An RCLED laser packaging module

Abstract

The utility model discloses a RC LED laser ware packaging module, include: heat sink base plate, the top of heat sink base plate is equipped with negative pole welding area and a plurality of positive pole welding area, and negative pole welding area and a plurality of positive pole welding area are all plated with metal plating, and the bottom of heat sink base plate is equipped with the negative pole pad of negative pole welding area electric connection and a plurality of respectively with corresponding positive pole pad electric connection positive pole pad, RC laser chip is located on negative pole welding area, and the top of RC laser chip is provided with a plurality of different luminous shape's luminous unit, and the negative pole of a plurality of luminous units extends to the bottom of RC laser chip and is electrically connected with negative pole welding area, and the positive pole of a plurality of luminous units is electrically connected with corresponding positive pole welding area respectively, anti -reflection coating, cover in heat sink base plate top. The utility model effectively solved the problem of the prior art in the reflection blur and the problem of the insufficient heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor power device technology, specifically to an RC LED laser packaging module. Background Technology

[0002] Currently, most RC LED laser modules on the market adopt SMD (Surface Mount Device) surface mount packaging technology, with SMD being the mainstream. Its typical structure consists of a mounting bracket cup and an internal die-bonding adhesive process. Specifically, the RC laser chip is fixed to a predetermined area at the bottom of the bracket cup using insulating or conductive adhesive. Then, bonding wires are used to electrically connect the chip to the bracket cup pins. Finally, epoxy resin or silicone is used to encapsulate and seal the chip and wires inside the cup. However, this packaging method has the following two drawbacks:

[0003] 1) Beam shape and imaging issues: The inner wall of the patch holder cup is prone to reflection, which makes the beam shape of the light emitted from the RC laser chip unclear. The final image has problems such as blurring and ghosting, which seriously affects the product's performance.

[0004] 2) Heat dissipation problem: The heat conduction performance of the patch bracket cup is limited, which cannot quickly dissipate the heat generated by the RC laser chip during operation. Long-term use can easily lead to increased chip power consumption and shortened lifespan, and may further aggravate optical distortion due to overheating.

[0005] Therefore, there is an urgent need for an RC LED laser module that can solve the problems of reflective blurring and insufficient heat dissipation, so as to improve the performance and reliability of the product. Utility Model Content

[0006] In order to overcome the problems of reflective blurring and insufficient heat dissipation in existing RC LED laser modules, this utility model provides an RC LED laser packaging module.

[0007] The technical solution of this utility model is as follows:

[0008] An RC LED laser packaging module includes:

[0009] A heat sink substrate, wherein the top of the heat sink substrate is provided with a negative electrode welding area and a plurality of positive electrode welding areas, the negative electrode welding area and the plurality of positive electrode welding areas are plated with a metal plating layer, and the bottom of the heat sink substrate is provided with a negative electrode pad electrically connected to the negative electrode welding area and a plurality of positive electrode pads respectively electrically connected to the corresponding positive electrode welding area.

[0010] An RC laser chip is disposed on the negative electrode welding area. The top of the RC laser chip is provided with multiple light-emitting units with different light-emitting shapes. The negative electrodes of the multiple light-emitting units extend to the bottom of the RC laser chip and are electrically connected to the negative electrode welding area. The positive electrodes of the multiple light-emitting units are respectively electrically connected to the corresponding positive electrode welding areas.

[0011] An anti-reflective coating is applied to the top of the heat sink substrate.

[0012] In a preferred embodiment of this invention, the area of ​​the negative electrode welding area is larger than the area of ​​the RC laser chip.

[0013] As a preferred embodiment of the present invention, the heat sink substrate is provided with a negative electrode connection through hole with an inner wall plated with a metal layer between the negative electrode welding area and the negative electrode pad, and the negative electrode welding area is electrically connected to the negative electrode pad through the negative electrode connection through hole;

[0014] The heat sink substrate is provided with a positive electrode connection through hole with an inner wall plated with a metal layer between each positive electrode welding area and the corresponding positive electrode pad. Each negative electrode welding area is electrically connected to the corresponding positive electrode welding area through the corresponding positive electrode connection through hole.

[0015] As a preferred embodiment of this utility model, the negative electrode of the light-emitting unit is eutectic welded to the negative electrode welding area by a highly conductive silver paste.

[0016] In a preferred embodiment of this utility model, the positive electrode of the light-emitting unit is electrically connected to the corresponding positive electrode welding area via a connecting wire.

[0017] In a preferred embodiment of this utility model, the connecting wire is a gold wire.

