Micro-structure heat-dissipation silica gel gasket

Abstract

The utility model relates to the technical field of heat dissipation silica gel gasket, and disclose a microstructure heat dissipation silica gel gasket, include: lower heat dissipation silica gel pad, upper heat dissipation silica gel pad, heat dissipation microstructure has lower auxiliary heat dissipation microstructure and multiple group upper auxiliary heat dissipation microstructure, lower auxiliary heat dissipation microstructure sets up on lower heat dissipation silica gel pad, and multiple group upper auxiliary heat dissipation microstructure evenly distributes on upper heat dissipation silica gel pad, and lower auxiliary heat dissipation microstructure and multiple group upper auxiliary heat dissipation microstructure form several heat removal channels, and the heat of electronic component emission can be discharged through the heat removal channel formed in heat dissipation microstructure. The heat dissipation hole of lower heat dissipation silica gel pad, the heat removal cavity of upper heat dissipation silica gel pad and heat dissipation hole are communicated and form heat removal channel, and the gap of efficient filling heating and heat dissipation part is punched through the heat path, and the heat dissipation silica gel strip increases the heat conduction contact area, and the heat conduction silicone grease coating reduces the thermal resistance, and the heat removal groove provides additional heat removal path, and multiple structures cooperate and greatly strengthen heat transfer and heat removal efficiency.

Description

Technical Field

[0001] This utility model relates to the field of thermal silicone pad technology, specifically to a microstructure thermal silicone pad. Background Technology

[0002] Thermal silicone pads are a type of thermally conductive medium material synthesized through a special process using silicone as the base material and adding various auxiliary materials such as metal oxides. In the industry, they are also known as thermally conductive silicone pads, thermally conductive silicone sheets, soft thermally conductive pads, thermally conductive silicone gaskets, etc. They are specifically designed and manufactured for heat transfer through gaps, filling gaps and opening up thermal channels between heat-generating and heat-dissipating parts, effectively improving heat transfer efficiency. At the same time, they also play a role in insulation, shock absorption, and sealing. They can meet the design requirements of miniaturization and ultra-thinness of equipment, and are a highly processable and practical material with a wide range of applicable thicknesses, making them an excellent thermally conductive filling material.

[0003] Existing technologies, such as the multilayer heat dissipation silicone pad disclosed in CN221598530U, do not have microstructures for auxiliary heat dissipation inside, which can easily lead to poor heat dissipation for electronic components.

[0004] Based on this, a microstructured heat dissipation silicone pad is proposed. Utility Model Content

[0005] The present invention aims to solve the problems mentioned in the background art by providing a microstructured heat dissipation silicone pad, thereby addressing the issue raised in the background art that the existing technology, such as the multilayer heat dissipation silicone pad disclosed in CN221598530U, does not have an internal microstructure for auxiliary heat dissipation, which easily leads to poor heat dissipation effect on electronic components.

[0006] The specific technical solution is as follows: A microstructured thermal silicone pad, comprising: Lower thermal pad; An upper thermal pad is disposed on the lower thermal pad; and: The heat dissipation microstructure has a lower auxiliary heat dissipation microstructure and multiple sets of upper auxiliary heat dissipation microstructures. The lower auxiliary heat dissipation microstructure is disposed on a lower heat dissipation silicone pad, and the multiple sets of upper auxiliary heat dissipation microstructures are evenly distributed on the upper heat dissipation silicone pad. The lower auxiliary heat dissipation microstructure and the multiple sets of upper auxiliary heat dissipation microstructures are interconnected internally and form several heat dissipation channels. The heat dissipated by the electronic components can be discharged through the heat dissipation channels formed in the heat dissipation microstructure.

[0007] As a preferred embodiment of this utility model, it also includes a plurality of heat-dissipating silicone strips, which are evenly distributed on the upper heat-dissipating silicone pad.

[0008] As a preferred embodiment of this utility model, the lower auxiliary heat dissipation microstructure consists of a plurality of heat dissipation holes formed on the lower heat dissipation silicone pad.

[0009] As a preferred embodiment of this utility model, the multiple sets of upper auxiliary heat dissipation microstructures include multiple heat dissipation cavities opened on the upper heat dissipation silicone pad. The multiple heat dissipation cavities are equidistantly distributed along the length direction of the upper heat dissipation silicone pad. Each heat dissipation cavity has several heat dissipation holes at its top and bottom, and the several heat dissipation holes are interconnected inside and out. Each of the heat dissipation cavities can be connected to the heat dissipation vent via a heat dissipation hole located on one side of the bottom.

[0010] As a preferred embodiment of this utility model, a blank area is formed between each group of adjacent heat dissipation holes; Each of the aforementioned thermal silicone strips is adhesively installed on the corresponding blank area.

