A glass laser cutting device

Abstract

The utility model relates to laser cutting technical field especially is a kind of glass laser cutting device, including laser cutting mechanism and moving platform, the laser cutting mechanism includes laser, reflecting mirror piece and objective, the moving platform is located the below of objective, the moving platform is used to place glass sheet, glass sheet includes the upper layer, intermediate layer and lower layer of primary connection, the laser is used to generate laser, and laser is cut glass sheet after passing reflecting mirror piece and objective.The utility model provides a kind of glass laser cutting device, and different cutting depth can effectively improve product yield to promote;Different cutting depth can effectively improve the strength and the strain force of small piece glass after cutting.

Description

Technical Field

[0001] This utility model relates to the field of laser cutting technology, and in particular to a glass laser cutting device. Background Technology

[0002] Currently, laser cutting is one of the key processes for achieving high-precision and high-efficiency processing in the filter manufacturing industry, especially when cutting seamless screen-printed filters, where the requirements are even more stringent. However, existing laser cutting technology still faces several technical challenges that urgently need to be addressed in practical applications.

[0003] Firstly, in traditional laser cutting processes for seamless screen-printed filters, the cut cross-section typically exhibits a fused-out morphology. This morphology stems from the instantaneous melting and evaporation of the material under the influence of laser energy. However, due to factors such as energy control and beam focusing stability, the microstructure of the fused-out region is often non-uniform, exhibiting problems such as phase changes and a large heat-affected zone. This phenomenon leads to poor physical stability and low microstructure consistency in the cut cross-section, thereby affecting the optical performance of the filter and its assembly accuracy and reliability within the optical system.

[0004] Secondly, during the product cutting process, due to the inherent brittleness of the material and the concentrated thermal stress from the laser, the edge areas are highly susceptible to chipping. This chipping phenomenon exhibits significant uncertainty, with substantial differences in edge integrity between different batches and even within the same batch. Consequently, the mechanical strength distribution of small filter pieces is discrete, with a marked decrease in edge strength for some products. This not only affects the yield rate of subsequent handling and assembly processes but also reduces the durability of the final product under environmental stresses such as vibration and temperature changes.

[0005] Furthermore, the cutting process for seamless optical filters with anti-reflective (AR) coatings presents even more complex challenges. The AR coating itself causes slight deformation of the glass substrate, typically manifesting as upward warping. During actual cutting, the UV film adheres to the infrared (IR) surface and is fixed to the processing platform via vacuum adsorption. The downward pulling force generated by this vacuum adsorption interacts with the warping deformation induced by the coating, exacerbating the uneven stress distribution within the glass. When laser cutting is performed under these conditions, the vacuum adsorption force often forcibly pulls apart the incompletely separated portion of the glass material before the cutting energy has completely severed it, resulting in abnormal breakage. This phenomenon directly leads to a low yield rate and further widens the differences in the morphology of the cut cross-section, severely affecting the mechanical strength and optical consistency of the product.

[0006] In summary, existing laser cutting technology for optical filters has significant shortcomings in areas such as cross-section control, edge integrity maintenance, and deformation management of coated products, which hinder further improvements in the quality and production efficiency of high-end optical filters. Therefore, a novel cutting method is urgently needed to improve cross-sectional stability, suppress edge chipping, and adapt to the structural characteristics of coated optical filters, thereby comprehensively improving product quality and processing yield. Summary of the Invention

[0007] This invention addresses the problems of existing technologies by providing a glass laser cutting device that can effectively improve product yield by using different cutting depths.

[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a glass laser cutting device, comprising a laser cutting mechanism and a moving stage, wherein the laser cutting mechanism comprises a laser, a reflecting mirror and an objective lens, the moving stage is located below the objective lens, the moving stage is used to place a glass sheet, the glass sheet comprising an upper layer, a middle layer and a lower layer connected in one step, the laser is used to generate laser light, and the laser light cuts the glass sheet after passing through the reflecting mirror and the objective lens; the first cutting position of the laser light generated by the laser light is located on the lower layer of the glass sheet, the second cutting position of the laser light generated by the laser light is located on the upper layer of the glass sheet, and the third cutting position of the laser light generated by the laser light is located on the middle layer of the glass sheet.

[0009] Preferably, the interval between the first and third cutting positions of the laser generated by the laser is greater than 20 μm.

[0010] Preferably, the interval between the second and third cutting positions of the laser generated by the laser is less than 20 μm.

