby ensuring the stability of the PCB hole copper tumor removal device, further ensuring the stability of the needle gauge assembly 30, so that the needle gauge assembly 30 is not easy to bend and can be used repeatedly, and the alignment accuracy of the needle gauge assembly 30 and the micro-holes of the PCB is ensured, thereby ensuring the removal efficiency and quality of the copper tumors in the holes and prolonging the service life of the PCB hole copper tumor removal device.

[0058] The specific structure of the support plate assembly 50 is optimized as a preferred embodiment.

[0059] As Figures 4-5As shown, the support plate assembly 50 comprises a plurality of support plates, the plurality of support plates are arranged in parallel, and two adjacent support plates are connected through the third support column 80. The first layer of support plates is connected to the support top plate 10 through the first support column 60 from top to bottom in the longitudinal direction, and the last layer of support plates is connected to the support bottom plate 20 through the second support column 70.

[0060] That is, it can be understood that two adjacent layers of support plates are connected through the third support column 80, the uppermost layer of support plates is connected to the support top plate 10 through the first support column 60, and the last layer of support plates is connected to the support bottom plate 20 through the second support column 70.

[0061] And the specific connection mode is that the first support column 60, the second support column 70 and the third support column 80 are connected through the fixing column 90 which penetrates the support top plate 10, the first support column 60, the support plate assembly 50, the third support column 80, the second support column 70 and the support bottom plate 20 in turn. After connection, the top of the fixing column 90 is locked and fixed with the top surface of the support top plate 10 through the locking piece 901.

[0062] The first support column 60, the second support column 70 and the third support column 80 are coaxially arranged after connection.

[0063] And for PCB boards of different thicknesses, the number of layers of support plates can be optimized to adjust the length of the pin gauge assembly 30 and the positioning assembly 40 extending out of the support top plate 10.

[0064] This embodiment is a preferred embodiment, and the spacing between two adjacent layers of support plates is the same or different.

[0065] At the same time, the spacing between the uppermost layer of support plates and the support top plate 10, and the spacing between the last layer of support plates and the support bottom plate 20 are the same or different.

[0066] That is, it can be understood that the heights of the first support column 60 and the second support column 70 are the same or different, the heights of the plurality of third support columns 80 are the same or different, and the heights between the first support column 60, the second support column 70 and the plurality of third support columns 80 are the same or different.

[0067] And the height of the first support column 60, the second support column 70 and / or the plurality of third support columns 80 can be adjusted according to the thickness of the PCB board. After the thickness of the PCB board to be repaired is determined, according to the length of the pin gauge assembly 30 and the positioning assembly 40 extending out of the support top plate 10, and according to the thickness of the third support column 80, the number of support plates is adjusted, so that the length of the pin gauge assembly 30 and the positioning assembly 40 extending out of the support top plate 10 matches the PCB board to be repaired.

[0068] For example:

[0069] Assuming the number of support plates is set to seven layers, the first layer is the support top plate 10, the second to eighth layers are support plates, and the ninth layer is the support bottom plate 20, then the number of the third support columns 80 coaxially arranged with the first support column 60 and the second support column 70 is six.

[0070] Therefore, the thicknesses of the support top plate 10, the support plates, the support bottom plate 20, the first support column 60, the second support column 70 and the six third support columns 80 are shown in the following table:

[0071] Support top plate 10 4.0 mm First support column 60 2.1 mm First layer support plate 1.0 mm First layer third support column 80 9.5 mm Second layer support plate 1.0 mm Second layer third support column 80 12.8 mm Third layer support plate 1.0 mm Third layer third support column 80 9.0 mm Fourth layer support plate 1.0 mm Fourth layer third support column 80 9.0 mm Fifth layer support plate 1.0 mm Fifth layer third support column 80 15.0 mm Sixth layer support plate 1.0 mm Sixth layer third support column 80 15.0 mm Seventh layer support plate 1.0 mm Second support column 70 3.5 mm Support bottom plate 20 4.0 mm

[0072] As can be seen from the above table, the thicknesses of the support bottom plate 20 and the support top plate 10 are the same, the thickness of the support plate is less than the thicknesses of the support bottom plate 20 and the support top plate 10, the thicknesses of the multiple support plates are the same, the thicknesses of the first support column 60 and the second support column 70 are different, the thicknesses of the multiple third support columns 80 can be the same or different, and the multiple thicknesses of the third support columns 80 are arranged, which not only optimizes the installation stability of the gauge assembly 30, but also adjusts the number of support plates adaptively according to the thickness of the PCB to be repaired.

