A test box structure for avalanche performance of a power semiconductor device

Abstract

The utility model discloses an avalanche performance test box structure of power semiconductor device relates to integrated circuit manufacturing technical field, and the utility model discloses a test box is equipped with installing mechanism in the middle part of test box for replacing the drive board and semiconductor device main part fast, and installing mechanism includes: replacement subassembly includes the frame fixed mounting in the middle part of test box, and the tray is slid outward along the limiting rod under the drive of the air cylinder of this application, until the tray is completely removed test box outside, when installing drive board, aligning installation slot and pressing down, make its contact pin and drive board pad close contact under the spring restoring force effect, realize electrical connection and the firm fixing of drive board, and when installing semiconductor device main body, utilize the adsorption between permanent magnet and tray and realize fast and stable fixation to semiconductor device main body pin, significantly shorten the test preparation time, improve the test efficiency, guarantee the reliability of electrical connection simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, specifically to a structure for an avalanche performance test box for power semiconductor devices. Background Technology

[0002] Avalanche energy testing measures the maximum energy a power semiconductor device can withstand under avalanche breakdown conditions. It is a key parameter for evaluating its reliability and safety, ensuring device reliability, verifying its ultimate withstand capability, and ensuring that the device will not be damaged by overload in practical applications. The avalanche test involves applying a pulse signal to the transistor to make the inductor in the circuit conduct and store energy. Then, the transistor signal is turned off, and the energy is released using the device's own avalanche breakdown characteristics. During the test, the avalanche voltage, current, and energy of the device are recorded. The transistor pulse width is gradually increased to increase the avalanche energy until the device fails due to avalanche, thus evaluating its single avalanche withstand capability.

[0003] Referring to the patent document: Patent Publication No. CN120072679A, Patent Publication Date 2025-05-30, a semiconductor testing apparatus and testing method are provided. The semiconductor testing apparatus includes a test piece on which various semiconductor devices are disposed, wherein the semiconductor devices include a testing section; a probe, the tip of which contacts the surface of the test piece; and a testing element electrically connected to the tail of the probe. The testing element applies a variable voltage or a variable current to the test piece. When a variable voltage is applied, the testing element acquires the current data of the test piece until the range of the variable voltage or the current data exceeds a current threshold range. When a variable current is applied, the testing element acquires the voltage data of the test piece until the voltage data exceeds a voltage threshold range. This method can improve the accuracy of semiconductor testing, thereby improving the manufacturing yield of semiconductor products.

[0004] Based on the search of patent numbers and the shortcomings of existing technologies, the following was found:

[0005] When performing avalanche testing on existing power semiconductor devices, the installation and replacement process of the test equipment's drive board and the semiconductor device body is cumbersome. Traditional equipment often uses welding or bolt fastening to achieve electrical connection and fixation. When testing different models of devices or maintaining the equipment, disassembly and reinstallation operations are complicated, consuming a lot of time and manpower, which seriously affects the testing efficiency. Moreover, during avalanche testing, semiconductor devices generate a lot of heat. If heat cannot be dissipated in a timely and effective manner, the device temperature will rise sharply, which will not only affect the accuracy of the test data, but may also cause permanent damage to the device.

[0006] Therefore, this utility model provides a structure for an avalanche performance test box for power semiconductor devices. Utility Model Content

[0007] To address the problems of cumbersome and time-consuming installation and replacement of driver boards and semiconductor devices, as well as insufficient heat dissipation in power semiconductor device avalanche testing equipment, the purpose of this utility model is to provide a test box structure for the avalanche performance of power semiconductor devices.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a test chamber structure for avalanche performance of power semiconductor devices, comprising a test chamber, wherein a mounting mechanism is provided in the middle of the test chamber for quickly replacing the driver board and the main body of the semiconductor device. The mounting mechanism includes:

