A UWB positioning instrument circuit board
By integrating heat dissipation components and using a modularly designed UWB positioning instrument circuit board, the problems of low heat dissipation efficiency and low integration have been solved, improving positioning accuracy and stability and simplifying the maintenance process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DALIAN JIAYUAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing UWB positioning devices have low heat dissipation efficiency on their circuit boards, resulting in excessively high chip temperatures that affect positioning accuracy and stability. In addition, the multi-layer circuit board structure has low integration, making disassembly and maintenance difficult.
It adopts an integrated heat dissipation component, including an integrated board, an L-shaped heat sink and heat dissipation fins, combined with a modular circuit board structure, with each functional layer designed independently. Heat conduction and heat dissipation are achieved through thermal vias and limiting blocks, and it is easy to disassemble and maintain.
It improves heat dissipation efficiency, reduces thermal resistance, enhances the structural stability of the circuit board, simplifies the maintenance process, and reduces repair costs.
Smart Images

Figure CN224521416U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wireless positioning technology, specifically a UWB positioning device circuit board. Background Technology
[0002] UWB positioning tags are miniature positioning devices based on Ultra-Wideband (UWB) wireless communication technology, enabling centimeter-level high-precision location tracking. The assembly process of UWB positioning tags involves circuit boards, which can be made from various materials including ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, printed circuit boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, and printed circuit boards (using copper etching technology). Circuit boards enable miniaturization and visualization of circuits, playing a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout.
[0003] Existing UWB positioning instrument circuit boards have the following problems: low heat dissipation efficiency, resulting in excessively high chip temperature, affecting positioning accuracy and stability; and low integration of multi-layer circuit board structure, making disassembly and maintenance difficult. Utility Model Content
[0004] The purpose of this invention is to provide a UWB positioning device circuit board to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a UWB positioning device circuit board, comprising an integrated heat dissipation assembly, wherein a circuit board assembly is disposed inside the integrated heat dissipation assembly; The integrated heat dissipation assembly includes an integrated plate, on one side of which an L-shaped heat dissipation plate is fixedly installed. The outer walls of the horizontal and vertical portions of the L-shaped heat dissipation plate are provided with square grooves, and multiple parallel heat dissipation fins are arranged in the square grooves. Multiple slots are evenly provided on the inner side of the integrated plate from top to bottom. A locking screw is threaded into the front of the top face of the integrated plate. The shaft of the locking screw passes through multiple slots, and a rotating head is fixedly sleeved on the top of the shaft of the locking screw. A connection port is provided on one end face of each of the multiple slots.
[0006] Preferably, the circuit board assembly includes an antenna layer board, and a digital signal layer board, a ground layer, an analog signal layer board, and an interface and peripheral connection layer board are sequentially arranged on the bottom of the antenna layer board. A plug-in connector rod is fixedly installed on one side of each of the antenna layer board, the digital signal layer board, the ground layer, the analog signal layer board, and the interface and peripheral connection layer board.
[0007] Preferably, each of the multiple insert connector rods has a locking thread opening on its top front surface, and multiple heat-conducting vias are provided on both sides of the top surface of the antenna layer, digital signal layer, ground layer, analog signal layer, and interface and peripheral connection layer.
[0008] Preferably, the plurality of the insert connector rods correspond one-to-one with the plurality of insert slots, and the insert connector rods are movably inserted into the insert slots.
[0009] Preferably, one end of the insert connector rod is movably inserted into the connection socket, and the threads of the locking screw pass through multiple locking threaded holes.
[0010] Preferably, multiple limiting blocks are fixedly installed on the front and rear sides of the longitudinal portion of the L-shaped heat sink, with a gap between adjacent limiting blocks, and the two adjacent limiting blocks are in contact with the outer wall of the circuit board assembly.
[0011] Compared with the prior art, the beneficial effects of this utility model are: This invention integrates heat dissipation components and a modular circuit board structure. The UWB positioning device circuit board features an independent design for each functional layer, reducing electromagnetic interference and facilitating disassembly and maintenance. Faulty layers can be replaced individually, reducing repair costs. Furthermore, the integrated heat dissipation components are tightly integrated with the circuit board, reducing thermal resistance. The gaps between the layers further enhance heat dissipation. The integrated heat dissipation components also improve the structural strength of the heating plate assembly and enhance the overall structural stability of the circuit board. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the integrated heat dissipation component structure of this utility model; Figure 3 This is a schematic diagram of the circuit board assembly structure of this utility model; Figure 4 This is a schematic diagram of the circuit board assembly structure of this utility model; Figure 5 This utility model Figure 3 Enlarged view of part A.