[0073] In addition, in the present embodiment, it needs to be clear that the lengths of the gauge assembly 30 and the positioning assembly 40 are fixed, so that after adjusting the number of support plates, adjusting the distance between the support top plate 10 and the support bottom plate 20, and further adjusting the length of the gauge assembly 30 and the positioning assembly 40 extending out of the support top plate 10, the length of the gauge assembly 30 and the positioning assembly 40 extending out of the support top plate 10 matches the PCB to be repaired.

[0074] Since the first support column 60, the second support column 70 and the third support column 80 are connected by the fixed column 90 which penetrates the support top plate 10, the first support column 60, the support plate assembly 50, the third support column 80, the second support column 70 and the support bottom plate 20 in turn, after connection, the top of the fixed column 90 is locked and fixed with the top surface of the support top plate 10 by the locking piece 901. Then, the specific adjustment process of the distance between the support top plate 10 and the support bottom plate 20 is as follows: the locking piece 901 is removed, the support top plate 10 and the first support column 60 are removed, the thicknesses of the third support columns 80 are referred to, the third support columns 80 to be removed or added are determined according to the thickness of the PCB to be repaired, after adjusting the distance between the support top plate 10 and the support bottom plate 20, the support plate, the first support column 60 and the support top plate 10 are assembled in turn, and finally locked and fixed by the locking piece 901, so as to adjust the length of the gauge assembly 30 and the positioning assembly 40 extending out of the support top plate 10, so that the PCB hole copper tumor removal device can be repaired for PCBs of different thicknesses.

[0075] In addition, in the embodiment, the number of the first support columns 60 is set to several, and the several first support columns 60 are distributed along the support top plate 10; the number of the second support columns 70 is set to several, and the several second support columns 70 are distributed along the support bottom plate 20; the number of the third support columns 80 is set to several, and the several third support columns 80 are distributed along the support plate; and the first support column 60, the second support column 70 and the third support column 80 at the same position are coaxially arranged, further ensuring the stability of the needle gauge assembly 30.

[0076] As a preferred embodiment, the length of the positioning assembly 40 is greater than the length of the needle gauge assembly 30, so that when the PCB board is maintained, the PCB board is first aligned by the positioning assembly 40, and then the PCB board is pressed downward, so that the copper tumor removal operation in all micro-holes is completed at one time by the needle gauge assembly 30, the operation is simple, and the copper tumor removal efficiency and quality in the hole are improved.

[0077] In addition, as a preferred embodiment, the positioning assembly 40 includes several positioning needles, and the positions of the several positioning needles are one-to-one corresponding to the positions of the several positioning holes on the PCB board. The positioning hole is a non-electroplated hole.

[0078] The needle gauge assembly 30 includes several needle gauges, and the positions of the several needle gauges are one-to-one corresponding to the positions of the several micro-holes on the PCB board. The micro-hole is an electroplated hole. During the electroplating process, due to the complexity of the process and some uncontrollable factors, copper may be deposited too much in the micro-hole, causing the hole to be blocked, i.e., the copper plug hole problem, so that there is a copper tumor in the micro-hole.

[0079] In the embodiment, the distribution positions of the several positioning needles can be adjusted and optimized according to the distribution of the positioning holes of the PCB board to be maintained. Similarly, the number and distribution positions of the several needle gauges can be adjusted and optimized according to the number and positions of the micro-holes of the PCB board to be maintained, so that the PCB board hole copper tumor removal device of the embodiment matches the specifications of the PCB board to be maintained.

