Manual glue application auxiliary device

Abstract

This application relates to a manual photoresist coating auxiliary device. The device includes a support, a sliding mechanism, a support mechanism, and a push rod. The sliding mechanism passes through the support and is movably connected to it. The support supports the sliding mechanism, and the support mechanism is fixed to the sliding mechanism. When the support is in a designated area, the support mechanism is located on the side of the support closer to the wafer stage. The support mechanism is used to fix a syringe for injecting photoresist. When the sliding mechanism slides to its maximum stroke towards the wafer stage, the nozzle of the syringe is aligned with the center of the wafer. The support includes a push rod through-hole, and the push rod includes a rod portion, a first pushing portion, and a second pushing portion. The rod portion passes through the push rod through-hole, and the first and second pushing portions are located at both ends of the rod portion and on both sides of the support. The first pushing portion is located at the end of the rod portion closer to the wafer stage and is used to abut against the piston handle to push the piston. This application enables rapid and safe coating of photoresist samples.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically to a manual adhesive application auxiliary device. Background Technology

[0002] In related technologies, photoresist is an essential material for photolithography and one of the core materials for semiconductor manufacturing. The uniform coating of photoresist onto a wafer is achieved using a photoresist coating and developing machine. Its working principle involves the photoresist being sprayed from a nozzle through a pipeline onto the center of the wafer. A suction stage, with the wafer fixed to it, rotates the wafer at high speed, uniformly coating it with photoresist. Then, the photoresist at the wafer edges is trimmed, and the photoresist on the back of the wafer is removed.

[0003] During the development phase of photoresist, a large number of samples need to be tested. However, because photoresist R&D is conducted on small-scale prototypes, installing them onto the spin coater and developer is costly and lacks the necessary piping. Therefore, the photoresist can only be applied manually to the wafers within the spin coater and developer. Currently, the common methods are to use a handheld photoresist reagent bottle to pour the sample onto the wafer for coating, or to use a handheld photoresist syringe inserted into the machine to inject the sample onto the wafer for coating.

[0004] Manually pouring photoresist can compromise experimental precision. Pouring off-center can result in missing photoresist at the wafer center, requiring more than machine coating. However, excessive coating can overflow the wafer, contaminating the equipment. Bottled photoresist can leak along the bottle's outer wall, contaminating the wafer and gloves. Manual syringe injection, with its tilt angle, makes it difficult to control the injection location. Furthermore, pouring requires reaching into the machine, which is inconvenient and potentially dangerous.

[0005] Therefore, how to quickly and safely coat photoresist samples onto wafers is a problem that urgently needs to be solved in the photoresist development stage. Utility Model Content

[0006] The purpose of this application is to provide a manual photoresist coating auxiliary device that can precisely control the position of photoresist injection, and can also prevent the operator's body and hands from entering the photoresist coating and developing machine during photoresist injection, thereby improving safety and enabling fast and safe coating of photoresist samples.

[0007] According to an embodiment of this application, a manual glue application auxiliary device is provided, which is applied to a glue application and developing machine. The manual glue application auxiliary device includes: a bracket, a sliding mechanism, a bearing mechanism, and a push rod.

[0008] The sliding mechanism passes through the bracket and is movably connected to the bracket. The bracket is used to support the sliding mechanism, and the sliding mechanism can slide in the horizontal direction.

[0009] The supporting mechanism is fixed to the sliding mechanism. When the support is located in the designated area, the supporting mechanism is located on the side of the support closer to the wafer stage. The supporting mechanism is used to support and fix the syringe, which is used to inject photoresist. The syringe includes an injection cylinder, a piston, a piston rod, a piston handle, and a needle tube. The piston is located in the injection cylinder, the piston rod is fixedly connected to the piston, the piston handle is fixed on the side of the piston rod away from the piston, and the needle tube communicates with the injection cylinder. When the sliding mechanism slides to its maximum stroke in the horizontal direction toward the wafer stage, the nozzle of the needle tube is aligned with the center of the wafer.

[0010] The support includes a push rod through hole. The push rod includes a rod portion, a first pushing portion, and a second pushing portion. The rod portion passes through the push rod through hole. The first pushing portion and the second pushing portion are located at both ends of the rod portion and on both sides of the support. The first pushing portion is located at the end of the rod portion closer to the wafer carrier stage. The first pushing portion is used to abut against the piston handle to push the piston to move.