[0013] In the diagram: 1. Integrated heat dissipation assembly; 101. Integrated board; 102. L-shaped heat sink; 103. Heat dissipation fins; 104. Limiting block; 105. Slot; 106. Locking screw; 107. Rotary head; 108. Connection socket; 2. Circuit board assembly; 201. Antenna layer; 202. Digital signal layer; 203. Grounding layer and analog signal layer; 204. Interface and peripheral connection layer; 205. Insert connector rod; 206. Locking threaded port; 207. Thermal via. Detailed Implementation
[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0015] like Figure 1-5 As shown, this utility model provides a technical solution: including an integrated heat dissipation component 1, wherein a circuit board component 2 is disposed inside the integrated heat dissipation component 1; The integrated heat dissipation assembly 1 includes an integrated plate 101, on one side of which an L-shaped heat sink 102 is fixedly mounted. Both the integrated plate 101 and the L-shaped heat sink 102 are made of aluminum alloy. The outer walls of both the horizontal and vertical portions of the L-shaped heat sink 102 are provided with square grooves. Multiple parallel heat dissipation fins 103 are arranged within these square grooves. The heat dissipation fins 103 are precision die-cast, with a thickness of 0.5-1 mm and a spacing of 1-2 mm. The inner... Multiple slots 105 are evenly provided on the side from top to bottom. A locking screw 106 is threaded into the front of the top face of the integrated plate 101. The shaft of the locking screw 106 passes through multiple slots 105. A rotating head 107 is fixedly sleeved on the top of the shaft of the locking screw 106. A connection port 108 is provided on one end face of each of the multiple slots 105. The horizontal and vertical parts of the L-shaped heat sink 102 are provided with square grooves with heat dissipation fins 103 to increase the heat dissipation area.
[0016] In this embodiment, the circuit board assembly 2 includes an antenna layer board 201. The bottom of the antenna layer board 201 is sequentially provided with a digital signal layer board 202, a ground layer, an analog signal layer board 203, and an interface and peripheral connection layer board 204. Each layer board uses FR-4 or high-frequency materials such as Rogers RO4350B. A plug-in connector rod 205 is fixedly installed on one side of the antenna layer board 201, the digital signal layer board 202, the ground layer, the analog signal layer board 203, and the interface and peripheral connection layer board 204. The circuit board assembly 2 adopts a layer structure design. The antenna layer board 201 is used to arrange a UWB antenna array. Digital signal layer 202: Processes positioning algorithms and digital signals; Ground plane and analog signal layer 203: Provides a ground plane and processes analog signals; Interface and peripheral connection layer 204: Connects external devices and power supply.
[0017] Meanwhile, locking threaded openings 206 are provided on the front of the top face of multiple insert connector rods 205. Multiple heat-conducting vias 207 are provided on both sides of the top surface of the antenna layer 201, digital signal layer 202, ground layer and analog signal layer 203, and interface and peripheral connection layer 204. The heat-conducting vias 207 have a diameter of 0.3-0.5mm and are filled with heat-conducting material such as copper paste. The heat-conducting vias 207 on both sides of the top surface of each layer conduct heat to the heat dissipation component.
[0018] Multiple insertion connector rods 205 correspond one-to-one with multiple insertion slots 105. The insertion connector rods 205 are movably inserted into the insertion slots 105. Multiple insertion slots 105 are opened inside the integrated board 101 for installing the circuit board assembly 2.
[0019] One end of the insert connector rod 205 is movably inserted into the connection socket 108. The insert connector rod 205 is made of gold-plated copper alloy to ensure the reliability of the electrical connection. The thread of the locking screw 106 passes through multiple locking threaded holes 206. The locking screw 106 passes through the insert slot 105 and the locking threaded holes 206 of the circuit board assembly 2 to achieve mechanical fixation. At the same time, the insert connector rod 205 cooperates with the connection socket 108 to achieve electrical connection. The insert slot 105 and the connection socket 108 are CNC machined to ensure precision.
