A heat dissipation preheating structure

Abstract

This utility model discloses a heat dissipation and preheating structure, including a control chip, a water tank, water pipes, a heat-conducting component, and an evaporator. The water tank provides a water source, and the water flows through the water pipes to the evaporator. During the water flow, it passes through the heat-conducting component, and the control chip is fixed on the heat-conducting component. Therefore, the flowing water can be used to dissipate heat from the control chip. At the same time, as a control component, the control chip operates at a high temperature, and the heat can also be transferred by the heat-conducting component to preheat the water in the water pipes, making it easier for the water to evaporate after entering the evaporator.

Description

Technical Field

[0001] This utility model relates to the field of home appliances, specifically to a heat dissipation and preheating structure. Background Technology

[0002] In the prior art, the mainboard control chip or thyristor chip of high-power electrical appliances is used to perform high-frequency and precise control of high-power current. Therefore, the operating temperature of the mainboard control chip or thyristor chip is very high. The maximum temperature tolerance of the thyristor chip is below 130 degrees Celsius, and heat dissipation is required in real time during operation. To address the overheating issue of motherboard control chips or silicon controlled rectifier (SCR) chips, the common heat dissipation method is to apply thermal grease to the chip surface and then use a fan to blow air to dissipate heat. However, fans are relatively large and cannot withstand temperatures above 60 degrees Celsius. Therefore, fans are not suitable for small spaces with high temperatures, which limits their application. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, this utility model provides a heat dissipation and preheating structure that can dissipate heat from the chip and has a small size.

[0004] The technical solution adopted by this utility model to solve its technical problem is: A heat dissipation and preheating structure, comprising: Control chip; Water tank, the water tank being used for water supply; A water pipe, one end of which is connected to the water tank and the other end of which is connected to an evaporator; A heat-conducting component is provided, the control chip is fixed on the heat-conducting component, and the water pipe is provided through the heat-conducting component. The heat-conducting component is used to conduct heat to the control chip and to heat the water in the water pipe.

[0005] The heat dissipation and preheating structure described above also includes a handheld part and a steam nozzle connected to the handheld part. The water tank is disposed in the handheld part, and the water pipe, the heat-conducting component, and the control chip are disposed in the steam nozzle.

[0006] As described above, in the heat dissipation and preheating structure, the heat-conducting component has a groove for mounting the control chip.

[0007] As described above, in the heat dissipation and preheating structure, the control chip is in contact with the surface of the heat-conducting component.

[0008] As described above, in the heat dissipation and preheating structure, the control chip is fixed to the heat-conducting component with screws.

[0009] As described above, in the heat dissipation and preheating structure, the heat-conducting component is provided with several protruding ridges to increase the surface area of ​​the heat-conducting component.

[0010] The heat dissipation and preheating structure described above also includes a water pump connected to the water pipe, the water pump being used to provide power to pump water from the water tank to the evaporator.

[0011] As described above in the heat dissipation and preheating structure, the water pump is located between the heat-conducting component and the evaporator.

[0012] The heat dissipation and preheating structure described above also includes a motherboard, a heat-conducting component fixed on the motherboard, and a water pipe, a control chip, and a heat-conducting component disposed between the motherboard and the evaporator.

[0013] As described above in the heat dissipation and preheating structure, the water pump and the main board are disposed in the steam nozzle.

[0014] The beneficial effects of this utility model are: This application provides a heat dissipation and preheating structure. A water tank provides a water source, and the water flows through a water pipe to the evaporator. During the water flow, it passes through a heat-conducting component. The control chip is fixed on the heat-conducting component, so the flowing water can be used to dissipate heat from the control chip. At the same time, as a control component, the control chip operates at a high temperature, and the heat can also be transferred by the heat-conducting component to preheat the water in the water pipe, making it easier for the water to evaporate after entering the evaporator. The structure is also small in size and suitable for application in small electrical fields. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1 This is a schematic diagram of the assembly relationship of the heat dissipation and preheating structure in this embodiment; Figure 2 This is a cross-sectional view of the heat dissipation and preheating structure in this embodiment; Figure 3 This is one of the exploded views of the heat dissipation and preheating structure in this embodiment; Figure 4 This is the second exploded view of the heat dissipation and preheating structure in this embodiment; The attached figures are labeled as follows: 1. Control chip; 2. Water tank; 3. Water pipe; 4. Evaporator; 5. Heat-conducting component; 5. Groove; 51. Protrusion; 52. Handheld unit 61, steam nozzle 62, water pump 7, mainboard 8. Detailed Implementation

[0017] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0018] Reference Figure 1 and Figure 4 A heat dissipation and preheating structure includes: a control chip 1, a water tank 2, a water pipe 3, an evaporator 4, and a heat-conducting component 5; The water tank 2 serves as a water storage component, supplying water through the water pipe 3 so that the water enters the evaporator 4. The heat-conducting component 5 is installed on the water pipe 3, and the control chip 1 is fixed on the heat-conducting component 5. The water pipe 3 passes through the heat-conducting component 5, and the control chip 1 transfers heat to the heat-conducting component 5 as the water flows through it. The heat-conducting component 5 uses the water flow to carry away the heat in it, and at the same time, it uses the heat transferred by the heat-conducting component 5 to preheat the water in the water pipe 3, making it easier for the water to evaporate after entering the evaporator. Compared with the prior art, there is no need to set up a complex fan cooling component, which makes the heat dissipation structure smaller.

[0019] Specifically, the control chip 1 is a silicon controlled rectifier chip.

[0020] Specifically, the heat-conducting element 5 is made of a highly thermally conductive material, such as copper or aluminum.

