Electronic device heat dissipation device and electronic device

By making the heat-conducting components and cold plate assemblies movable, the heat dissipation problem between small-gap components is solved, achieving efficient heat dissipation and easy-to-maintain hot-swap operation, avoiding the risk of leakage and reducing manufacturing costs.

CN224722193UActive Publication Date: 2026-09-04INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202621148463.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2026-07-28
Publication Date
2026-09-04
Estimated Expiration
2036-07-28

AI Technical Summary

Technical Problem

Existing heat dissipation structures cannot meet the heat dissipation requirements between components with small gaps and affect the ease of hot-swapping. Direct contact liquid cooling increases manufacturing costs and the risk of leakage.

Method used

The heat-conducting component and the cold plate assembly are movable. The evaporation section of the heat-conducting component is heat-exchange matched with the heating element, and the condensation section is heat-exchange matched with the cold plate assembly. The bracket drives the heat-conducting component and the cold plate assembly to move, so as to achieve a separable fit and support hot-swap operation.

Benefits of technology

It achieves efficient heat dissipation for densely arranged heat-generating components, supports easy maintenance and high availability, avoids the risk of leakage, and reduces manufacturing costs.

✦ Generated by Eureka AI based on patent content.
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Abstract

The application discloses an electronic equipment heat dissipation device and electronic equipment. The electronic equipment heat dissipation device comprises a bracket, the bracket is movably arranged in a cabinet; a heat conduction member, the heat conduction member is connected with the bracket, and is switched between a heat dissipation position for heat exchange cooperation with a heat generating device and an avoiding position for avoiding the heat generating device under the driving of the bracket; the heat conduction member has an evaporation section for heat exchange cooperation with the heat generating device and a condensation section for heat dissipation; a cold plate assembly, the cold plate assembly is connected with the bracket, and the cold plate assembly is arranged at intervals between the heat generating device; and the condensation section is connected with the cold plate assembly and is in heat exchange cooperation. The application solves the problem that the heat dissipation structure in the prior art cannot meet the heat dissipation and maintenance requirements.
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