[0020] Multiple limiting blocks 104 are fixedly installed on the front and rear sides of the longitudinal portion of the L-shaped heat sink 102. There is a gap between two adjacent limiting blocks 104. Two adjacent limiting blocks 104 are in contact with the outer wall of the circuit board assembly 2. The limiting blocks 104 are in contact with the outer wall of the circuit board assembly 2, which assists in heat dissipation and supports one side of the circuit board assembly 2.
[0021] The assembly steps are as follows: First, align the insertion connector rods 205 of each layer of the circuit board assembly 2 with the insertion slots 105 of the integrated board 101. Then, push the circuit board assembly 2 to insert the insertion connector rods 205 into the connection sockets 108. Next, rotate the rotating head 107 to thread the locking screw 106 into the locking threaded opening 206, thus securing the circuit board assembly 2. The heat dissipation principle is as follows: The heat generated by circuit board assembly 2 is conducted to the surface through thermally conductive vias 207; Heat is transferred to the heat dissipation component through the contact interface between the limiting block 104 and the L-shaped heat sink 102; The heat dissipation fins 103 dissipate heat into the environment through convection and radiation.
[0022] In summary, the UWB positioning instrument circuit board reduces electromagnetic interference through independent design of each functional layer, while facilitating disassembly and maintenance. Faulty layers can be replaced individually, reducing maintenance costs. Furthermore, the integrated heat dissipation component is tightly integrated with the circuit board, reducing thermal resistance. The gaps between the layers also improve heat dissipation. The further integration of heat dissipation component 2 enhances the structural strength of the heating plate component 1 and improves the overall structural stability of the circuit board.
[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A UWB positioning device circuit board, comprising an integrated heat dissipation assembly (1), characterized in that... The integrated heat dissipation component (1) has a circuit board assembly (2) inside. The integrated heat dissipation assembly (1) includes an integrated plate (101). An L-shaped heat dissipation plate (102) is fixedly installed on one side of the integrated plate (101). The outer walls of the horizontal and vertical portions of the L-shaped heat dissipation plate (102) are provided with square grooves. Multiple parallel heat dissipation fins (103) are arranged in the square grooves. Multiple slots (105) are evenly provided on the inner side of the integrated plate (101) from top to bottom. A locking screw (106) is threaded into the front of the top face of the integrated plate (101). The shaft of the locking screw (106) passes through multiple slots (105). A rotating head (107) is fixedly sleeved on the top of the shaft of the locking screw (106). A connection socket (108) is provided on one end face of each of the multiple slots (105).
2. The UWB locator circuit board according to claim 1, wherein, The circuit board assembly (2) includes an antenna layer board (201). The bottom of the antenna layer board (201) is provided with a digital signal layer board (202), a ground layer and an analog signal layer board (203) and an interface and peripheral connection layer board (204). A plug-in connector rod (205) is fixedly installed on one side of the antenna layer board (201), the digital signal layer board (202), the ground layer and the analog signal layer board (203) and the interface and peripheral connection layer board (204).
3. The UWB locator circuit board according to claim 2, wherein, The top front of each of the multiple plug-in connector rods (205) is provided with a locking thread (206), and the top surfaces of the antenna layer (201), digital signal layer (202), ground layer and analog signal layer (203), and interface and peripheral connection layer (204) are provided with multiple heat-conducting vias (207).
4. The UWB positioning instrument circuit board of claim 2, wherein, Each of the multiple insert connector rods (205) corresponds to a multiple insert slots (105), and the insert connector rods (205) are movably inserted into the insert slots (105).
5. The UWB locator circuit board according to claim 3, wherein, One end of the insert connector rod (205) is movably inserted into the connection socket (108), and the thread of the locking screw (106) passes through multiple locking threaded holes (206).
6. The UWB locator circuit board according to claim 1, wherein, Multiple limiting blocks (104) are fixedly installed on the front and rear sides of the longitudinal part of the L-shaped heat sink (102). There is a gap between two adjacent limiting blocks (104), and two adjacent limiting blocks (104) are in contact with the outer wall of the circuit board assembly (2).