[0021] Reference Figure 2 In one embodiment, the device further includes a handheld part 61 and a steam nozzle 62 connected to the handheld part 61. The water tank 2 is partially disposed in the handheld part 61, and the water pipe 3, the heat-conducting component 5, and the control chip 1 are disposed in the steam nozzle 62. This further improves the integration of the structure. The weight of the water tank 2 varies according to the amount of water, which allows the center of gravity of the whole machine to be closer to the user's grip, reducing wrist strain, making it easier to use for a long time, and making operation more flexible.

[0022] Specifically, at least half of the water tank 2 is located in the handheld part 61. If most of the water tank 2 is located in the steam nozzle 62, the user will clearly feel that the center of gravity of the product shifts to the steam nozzle 62 when using it, resulting in a top-heavy and unbalanced experience. In the former solution, the center of gravity always falls within the palm's coverage area, the weight distribution is more concentrated, and it is more stable to hold for a long time.

[0023] In one embodiment, the water tank 2 is entirely disposed within the handheld part 61.

[0024] Reference Figure 1 , Figure 2 In one embodiment, the heat-conducting component 5 is provided with a groove 51 for mounting the control chip 1. The groove 51 increases the surface area of ​​the heat-conducting component 5, thereby increasing the contact area with the control chip 1, improving the efficiency of heat transfer, and having a better heat conduction effect.

[0025] In one embodiment, the control chip 1 is disposed in contact with the heat-conducting component 5, maximizing the contact area between them and thus maximizing the heat conduction efficiency.

[0026] Specifically, the control chip 1 is cubic or elongated; the heat-conducting component 5 is cubic or elongated, and one side of the control chip 1 is completely in contact with the heat-conducting component 5; The water pipe 3 has one and only one conductive path, which is located in the heat-conducting component 5.

[0027] In one embodiment, the control chip 1 is fixed to the heat-conducting component 5 with screws. Compared with other fixing methods, screw fixing can ensure a tighter connection between the control chip 1 and the heat-conducting component 5, reduce the air gap between them, and facilitate disassembly and assembly. It can further improve the heat dissipation efficiency of the control chip 1, reduce heat loss, and ensure that most of the heat of the control chip 1 can be transferred to the water pipe 3.

[0028] In one embodiment, the heat-conducting element 5 is provided with a plurality of protruding ridges 52 to increase the surface area of ​​the heat-conducting element 5, thereby further improving the heat dissipation effect of the heat-conducting element 5.

[0029] In one embodiment, a water pump 7 connected to the water pipe 3 is also included. The water pump 7 is used to provide power to pump the water in the water tank 2 to the evaporator 4. On the one hand, the water pump 7 provides power as a power source, and on the other hand, it can increase the flow rate of the liquid in the water pipe 3. The high-speed water flow is used to quickly reduce the temperature of the surface of the heat-conducting component 5 and improve the heat dissipation effect of the control chip 1.

[0030] In one embodiment, the water pump 7 is located between the heat-conducting component 5 and the evaporator 4. When the heat dissipation and preheating structure is integrated into the steam nozzle 62, such a structural layout can further improve the compactness of the structure and optimize the internal space configuration of the steam nozzle 62.

[0031] In one embodiment, the system further includes a mainboard 8, with the heat-conducting component 5 fixed to the mainboard 8. The water pipe 3, the control chip 1, and the heat-conducting component 5 are disposed between the mainboard 8 and the evaporator 4. The mainboard 8 serves as the supporting substrate for the entire structure, integrating electrical connections to make the overall structure more compact and stable.

[0032] In one embodiment, the water pump 7 and the mainboard 8 are also configured in the steam nozzle 62, achieving a high degree of integration of all key functional components and optimizing the internal space layout of the product.

[0033] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A heat dissipation and preheating structure, characterized in that, include: Control chip; water tank for water supply; water pipe, one end of which is connected to the water tank and the other end of which is connected to an evaporator; A heat-conducting component is provided, the control chip is fixed on the heat-conducting component, and the water pipe is provided through the heat-conducting component. The heat-conducting component is used to conduct heat to the control chip and to heat the water in the water pipe.

2. The heat dissipation and preheating structure as described in claim 1, characterized in that: It also includes a handheld part and a steam nozzle connected to the handheld part, the water tank part is disposed in the handheld part, and the water pipe, the heat-conducting component and the control chip are disposed in the steam nozzle.

3. The heat dissipation and preheating structure as described in claim 2, characterized in that: The heat-conducting component has a groove for mounting the control chip.

4. The heat dissipation and preheating structure as described in claim 3, characterized in that: The control chip is positioned in contact with the heat-conducting component.

5. The heat dissipation and preheating structure as described in any one of claims 2, 3, and 4, characterized in that: The control chip is fixed to the heat-conducting component with screws.

6. The heat dissipation and preheating structure as described in claim 5, characterized in that: The heat-conducting component is provided with several raised ridges to increase the surface area of ​​the heat-conducting component.

7. The heat dissipation and preheating structure as described in claim 2, characterized in that: It also includes a water pump connected to the water pipe, the water pump being used to provide power to pump water from the water tank to the evaporator.

8. The heat dissipation and preheating structure as described in claim 7, characterized in that: The water pump is located between the heat-conducting component and the evaporator.

9. The heat dissipation and preheating structure as described in claim 7, characterized in that: It also includes a motherboard, the heat-conducting component fixed on the motherboard, and the water pipe, the control chip, and the heat-conducting component disposed between the motherboard and the evaporator.

10. The heat dissipation and preheating structure as described in claim 9, characterized in that: The water pump and the main board are configured in the steam nozzle.

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