A height-adjustable power module package structure

Abstract

The utility model provides a height adjustable power module packaging structure, include: radiator, module side frame sets up on radiator, module side frame top both sides set up heightening subassembly, module side frame all sets up self -tapping screw hole with each heightening subassembly's position correspondingly, and the heightening subassembly clamping cooperation of setting up with it correspondingly is connected with self -tapping screw hole, terminal pin interval arrangement is in the module side frame top between heightening subassembly, PCB board sets up in module side frame top, terminal pin passes through PCB board and extends to PCB board outside, and PCB board and heightening subassembly screw connection, or PCB board and heightening subassembly contact, the utility model discloses height adjustable power module packaging structure can solve the compatible problem of module side frame different height, is applicable to the packaging form of the majority of self -tapping screw hole position on market, heightening subassembly is general spare, reduces the mould cycle and mould expense, nimblely can realize, can dispense with system support column, reduces the benefit, and reduces PCB trepanning, improves the utilization of wiring.

Description

Technical Field

[0001] This utility model belongs to the field of power semiconductor technology, specifically relating to a highly adjustable power module packaging structure. Background Technology

[0002] As mainstream devices among new power semiconductor devices, IGBT power modules and SiC power modules have been widely used in emerging industries such as industry, rail transportation, new energy, smart grids, and new energy vehicles.

[0003] For the packaging forms and systems of IGBT and SiC power modules, the terminal pins in their structure mainly serve to electrically connect the module and the system, while the side frame mainly serves to provide support, protection, and isolation insulation.

[0004] In traditional IGBT and SiC module packaging, the electrical clearance between the PCB and the heat sink is mainly determined by the side frame height h. As application efficiency increases, the bus voltage increases accordingly, and the electrical clearance between the PCB and the heat sink needs to be further increased. At this time, a new height of side frame needs to be manufactured, and the related mold costs are high. Considering optimal electrical performance, side frames of different heights cannot be used interchangeably. If the height of the system fixing support column is simply increased, the PCB will be suspended above the side frame. Due to the gravity of the PCB, stress will be concentrated at the connection between the terminal pin and the PCB (the connection method here can be welding or crimping). Long-term stress mismatch may cause problems such as terminal pin detachment or solder joint detachment, resulting in electrical failure. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a height-adjustable power module packaging structure to solve the compatibility problem of different side frame heights. It is applicable to most packaging forms with self-tapping screw holes on the market.

[0006] To achieve the above technical objectives, the technical solution adopted by this utility model is as follows:

[0007] A height-adjustable power module packaging structure, wherein the height-adjustable power module packaging structure includes:

[0008] heat sink;

[0009] A module side frame is mounted on a heat sink. Heightening components are provided on both sides of the top of the module side frame. Self-tapping screw holes are provided on the module side frame corresponding to the positions of each heightening component. The self-tapping screw holes and the corresponding heightening components are engaged in a snap-fit ​​manner.

[0010] Terminal pins, which are spaced apart on the top of the module side frame between the height-increasing components;

[0011] The PCB board is disposed above the side frame of the module. The terminal pins extend through the PCB board to the outside of the PCB board. The PCB board and the height-increasing component are threadedly connected, or the bottom of the PCB board contacts the height-increasing component.

[0012] Preferably, in the height-adjustable power module packaging structure, a thermally conductive silicone grease layer is disposed between the heat sink and the module side frame.

[0013] Preferably, in the height-adjustable power module packaging structure, a gasket is provided between the module side frame and the heat sink and fixed by a first screw.

[0014] Preferably, in the height-adjustable power module packaging structure, the height-increasing component includes a height-increasing block and connectors disposed on both sides of the lower end of the height-increasing block. The end of the connector away from the height-increasing block is bent outward into a hook-shaped structure, and the self-tapping screw hole and the corresponding connector of the height-increasing component are engaged.

[0015] Preferably, in the height-adjustable power module packaging structure, a screw hole is provided at the end of the height-increasing block away from the connector, and an internal thread is provided in the screw hole. When the PCB board and the height-increasing component are threaded together, the PCB board and the height-increasing component are connected by a second screw, and the second screw has an external thread at the position corresponding to the internal thread.

[0016] Preferably, in the height-adjustable power module packaging structure, the height of the height-increasing block and the connector are both 5-8mm.

[0017] Preferably, in the height-adjustable power module packaging structure, the depth of the screw holes is 5-8 mm.

[0018] Preferably, in the height-adjustable power module packaging structure, the module side frame is a frame structure, a receiving cavity is provided in the frame structure, a ceramic substrate is provided in the receiving cavity, a solder layer is provided on the side of the ceramic substrate near the receiving cavity, a chip is provided on the solder layer, a pin hole is provided on the module side frame, one end of a terminal pin passes through the pin hole and is connected to the solder layer, and the terminal pin and the chip are electrically interconnected through bonding wires and the solder layer.

