A chip adhesion degree detecting mechanism

Abstract

The utility model discloses a chip stick and degree detection technical field's a kind of chip stick and degree detection mechanism, including operation frame, the top front end of operation frame is equipped with placement area, its structure is reasonable, the utility model is placed in the two groups of mounting frame on placement area by the way of sliding of two groups of guide column A butt joint, and spring B is sleeved on the outer wall of guide column A, according to the effect that spring B has elastic reaction force, and the inclined shape of the one side of the upper surface of the bayonet pin on guide column A, so that it needs to stick and degree impact detection chip is placed on placement mesa, and placement mesa is reset in the plane of placement area by spring A, press chip, until two groups of bayonet pin shrink are extruded by placement mesa, when chip is below bayonet pin, spring B pushes bayonet pin reset, can reach to chip installation fixed treatment, similarly, when chip needs to be disassembled, just pull out pull ring, until bayonet pin retract, spring A pushes placement mesa reset under no pressure state, can take out chip.

Description

Technical Field

[0001] This utility model relates to the field of chip adhesion testing technology, specifically a chip adhesion testing mechanism. Background Technology

[0002] Chip adhesion testing is primarily used to evaluate the adhesion of coatings or adhesives on chip surfaces. This testing is crucial for ensuring the reliability and performance of electronic devices. Common chip adhesion testing methods include peel testing, scratch testing, and impact testing. However, there are still some shortcomings in impact testing for chip adhesion. During impact testing, the chip's stability must be ensured to prevent displacement or detachment from the testing area due to the impact force. Common chip fixing methods, such as screw tightening, require time for tightening and disassembly after testing, increasing repetitive operations and reducing the efficiency of large-scale chip testing. Furthermore, impact testing can cause some substandard chips to break, potentially leading to chip sputtering, which poses safety risks to surrounding equipment and personnel, thus reducing the efficiency and effectiveness of chip adhesion testing.

[0003] Therefore, it is necessary to develop a chip adhesion testing mechanism. Utility Model Content

[0004] The purpose of this invention is to provide a chip adhesion detection mechanism to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a chip adhesion detection mechanism, comprising an operating frame, wherein a placement area is installed at the top front end of the operating frame, and mounting frames are installed on the upper sides of the outer walls of the placement area;

[0006] A detection component is installed at the top rear end of the operating frame. The detection component includes an electric impact testing machine, and an impact hammer is installed at the bottom center of the electric impact testing machine.

[0007] Preferably, a limiting seat is installed on the lower part of the inner walls on both sides of the placement area, and a placement platform is slidably connected to the upper part of the placement area. A spring A is installed between the placement platform and the placement area.

[0008] Preferably, the mounting bracket has a guide post A slidably connected inside, and a pull ring is installed at one end of the guide post A.

[0009] Preferably, a locking pin is installed at the other end of the guide post A, and the outer wall of the locking pin is slidably connected to the outer wall of the placement area.

[0010] Preferably, a spring B is installed on one side of the outer wall of the guide post A, and the spring B is located inside the mounting bracket.

[0011] Preferably, guide posts B are installed on both sides of the bottom of the electric impact testing machine, and a rubber pad is installed at the bottom end of the impact hammer.

[0012] Preferably, a limit ring is installed on the upper part of the outer wall of the impact hammer, and a protective cover is slidably connected to the lower part of the outer wall of the impact hammer.

[0013] Preferably, a spring C is installed between the protective cover and the limiting ring, and the inner sides of the protective cover are slidably connected to the outer wall of the guide post B.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] By sliding two sets of guide posts A into two sets of mounting brackets in the placement area, and installing springs B on the outer walls of guide posts A, the chip requiring adhesion impact testing is placed on the placement stage, taking advantage of the elastic reaction force of springs B and the inclined shape of one side of the upper surface of the locking pins on guide posts A. The placement stage is then reset to the plane of the placement area by springs A. Pressing the chip causes the placement stage to compress the two sets of locking pins and retract. When the chip is lower than the locking pins, springs B push the locking pins to reset, thus achieving the chip installation and fixation. Similarly, when the chip needs to be removed, simply pull the pull ring outward until the locking pins retract. With springs A no longer under pressure, the placement stage is reset, and the chip can be removed. During chip installation and removal, only pressing and pulling are required, making the operation simple and minimizing the time spent on chip installation and removal that could affect testing efficiency.