[0011] In one embodiment, the sliding mechanism includes a first slide rod, a second slide rod, and a limiting part;

[0012] The first slide bar and the second slide bar are parallel to each other, and the bearing mechanism is fixed to the first end of the first slide bar and the first end of the second slide bar, and is located between the first slide bar and the second slide bar;

[0013] The limiting part is fixed to the second end of the first slide rod and the second end of the second slide rod, and is located between the first slide rod and the second slide rod; the first end of the first slide rod and the second end of the first slide rod are opposite each other, and the first end of the second slide rod and the second end of the second slide rod are opposite each other.

[0014] The bracket includes a first slide rod through hole and a second slide rod through hole, the first slide rod passes through the first slide rod through hole, the second slide rod passes through the second slide rod through hole, the bearing mechanism and the limiting part are located on both sides of the bracket; the push rod through hole is located above the first slide rod through hole and the second slide rod through hole;

[0015] When the sliding mechanism slides at its maximum stroke in the horizontal direction toward the wafer carrier stage, the bracket blocks the limiting part.

[0016] In one embodiment, the supporting mechanism includes a supporting plate and a cover plate;

[0017] The bearing plate is fixed to the first end of the first slide rod and the first end of the second slide rod, and is located between the first slide rod and the second slide rod;

[0018] The support plate includes a first groove, a second groove, and a notch; the needle includes a horizontal tube section and a vertical tube section; the first end of the horizontal tube section is connected to the syringe; the second end of the horizontal tube section is connected to the first end of the vertical tube section; and the nozzle is provided at the second end of the vertical tube section.

[0019] The first groove is used to support the injection cylinder, the second groove is used to support the horizontal tube segment, the notch communicates with the second groove, and the vertical tube segment extends vertically downward through the notch so that the nozzle of the needle is aligned with the center of the wafer;

[0020] The cover plate includes a third groove, and the cover plate is capable of covering the carrier plate;

[0021] When the cover plate is closed on the support plate, the third groove is opposite to the first groove, forming a space for accommodating the injection cylinder.

[0022] In one embodiment, the cover plate further includes a fourth groove;

[0023] When the cover plate is placed on the support plate, the fourth groove is opposite to the second groove, forming a space for accommodating the horizontal pipe section.

[0024] In one embodiment, the central axis of the vertical tube segment is aligned with the first end of the first slide bar, the nozzle of the needle tube is located on the central axis of the vertical tube segment, and the distance between the first end and the second end of the first slide bar is the distance from the side of the support away from the wafer carrier stage to the center of the wafer.

[0025] In one embodiment, the supporting mechanism further includes a connector, through which a first side of the cover plate is movably connected to a first side of the supporting plate.

[0026] In one embodiment, the syringe further includes a support portion located at the end of the syringe barrel away from the needle tube;

[0027] When the vertical pipe section is located in the gap, the support part abuts against the side of the bearing plate near the bracket.

[0028] In one embodiment, the length of the injection barrel matches the length of the first groove.

[0029] In one embodiment, the bearing mechanism further includes fasteners disposed on a second side of the bearing plate and a second side of the cover plate; the second side of the bearing plate is opposite to the first side of the bearing plate, and the second side of the cover plate is opposite to the first side of the cover plate;

[0030] When the cover plate is placed on the carrier plate, the fasteners secure the cover plate to the carrier plate.

[0031] In one embodiment, the fastener includes a first ferromagnetic portion and a second ferromagnetic portion;

[0032] The first ferromagnetic part is located on the second side of the bearing plate, and the second ferromagnetic part is located on the second side of the cover plate;

[0033] When the cover plate is placed on the support plate, the first ferromagnetic part and the second ferromagnetic part are positioned opposite each other and attract each other.

[0034] In one embodiment, the bracket further includes a fixing part located at the bottom of the bracket; the coating and developing machine includes a support base;

[0035] The fixing part is used to fix the bracket to the support base.

[0036] In one embodiment, the fixing part is a third ferromagnetic part, the designated area is located on the support base, and the designated area is provided with a fourth ferromagnetic part;

[0037] When the bracket is located in the designated area, the third ferromagnetic part is located on the fourth ferromagnetic part, and the third ferromagnetic part and the fourth ferromagnetic part attract each other.