[0011] Preferably, the intermediate layer of the glass sheet is less than 60 μm.

[0012] Preferably, the mobile platform includes a product base, an X-moving component, a Y-moving component, and a rotary table. The X-moving component is slidably mounted on the Y-moving component, the rotary table is slidably mounted on the X-moving component, and the product base is mounted on the rotary table. The rotary table is used to drive the product base to rotate.

[0013] The beneficial effects of this utility model are:

[0014] 1. Different cutting depths can effectively improve product yield;

[0015] 2. Different cutting depths can effectively improve the strength and strain of small glass pieces after cutting;

[0016] 3. Effectively improves the efficiency of operators in setting up machines, saving effort and increasing work efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the glass sheet of this utility model;

[0019] Figure 3 A cross-sectional view of a glass slide from the prior art;

[0020] Figure 4 This is a cross-sectional view of the glass sheet of this utility model.

[0021] exist Figures 1 to 4 The reference numerals in the figures include:

[0022] 1-Laser, 2-Beam expander, 3-Reflecting mirror, 4-Wave plate, 5-Objective lens, 6-Glass plate, 7-Upper layer, 8-Middle layer, 9-Lower layer, 10-Moving stage. Detailed Implementation

[0023] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0024] This embodiment provides a glass laser cutting device, such as... Figures 1 to 4 The system includes a laser cutting mechanism and a moving stage 10. The laser cutting mechanism includes a laser 1, a reflecting mirror 3, and an objective lens 5. The moving stage 10 is located below the objective lens 5 and is used to place a glass plate 6. The glass plate 6 includes an upper layer 7, a middle layer 8, and a lower layer 9 connected in one step. The laser 1 generates a laser beam, which cuts the glass plate 6 after passing through the reflecting mirror 3 and the objective lens 5. The first cutting position of the laser generated by the laser 1 is located at the lower layer 9 of the glass plate 6, the second cutting position of the laser generated by the laser 1 is located at the upper layer 7 of the glass plate 6, and the third cutting position of the laser generated by the laser 1 is located at the middle layer 8 of the glass plate 6.

[0025] Wherein, the interval between the first and third cutting positions of the laser generated by the laser 1 is greater than 20 μm; the interval between the second and third cutting positions of the laser generated by the laser 1 is less than 20 μm; and the intermediate layer 8 of the glass sheet 6 is less than 60 μm.

[0026] Furthermore, the moving stage 10 includes a product seat, an X-moving component, a Y-moving component, and a rotary table. The X-moving component is slidably mounted on the Y-moving component, the rotary table is slidably mounted on the X-moving component, and the product seat is mounted on the rotary table. The rotary table is used to drive the product seat to rotate. The X-moving component and the Y-moving component may include linear tracks and sliders. The X-linear tracks and Y-linear tracks intersect perpendicularly. The Y-slider slides on the Y-linear track, the X-linear track is fixed to the Y-slider, the rotary table is rotatably mounted on the X-slider, and the product seat is fixed to the rotary table. By driving the slider to move with a motor or cylinder, or by driving the rotary table to rotate with a motor, the product seat can be controlled to move linearly or rotate, achieving the purpose of cutting at different positions.

[0027] Specifically, the laser cutting device in this embodiment mainly consists of core components such as a laser 1, a reflecting mirror 3, a beam expander 2, a waveplate 4, and an objective lens 5. It achieves a significant improvement in the cutting process through precise optical control. It utilizes the waveplate 4 to precisely control the laser polarization state (the control method is existing technology and will not be detailed here). By distributing different spot angles on the waveplate 4, it achieves hierarchical control of the cutting depth and heat-affected zone, thereby effectively improving the morphology and mechanical properties of the cut cross-section. In specific operation, firstly, based on the material and coating characteristics of the filter to be processed, appropriate basic parameters such as laser power, frequency, and scanning speed are selected. The optical path is adjusted to ensure that the laser beam, after being collimated by the reflecting mirror and beam expander 2 and modulated by the waveplate 4, is precisely focused onto the workpiece surface by the objective lens 5.

[0028] Layered cutting execution: The cutting process employs a specially designed multi-pass layered cutting strategy, which includes:

[0029] First cut (bottom cut): First, control the laser focus to position it at the bottom of the material to make the first cut; the main purpose is to form an initial, relatively separated fusion layer at the bottom of the material.

