Electroplating solution impurity ion detection device

Abstract

The utility model discloses a kind of electroplating liquid impurity ion detection devices, belong to electroplating liquid detection technical field, including cabinet, be located on the feeding mechanism of cabinet, with the oscillation mechanism connected with the feeding mechanism, and with the detection mechanism connected with the oscillation mechanism;Wherein, the oscillation mechanism includes second power component, with the eccentric wheel connected with the second power component, be located on the connecting shaft of the eccentric wheel, and be located on the electrolytic cell of the connecting shaft;The eccentric wheel is annular structure, the center is connected with second power component, one end of the connecting shaft is connected with the end surface of eccentric wheel annular structure;The electrolytic cell is the square container with opening in top, the geometric center of electrolytic cell bottom is connected with the end of connecting shaft away from eccentric wheel. The utility model solves the technical problem that electroplating analysis efficiency is lower after manual sampling, realizes electroplating liquid automatic feeding, oscillation and detection process.

Description

Technical Field

[0001] This utility model relates to the field of electroplating solution detection technology, specifically to an electroplating solution impurity ion detection device. Background Technology

[0002] Impurity ions in electroplating solutions have many adverse effects on the electroplating process and the quality of the plating layer. For example, impurity ions can mix into the plating layer, causing the chemical composition of the plating layer to deviate from the expected value, resulting in a decrease in its purity. On the other hand, the type and content of impurity ions can affect the conductivity of the electroplating solution, which may increase the resistance of the solution and cause uneven current distribution, resulting in excessively high or low current density on the surface of the plated part. Therefore, it is necessary to detect them and implement purification measures.

[0003] In existing technologies, the detection process of impurity ions in electroplating solutions usually involves manual sampling followed by electroplating analysis to detect the impurity ions. By simulating the electroplating production process, the actual impact of impurity ions on electroplating quality and performance can be intuitively reflected. However, the efficiency of electroplating analysis after manual sampling is low and cannot be adapted to large-scale production. Utility Model Content

[0004] To solve the above problems, this utility model provides an electroplating solution impurity ion detection device, including a cabinet, a feeding mechanism disposed on the cabinet, an oscillation mechanism connected to the feeding mechanism, and a detection mechanism connected to the oscillation mechanism. The oscillation mechanism includes a second power component, an eccentric wheel connected to the second power component, a connecting shaft on the eccentric wheel, and an electrolytic cell on the connecting shaft. The eccentric wheel is a ring structure, and its center is connected to the second power component. One end of the connecting shaft is connected to the end face of the eccentric wheel ring structure. The electrolytic cell is a square container with an opening at the top, and the geometric center of the bottom of the electrolytic cell is connected to the end of the connecting shaft away from the eccentric wheel.

[0005] Preferably, the feeding mechanism includes: a first power component, a threaded rod connected to the first power component, a threaded block connected to the threaded rod, and a base connected to the threaded block.

[0006] Preferably, the feeding mechanism further includes a guide rail slider structure, which includes a guide rail and a slider slidably connected to the guide rail, wherein the guide rail is disposed on the cabinet and parallel to the threaded rod, and the slider is disposed at the bottom of the base.

[0007] Preferably, the electrolytic cell is provided with limiting shafts at the four corners of the bottom, and the base is provided with limiting grooves that are adapted to the limiting shafts, for limiting the electrolytic cell.

[0008] Preferably, the limiting groove has a circular structure.

[0009] Preferably, the detection mechanism includes: a first telescopic cylinder, a cover plate connected to the first telescopic cylinder, a second telescopic cylinder and a third telescopic cylinder disposed on the cover plate, a cathode plate disposed on the second telescopic cylinder, and an anode plate disposed on the third telescopic cylinder. The detection mechanism is located above the electrolytic cell.

[0010] Preferably, the detection mechanism further includes a fourth telescopic cylinder and a clamping plate connected to the fourth telescopic cylinder, wherein the fourth telescopic cylinder and the clamping plate are located on both sides of the electrolytic cell.

[0011] By adopting the above technical solution, this utility model mainly has the following technical effects: The electroplating solution is moved to the bottom of the detection mechanism by the feeding mechanism. After the cathode plate and anode plate are energized, the system analyzes the correlation between the state of the anode plate and the coating defects of the cathode plate, accurately locates the type of impurities in the electroplating solution, solves the technical problem of low efficiency of electroplating analysis after manual sampling, and realizes the automatic feeding, shaking and detection process of electroplating solution. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of an electroplating solution impurity ion detection device according to the present invention; Figure 2 This is a schematic diagram of the oscillation mechanism in an electroplating solution impurity ion detection device of this utility model; Figure 3 This is a schematic diagram of the oscillation mechanism (from another perspective) in an electroplating solution impurity ion detection device of this utility model; Figure 4 This is a cross-sectional schematic diagram of the oscillation mechanism in an electroplating solution impurity ion detection device of this utility model; Figure 5 This is a schematic diagram of the structure of an electroplating solution impurity ion detection device (from another perspective) according to the present invention.