[0018] As a preferred embodiment of this utility model, three positive electrode welding areas, three positive electrode pads, and three light-emitting units are provided. The negative electrode welding area is located at the top center of the heat sink substrate, and one corner of the negative electrode welding area extends to the corresponding corner of the top of the heat sink substrate. The three positive electrode welding areas are respectively provided in the remaining triangles of the top of the heat sink substrate. The negative electrode pad and the three positive electrode pads are respectively provided in the four bottom corners of the heat sink substrate, and the positions of the three positive electrode pads correspond to the positions of the three positive electrode welding areas.

[0019] As a preferred embodiment of this utility model, one corner of the negative electrode pad is provided with a foolproof chamfer.

[0020] As a preferred embodiment of this utility model, the bottom of the heat sink substrate is provided with corresponding pin markings near the negative electrode pad and the positive electrode pad.

[0021] In a preferred embodiment of this utility model, the heat sink substrate is a ceramic substrate.

[0022] As a preferred embodiment of this utility model, the light-emitting unit is composed of a number of RC LED beads connected in series.

[0023] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0024] The RC LED laser packaging module provided by this utility model, by setting a heat sink substrate, can quickly conduct the heat generated by the RC laser chip to the entire heat sink substrate, and then diffuse it to the outside or external heat dissipation structure through the heat sink substrate, thereby effectively reducing the operating temperature of the RC laser chip, extending the chip's lifespan, and avoiding luminous efficiency decay caused by high temperature; by setting an anti-reflection coating covering the top of the heat sink substrate, diffuse reflection or specular reflection of the RC laser chip can be avoided, so that the light emitted by the RC laser chip can propagate along a preset direction, and the final pattern formed has clear edges and no ghosting, meeting the high-resolution light pattern requirements of imaging devices; the overall structure is compact, small in size, and has high luminous efficiency and stability. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a top view of an RC LED laser packaging module in one embodiment of the present invention;

[0027] Figure 2 This is a top view of the heat sink substrate in one embodiment of the present invention;

[0028] Figure 3 This is a bottom view of the heat sink substrate in one embodiment of the present invention.

[0029] In the diagram,

[0030] 1. Heat sink substrate; 11. Negative electrode soldering area; 12. Positive electrode soldering area; 13. Negative electrode pad; 131. Foolproof chamfer; 14. Positive electrode pad; 15. Negative electrode connection via; 16. Positive electrode connection via; 17. Pin marking; 2. RC laser chip; 21. Light-emitting unit; 3. Anti-reflective coating; 4. Connecting wire. Detailed Implementation

[0031] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also declared that the embodiments described below are only for explaining this utility model and are not intended to limit this utility model.

[0032] It should be noted that the terms "installation," "setting," "connection," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Indications of orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. "A plurality" means two or more, unless otherwise explicitly defined. "Several" means one or more, unless otherwise explicitly defined.

[0033] Please see Figures 1 to 3 An embodiment of this utility model provides an RC LED laser packaging module, including a heat sink substrate 1, an RC laser chip 2, and an anti-reflective coating 3. The top of the heat sink substrate 1 is provided with a negative electrode soldering area 11 and multiple positive electrode soldering areas 12. Both the negative electrode soldering area 11 and the multiple positive electrode soldering areas 12 are plated with a metal plating layer, such as a copper plating layer. The bottom of the heat sink substrate 1 is provided with a negative electrode pad 13 electrically connected to the negative electrode soldering area 11 and multiple positive electrode pads 14 electrically connected to the corresponding positive electrode soldering areas 12. The RC laser chip 2 is disposed on the negative electrode soldering area 11 of the heat sink substrate 1. The top of the RC laser chip 2 is provided with multiple light-emitting units 21 with different light-emitting shapes. The light-emitting unit 21 is composed of several RC LED beads connected in series. The negative electrode of the multiple light-emitting units 21 extends to the bottom of the RC laser chip 2 and is electrically connected to the negative electrode soldering area 11. The positive electrode of the multiple light-emitting units 21 is electrically connected to the corresponding positive electrode soldering area 12. By controlling the on and off of different positive electrode pads 14, the on and off of different light-emitting units 21 can be controlled, so that the pattern emitted by the RC laser chip 2 presents different light-emitting shapes, such as dots, crosses, and rings. An anti-reflective coating 3 is applied to the top of the heat sink substrate 1.

[0034] In this embodiment, the heat sink substrate 1 can be an AIN 230W ceramic substrate, which has high insulation and high thermal conductivity. It can quickly conduct the heat generated by the RC laser chip 2 to the entire heat sink substrate 1, and then diffuse it to the outside or external heat dissipation structure through the heat sink substrate 1, thereby effectively reducing the operating temperature of the RC laser chip 2, extending the chip's lifespan, and avoiding light efficiency decay caused by high temperature. By setting an anti-reflective coating 3 covering the top of the heat sink substrate 1, such as a silicon dioxide or titanium dioxide composite coating, diffuse reflection or specular reflection of the RC laser chip 2 can be avoided, so that the emitted light of the RC laser chip 2 can propagate along a preset direction. The final pattern has clear edges and no ghosting, which meets the high-resolution light pattern requirements of imaging devices (such as aiming scopes, LiDAR, and industrial inspection cameras).