[0016] By sliding the protective cover to the guide post B and the outer wall of the impact hammer on the electric impact testing machine, and fitting a spring C between the protective cover and the limiting ring on the impact hammer, the impact hammer performs an impact test on the adhesion of the installed chip, utilizing the buffering effect of the spring C. As the impact hammer descends, the protective cover also descends synchronously, contacting the placement area to form a closed state, which serves as a protective measure during the chip testing process. This minimizes the possibility of chip breakage or sputtering due to substandard quality during the impact test, ensuring the safety of surrounding equipment and personnel, and effectively improving the efficiency and effectiveness of chip adhesion testing. Attached Figure Description

[0017] Figure 1 A front sectional view provided for this utility model;

[0018] Figure 2 A front view provided for this utility model;

[0019] Figure 3Provided by this utility model Figure 1 Enlarged view of the structure at point A in the image;

[0020] Figure 4 This is a partial exploded view of the structure provided by this utility model.

[0021] In the diagram: 1. Operating frame; 2. Placement area; 201. Limit seat; 202. Placement platform; 203. Spring A; 3. Mounting frame; 301. Guide post A; 302. Pull ring; 303. Locking pin; 304. Spring B; 4. Electric impact testing machine; 401. Impact hammer; 402. Guide post B; 403. Rubber pad; 404. Limit ring; 405. Protective cover; 406. Spring C. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] This utility model provides the following technical solution: a chip adhesion detection mechanism, please refer to... Figures 1-4The system includes an operating frame 1, with a placement area 2 mounted on the top front end of the operating frame 1. Limit seats 201 are installed on the lower part of the inner walls on both sides of the placement area 2. A placement platform 202 is slidably connected to the upper part of the placement area 2. Springs A203 are installed between the placement platform 202 and the placement area 2. The placement platform 202 is mounted on the lower part of the placement area 2 by the springs A203. Due to the elastic reaction force of the springs A203, the springs A203 reset the placement platform 202, placing it on the plane of the placement area 2, facilitating chip placement and easy movement into the placement area 2. Mounting brackets 3 are installed on the upper part of the outer walls on both sides of the placement area 2. Guide posts A301 are slidably connected inside the mounting brackets 3. A pull ring 302 is installed at one end of the guide post A301, and a locking pin 303 is installed at the other end. The outer wall of the locking pin 303 is slidably connected to the outer wall of the placement area 2. A spring B304 is installed on one side of the outer wall of column A301. The spring B304 is located inside the mounting bracket 3. The two sets of guide columns A301 are slidably connected to the two sets of mounting brackets 3 on the placement area 2. The spring B304 is fitted on the outer wall of the guide column A301. Based on the elastic reaction force of the spring B304 and the inclined shape of one side of the upper surface of the latch 303 on the guide column A301, the chip that needs to be tested for adhesion impact is placed on the surface of the placement stage 202. The placement stage 202 is reset to the plane of the placement area 2 by the spring A203. Press the chip until the placement stage 202 squeezes the two sets of latches 303 to retract. When the chip is lower than the latches 303, the spring B304 pushes the latches 303 to reset, thus achieving the installation and fixing of the chip. Similarly, when the chip needs to be removed, simply pull the pull ring 302 outward until the latches 303 retract. The spring A203 pushes the placement stage 202 to reset under no pressure, and the chip can be removed.

[0024] A detection assembly is installed at the top rear end of the operating frame 1. The detection assembly includes an electric impact testing machine 4. An impact hammer 401 is installed at the bottom center of the electric impact testing machine 4. Guide posts B402 are installed on both sides of the bottom of the electric impact testing machine 4. A rubber pad 403 is installed at the bottom end of the impact hammer 401. A limit ring 404 is installed on the upper part of the outer wall of the impact hammer 401. A protective cover 405 is slidably connected to the lower part of the outer wall of the impact hammer 401. A spring C406 is installed between the protective cover 405 and the limit ring 404. The inner sides of the protective cover 405 are slidably connected to the outer wall of the guide post B402. The protective cover 405 is slidably connected to the outer wall of the guide post B402. The protective cover 405 is slidably connected to the guide column B402 and the outer wall of the impact hammer 401 on the electric impact testing machine 4, and a spring C406 is fitted between the protective cover 405 and the limiting ring 404 on the impact hammer 401. The buffering effect of the spring C406 is used to test the adhesion of the chip after installation by the impact hammer 401. As the impact hammer 401 descends, the protective cover 405 also descends synchronously and contacts the placement area 2 to form a closed state, which plays a protective role in the chip testing process and avoids the chip from breaking or sputtering due to substandard quality during the impact test.