[0013] The meanings of the reference numerals in the attached figures are as follows: 1. Cabinet; 2. Feeding mechanism; 21. First power assembly; 22. Threaded rod; 23. Threaded block; 24. Base; 25. Guide rail and slider structure; 251. Guide rail; 252. Slider; 3. Oscillating mechanism; 31. Second power component; 32. Eccentric wheel; 33. Connecting shaft; 34. Electrolytic cell; 341. Limiting shaft; 342. Limiting groove; 4. Testing mechanism; 41. First telescopic cylinder; 42. Cover plate; 43. Second telescopic cylinder; 44. Third telescopic cylinder; 45. Cathode plate; 46. Anode plate; 47. Fourth telescopic cylinder; 48. Clamping plate. Detailed Implementation

[0014] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0015] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0016] Please see Figures 1-5 This utility model provides an electroplating solution impurity ion detection device, including a cabinet 1, a feeding mechanism 2 disposed on the cabinet 1, an oscillation mechanism 3 connected to the feeding mechanism 2, and a detection mechanism 4 connected to the oscillation mechanism 3.

[0017] In some embodiments, the cabinet 1 is a support part of the electroplating solution impurity ion detection device, which has a certain rigidity and hardness, and is used to support and fix the device installed on the cabinet 1.

[0018] In some embodiments, the feeding mechanism 2 is the part of the electroplating solution impurity ion detection device used to move the electroplating solution. The feeding mechanism 2 can move the electroplating solution to below the detection mechanism 4 to facilitate detection and analysis of the electroplating solution, or it can move the electroplating solution away from the detection mechanism 4 to facilitate recovery of the electroplating solution.

[0019] In some embodiments, the feeding mechanism 2 includes: a first power component 21, a threaded rod 22 connected to the first power component 21, a threaded block 23 connected to the threaded rod 22, and a base 24 connected to the threaded block 23. The first power component 21 is used to generate power and transmit it to subsequent components or actuators. An exemplary first power component 21 may include a motor, which can convert electrical energy into mechanical energy based on the principle of electromagnetic induction.

[0020] Furthermore, the threaded rod 22 cooperates with the threaded block 23 to convert rotational motion into linear motion, thereby driving the base 24 connected to the threaded block 23 to move along the direction set by the threaded rod 22; the base 24 is used to install and fix the oscillation mechanism 3.

[0021] In some embodiments, the feeding mechanism 2 further includes a guide rail slider structure 25. In some embodiments, the guide rail slider structure 25 includes a guide rail 251 and a slider 252 slidably connected to the guide rail 251. The guide rail 251 is disposed on the cabinet 1 and parallel to the threaded rod 22. The slider 252 is disposed at the bottom of the base 24. The slider 252 slides on the guide rail 251 to enhance the smoothness of the base 24 when moving along the direction of the threaded rod 22.

[0022] In some embodiments, the oscillation mechanism 3 is a part of the electroplating solution impurity ion detection device used for oscillating the electroplating solution. The oscillation mechanism 3 includes: a second power component 31, an eccentric wheel 32 connected to the second power component 31, a connecting shaft 33 disposed on the eccentric wheel 32, and an electrolytic cell 34 disposed on the connecting shaft 33. The second power component 31 is a part used to generate power and transmit it to subsequent components or actuators, and is disposed in the base 24. An exemplary second power component 31 may include a motor, which can convert electrical energy into mechanical energy based on the principle of electromagnetic induction.

[0023] In some embodiments, the eccentric wheel 32 and the connecting shaft 33 are transmission components used to transmit the power generated by the second power component 31 to the electrolytic cell 34, causing the electrolytic cell 34 to oscillate back and forth, thereby fully and uniformly mixing the electroplating solution in the electrolytic cell 34.

[0024] Specifically, the eccentric wheel 32 is connected to the second power component 31, and the eccentric wheel 32 can be rotated by the power output from the second power component 31. The eccentric wheel 32 has a ring structure, and its center is connected to the second power component 31. One end of the connecting shaft 33 is connected to the end face of the ring structure of the eccentric wheel 32. When the eccentric wheel 32 rotates, the connecting shaft 33 will follow the eccentric wheel 32 in a circular motion with the center of the ring structure as the center.

[0025] In some embodiments, the electrolytic cell 34 is a square container with an opening at the top for holding the electroplating solution. Further, the geometric center of the bottom of the electrolytic cell 34 is connected to the end of the connecting shaft 33 away from the eccentric wheel 32. When the eccentric wheel 32 rotates, the geometric center of the bottom of the electrolytic cell 34 also takes the center of the annular structure of the eccentric wheel 32 as its center and follows the eccentric wheel 32 in a circular motion, thereby driving the electrolytic cell 34 to perform a circular motion in the plane, thereby fully and uniformly mixing the electroplating solution in the electrolytic cell 34.