[0009] The replacement components include a frame fixedly installed in the middle of the test chamber, a tray in the middle of the frame, multiple equally spaced mounting slots on the upper part of the tray, a set of ejector pins slidingly mounted on the upper part of the tray corresponding to the mounting slots, springs fixedly mounted on the middle of one side of each set of ejector pins, and the other side of each set of springs fixedly mounted on the upper part of the tray, a drive board slidingly mounted in the middle of each of the mounting slots, the pads of the drive board contacting one side of the ejector pins to achieve quick electrical connection, a semiconductor device body on the upper part of one side of the tray, two symmetrically distributed permanent magnets on the upper part of one side of the tray, one side of the two permanent magnets adsorbed on the top side of the tray, a cylinder fixedly mounted in the middle of the frame, and the drive end of the cylinder fixedly mounted on the lower side of the tray;

[0010] A heat dissipation component, located at the bottom of the tray, is used to dissipate heat generated during avalanche testing.

[0011] Preferably, the heat dissipation assembly includes a set of heat dissipation fins fixedly installed at the bottom of the tray, and two sets of symmetrically distributed heat dissipation fans are installed at the bottom of the tray, with the heat dissipation fans and heat dissipation fins working together.

[0012] Preferably, each of the multiple sets of ejector pins has an inclined groove on the upper part of one side, and each of the multiple sets of ejector pins has a telescopic rod fixedly installed on one side, and the other side of the multiple sets of telescopic rods is fixedly installed on the upper side of the tray.

[0013] Preferably, the upper side of the tray has two symmetrically distributed grooves, and the lower parts of the two permanent magnets are slidably locked in the middle of the grooves.

[0014] Preferably, two symmetrically distributed limiting rods are fixedly installed on the upper part of the frame, and both sides of the tray are slidably locked onto the outer surface of the limiting rods.

[0015] Preferably, the lower side of the tray has a plurality of evenly distributed heat dissipation holes, and the plurality of heat dissipation holes are interconnected with the mounting groove.

[0016] Beneficial effects

[0017] This invention provides a test chamber structure for the avalanche performance of power semiconductor devices. Compared with the prior art, it has the following advantages:

[0018] 1. When replacement is required, the operator activates the cylinder, which pushes the tray outward along the limit rod until the tray is completely removed from the test chamber. At this time, when installing the drive board, it is aligned with the mounting slot and pressed down. The ejector pin is guided by the inclined slot and squeezed by the spring. When the drive board is completely inserted into the bottom of the slot, the ejector pin is in close contact with the drive board pad under the action of the spring's restoring force, realizing electrical connection and stable fixation of the drive board. When installing the semiconductor device body, by accurately placing one side of the permanent magnet directly above the semiconductor device body pin, the attraction force between the permanent magnet and the tray is used to achieve fast and stable fixation, which significantly shortens the test preparation time, improves test efficiency, and ensures the reliability of electrical connection.

[0019] 2. During avalanche testing, the heat generated by the semiconductor device body and the driver board is conducted to the bottom heat sink fins via the tray. This increases the surface area and accelerates heat dissipation. Simultaneously, two sets of cooling fans are activated to enhance airflow and improve heat dissipation efficiency. Furthermore, the heat dissipation holes at the bottom of the tray are connected to the mounting slot, allowing the heat generated by the driver board to dissipate in a timely manner and preventing heat accumulation in the mounting slot. This ensures that the temperature of the driver board and the semiconductor device body remains within a safe range during the test, preventing device damage or test data distortion due to overheating and guaranteeing the accuracy and reliability of the avalanche performance test. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model.

[0021] Figure 2 This is a schematic diagram of the replacement component structure of this utility model.

[0022] Figure 3 This is a schematic diagram of the structure after the components are replaced and disassembled in this utility model.

[0023] Figure 4 This utility model Figure 3 Enlarged view of point A in the middle.

[0024] Figure 5 This is a schematic diagram of the cross-sectional structure of the tray of this utility model.

[0025] Figure 6 This utility model Figure 5 Enlarged view of point B in the middle.