[0038] Compared with the prior art, the beneficial effects of this application are as follows: The manual photoresist application auxiliary device includes a support, a sliding mechanism, a supporting mechanism, and a push rod. The sliding mechanism passes through the support and is movably connected to it. The support supports the sliding mechanism, which can slide horizontally. The supporting mechanism is fixed to the sliding mechanism. When the support is in a designated area, the supporting mechanism is located on the side of the support closer to the wafer stage. The supporting mechanism supports and fixes the syringe, which is used to inject photoresist. The syringe includes an injection cylinder, a piston, a piston rod, a piston handle, and a needle tube. The piston is located in the injection cylinder, the piston rod is fixedly connected to the piston, the piston handle is fixed to the side of the piston rod away from the piston, and the needle tube is connected to the injection cylinder. When the sliding mechanism slides to its maximum stroke along the horizontal direction towards the wafer carrier stage, the nozzle of the needle is aligned with the center of the wafer. This allows for precise control of the photoresist injection position. Furthermore, the support includes a push rod through-hole, and the push rod comprises a rod portion, a first pushing portion, and a second pushing portion. The rod portion passes through the push rod through-hole, and the first and second pushing portions are located at both ends of the rod portion and on both sides of the support. The first pushing portion is located at the end of the rod portion closest to the wafer carrier stage and is used to abut against the piston handle to push the piston. Thus, the coating operator can push the piston by pushing the second pushing portion of the push rod to complete the photoresist injection operation without having to put their body and hands into the coating and developing machine, improving safety. In summary, the technical solution provided in this application can precisely control the photoresist injection position and avoids the operator's body and hands from entering the coating and developing machine during photoresist injection, improving safety and enabling rapid and safe coating of photoresist samples. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of a manual glue application auxiliary device according to an exemplary embodiment.

[0040] Figure 2 yes Figure 1 Side view.

[0041] Figure 3 This is a front view of a carrier plate and cover plate according to an exemplary embodiment.

[0042] Figure 4 This is a left view of a carrier plate and cover plate according to an exemplary embodiment.

[0043] Figure 5 This is a top view of a carrier plate and cover plate according to an exemplary embodiment.

[0044] Figure 6 This is a front view of a carrier plate and cover plate according to another exemplary embodiment.

[0045] Figure 7This is a left view of a carrier plate and cover plate according to another exemplary embodiment.

[0046] Figure 8 This is a top view of a carrier plate and cover plate according to another exemplary embodiment.

[0047] Figure 9 This is a graph showing the film thickness of the photoresist at 49 sampling points during automatic photoresist coating and developing.

[0048] Figure 10 This is a graph showing the film thickness of the photoresist at 49 sampling points when manually applying the photoresist using a reagent bottle.

[0049] Figure 11 This is a graph showing the film thickness of the photoresist at 49 sampling points when using a manual coating aid device. Detailed Implementation

[0050] Unless otherwise defined, the technical or scientific terms used in this specification and claims shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. Specific embodiments of this application will be described below in conjunction with the accompanying drawings. It should be noted that, in order to provide a concise description, this specification cannot exhaustively describe all features of the actual embodiments. Without departing from the spirit and scope of this application, those skilled in the art can modify and substitute the embodiments of this application, and the resulting embodiments are also within the protection scope of this application.

[0051] One embodiment of this application provides a manual glue application auxiliary device. This manual glue application auxiliary device can be applied to a glue application and developing machine to assist in manual glue application.

[0052] Before introducing the manual coating auxiliary device, let's briefly introduce the coating and developing machine. The coating and developing machine consists of a support base and a wafer carrier stage. The wafer carrier stage is located on the support base and can be a vacuum adsorption stage used to fix the wafer. During the wafer coating process, the wafer carrier stage can carry the wafer and rotate it at a low speed, with a rotation speed of 1-50 revolutions per minute (r / min).

[0053] When a manual glue application auxiliary device is required to assist in glue application, place the manual glue application auxiliary device in the designated area, with the device positioned on the support base.

[0054] like Figure 1 and Figure 2 As shown, the manual glue application auxiliary device may include: a bracket 1, a sliding mechanism 2, a bearing mechanism 3, and a push rod 4.

[0055] like Figure 1 and Figure 2 As shown, the sliding mechanism 2 passes through the support 1 and is movably connected to the support 1. The support 1 supports the sliding mechanism 2, which can slide in a horizontal direction. The horizontal direction is parallel to the surface of the wafer 6 away from the wafer carrier stage 7.

[0056] The support mechanism 3 is fixed on the sliding mechanism 2. When the support 1 is in the designated area, the support mechanism 3 is located on the side of the support 1 that is close to the wafer support stage 7.