[0030] The second cut (top cut): The laser focus is moved to the top layer 7 of the material for cutting. This layer cut must ensure that the gap between it and the middle layer 8 is less than 20μm to achieve a smooth transition and effective separation between the upper and lower layers 9;

[0031] The third cut (intermediate layer 8 cutting): The laser focus is adjusted to the intermediate layer 8 for cutting. This layer is a key area for forming a good cross-section. The process requires that the thickness of this intermediate layer itself be controlled within 60μm to ensure that its heat-affected zone is small and the microstructure is uniform.

[0032] Key Spacing Control: Throughout the layered cutting process, the axial spacing between the lowest cut (bottom) and the intermediate fracture layers must be strictly greater than 20 μm. This design aims to provide sufficient pre-separation and stress release space for the bottom layer, preventing unexpected fractures due to thermal stress accumulation. Simultaneously, the tight upper layer 7 cuts (<20 μm) ensure the continuity of the cut and the perpendicularity of the edges.

[0033] Process monitoring and optimization: Operators can fine-tune the four angles of the waveplate to optimize the spot shape based on real-time observation or CCD visual feedback, thereby precisely controlling the cutting effect of each layer. This embodiment significantly reduces over-reliance on operator experience, making the machine setup process more standardized and improving efficiency.

[0034] This embodiment significantly improves the quality of the cut cross-section and the strength of the product: through precise three-layer positioning cutting (bottom-middle-top), hierarchical control of the cut cross-section is achieved, resulting in a distinct fusion layer structure and a significantly reduced heat-affected zone. This directly solves the problem of cross-sectional instability caused by traditional single-point fusion and effectively suppresses edge chipping. The resulting product exhibits significantly improved edge mechanical strength consistency, enhanced strain capacity of small glass pieces, and fundamentally improved product reliability and service life.

[0035] Completely solves the cutting challenge of coated filters: For filters with AR coatings that are prone to warping, this solution's layered progressive cutting strategy enables a more controllable separation process under vacuum adsorption conditions. Even if the glass is deformed, the layered energy application method ensures that each layer is effectively cut, avoiding the problem of the material being forcibly torn apart by vacuum adsorption force before it is completely cut through, thereby significantly improving the cutting yield of coated products.

[0036] Improving machine setup efficiency and process standardization: The standardized cutting process based on waveplate 4 control reduces reliance on the individual technical experience of operators. Operators can quickly set and adjust according to specific depth interval parameters (e.g., >20μm, <20μm, <60μm), making the machine setup process more labor-saving and faster. Production efficiency and work efficiency are improved simultaneously, while also helping to ensure process stability and product consistency in large-scale production.

[0037] In summary, this embodiment, by innovatively employing layered laser cutting based on waveplate 4 control, not only effectively solves the technical bottlenecks in the current filter industry such as poor cutting cross-sections, edge chipping, and low yield of coated products, but also achieves significant progress in production efficiency and process controllability.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A glass laser cutting device, characterized in that: The device includes a laser cutting mechanism and a moving stage. The laser cutting mechanism includes a laser, a reflecting mirror, and an objective lens. The moving stage is located below the objective lens and is used to place a glass sheet. The glass sheet includes an upper layer, a middle layer, and a lower layer connected in one step. The laser is used to generate laser light, which cuts the glass sheet after passing through the reflecting mirror and the objective lens. The first cutting position of the laser light generated by the laser is located on the lower layer of the glass sheet, the second cutting position of the laser light generated by the laser is located on the upper layer of the glass sheet, and the third cutting position of the laser light generated by the laser is located on the middle layer of the glass sheet.

2. The glass laser cutting device according to claim 1, characterized in that: The interval between the first and third cutting positions of the laser generated by the laser is greater than 20 μm.

3. The glass laser cutting device according to claim 1, characterized in that: The interval between the second and third cutting positions of the laser generated by the laser is less than 20 μm.

4. The glass laser cutting device according to claim 1, characterized in that: The intermediate layer of the glass sheet is less than 60 μm.

5. The glass laser cutting device according to claim 1, characterized in that: The mobile platform includes a product base, an X-moving component, a Y-moving component, and a rotating platform. The X-moving component is slidably mounted on the Y-moving component, the rotating platform is slidably mounted on the X-moving component, and the product base is mounted on the rotating platform. The rotating platform is used to drive the product base to rotate.

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