[0026] Figure 7 This is a schematic diagram of the cross-sectional structure of the heat dissipation fins of this utility model.

[0027] In the diagram: 1. Test box; 2. Mounting mechanism; 21. Replacement component; 211. Tray; 212. Drive board; 213. Mounting slot; 214. Telescopic rod; 2141. Spring; 215. Ejector pin; 2151. Inclined slot; 216. Slot; 217. Permanent magnet; 218. Semiconductor device body; 219. Frame; 2191. Limiting rod; 2192. Cylinder; 22. Heat dissipation assembly; 221. Heat dissipation fins; 222. Heat dissipation fan; 223. Heat dissipation hole. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-7 This utility model provides a technical solution: a test box structure for avalanche performance of power semiconductor devices, including a test box 1, with a mounting mechanism 2 in the middle of the test box 1 for quickly replacing its driver board 212 and semiconductor device body 218. The mounting mechanism 2 includes:

[0030] The replacement component 21 includes a frame 219 fixedly installed in the middle of the test chamber 1. A tray 211 is located in the middle of the frame 219. The tray 211 integrates a multi-layer printed circuit board (PCB) for connecting drive circuits, semiconductor device component interfaces, and electrical connections with other modules of the test chamber. The PCB has multiple quick-connect connectors, such as board-to-board connectors, to enable quick connection and disconnection with the test chamber's power interface, measurement modules, etc. Multiple equally spaced mounting slots 213 are provided in the upper part of the middle of the tray 211. A set of ejector pins 215 are slidably engaged at the upper part of the tray 211 corresponding to the mounting slots 213. Springs 2141 are fixedly installed on the middle of one side of each ejector pin 215. The other side of multiple sets of springs 2141 are fixedly installed on the upper part of the tray 211. Drive plates 212 are slidably engaged in the middle of multiple mounting slots 213. The pads of the drive plates 212 contact one side of each ejector pin 215 to achieve rapid electrical connection. When the drive plate 212 is installed into the mounting slot 213, the inclined groove 2151 causes the drive plate 212 to move downwards, squeezing the ejector pin 215 towards the interior of the tray 211 and simultaneously squeezing the springs 2141. Once the drive plate 212 is fully inserted into the mounting slot 213, the ejector pin... Pin 215 is in contact with the pads of the driver board 212, and pin 215 is electrically connected to the integrated circuit board on the tray 211, thus achieving electrical connection between the driver board 212 and the circuit board on the tray 211. Simultaneously, under the force of spring 2141, pin 215 makes tight contact with the driver board 212, securing the driver board 212 within the mounting slot 213. A semiconductor device body 218 is located on the upper side of one side of the tray 211, and two symmetrically distributed permanent magnets 217 are located on the upper side of one side of the tray 211. One side of each permanent magnet 217 is attracted to the top of the tray 211. By attaching the permanent magnets 217... One side of the tray 211 is placed on the upper part of the pin of the semiconductor device body 218. At this time, under the attraction force generated by the permanent magnet 217 and the tray 211, the semiconductor device assembly 218 can be quickly fixed. A cylinder 2192 is fixedly installed in the middle of the frame 219. The lower side of the tray 211 is fixedly installed on the drive end of the cylinder 2192. The cylinder 2192 can be an Airtac SC series cylinder. Driven by the cylinder 2192, the tray 211 can be pushed to slide outward along the limit rod 2191, so that the tray 211 moves to the outside of the test box 1, thereby facilitating the staff to quickly replace the drive board 212 and the semiconductor device body 218.

[0031] The heat dissipation component 22 is located at the bottom of the tray 211 and is used to dissipate the heat generated during the avalanche test.

[0032] The heat dissipation assembly 22 includes a set of heat dissipation fins 221 fixedly installed at the bottom of the tray 211. Two sets of symmetrically distributed cooling fans 222 are installed at the bottom of the tray 211. The cooling fans 222 and the heat dissipation fins 221 work together. During the avalanche test, the heat will be conducted through the tray 211 to the lower heat dissipation fins 221, increasing the heat dissipation area through the heat dissipation fins 221. At the same time, the cooling fans 222 drive the heat dissipation fins 221 to cool them down.