[0025] Working principle: When using this utility model, the placement platform 202 is installed at the bottom of the placement area 2 by spring A203. Due to the elastic reaction force of spring A203, the placement platform 202 is reset, and in the reset state, it is positioned on the plane of the placement area 2. This facilitates chip placement on the surface of the placement platform 202 and allows the chip to be easily pressed into the placement area 2. Two sets of guide posts A301 are slidably connected to the two sets of mounting brackets 3 on the placement area 2, and the guide posts A301... A spring B304 is fitted onto the outer wall. Based on the elastic reaction force of the spring B304, and the inclined shape of one side of the upper surface of the locking pin 303 on the guide post A301, the chip requiring adhesion impact testing is placed on the placement stage 202. The placement stage 202 is reset to the plane of the placement area 2 by the spring A203. Pressing the chip causes the placement stage 202 to compress the two sets of locking pins 303, causing them to retract. When the chip is below the locking pins 303, the spring B304 pushes the locking pins 303 back to their original position, thus achieving the chip installation and fixation process. Similarly, the chip requires... To disassemble, simply pull the pull ring 302 outward until the locking pin 303 retracts. With the spring A203 no longer under pressure, it pushes the placement stage 202 back to its original position, allowing the chip to be removed. During chip removal and installation, only pressing and pulling are required, making the operation simple and minimizing time spent on chip removal and installation that could affect testing efficiency. The protective cover 405 is slidably connected to the guide post B402 and the outer wall of the impact hammer 401 on the electric impact testing machine 4, respectively, and a spring is fitted between the protective cover 405 and the limiting ring 404 on the impact hammer 401. C406 utilizes the cushioning effect of spring C406 to conduct impact testing on the adhesion of the installed chip using impact hammer 401. As impact hammer 401 descends, protective cover 405 also descends simultaneously, contacting the placement area 2 to form a closed state. This serves as a protective measure during the chip testing process, minimizing the possibility of chip breakage or sputtering due to substandard chip quality during the impact test. This ensures the safety of surrounding equipment and personnel, effectively improving the efficiency and effectiveness of chip adhesion testing.

[0026] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A chip adhesion testing mechanism, comprising an operating frame (1), wherein a placement area (2) is mounted on the top front end of the operating frame (1), characterized in that: Mounting brackets (3) are installed on the upper part of the outer walls on both sides of the placement area (2); The top rear end of the operating frame (1) is equipped with a detection component, which includes an electric impact testing machine (4) and an impact hammer (401) is installed at the bottom center of the electric impact testing machine (4).

2. The chip adhesion detection mechanism according to claim 1, characterized in that: Limit seats (201) are installed on the lower part of the inner walls on both sides of the placement area (2). A placement platform (202) is slidably connected to the upper part of the interior of the placement area (2). A spring A (203) is installed between the placement platform (202) and the placement area (2).

3. The chip adhesion detection mechanism according to claim 1, characterized in that: The mounting bracket (3) is internally slidably connected to a guide post A (301), and a pull ring (302) is installed at one end of the guide post A (301).

4. The chip adhesion detection mechanism according to claim 3, characterized in that: The other end of the guide post A (301) is equipped with a locking pin (303), and the outer wall of the locking pin (303) is slidably connected to the outer wall of the placement area (2).

5. The chip adhesion detection mechanism according to claim 4, characterized in that: A spring B (304) is installed on one side of the outer wall of the guide post A (301), and the spring B (304) is located inside the mounting bracket (3).

6. The chip adhesion detection mechanism according to claim 1, characterized in that: The electric impact testing machine (4) has guide columns B (402) installed on both sides of its bottom, and the impact hammer (401) has a rubber pad (403) installed at its bottom end.

7. The chip adhesion detection mechanism according to claim 6, characterized in that: A limit ring (404) is installed on the upper part of the outer wall of the impact hammer (401), and a protective cover (405) is slidably connected to the lower part of the outer wall of the impact hammer (401).

8. The chip adhesion detection mechanism according to claim 7, characterized in that: A spring C (406) is installed between the protective cover (405) and the limiting ring (404), and the inner sides of the protective cover (405) are slidably connected to the outer wall of the guide post B (402).

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