[0057] The support mechanism 3 is used to support and fix the syringe 8, which is used to inject photoresist. The syringe 8 includes a syringe barrel 81, a piston 82, a piston rod 83, a piston handle 84, and a needle tube 85. The piston 82 is located in the syringe barrel 81, the piston rod 83 is fixedly connected to the piston 82, the piston handle 84 is fixed to the side of the piston rod 83 away from the piston 82, and the needle tube 85 is connected to the syringe barrel 81.

[0058] When the sliding mechanism 2 slides to its maximum horizontal stroke toward the wafer stage 7, the nozzle of the needle tube 85 is aligned with the center of the wafer 6. That is, when the sliding mechanism 2 is stationary in the horizontal direction toward the wafer stage 7, the nozzle of the needle tube 85 is aligned with the center of the wafer 6. In this way, the position of the injected photoresist can be easily and quickly controlled precisely.

[0059] like Figure 1 As shown, the support 1 includes a push rod through hole 11, and the push rod 4 includes a rod portion 41, a first pushing portion 42, and a second pushing portion 43. The rod portion 41 of the push rod 4 passes through the push rod through hole 11 on the support 1. The first pushing portion 42 and the second pushing portion 43 are located at both ends of the rod portion 41 and on both sides of the support 1. The first pushing portion 42 is located at the end of the rod portion 41 closer to the wafer carrier stage 7. When the syringe 8 is fixed to the carrier mechanism 3, the first pushing portion 42 is used to abut against the piston handle 84 to push the piston 82 of the syringe 8 to move. In this way, the glue coating operator can push the piston 82 of the syringe 8 by pushing the second pushing portion 43 of the push rod 4 to complete the glue coating operation without having to put their body and hands into the glue coating and developing machine, thus improving safety.

[0060] like Figure 2 As shown, the cross-sectional area of ​​the first pushing part 42 is larger than the cross-sectional area of ​​the piston handle 84 to achieve smooth glue injection.

[0061] like Figure 2 As shown, the cross-sectional area of ​​the second pushing part 43 is larger than that of the rod part 41, making it easier for the user to apply pressure to achieve pushing. In one embodiment, the second pushing part 43 can be circular or elliptical, but is not limited to these shapes.

[0062] In summary, the technical solution provided in this application can precisely control the position of photoresist injection, and can also prevent the operator's body and hands from entering the photoresist coating and developing machine during photoresist injection, thereby improving safety and enabling fast and safe coating of photoresist samples.

[0063] like Figure 1 and Figure 2 As shown, the sliding mechanism 2 includes a first slide bar 21, a second slide bar 22, and a limiting part 23.

[0064] like Figure 1 and Figure 2 As shown, the first slide bar 21 and the second slide bar 22 are parallel to each other. The supporting mechanism 3 is fixed to the first end of the first slide bar 21 and the first end of the second slide bar 22, and is located between the first slide bar 21 and the second slide bar 22. The first end of the first slide bar 21 and the first end of the second slide bar 22 are close to the wafer support stage 7.

[0065] like Figure 1 and Figure 2 As shown, the limiting part 23 is fixed to the second end of the first slide rod 21 and the second end of the second slide rod 22, and is located between the first slide rod 21 and the second slide rod 22. The first end of the first slide rod 21 and the second end of the first slide rod 21 are opposite to each other, and the first end of the second slide rod 22 and the second end of the second slide rod 22 are opposite to each other.

[0066] like Figure 1 and Figure 2 As shown, the support 1 includes a first sliding rod through hole 12 and a second sliding rod through hole 13. A first sliding rod 21 passes through the first sliding rod through hole 12, and a second sliding rod 22 passes through the second sliding rod through hole 13. The bearing mechanism 3 and the limiting part 23 are located on both sides of the support 1. The push rod through hole 11 is located on the side of the first sliding rod through hole 12 and the second sliding rod through hole 13 away from the wafer support stage 7. That is, the push rod through hole 11 is located above the first sliding rod through hole 12 and the second sliding rod through hole 13, meaning the distance of the push rod through hole 11 from the bottom end of the support 1 is greater than the distance of the first sliding rod through hole 12 and the second sliding rod through hole 13 from the bottom end of the support 1. The distances of the first sliding rod through hole 12 and the second sliding rod through hole 13 from the bottom end of the support 1 are the same. The bottom end of the support 1 is in contact with the support base.