[0011] As a preferred embodiment of this utility model, the upper surface of each of the heat dissipation silicone strips is coated with a thermally conductive silicone grease coating.

[0012] As a preferred embodiment of this utility model, a heat dissipation groove is formed between adjacent heat dissipation silicone strips to facilitate heat dissipation.

[0013] In a preferred embodiment of this utility model, the lower surface of the upper heat dissipation silicone pad is bonded and fixed to the upper surface of the lower heat dissipation silicone pad.

[0014] This utility model has the following beneficial effects: I. In this utility model, the heat dissipation holes of the lower heat dissipation silicone pad and the heat dissipation cavity of the upper heat dissipation silicone pad are connected to the heat dissipation holes to form a heat dissipation channel, which efficiently fills the gap between the heat-generating and heat-dissipating parts and opens up the heat path.

[0015] II. In this utility model, the heat dissipation silicone strip increases the thermal contact area, the thermal grease coating reduces thermal resistance, and the heat dissipation groove provides an additional heat dissipation path. The synergy of multiple structures greatly enhances heat transfer and heat dissipation efficiency.

[0016] Third, in this utility model, the lower heat dissipation silicone pad, the upper heat dissipation silicone pad, and the heat dissipation silicone strip, which are based on silicone, have the functions of insulation, shock absorption, and sealing, meet the design requirements of miniaturization and ultra-thinness of equipment, have outstanding processability and practicality, and have a wide range of applicable thicknesses.

[0017] Fourth, in this utility model, the upper heat dissipation silicone pad and the lower heat dissipation silicone pad are bonded and fixed together, and the heat dissipation silicone strip is bonded and installed to the blank part of the upper heat dissipation silicone pad, so as to ensure the stability of the position of each heat dissipation structure and enable the heat dissipation channel and the auxiliary heat dissipation structure to play a continuous and stable role. Attached Figure Description

[0018] Figure 1This is a three-dimensional schematic diagram of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 This is a three-dimensional schematic diagram of the present invention viewed from below; Figure 4 This is a three-dimensional schematic diagram of the upper heat dissipation silicone pad of this utility model; Figure 5 for Figure 4 A magnified 3D schematic diagram of part A in the middle.

[0019] In the picture: 100. Lower thermal pad; 110. Heat dissipation hole; 200. Upper thermal pad; 210. Heat dissipation cavity; 220. Heat dissipation hole; 230. Blank area; 300. Thermal silicone strip; 310. Thermal grease coating. Detailed Implementation

[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this utility model, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0022] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0023] In the description of this utility model, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating the connection relationship between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] Example 1

[0025] like Figures 1-5 As shown in the figure, a microstructured heat dissipation silicone pad provided in this embodiment of the present invention includes: 100mm thermal pad; An upper thermal pad 200 is disposed on a lower thermal pad 100; and a thermal microstructure, which has a lower auxiliary thermal microstructure and multiple upper auxiliary thermal microstructures. The lower auxiliary thermal microstructure is disposed on the lower thermal pad 100, and the multiple upper auxiliary thermal microstructures are evenly distributed on the upper thermal pad 200. The lower auxiliary thermal microstructure and the multiple upper auxiliary thermal microstructures are interconnected internally and form several heat dissipation channels. The heat dissipated by the electronic components can be discharged through the heat dissipation channels formed in the thermal microstructure.

[0026] In this embodiment, by setting a lower heat dissipation silicone pad 100 and an upper heat dissipation silicone pad 200, and utilizing a heat dissipation microstructure with a lower auxiliary heat dissipation microstructure and multiple sets of upper auxiliary heat dissipation microstructures, the lower auxiliary heat dissipation microstructure and the multiple sets of upper auxiliary heat dissipation microstructures are interconnected to form several heat dissipation channels. The heat emitted by the electronic components can be discharged through these heat dissipation channels, thereby achieving heat dissipation.

[0027] Example 2

[0028] like Figures 1-5 As shown, improvements are made based on Example 1: Furthermore, the lower auxiliary heat dissipation microstructure consists of several heat dissipation holes 110 formed on the lower heat dissipation silicone pad 100.

[0029] In this embodiment, the lower auxiliary heat dissipation microstructure utilizes a plurality of heat dissipation holes 110 formed on the lower heat dissipation silicone pad 100 to provide a channel for heat transfer or temporary storage.

[0030] Furthermore, the multiple sets of upper auxiliary heat dissipation microstructures include multiple heat dissipation cavities 210 formed on the upper heat dissipation silicone pad 200. The multiple heat dissipation cavities 210 are equidistantly distributed along the length direction of the upper heat dissipation silicone pad 200. Each heat dissipation cavity 210 has several heat dissipation holes 220 formed at its top and bottom, and the several heat dissipation holes 220 are interconnected inside and out. Each heat dissipation cavity 210 can be connected to the heat dissipation hole 110 through the heat dissipation hole 220 located on the bottom side.