[0080] In some optional embodiments, the needle gauge assembly 30 is set to several groups, the positioning assembly 40 is set to several groups, and one group of the needle gauge assembly 30 and one group of the positioning assembly 40 correspond to one PCB board. The PCB board hole copper tumor removal device of the embodiment can also be used to maintain a large PCB board, further improving the copper tumor removal efficiency in the hole of the PCB board.

[0081] The above is only the preferred embodiment of the utility model, and is only an example for clearly explaining the utility model, and does not limit the patent range of the utility model. For ordinary skilled persons in the art, other different forms of changes or changes can be made on the basis of the above description, which need not and cannot be exhausted here. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the utility model should be included in the protection range of the utility model claims.

Claims

1. A device for removing copper nodules inside PCB board holes, characterized in that, include: The support includes a top plate (10), a bottom plate (20), a needle gauge assembly (30), and a positioning assembly (40). The top plate (10) is arranged parallel above the bottom plate (20) and connected to the bottom plate (20). The first end of the needle gauge assembly (30) is fixedly connected to the bottom plate (20), and the second end of the needle gauge assembly (30) extends longitudinally out of the upper surface of the top plate (10). The first end of the positioning assembly (40) is fixedly connected to the bottom plate (20), and the second end of the positioning assembly (40) extends longitudinally out of the upper surface of the top plate (10).

2. The PCB board hole copper nodule removal device according to claim 1, characterized in that, It also includes a support plate assembly (50), which is arranged in parallel between the support base plate (20) and the support top plate (10). The top surface of the support plate assembly (50) is connected to the support top plate (10) through a first support column (60), and the bottom surface of the support plate assembly (50) is connected to the support base plate (20) through a second support column (70).

3. The PCB board hole copper nodule removal device according to claim 2, characterized in that, The support plate assembly (50) includes several support plates arranged in parallel. Adjacent support plates are connected by a third support column (80). The first layer of support plates is connected to the top support plate (10) via a first support column (60) along the longitudinal direction from top to bottom. The last layer of support plates is connected to the bottom support plate (20) via a second support column (70).

4. The PCB board hole copper nodule removal device according to claim 3, characterized in that, The spacing between two adjacent support plates may be the same or different.

5. The PCB board hole copper nodule removal device according to claim 3, characterized in that, The thickness of the support plate is less than the thickness of the support bottom plate (20) and the support top plate (10).

6. The PCB board hole copper nodule removal device according to claim 3, characterized in that, The number of the first support columns (60) is set to several, and the several first support columns (60) are distributed around the support top plate (10); The number of the second support columns (70) is set to several, and the several second support columns (70) are distributed around the support base plate (20); The number of the third support columns (80) is set to several, and the several third support columns (80) are distributed around the support plate; The first support column (60), the second support column (70), and the third support column (80) at the same position are coaxially arranged.

7. The PCB board hole copper nodule removal device according to claim 6, characterized in that, The first support column (60), the second support column (70) and the third support column (80) are connected by a fixing column (90) that passes through the top support plate (10), the first support column (60), the support plate assembly (50), the third support column (80), the second support column (70) and the bottom support plate (20) in sequence; The top of the fixed column (90) is locked and fixed to the top surface of the supporting top plate (10) by a locking member (901).

8. The PCB board hole copper nodule removal device according to claim 1, characterized in that, The positioning component (40) includes a plurality of positioning pins, and the positions of the plurality of positioning pins are respectively set to correspond one-to-one with a plurality of positioning holes on the PCB board.

9. The PCB board hole copper nodule removal device according to claim 1, characterized in that, The pin gauge assembly (30) includes several pin gauges, and the positions of the several pin gauges are respectively set to correspond one-to-one with several microholes on the PCB board.

10. The PCB board hole copper nodule removal device according to claim 1, characterized in that, The pin gauge assembly (30) is configured in several groups, and the positioning assembly (40) is configured in several groups. Each group of the pin gauge assembly (30) and each group of the positioning assembly (40) corresponds to a PCB board.

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