[0067] When the sliding mechanism 2 slides to its maximum stroke in the horizontal direction toward the wafer carrier stage 7, the bracket 1 blocks the limiting part 23, preventing the sliding mechanism 2 from continuing to slide toward the wafer carrier stage 7, thereby limiting the maximum stroke of the sliding mechanism 2.

[0068] like Figure 1 and Figure 2As shown, the support mechanism 3 may include a support plate 31, a cover plate 32, and a connector. In one embodiment, the connector may be a hinge, but is not limited thereto. In other embodiments, the support mechanism 3 may not include a connector.

[0069] like Figure 1 and Figure 2 As shown, the support plate 31 is fixed to the first end of the first slide rod 21 and the first end of the second slide rod 22, and is located between the first slide rod 21 and the second slide rod 22. The support plate 31 can be integrally formed with the first slide rod 21 and the second slide rod 22, but is not limited thereto.

[0070] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in one embodiment, the carrier disk 31 includes a first groove 313, a second groove 311, and a notch 312. Wherein, Figure 3 This is a front view of the support plate 31 and the cover plate 32. Figure 4 This is a left view of the support plate 31 and the cover plate 32. Figure 5 This is a top view of the support plate 31 and the cover plate 32.

[0071] like Figure 2 As shown, the syringe 85 is a curved syringe tube, which includes a horizontal tube section 851 and a vertical tube section 852. The first end of the horizontal tube section 851 is connected to the syringe 81, and the second end of the horizontal tube section 851 is connected to the first end of the vertical tube section 852. The second end of the vertical tube section 852 is provided with a nozzle.

[0072] The first groove 313 is used to support the syringe 81, and the shape of the inner wall of the first groove 313 can match the shape of the outer wall of the syringe 81. In one embodiment, the syringe 81 is cylindrical, and the first groove 313 can be a semi-circular groove, but is not limited thereto. The second groove 311 is used to support the horizontal tube section 851 of the needle tube 85, and the shape of the inner wall of the second groove 311 can match the shape of the outer wall of the horizontal tube section 851. In one embodiment, the horizontal tube section 851 is cylindrical, and the second groove 311 can be a semi-circular groove, but is not limited thereto. The first groove 313 and the second groove 311 can be integrally formed.

[0073] In one embodiment, such as Figure 3 , Figure 4 and Figure 5As shown, the central axis of the first groove 313 coincides with the central axis of the second groove 311. That is, when the syringe 81 is located in the first groove 313, the central axis of the syringe 81 coincides with the central axis of the second groove 311. In this embodiment, the cover plate 32 includes a third groove 321 and a fourth groove 322. When the cover plate 32 is closed on the support plate 31, the third groove 321 is opposite to the first groove 313, forming a space for accommodating the syringe 81, and the fourth groove 322 is opposite to the second groove 311, forming a space for accommodating the horizontal tube segment 851. That is, when the cover plate 32 is closed on the support plate 31, two concentric cylindrical spaces are formed to respectively accommodate the horizontal tube segment 851 of the syringe 81 and the needle tube 85.

[0074] like Figure 1 and Figure 5 As shown, the notch 312 is connected to the second groove 311. Preferably, the width of the notch 312 in the direction from the first slide bar 21 to the second slide bar 22 is equal to the diameter of the vertical tube section 852 of the needle tube 85. The vertical tube section 852 of the needle tube 85 extends vertically downward through the notch 312 so that the nozzle of the needle tube 85 is aligned with the center of the wafer 6.

[0075] In another embodiment, such as Figure 6 , Figure 7 and Figure 8 As shown, the cover plate 32 may not cover the horizontal tube section 851 of the syringe 85. Wherein, Figure 6 This is a front view of the support plate 31 and the cover plate 32. Figure 7 This is a left view of the support plate 31 and the cover plate 32. Figure 8 This is a top view of the support plate 31 and the cover plate 32. In this embodiment, as... Figure 7 As shown, the plane 314 where the opening of the second groove 311 is located may be lower than the plane 315 where the opening of the first groove 313 is located. The lowest point of the second groove 311 is higher than the lowest point of the first groove 313, that is, the distance between the lowest point of the second groove 311 and the support base is greater than the distance between the lowest point of the first groove 313 and the support base. In other embodiments, the plane 314 where the opening of the second groove 311 is located and the plane 315 where the opening of the first groove 313 is located may be flush.