[0019] The beneficial effects of this utility model are:

[0020] This utility model features a height-adjustable power module packaging structure that solves the compatibility problem of different module side frame heights and is applicable to most packaging forms with self-tapping screw holes on the market. The height-increasing component is a universal part, reducing mold opening cycle and mold opening costs, and is flexible and feasible. It can eliminate the need for system support pillars, reduce costs and increase efficiency, and reduce PCB openings, thereby improving wiring utilization. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the height-adjustable power module packaging structure of this utility model.

[0022] Figure 2 This is an exploded view of the height-adjustable power module packaging structure of this utility model.

[0023] Figure 3 for Figure 1 A schematic diagram showing the structure with self-tapping screw holes on the side frame of the middle module.

[0024] Figure 4 This is a schematic diagram of the structure of the height-increasing component and the self-tapping screw hole of this utility model.

[0025] Figure 5 This is a schematic diagram of the height-increasing component of this utility model.

[0026] Figure 6 A schematic diagram showing the self-tapping screw holes on the side frame of the module.

[0027] Figure 7 This is a structural diagram of the module's side frame. Detailed Implementation

[0028] In the description of this utility model, it should be understood that the orientation or positional relationship indicated by directional terms such as "inner" and "outer", "upper" and "lower", "front" and "back" is usually based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0030] Example 1

[0031] like Figures 1-7 A height-adjustable power module packaging structure, wherein the height-adjustable power module packaging structure includes:

[0032] Radiator 8;

[0033] A module side frame 1 is disposed on a heat sink 8. Heightening components 9 are disposed on both sides of the top of the module side frame 1. Self-tapping screw holes 10 are provided on the module side frame 1 corresponding to the positions of each heightening component 9. The self-tapping screw holes 10 and the corresponding heightening components 9 are engaged in a snap-fit ​​connection.

[0034] Terminal pins 2 are spaced apart on the top of the module side frame 1 between the heightening components 9;

[0035] PCB board 3 is disposed above the side frame 1 of the module. The terminal pin 2 extends through PCB board 3 to the outside of PCB board 3. PCB board 3 and heightening component 9 are threaded, connected, or the bottom of PCB board 3 contacts heightening component 9.

[0036] A thermally conductive silicone grease layer 7 is provided between the heat sink 8 and the module side frame 1; a gasket 6 is provided between the module side frame 1 and the heat sink 8 and fixed by a first screw 5; the height-increasing component 9 includes a height-increasing block 91 and connectors 92 disposed on both sides of the lower end of the height-increasing block, the end of the connector 92 away from the height-increasing block 91 is bent outward into a hook-shaped structure, and the self-tapping screw hole 10 and the corresponding connector 92 of the height-increasing component 9 are engaged; a screw hole 93 is provided at the end of the height-increasing block 91 away from the connector 92, and an internal thread is provided in the screw hole 93. When the PCB board 3 and the height-increasing component 9 are threaded together, the PCB board 3 and the height-increasing component 9 are connected by a second screw 4, and the second screw 4 is provided with an external thread at the position corresponding to the internal thread; the height of the height-increasing block 91 and the connector 92 is 5-8mm; the depth of the screw hole 93 is 5-8mm.

[0037] The module side frame 1 is a frame structure with a receiving cavity. A ceramic substrate 11 is disposed in the receiving cavity. A solder layer 12 is disposed on the side of the ceramic substrate 11 near the receiving cavity. A chip 13 is disposed on the solder layer 12. A pin hole 14 is disposed on the module side frame 1. One end of a terminal pin 2 passes through the pin hole 14 and is connected to the solder layer 12. The terminal pin 2 and the chip 13 are electrically interconnected with the solder layer 12 through a bonding wire 15. The gate at the top of the chip 13 is interconnected with the terminal pin 2 through the bonding wire 15. The collector at the bottom of the chip 13 is interconnected with the terminal pin 2 through the solder layer 12.

[0038] Based on the existing module side frame, this utility model sets self-tapping screw holes in the module side frame to cooperate with the heightening component. The heightening component and the self-tapping screw holes form an interlocking structure by snapping together. The depth of the self-tapping screw holes is 8mm. This structure is compatible with general self-tapping screws.

[0039] The PCB board 3, module side frame 1 and terminal pin 2 are interconnected. The heightening component has the function of limiting or limiting and reinforcing. The heightening component and the PCB board are connected by the second screw 4, or the PCB board is placed directly on the heightening component 9 and contacts the heightening component 9.