[0035] Please see Figure 1 In one embodiment, the area of ​​the negative electrode welding area 11 is larger than the area of ​​the RC laser chip 2. The larger area of ​​the negative electrode welding area 11 means that there is more area in contact with the heat sink substrate 1, which can more effectively conduct the heat generated by the RC laser chip 2 during operation to the heat sink substrate 1, further reduce the operating temperature of the RC laser chip 2, improve the luminous efficiency and stability of the chip, and extend the service life of the chip.

[0036] Please see Figures 1 to 3 In one embodiment, the heat sink substrate 1 has a negative electrode connection via 15 with an inner wall plated with a metal layer between the negative electrode soldering area 11 and the negative electrode pad 13. The negative electrode soldering area 11 is electrically connected to the negative electrode pad 13 through the negative electrode connection via 15. The heat sink substrate 1 also has a positive electrode connection via 16 with an inner wall plated with a metal layer between each positive electrode soldering area 12 and the corresponding positive electrode pad 14. Each negative electrode soldering area 11 is electrically connected to the corresponding positive electrode soldering area 12 through the corresponding positive electrode connection via 16. By providing negative electrode connection via 15 and positive electrode connection via 16 with an inner wall plated with a metal layer in the heat sink substrate 1, a reliable electrical connection channel is provided between the negative electrode soldering area 11 and the negative electrode pad 13, and between the positive electrode soldering area 12 and the positive electrode pad 14. Compared with the traditional external wiring method, this can effectively save space and make the module structure more compact. At the same time, it avoids mechanical damage and interference problems that external lines may be subject to, further improving the overall performance and anti-interference capability of the module.

[0037] In one embodiment, the negative electrode of the light-emitting unit 21 is eutectic welded to the negative electrode welding area 11 using highly conductive silver paste. The highly conductive silver paste has excellent conductivity; after eutectic welding with the negative electrode welding area 11, it forms a low-resistance connection between the negative electrode of the light-emitting unit 21 and the negative electrode welding area 11, reducing current loss at the connection point. The highly conductive silver paste also has a certain degree of thermal conductivity; the heat generated when the light-emitting unit 21 is working can be conducted through the highly conductive silver paste to the negative electrode welding area 11, and then dissipated by the heat sink substrate 1, thereby further reducing the operating temperature of the light-emitting unit 21, improving its luminous efficiency and stability, and also helping to extend the chip's lifespan. Eutectic welding is a high-temperature fusion bonding process. Through the eutectic reaction between the highly conductive silver paste and the negative electrode welding area 11, a strong metallurgical bond can be formed between the two. Compared with ordinary bonding or welding methods, it has higher connection strength and can effectively resist mechanical stresses such as vibration and impact, preventing problems such as loosening and detachment of the light-emitting unit 21 during long-term use, thus improving the reliability and lifespan of the module.

[0038] Please see Figure 1 In one embodiment, the positive electrode of the light-emitting unit 21 is electrically connected to the corresponding positive electrode welding area 12 via a connecting line 4. The connecting line 4 serves as a current transmission channel, and its conductivity directly affects the working effect of the RC laser chip. Therefore, the connecting line 4 is preferably gold wire. Gold wire has excellent conductivity and low resistivity, ensuring efficient current transmission between the positive electrode of the light-emitting unit 21 and the positive electrode welding area 12, reducing power loss, and ensuring that the RC laser chip 2 receives stable current drive, thereby emitting stable, high-brightness light. The fine diameter of the gold wire allows for precise connections within a limited space, meeting the requirements of miniaturization design. Gold has stable chemical properties, good anti-oxidation and corrosion resistance, maintaining the stability and reliability of the connection, and extending the module's service life.

[0039] Please see Figures 1 to 3In one embodiment, three positive electrode welding areas 12, three positive electrode pads 14, and three light-emitting units 21 are provided. A negative electrode welding area 11 is located at the top center of the heat sink substrate 1, with one corner extending to a corresponding corner of the top of the heat sink substrate 1. Three positive electrode welding areas 12 are respectively located in the remaining triangles of the top of the heat sink substrate 1. A negative electrode pad 13 and three positive electrode pads 14 are respectively located at the four bottom corners of the heat sink substrate 1, with the positions of the three positive electrode pads 14 corresponding to the positions of the three positive electrode welding areas 12. By providing three light-emitting units 21 and controlling the on / off state of different positive electrode pads 14 to control the illumination of different light-emitting units 21, the RC laser chip 2 can emit different light-emitting shapes, such as dots, crosses, and rings, to meet the needs of more diverse application scenarios. By placing the negative electrode soldering area 11 in the top center of the heat sink substrate 1 and extending it to one corner, and setting the three positive electrode soldering areas 12 in the remaining triangles, the top space of the heat sink substrate 1 can be fully utilized, making the distribution between the soldering areas reasonable and avoiding mutual interference. At the same time, the negative electrode solder pad 13 and the three positive electrode solder pads 14 are respectively set at the four bottom corners of the heat sink substrate 1 and their positions correspond, which facilitates connection with external circuits, reduces the complexity and length of the circuit connection, and improves the integration and reliability of the module.