[0076] In this embodiment, the first side of the cover plate 32 is movably connected to the first side of the carrier plate 31 via a connector. The cover plate 32 can be closed on the carrier plate 31, and when the cover plate 32 is opened, it can also be located on the same plane as the carrier plate 31. When the cover plate 32 is closed on the carrier plate 31, the third groove 321 is opposite to the first groove 313, forming a space for accommodating the syringe 81. The first side of the cover plate 32 can be located on either side of the third groove 313. The first side of the carrier plate 31 can be located on either side of the first groove 313. The first side of the cover plate 32 and the first side of the carrier plate 31 are located on the same side of the first groove 313.

[0077] In one embodiment, the central axis of the vertical tube segment 852 of the needle tube 85 can be aligned with the first end of the first slide bar 21, and the nozzle of the needle tube 85 is located on the central axis of the vertical tube segment 852. The distance between the first end and the second end of the first slide bar 21 is the distance from the side of the support 1 away from the wafer stage 7 to the center of the wafer 6. Thus, when the sliding mechanism 2 slides its maximum stroke horizontally toward the wafer stage 7, the nozzle of the needle tube 85 is aligned with the center of the wafer 6.

[0078] like Figure 1 As shown, the syringe 8 also includes a support portion 86 located at the end of the syringe barrel 81 away from the needle tube 85. The length of the syringe barrel 81 matches the length of the first groove 313, so that when the syringe barrel 81 is located in the first groove 313 or the vertical tube section 852 of the needle tube 85 is located in the notch 312, the support portion 86 abuts against the side of the support plate 31 near the bracket 1, thus preventing the syringe 8 from shifting during the injection process.

[0079] The support mechanism 3 also includes fasteners (not shown), which are disposed on the second side of the support plate 31 and the second side of the cover plate 32. The second side of the support plate 31 is opposite to the first side of the support plate 31, and the second side of the cover plate 32 is opposite to the first side of the cover plate 32. When the cover plate 32 is closed on the support plate 31, the fasteners fix the cover plate 32 and the support plate 31 together.

[0080] In one embodiment, the fastener includes a first ferromagnetic portion and a second ferromagnetic portion. The first and second ferromagnetic portions may be thin magnetic strips, but are not limited thereto. The first ferromagnetic portion is located on the second side of the support plate 31, and the second ferromagnetic portion is located on the second side of the cover plate 32. When the cover plate 32 is placed on the support plate 31, the first and second ferromagnetic portions are positioned opposite each other and attract each other, thus securing the cover plate 32 and the support plate 31 together.

[0081] like Figure 2As shown, the bracket 1 also includes a fixing part 14, which is located at the bottom of the bracket 1. The coating and developing machine includes a support base 9, and the fixing part 14 is used to fix the bracket 1 on the support base 9.

[0082] In one embodiment, the fixing part 14 is a third ferromagnetic part, for example, the fixing part 14 is a magnet, the designated area is located on the support base 9, and the designated area is provided with a fourth ferromagnetic part, or the support base 9 is ferromagnetic. When the bracket 1 is located in the designated area, the third ferromagnetic part is located on the fourth ferromagnetic part, and the third ferromagnetic part and the fourth ferromagnetic part attract each other to fix the bracket 1 on the support base 9.

[0083] The above describes the manual glue application auxiliary device provided in this application. The following section uses a single glue application as an example to illustrate the method of applying glue using the manual glue application auxiliary device.

[0084] First, place the bracket 1 of the manual glue application auxiliary device in the designated area of ​​the glue application and developing machine. The fixing part 14 (e.g., a magnet) at the bottom of the bracket 1 will firmly fix the manual glue application auxiliary device in the designated area of ​​the glue application and developing machine. Figure 2 As shown, this ensures the accuracy of the glue spraying position.

[0085] Then, prepare the photoresist sample to be coated, use the syringe 8 to draw an appropriate amount of photoresist, place the syringe 8 on the first groove and the second groove 311 of the support plate 31 of the support mechanism 3, and make the horizontal tube section 851 of the curved needle tube 85 located in the second groove 311, and the vertical tube section 852 vertically downward through the notch 312. Cover the cover plate 32 and fix the syringe 8.

[0086] Then, wafer 6 is transported to wafer carrier stage 7 via the transfer arm of the coating and developing machine, and wafer 6 is subsequently fixed on wafer carrier stage 7. Wafer carrier stage 7 drives wafer 6 to rotate at a low speed.