[0040] The height-increasing component of this utility model has a connector 92 and a self-tapping screw hole 10 that cooperate to form an interlocking structure after assembly; the height-increasing block 91 is provided with a screw hole 93, and the PCB board 3 and the height-increasing component 9 are connected by a second screw 4, which further strengthens the connection between the height-increasing component 9 and the PCB board 3.

[0041] This utility model's height-increasing component includes a height-increasing block 91 and a connector 92. The connector 92 has a height of 5-8mm and is used to be riveted to the self-tapping screw holes of the module side frame and fixed on the module side frame. The height-increasing block 91 has a height of 5-8mm and is used to increase the overall height of the module side frame, thereby meeting the requirement of increasing the electrical clearance between the PCB board and the heat dissipation platform. By setting the height-increasing component, the required electrical clearance between the PCB board and the heat sink 8 can be flexibly achieved.

[0042] The module side frame 1 serves to support, protect, and isolate the chip. The module side frame 1 is a frame structure with a cavity containing a ceramic substrate. Pin holes are provided on the frame structure. One end of a terminal pin 2 passes through the pin hole and is soldered to the solder layer 13 on the ceramic substrate. The other end of the terminal pin 2 is soldered to the PCB board 3 via welding or crimping, providing electrical interconnection between the chip and the PCB board. A second screw 4 is used to mechanically fix the module side frame 1 and the PCB board 3, reinforcing the system's mechanical structure. A first screw 5 and a washer 6 fix the module side frame 1 to the heat sink 8. A thermally conductive grease layer 7 is placed between the bottom of the module side frame 1 and the heat sink 8 for heat conduction. The heat sink 8 supports both air cooling and liquid cooling. A height-adjusting component 9 can flexibly change the height of the module side frame 1, controlling the electrical clearance between the PCB board 3 and the heat sink 8.

[0043] Figure 6 This is a schematic diagram showing the self-tapping screw holes on the module side frame 1. The power module packaging structure of this utility model is applicable to most module side frames with self-tapping screw holes on the market.

[0044] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although this utility model has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A height-adjustable power module packaging structure, characterized in that, include: Radiator (8); The module side frame (1) is set on the heat sink (8). The module side frame (1) is provided with height-increasing components (9) on both sides of the top of the module side frame (1). The module side frame (1) is provided with self-tapping screw holes (10) corresponding to the height-increasing components (9). The self-tapping screw holes (10) and the height-increasing components (9) provided therewith are engaged. Terminal pins (2) are spaced apart on the top of the module side frame (1) between the heightening components (9); PCB board (3), the PCB board (3) is disposed above the module side frame (1), the terminal pin (2) extends through the PCB board (3) to the outside of the PCB board (3), the PCB board (3) and the heightening component (9) are threadedly connected or the bottom of the PCB board (3) contacts the heightening component (9).

2. The height-adjustable power module packaging structure according to claim 1, characterized in that, A thermal grease layer (7) is provided between the heat sink (8) and the module side frame (1).

3. The height-adjustable power module packaging structure according to claim 1, characterized in that, A gasket (6) is provided between the module side frame (1) and the heat sink (8) and fixed by a first screw (5).

4. The height-adjustable power module packaging structure according to claim 1, characterized in that, The height-increasing component (9) includes a height-increasing block (91) and connectors (92) located on both sides of the lower end of the height-increasing block. The end of the connector (92) away from the height-increasing block (91) is bent outward into a hook-shaped structure, and the self-tapping screw hole (10) and the connector (92) of the height-increasing component (9) corresponding to it are engaged.

5. The height-adjustable power module packaging structure according to claim 4, characterized in that, The heightening block (91) has a screw hole (93) at one end away from the connector (92). The screw hole (93) has an internal thread. When the PCB board (3) and the heightening component (9) are threaded together, the PCB board (3) and the heightening component (9) are connected by a second screw (4). The second screw (4) has an external thread at the position corresponding to the internal thread.

6. The height-adjustable power module packaging structure according to claim 4, characterized in that, The height of both the heightening block (91) and the connector (92) is 5-8mm.

7. The height-adjustable power module packaging structure according to claim 5, characterized in that, The depth of the screw hole (93) is 5-8mm.

8. The height-adjustable power module packaging structure according to claim 1, characterized in that, The module side frame (1) is a frame structure with a receiving cavity in it. A ceramic substrate (11) is provided in the receiving cavity. A solder layer (12) is provided on the side of the ceramic substrate (11) near the receiving cavity. A chip (13) is provided on the solder layer (12). A pin hole (14) is provided on the module side frame (1). One end of a terminal pin (2) passes through the pin hole (14) and is connected to the solder layer (12). The terminal pin (2) and the chip (13) are electrically interconnected through a bonding wire (15) and the solder layer (12).

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