[0040] Of course, in other embodiments, the positive electrode welding area 12, the positive electrode pad 14 and the light-emitting unit 21 may also be set to two, four or other numbers, and this utility model does not limit this.

[0041] Please see Figure 3 In one embodiment, one corner of the negative electrode pad 13 is provided with a foolproof chamfer 131. The foolproof chamfer 131 design ensures that the negative electrode pad 13 is installed in the correct direction and position when the RC LED laser module is mounted to an external circuit or device, avoiding short circuits, open circuits, and other faults caused by incorrect installation. This improves the accuracy and efficiency of installation and reduces product damage and rework costs caused by installation errors.

[0042] Please see Figure 3 In one embodiment, the bottom of the heat sink substrate 1 is provided with corresponding pin markings 17 near the negative electrode pad 13 and the positive electrode pad 14. The pin markings 17 can clearly indicate the position and function of the negative electrode pad 13 and each positive electrode pad 14. When the user connects the module to the external circuit, he / she can quickly and accurately find the corresponding pin, avoiding connection errors caused by pin confusion.

[0043] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0044] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. An RC LED laser packaging module, characterized in that, include: A heat sink substrate, wherein the top of the heat sink substrate is provided with a negative electrode welding area and a plurality of positive electrode welding areas, the negative electrode welding area and the plurality of positive electrode welding areas are plated with a metal plating layer, and the bottom of the heat sink substrate is provided with a negative electrode pad electrically connected to the negative electrode welding area and a plurality of positive electrode pads respectively electrically connected to the corresponding positive electrode welding area. An RC laser chip is disposed on the negative electrode welding area. The top of the RC laser chip is provided with multiple light-emitting units with different light-emitting shapes. The negative electrodes of the multiple light-emitting units extend to the bottom of the RC laser chip and are electrically connected to the negative electrode welding area. The positive electrodes of the multiple light-emitting units are respectively electrically connected to the corresponding positive electrode welding areas. An anti-reflective coating is applied to the top of the heat sink substrate.

2. The RC LED laser packaging module according to claim 1, characterized in that, The area of ​​the negative electrode welding area is larger than the area of ​​the RC laser chip.

3. The RC LED laser packaging module according to claim 1, characterized in that, The heat sink substrate has a negative electrode connection through hole with an inner wall plated with a metal layer between the negative electrode welding area and the negative electrode pad, and the negative electrode welding area is electrically connected to the negative electrode pad through the negative electrode connection through hole; The heat sink substrate is provided with a positive electrode connection through hole with an inner wall plated with a metal layer between each positive electrode welding area and the corresponding positive electrode pad. Each negative electrode welding area is electrically connected to the corresponding positive electrode welding area through the corresponding positive electrode connection through hole.

4. The RC LED laser packaging module according to claim 1, characterized in that, The negative electrode of the light-emitting unit is eutectic welded to the negative electrode welding area via highly conductive silver paste.

5. The RC LED laser packaging module according to claim 1, characterized in that, The positive electrode of the light-emitting unit is electrically connected to the corresponding positive electrode welding area via a connecting wire.

6. The RC LED laser packaging module according to claim 5, characterized in that, The connecting wire is gold wire.

7. The RC LED laser packaging module according to claim 1, characterized in that, The positive electrode welding area, the positive electrode pad, and the light-emitting unit are each provided in threes. The negative electrode welding area is located at the top center of the heat sink substrate, and one corner of the negative electrode welding area extends to the corresponding corner of the top of the heat sink substrate. The three positive electrode welding areas are respectively provided in the remaining triangles of the top of the heat sink substrate. The negative electrode pad and the three positive electrode pads are respectively provided in the four bottom corners of the heat sink substrate, and the positions of the three positive electrode pads correspond to the positions of the three positive electrode welding areas.

8. The RC LED laser packaging module according to claim 1 or 7, characterized in that, One corner of the negative electrode pad is provided with a foolproof chamfer.

9. The RC LED laser packaging module according to claim 1, characterized in that, The bottom of the heat sink substrate has corresponding pin markings near the negative electrode pad and the positive electrode pad.

10. The RC LED laser packaging module according to claim 1, characterized in that, The heat sink substrate is a ceramic substrate.

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