[0087] Then, the sliding mechanism 2 is pushed to slide horizontally towards the wafer carrier stage 7 to its maximum stroke. At this time, the nozzle of the syringe 8's needle 85 is aligned with the center of the wafer 6. Figure 2 As shown.

[0088] Then, push the push rod 4 so that the first pushing part 42 abuts against the piston handle 84, and continue to push the push rod 4 to move the piston 82 of the syringe 8, causing the photoresist 5 to be ejected from the needle tube 85, as... Figure 2 As shown. The operator can hold the second pusher 43 to push the push rod 4. The maximum distance that the second pusher 43 can move toward the wafer stage 7 is greater than or equal to the maximum stroke of the piston 82 from the support part 86 to the needle tube 85, thus ensuring that all the photoresist can be pushed out. The photoresist is sprayed onto the center of the wafer 6, and then normal spin coating is performed to obtain the photoresist-coated wafer 6.

[0089] Finally, pull back the sliding mechanism 2, open the cover plate 32, remove the syringe 8, and complete one application of adhesive.

[0090] If there are multiple photoresist samples, you can continue to change the syringe for the next sample and perform the next photoresist coating.

[0091] The technical solution provided in this application uses a first slide bar and a second slide bar of specific length to deliver the nozzle of the needle to the center of the wafer, which can reduce the amount of photoresist used, making it close to the amount used in automatic coating and developing machines, and avoiding excessive photoresist contamination of the coating and developing machine. Manual coating typically requires more than 10ml of photoresist; this manual coating auxiliary device can reduce the amount of photoresist used by 50%.

[0092] The technical solution provided in this application involves spraying photoresist onto the center of the wafer, resulting in a good coating effect and good film thickness uniformity. Figures 9-11 As shown, the horizontal axis represents the sampling point number, and the vertical axis represents the photoresist film thickness, in angstroms. Figure 9 This is a graph showing the film thickness of the photoresist at 49 sampling points during automatic photoresist coating and developing. Figure 10 This is a graph showing the photoresist film thickness at 49 sampling points when manually applying the photoresist using reagent bottles. Figure 11 This is a photoresist film thickness curve at 49 sampling points when using a manual coating aid. A comparison shows that... Figure 9 and Figure 11 The photoresist shown exhibits good film thickness uniformity. Even with the aid of a manual coating device, the film thickness uniformity remains good.

[0093] The sliding mechanism features sliding push-pull rods (first slide rod, second slide rod), which can quickly extend and retract within the confined space of the photoresist coating and developing machine, making it convenient to change photoresist samples and saving time.

[0094] The manual glue application auxiliary device provided in this application has a simple structure and low cost.

[0095] The second groove and notch on the carrier plate work together to quickly fix the needle tube, so that the nozzle is vertically downward and the photoresist is not sprayed onto the wafer position outside the center of the wafer.

[0096] In summary, the technical solution provided in this application can precisely control the position of photoresist injection, and can also prevent the operator's body and hands from entering the photoresist coating and developing machine during photoresist injection, thereby improving safety and enabling fast and safe coating of photoresist samples.

[0097] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0098] The above description of the embodiments is intended to enable those skilled in the art to understand and apply this application. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without creative effort. Therefore, this application is not limited to the embodiments described herein, and any improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.

Claims

1. A hand gluing aid device, characterized in that, The manual adhesive coating auxiliary device, which is applied to an adhesive coating and developing machine, includes: a bracket, a sliding mechanism, a bearing mechanism, and a push rod; The sliding mechanism passes through the bracket and is movably connected to the bracket. The bracket is used to support the sliding mechanism, and the sliding mechanism can slide in the horizontal direction. The supporting mechanism is fixed to the sliding mechanism. When the support is located in the designated area, the supporting mechanism is located on the side of the support closer to the wafer stage. The supporting mechanism is used to support and fix the syringe, which is used to inject photoresist. The syringe includes an injection cylinder, a piston, a piston rod, a piston handle, and a needle tube. The piston is located in the injection cylinder, the piston rod is fixedly connected to the piston, the piston handle is fixed on the side of the piston rod away from the piston, and the needle tube communicates with the injection cylinder. When the sliding mechanism slides to its maximum stroke in the horizontal direction toward the wafer stage, the nozzle of the needle tube is aligned with the center of the wafer. The support includes a push rod through hole. The push rod includes a rod portion, a first pushing portion, and a second pushing portion. The rod portion passes through the push rod through hole. The first pushing portion and the second pushing portion are located at both ends of the rod portion and on both sides of the support. The first pushing portion is located at the end of the rod portion closer to the wafer carrier stage. The first pushing portion is used to abut against the piston handle to push the piston to move.