[0033] Each set of ejector pins 215 has an inclined groove 2151 on one side of its upper part. The opening of the inclined groove 2151 allows the ejector pins 215 to be squeezed and moved toward the side where the spring 2141 is installed when the drive plate 212 enters the mounting groove 213. Each set of ejector pins 215 has a telescopic rod 214 fixedly installed on one side. The other side of the telescopic rod 214 is fixedly installed on the upper side of the tray 211. The telescopic rod 214 can guide and support the ejector pins 215, ensuring the stability of the ejector pins 215 under the force of the spring 2141.

[0034] Two symmetrically distributed grooves 216 are provided on the upper side of the tray 211. The lower parts of the two permanent magnets 217 are slidably locked in the middle of the grooves 216. The inner wall of the grooves 216 is provided with anti-slip rubber pads with a thickness of 2mm, thereby increasing the friction of the bottom of the permanent magnets 217 after the semiconductor device body 218 is fixed by adsorption.

[0035] Two symmetrically distributed limiting rods 2191 are fixedly installed on the upper part of the frame 219. Both sides of the tray 211 are slidably locked onto the outer surface of the limiting rods 2191. The limiting rods 2191 are used to support and guide the tray 211, and can extend and retract within the test chamber 1 in cooperation with the cylinder 2192.

[0036] The lower side of the tray 211 has a plurality of evenly distributed heat dissipation holes 223, which are all interconnected with the mounting groove 213. The opening of the heat dissipation holes 223 allows the heat generated by the drive board 212 during operation to be dissipated in a timely manner through the heat dissipation holes 223, preventing heat from accumulating in the mounting groove 213 and effectively reducing the temperature of the drive board 212 and the semiconductor device body 218.

[0037] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0038] During operation, when the drive board 212 needs to be installed, the operator aligns the drive board 212 with the mounting slot 213 on the tray 211. As the drive board 212 is inserted downward into the mounting slot 213, the edge of the drive board 212 will contact the inclined groove 2151 on the upper side of the ejector pin 215. Due to the guiding effect of the inclined groove 2151, the ejector pin 215 will be squeezed and move into the tray 211 along the telescopic rod 214, while compressing the spring 2141. When the drive board 212 is fully inserted into the bottom of the mounting slot 213, the ejector pin 215 will pop outward under the elastic restoring force of the spring 2141 and make close contact with the pad of the drive board 212. At this time, the ejector pin 215 not only achieves electrical connection with the drive board 212, but also firmly fixes the drive board 212 in the mounting slot 213 through the elastic force of the spring 2141, ensuring that the drive board 212 will not loosen during the test and ensuring the stability of the electrical connection.

[0039] For the installation of the semiconductor device body 218, the operator places the semiconductor device body into a slot on the upper side of the tray 211. Then, by moving the permanent magnet 217, it slides within the slot 216. Under its limiting position, the upper side of the permanent magnet 217 is positioned directly above the pins of the semiconductor device body 218. Due to the attraction between the permanent magnet 217 and the tray 211, the semiconductor device body 218 is quickly and stably fixed to the tray 211.

[0040] During avalanche testing of power semiconductor devices, a large amount of heat is generated. This heat is first conducted through the semiconductor device body 218 to the tray 211, and then the tray 211 conducts the heat to the heat dissipation fins 221 at its bottom. The heat dissipation fins 221 increase the heat dissipation area, accelerating the dissipation of heat to the surrounding environment. At the same time, the two sets of cooling fans 222 at the bottom of the tray 211 are activated, forcing airflow and accelerating air convection on the surface of the heat dissipation fins 221, further improving the heat dissipation efficiency. In addition, multiple heat dissipation holes 223 opened on one side of the lower part of the tray 211 are interconnected with the mounting groove 213, so that the heat generated by the drive board 212 during operation can be dissipated in time through the heat dissipation holes 223, avoiding the accumulation of heat in the mounting groove 213 and effectively reducing the temperature of the drive board 212.