[0031] In this embodiment, multiple sets of upper auxiliary heat dissipation microstructures are formed by opening multiple heat dissipation cavities 210 that are equidistantly distributed along the length of the upper heat dissipation silicone pad 200. Each heat dissipation cavity 210 has several heat dissipation holes 220 that are open to the inside and outside at the top and bottom. This allows each heat dissipation cavity 210 to be connected to the heat dissipation hole 110 through the heat dissipation hole 220 on the bottom side, so that heat enters the heat dissipation cavity 210 from the heat dissipation hole 110 and is then discharged through the heat dissipation hole 220 at the top.

[0032] Furthermore, the lower surface of the upper heat-dissipating silicone pad 200 is bonded and fixed to the upper surface of the lower heat-dissipating silicone pad 100.

[0033] In this embodiment, by bonding and fixing the lower surface of the upper heat dissipation silicone pad 200 to the upper surface of the lower heat dissipation silicone pad 100, the stability of the overall structure is ensured, and the lower auxiliary heat dissipation microstructure and the upper auxiliary heat dissipation microstructure can be stably connected to form a heat dissipation channel.

[0034] Example 3

[0035] like Figures 1-5 As shown, the difference in Embodiment 2 is: Furthermore, it also includes multiple heat-dissipating silicone strips 300, which are evenly distributed on the upper heat-dissipating silicone pad 200.

[0036] In this embodiment, multiple heat-dissipating silicone strips 300 are evenly distributed on the upper heat-dissipating silicone pad 200, which can increase the contact area with the heat-generating components, assist in absorbing and conducting heat, and improve the overall thermal conductivity.

[0037] Furthermore, a blank space 230 is formed between each adjacent group of heat dissipation holes 220; Each thermal silicone strip 300 is adhesively installed on the corresponding blank part 230.

[0038] In this embodiment, a blank space 230 is formed between adjacent groups of heat dissipation holes 220. Each heat dissipation silicone strip 300 is bonded and installed on the corresponding blank space 230. This not only makes reasonable use of the space of the upper heat dissipation silicone pad 200, but also ensures the stability of the position of the heat dissipation silicone strip 300, so that heat can be stably transferred to the heat dissipation silicone strip 300.

[0039] Furthermore, the upper surface of each thermal silicone strip 300 is coated with a thermal grease coating 310.

[0040] In this embodiment, the upper surface of each heat-dissipating silicone strip 300 is coated with a thermally conductive silicone grease coating 310. The thermally conductive silicone grease coating 310 can reduce the thermal resistance between the heat-dissipating silicone strip 300 and the heat-generating component, so that the heat from the heat-generating component can be transferred to the heat-dissipating silicone strip 300 more efficiently.

[0041] Furthermore, heat dissipation grooves are formed between adjacent heat dissipation silicone strips 300 to facilitate heat dissipation.

[0042] Furthermore, the heat dissipation hole 220 located on the top side is connected to the heat dissipation groove.

[0043] In this embodiment, a heat dissipation groove is formed between adjacent heat dissipation silicone strips 300, and the heat dissipation hole 220 on the top side is connected to the heat dissipation groove, providing an additional channel for heat dissipation. This allows the heat in the heat dissipation cavity 210 to be dissipated more smoothly after entering the heat dissipation groove through the heat dissipation hole 220, thereby improving the overall heat dissipation efficiency.

[0044] Work steps: like Figures 1-5 As shown, electronic components can be mounted on multiple thermal silicone strips 300. After installation, the electronic components are in contact with the thermal grease coating 310 on each thermal silicone strip 300. At this time, the heat emitted by the electronic components is first transferred to the lower thermal silicone pad 100 and then transferred through the heat dissipation holes 110 on the lower thermal silicone pad 100. Next, the heat is discharged through the heat dissipation hole 220 at the bottom of the upper heat dissipation silicone pad 200, which is connected to the heat dissipation hole 110, and enters the heat dissipation cavity 210 that is equidistantly distributed along the length direction on the upper heat dissipation silicone pad 200. Subsequently, the heat diffuses within the heat dissipation cavity 210. On one hand, it is discharged through the heat dissipation hole 220 at the top of the heat dissipation cavity 210. On the other hand, the heat dissipation silicone strip 300 bonded to the blank part 230 of the upper heat dissipation silicone pad 200 efficiently absorbs heat with the help of the thermally conductive silicone grease coating 310 on its surface. Furthermore, the heat dissipation groove between adjacent heat dissipation silicone strips 300 is connected to the top heat dissipation hole 220, further guiding the heat to be discharged from the heat dissipation groove. Meanwhile, the upper heat dissipation silicone pad 200 and the lower heat dissipation silicone pad 100 are bonded and fixed to ensure stable communication between the lower auxiliary heat dissipation microstructure and the upper auxiliary heat dissipation microstructure, forming a complete heat dissipation channel, and ultimately achieving effective heat dissipation of electronic components.