2. The manual gluing aid device according to claim 1, characterized in that The sliding mechanism includes a first slide rod, a second slide rod, and a limiting part; The first slide bar and the second slide bar are parallel to each other, and the bearing mechanism is fixed to the first end of the first slide bar and the first end of the second slide bar, and is located between the first slide bar and the second slide bar; The limiting part is fixed to the second end of the first slide rod and the second end of the second slide rod, and is located between the first slide rod and the second slide rod; the first end of the first slide rod and the second end of the first slide rod are opposite each other, and the first end of the second slide rod and the second end of the second slide rod are opposite each other. The bracket includes a first slide rod through hole and a second slide rod through hole, the first slide rod passes through the first slide rod through hole, the second slide rod passes through the second slide rod through hole, the bearing mechanism and the limiting part are located on both sides of the bracket; the push rod through hole is located above the first slide rod through hole and the second slide rod through hole; When the sliding mechanism slides at its maximum stroke in the horizontal direction toward the wafer carrier stage, the bracket blocks the limiting part.

3. The manual gluing aid device of claim 2, wherein, The supporting mechanism includes a supporting plate and a cover plate; The bearing plate is fixed to the first end of the first slide rod and the first end of the second slide rod, and is located between the first slide rod and the second slide rod; The support plate includes a first groove, a second groove, and a notch; the needle includes a horizontal tube section and a vertical tube section; the first end of the horizontal tube section is connected to the syringe; the second end of the horizontal tube section is connected to the first end of the vertical tube section; and the nozzle is provided at the second end of the vertical tube section. The first groove is used to support the injection cylinder, the second groove is used to support the horizontal tube segment, the notch communicates with the second groove, and the vertical tube segment extends vertically downward through the notch so that the nozzle of the needle is aligned with the center of the wafer; The cover plate includes a third groove, and the cover plate is capable of covering the carrier plate; When the cover plate is closed on the support plate, the third groove is opposite to the first groove, forming a space for accommodating the injection cylinder.

4. The manual gluing aid device according to claim 3, characterized in that The cover plate also includes a fourth groove; When the cover plate is placed on the support plate, the fourth groove is opposite to the second groove, forming a space for accommodating the horizontal pipe section.

5. The manual gluing aid device according to claim 3 or 4, characterized in that The central axis of the vertical tube section is aligned with the first end of the first slide bar, and the nozzle of the needle tube is located on the central axis of the vertical tube section.

6. The manual gluing aid device according to claim 3 or 4, characterized in that The supporting mechanism also includes a connector, through which the first side of the cover plate is movably connected to the first side of the supporting plate.

7. The manual gluing aid device of claim 3, wherein The syringe also includes a support portion located at the end of the syringe barrel away from the needle tube; When the vertical pipe section is located in the gap, the support part abuts against the side of the bearing plate near the bracket.

8. The manual gluing aid device according to claim 7, characterized in that The length of the injection tube matches the length of the first groove.

9. The manual gluing aid device of claim 6, wherein, The bearing mechanism further includes fasteners, which are disposed on the second side of the bearing plate and the second side of the cover plate; the second side of the bearing plate is opposite to the first side of the bearing plate, and the second side of the cover plate is opposite to the first side of the cover plate; When the cover plate is placed on the carrier plate, the fasteners secure the cover plate to the carrier plate.

10. The manual gluing aid device according to claim 9, characterized in that The fastener includes a first ferromagnetic part and a second ferromagnetic part; The first ferromagnetic part is located on the second side of the bearing plate, and the second ferromagnetic part is located on the second side of the cover plate; When the cover plate is placed on the support plate, the first ferromagnetic part and the second ferromagnetic part are positioned opposite each other and attract each other.

11. The manual gluing aid device of claim 1, wherein, The bracket also includes a fixing part located at the bottom of the bracket; the coating and developing machine includes a support base; The fixing part is used to fix the bracket to the support base.

12. The manual gluing aid device of claim 11, wherein, The fixing part is a third ferromagnetic part, the designated area is located on the support base, and the designated area is provided with a fourth ferromagnetic part; When the bracket is located in the designated area, the third ferromagnetic part is located on the fourth ferromagnetic part, and the third ferromagnetic part and the fourth ferromagnetic part attract each other.

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