A step suction mechanism in a semiconductor processing process

Abstract

This utility model discloses a stepping suction mechanism in semiconductor processing, belonging to the technical field of stepping suction mechanisms. The stepping suction mechanism in semiconductor processing includes a feeding conveyor mechanism with a stepping suction conveyor mechanism at its front end; a discharging conveyor mechanism at its front end; and a sorting and collecting mechanism at its front end. In this utility model, the horizontal linear module can precisely control the lateral displacement of the suction components; the vertical cylinder can precisely control the vertical lifting distance of the pneumatic suction nozzle, ensuring precise docking between the nozzle and the semiconductor workpiece; the rotary cylinder can precisely adjust the angle of the workpiece, maintaining a precise posture during processing or transfer; the precise cooperation of the components achieves high-precision positioning of the semiconductor workpiece during gripping and transfer, effectively avoiding processing errors caused by positioning deviations.

Description

Technical Field

[0001] This utility model specifically relates to the technical field of stepping feeding mechanisms, and more specifically to a stepping feeding mechanism in semiconductor processing. Background Technology

[0002] In the semiconductor manufacturing industry, automated workpiece transfer and processing are core aspects of improving production efficiency and ensuring product quality. In traditional production models, the loading, processing, unloading, and sorting of semiconductor workpieces largely rely on manual operation or discrete equipment combinations. Manual operation is not only inefficient but also prone to human error, causing damage and contamination of semiconductor workpieces, which seriously affects product yield. Discrete equipment has poor connectivity, and the transfer of workpieces between processes is time-consuming, making it difficult to meet the semiconductor industry's demands for high-precision, high-speed production.

[0003] To overcome this bottleneck, the industry urgently needs an integrated stepper feed mechanism to automate the entire process from workpiece loading, precise stepper transfer, collaborative processing, to unloading and sorting. This mechanism must possess high-precision material gripping and transfer capabilities while meeting the stringent requirements of semiconductor workpieces for cleanliness and positioning accuracy. This will address the pain points of low efficiency, poor yield, and high costs caused by reliance on manual labor and fragmented equipment, thus driving the semiconductor manufacturing industry towards intelligent and efficient upgrades. Utility Model Content

[0004] The purpose of this utility model is to provide a stepping material feeding mechanism in the semiconductor processing process. By using a feeding conveyor mechanism, a stepping material feeding conveyor mechanism, a discharging conveyor mechanism and a sorting and collecting mechanism in combination, the automation, processing accuracy, integration and adaptability of the stepping material feeding mechanism are improved, thereby solving the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A stepping feeding mechanism in a semiconductor processing procedure, comprising: The feeding conveyor mechanism has a stepping suction conveyor mechanism at its front end; the stepping suction conveyor mechanism has a discharge conveyor mechanism at its front end; and the discharge conveyor mechanism has a sorting and collecting mechanism at its front end. The loading and unloading conveying mechanisms are composed of the same structure. The stepping material conveying mechanism includes a working platform, with support legs fixedly installed at the four corners of the lower surface of the working platform; the upper left side of the working platform is provided with a workpiece platform in a rectangular array, and a semiconductor workpiece is placed inside the workpiece platform, and the workpiece platform is arranged in a ring. A support frame is fixedly installed on the upper right surface of the work platform, and mounting seats are fixedly installed in a rectangular array on the lower surface of the support frame. The left side of the mounting seats arranged in a rectangular array is fixedly connected to the horizontal linear module.

[0006] As a further technical solution of this utility model, each of the sliders arranged in a rectangular array on the left side of the horizontal linear module is equipped with a vertical cylinder, and each vertical cylinder is provided with a rotary cylinder at its lower end.

[0007] As a further technical solution of this utility model, the lower end of the rotary cylinder is provided with a suction nozzle bracket, and multiple pneumatic suction nozzles are fixedly installed on the suction nozzle bracket; the front and rear ends of the working platform are respectively provided with a material feeding conveyor and a material feeding conveyor.

[0008] As a further technical solution of this utility model, the front end of the feeding conveyor mechanism is provided with a sorting slide, the sorting slide is inclined, and the rear end of the sorting slide is symmetrically and fixedly installed with detection sensors; the lower end of the sorting slide is fixedly connected to the sorting mounting plate.

[0009] As a further technical solution of this utility model, the sorting mounting plate is fixedly installed on the upper end of the sorting mechanism base; a sorting mechanism mounting seat is fixedly installed on the sorting mounting plate, and a sorting drive mechanism is fixedly installed on the sorting mechanism mounting seat; a collection box is symmetrically provided at the front end of the sorting slide.

[0010] Compared with the prior art, the beneficial effects of this utility model are: This invention features a feeding conveyor that automatically transports workpieces to the processing area, a stepping suction conveyor that automatically grips, transfers, and adjusts the angle of the workpieces, and an unloading conveyor that automatically transports the processed workpieces to a sorting and collection mechanism. The sorting and collection mechanism automatically performs workpiece detection, sorting, and classification collection. The entire process requires no manual intervention, greatly reducing the time and effort required for manual operation, significantly improving overall production efficiency, and meeting the needs of large-scale, continuous production in the semiconductor industry. This invention features a horizontal linear module that precisely controls the lateral displacement of the suction component; a vertical cylinder that precisely controls the vertical lifting distance of the pneumatic suction nozzle, ensuring accurate docking between the nozzle and the semiconductor workpiece; and a rotary cylinder that precisely adjusts the angle of the workpiece, maintaining a precise posture during processing or transport. The precise coordination of these components enables high-precision positioning of the semiconductor workpiece during gripping and transport, effectively avoiding processing errors caused by positioning deviations, thereby significantly improving product yield and ensuring that the processing quality of the semiconductor workpiece meets high industry standards. This invention features a pneumatic suction nozzle that can be replaced according to the shape, size, and material of different semiconductor workpieces. The structural design of the suction nozzle bracket also facilitates the disassembly and assembly of the nozzle. The workpiece platform is arranged in a ring and can be adapted to semiconductor workpieces of different specifications, meeting the load-bearing requirements of various semiconductor workpieces. This allows the mechanism to adapt to the processing requirements of different types and specifications of semiconductor workpieces, enhancing the applicability and service life of the equipment. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0012] Figure 2 This utility model Figure 1 Top view.