[0045] In summary: 1. Significantly improved heat dissipation efficiency: The heat dissipation holes 110 of the lower heat dissipation silicone pad 100 and the heat dissipation cavity 210 of the upper heat dissipation silicone pad 200 are connected to the heat dissipation holes 220 to form a heat dissipation channel, which efficiently fills the gap between heat-generating and heat-dissipating parts and opens up the heat path. The thermal silicone strip 300 increases the thermal contact area, the thermal grease coating 310 reduces thermal resistance, and the heat dissipation groove provides an additional heat dissipation path. The synergy of these multiple structures greatly enhances heat transfer and heat dissipation efficiency.

[0046] II. Multifunctional and highly adaptable: The lower heat dissipation silicone pad 100, upper heat dissipation silicone pad 200 and heat dissipation silicone strip 300, which are based on silicone, have the functions of insulation, shock absorption and sealing, meet the design requirements of miniaturization and ultra-thinness of equipment, have outstanding processability and practicality, and have a wide range of applicable thicknesses.

[0047] III. Stable and reliable structure: The upper heat dissipation silicone pad 200 and the lower heat dissipation silicone pad 100 are bonded and fixed together, and the heat dissipation silicone strip 300 is bonded and installed to the blank part 230 of the upper heat dissipation silicone pad 200, ensuring the stability of each heat dissipation structure and enabling the heat dissipation channel and auxiliary heat dissipation structure to function stably and continuously.

[0048] It should be noted that the different embodiments described above can be combined, substituted, and used in combination with each other.

[0049] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A microstructured thermally conductive silicone pad, characterized in that, include: Lower thermal pad (100); An upper thermal pad (200) is disposed on the lower thermal pad (100); as well as: The heat dissipation microstructure has a lower auxiliary heat dissipation microstructure and multiple upper auxiliary heat dissipation microstructures. The lower auxiliary heat dissipation microstructure is disposed on the lower heat dissipation silicone pad (100), and the multiple upper auxiliary heat dissipation microstructures are evenly distributed on the upper heat dissipation silicone pad (200). The lower auxiliary heat dissipation microstructure and the multiple upper auxiliary heat dissipation microstructures are interconnected internally and form several heat dissipation channels. The heat dissipated by the electronic components can be discharged through the heat dissipation channels formed in the heat dissipation microstructure.

2. The microstructured heat-dissipating silicone pad according to claim 1, characterized in that, It also includes multiple heat-dissipating silicone strips (300), which are evenly distributed on the upper heat-dissipating silicone pad (200).

3. The microstructured heat-dissipating silicone pad according to claim 1, characterized in that, The lower auxiliary heat dissipation microstructure consists of several heat dissipation holes (110) formed on the lower heat dissipation silicone pad (100).

4. The microstructured heat-dissipating silicone pad according to claim 2, characterized in that, The multiple sets of upper auxiliary heat dissipation microstructures include multiple heat dissipation cavities (210) opened on the upper heat dissipation silicone pad (200). The multiple heat dissipation cavities (210) are equidistantly distributed along the length direction of the upper heat dissipation silicone pad (200). Each heat dissipation cavity (210) has several heat dissipation holes (220) opened at the top and bottom, and the several heat dissipation holes (220) are interconnected inside and out. Each of the heat dissipation cavities (210) can be connected to the heat dissipation vent (110) through a heat dissipation hole (220) located on the bottom side.

5. The microstructured heat-dissipating silicone pad according to claim 4, characterized in that, A blank area (230) is formed between each adjacent group of heat dissipation holes (220); Each of the aforementioned heat-dissipating silicone strips (300) is adhesively installed on the corresponding blank portion (230).

6. The microstructured heat-dissipating silicone pad according to claim 2 or 5, characterized in that, The upper surface of each of the aforementioned heat-dissipating silicone strips (300) is coated with a thermally conductive silicone grease coating (310).

7. The microstructured heat-dissipating silicone pad according to claim 6, characterized in that, A heat dissipation groove is formed between adjacent heat dissipation silicone strips (300) to facilitate heat dissipation.

8. The microstructured heat-dissipating silicone pad according to claim 1, characterized in that, The lower surface of the upper heat dissipation silicone pad (200) is bonded and fixed to the upper surface of the lower heat dissipation silicone pad (100).

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