[0026] In some more preferred embodiments, limiting shafts 341 are also provided at the four corners of the bottom of the electrolytic cell 34. When the electrolytic cell 34 moves in a circular motion in the plane, the limiting shafts 341 at the bottom of the electrolytic cell 34 will also follow in a circular motion, and their movement trajectory in the plane is circular. The base 24 is also provided with limiting grooves 342 that are adapted to the limiting shafts 341, which are used to limit the electrolytic cell 34, thereby reducing the degree of shaking of the electrolytic cell 34 during oscillation. Specifically, the limiting grooves 342 are circular structures and are adapted to the circular movement trajectory of the limiting shafts 341, so that when the electrolytic cell 34 follows the connecting shaft 33 in a circular motion, the limiting shafts 341 abut against the inner wall surface of the limiting grooves 342, thereby limiting the limiting shafts 341 through the limiting grooves 342, and thus limiting the electrolytic cell 34.

[0027] In some embodiments, the detection mechanism 4 is the electroplating part of the electroplating solution impurity ion detection device. The detection mechanism 4 includes: a first telescopic cylinder 41, a cover plate 42 connected to the first telescopic cylinder 41, a second telescopic cylinder 43 and a third telescopic cylinder 44 disposed on the cover plate 42, a cathode plate 45 disposed on the second telescopic cylinder 43, and an anode plate 46 disposed on the third telescopic cylinder 44. In some embodiments, the detection mechanism 4 is located above the electrolytic cell 34 and can be operated by the first telescopic cylinder 41 to drive the cover plate 42 to approach the electrolytic cell 34 until it is engaged with the electrolytic cell 34.

[0028] Furthermore, by operating the second telescopic cylinder 43 and the third telescopic cylinder 44, the cathode plate 45 and the anode plate 46 can be respectively introduced into the electroplating solution of the electrolytic cell 34. After energizing the cathode plate 45 and the anode plate 46, the system analyzes the correlation between the state of the anode plate 46 and the plating defects of the cathode plate 45. Combined with chemical verification methods, the type of impurities in the electroplating solution can be accurately located, thereby implementing targeted purification measures to improve the quality and efficiency of electroplating.

[0029] In some more preferred embodiments, the detection mechanism 4 further includes a fourth telescopic cylinder 47 and a clamping plate 48 connected to the fourth telescopic cylinder 47. The fourth telescopic cylinder 47 and the clamping plate 48 are located on both sides of the electrolytic cell 34. The fourth telescopic cylinder 47 can work, and the clamping plate 48 can abut against the electrolytic cell 34 to limit the electrolytic cell 34 and prevent the electrolytic cell 34 from shaking during the electroplating process.

[0030] Finally, it should be noted that the embodiments disclosed in this utility model are merely preferred embodiments of this utility model and are only used to illustrate the technical solutions of this utility model, not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of this utility model.

Claims

1. A device for detecting impurity ions in electroplating solutions, characterized in that, It includes a cabinet, a feeding mechanism mounted on the cabinet, a vibration mechanism connected to the feeding mechanism, and a detection mechanism connected to the vibration mechanism; The oscillation mechanism includes a second power component, an eccentric wheel connected to the second power component, a connecting shaft on the eccentric wheel, and an electrolytic cell on the connecting shaft. The eccentric wheel is a ring structure, and its center is connected to the second power component. One end of the connecting shaft is connected to the end face of the eccentric wheel ring structure. The electrolytic cell is a square container with an opening at the top, and the geometric center of the bottom of the electrolytic cell is connected to the end of the connecting shaft away from the eccentric wheel.

2. The electroplating solution impurity ion detection device according to claim 1, characterized in that, The feeding mechanism includes: a first power component, a threaded rod connected to the first power component, a threaded block connected to the threaded rod, and a base connected to the threaded block.

3. The electroplating solution impurity ion detection device according to claim 2, characterized in that, The feeding mechanism further includes a guide rail slider structure, which includes a guide rail and a slider slidably connected to the guide rail. The guide rail is located on the cabinet and parallel to the threaded rod, and the slider is located at the bottom of the base.

4. The electroplating solution impurity ion detection device according to claim 2, characterized in that, The electrolytic cell is also provided with limiting shafts at the four corners of its bottom, and the base is also provided with limiting grooves that are adapted to the limiting shafts, for limiting the electrolytic cell.

5. The electroplating solution impurity ion detection device according to claim 4, characterized in that, The limiting groove has a circular structure.

6. The electroplating solution impurity ion detection device according to claim 1, characterized in that, The detection mechanism includes: a first telescopic cylinder, a cover plate connected to the first telescopic cylinder, a second telescopic cylinder and a third telescopic cylinder disposed on the cover plate, a cathode plate disposed on the second telescopic cylinder, and an anode plate disposed on the third telescopic cylinder. The detection mechanism is located above the electrolytic cell.

7. The electroplating solution impurity ion detection device according to claim 6, characterized in that, The detection mechanism also includes a fourth telescopic cylinder and a clamping plate connected to the fourth telescopic cylinder, with the fourth telescopic cylinder and the clamping plate located on both sides of the electrolytic cell.

Images