[0041] When it is necessary to replace the drive board 212 or the semiconductor device body 218, the cylinder 2192 in the middle of the frame 219 is activated. Driven by the cylinder 2192, the tray 211 is pushed outward along the limit rod 2191 on the upper part of the frame 219 until the tray 211 is moved out of the test chamber 1. At this time, the staff can easily disassemble the used drive board 212 and semiconductor device body 218, and quickly install the new drive board 212 and semiconductor device body 218. After the replacement is completed, the cylinder 2192 is activated again to pull the tray 211 back into the test chamber 1, and the avalanche performance test can continue. This greatly shortens the test preparation time and improves the test efficiency.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A test chamber structure for avalanche performance of power semiconductor devices, comprising a test chamber (1), characterized in that: The test box (1) is provided with a mounting mechanism (2) in the middle for quickly replacing its driver board (212) and semiconductor device body (218). The mounting mechanism (2) includes: The replacement component (21) includes a frame (219) fixedly installed in the middle of the test chamber (1). A tray (211) is provided in the middle of the frame (219). Multiple equally spaced mounting slots (213) are provided in the upper part of the middle of the tray (211). A set of ejector pins (215) are slidably engaged at the corresponding positions of the upper part of the tray (211) and the mounting slots (213). A spring (2141) is fixedly installed in the middle of one side of each set of ejector pins (215). The other side of each set of springs (2141) is fixedly installed in the upper part of the tray (211). The multiple mounting slots (213) The middle part of each slides and is equipped with a drive plate (212). The pads of multiple drive plates (212) are in contact with one side of the ejector pin (215) to achieve a quick electrical connection. The upper part of one side of the tray (211) is provided with a semiconductor device body (218). The upper part of one side of the tray (211) is provided with two symmetrically distributed permanent magnets (217). One side of the two permanent magnets (217) is attracted to the top side of the tray (211). The middle part of the frame (219) is fixedly installed with a cylinder (2192). The lower side of the tray (211) is fixedly installed at the drive end of the cylinder (2192). A heat dissipation component (22) is located at the bottom of the tray (211) to dissipate heat generated during avalanche testing.

2. The avalanche performance test box structure for power semiconductor devices according to claim 1, characterized in that: The heat dissipation assembly (22) includes a set of heat dissipation fins (221) fixedly installed at the bottom of the tray (211). Two sets of symmetrically distributed heat dissipation fans (222) are installed at the bottom of the tray (211). The heat dissipation fans (222) and the heat dissipation fins (221) work together.

3. The avalanche performance test box structure for a power semiconductor device according to claim 1, characterized in that: Each of the multiple sets of ejector pins (215) has an inclined groove (2151) on the upper part of one side, and each of the multiple sets of ejector pins (215) has a telescopic rod (214) fixedly installed on one side, and the other side of the multiple sets of telescopic rods (214) is fixedly installed on the upper side of the tray (211).

4. The avalanche performance test box structure for a power semiconductor device according to claim 1, characterized in that: The upper side of the tray (211) has two symmetrically distributed grooves (216), and the lower parts of the two permanent magnets (217) are slidably locked in the middle of the grooves (216).

5. The avalanche performance test box structure for a power semiconductor device according to claim 1, characterized in that: Two symmetrically distributed limiting rods (2191) are fixedly installed on the upper part of the frame (219), and both sides of the tray (211) are slidably locked onto the outer surface of the limiting rods (2191).

6. The avalanche performance test box structure for a power semiconductor device according to claim 1, characterized in that: The tray (211) has a plurality of evenly distributed heat dissipation holes (223) on one side of its lower part, and the plurality of heat dissipation holes (223) are all interconnected with the mounting groove (213).

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