[0013] Figure 3 This utility model Figure 1 A schematic diagram of the split structure.

[0014] Figure 4 This utility model Figure 3 The left view.

[0015] Figure 5 This utility model Figure 2 A schematic diagram of the split structure.

[0016] Figure 6 This utility model Figure 5 A bottom view.

[0017] Figure 7 This utility model Figure 2 A magnified view of a portion of the image.

[0018] Figure 8 This utility model Figure 6 A magnified view of a portion of the image.

[0019] In the diagram: 1-Feeding conveyor mechanism, 2-Stepping suction conveyor mechanism, 3-Discharge conveyor mechanism, 4-Sorting and collecting mechanism; 21-Support leg, 22-Working platform, 23-Workpiece carrier, 24-Support stand, 25-Mounting base, 26-Horizontal linear module, 27-Vertical cylinder, 28-Rotary cylinder, 29-Nozzle bracket, 210-Pneumatic nozzle; 41-Sorting mechanism base, 42-Sorting mounting plate, 43-Sorting mechanism mounting seat, 44-Sorting drive mechanism, 45-Sorting slide, 46-Detection sensor, 47-Collection box. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-8 In this embodiment of the present invention, a stepping material feeding mechanism in a semiconductor processing process includes a feeding conveying mechanism 1, a stepping material feeding conveying mechanism 2 at the front end of the feeding conveying mechanism 1; a discharging conveying mechanism 3 at the front end of the stepping material feeding conveying mechanism 2; and a sorting and collecting mechanism 4 at the front end of the discharging conveying mechanism 3. The loading conveyor mechanism 1 and the unloading conveyor mechanism 3 are composed of the same structure; The stepping material conveying mechanism 2 includes a working platform 22, and support legs 21 are fixedly installed at the four corners of the lower surface of the working platform 22. The upper left side surface of the working platform 22 is provided with a workpiece platform 23 in a rectangular array. Semiconductor workpieces are placed inside the workpiece platform 23, and the workpiece platform 23 is arranged in a ring. The work platform 22 has a support frame 24 fixedly installed on the upper right side surface. The support frame 24 has mounting seats 25 fixedly installed in a rectangular array on the lower surface. The mounting seats 25 arranged in a rectangular array are fixedly connected to the horizontal linear module 26 on the left side.

[0022] By adopting the above technical solution, the material conveying mechanism 1 automatically conveys the workpiece to the processing area, the stepping suction conveying mechanism 2 automatically completes the gripping, transfer and angle adjustment of the workpiece, and the unloading conveying mechanism 3 automatically conveys the processed workpiece to the sorting and collection mechanism 4. The sorting and collection mechanism 4 automatically completes the workpiece detection, sorting and classification collection. The entire process requires no manual intervention, which greatly reduces the time and effort invested in manual operation, significantly improves the overall production efficiency, and can meet the needs of large-scale and continuous production in the semiconductor industry.

[0023] In this embodiment, vertical cylinders 27 are installed on the sliders arranged in a rectangular array on the left side of the horizontal linear module 26, and rotary cylinders 28 are provided at the lower end of each vertical cylinder 27. The lower end of the rotary cylinder 28 is provided with a suction nozzle bracket 29, and multiple pneumatic suction nozzles 210 are fixedly installed on the suction nozzle bracket 29; the front and rear ends of the working platform 22 are respectively provided with a feeding conveying mechanism 3 and a feeding conveying mechanism 1. The material feeding and conveying mechanism 3 has a sorting slide 45 at its front end. The sorting slide 45 is inclined and the rear end of the sorting slide 45 is symmetrically and fixedly equipped with detection sensors 46. The lower end of the sorting slide 45 is fixedly connected to the sorting mounting plate 42. The sorting mounting plate 42 is fixedly mounted on the upper end of the sorting mechanism base 41; a sorting mechanism mounting seat 43 is fixedly mounted on the sorting mounting plate 42, and a sorting drive mechanism 44 is fixedly mounted on the sorting mechanism mounting seat 43; a collection box 47 is symmetrically provided at the front end of the sorting slide 45.

[0024] By adopting the above technical solutions, the horizontal linear module 26 can precisely control the lateral displacement of the suction component; the vertical cylinder 27 can precisely control the vertical lifting distance of the pneumatic suction nozzle 210, ensuring the precise docking of the suction nozzle 210 with the semiconductor workpiece; the rotary cylinder 28 can precisely adjust the angle of the workpiece, so that the semiconductor workpiece maintains a precise posture during processing or transfer; the precise cooperation of the components realizes high-precision positioning of the semiconductor workpiece during gripping and transfer, effectively avoiding processing errors caused by positioning deviations, thereby greatly improving product yield and ensuring that the processing quality of the semiconductor workpiece meets high industry standards; The pneumatic suction nozzle 210 can be replaced according to the shape, size and material of different semiconductor workpieces, and the structural design of the suction nozzle bracket 29 also facilitates the disassembly and assembly of the suction nozzle; the workpiece platform 23 is arranged in a ring and can be adapted to semiconductor workpieces of different specifications, which can meet the bearing requirements of various semiconductor workpieces; thus, the mechanism can adapt to the processing requirements of different types and specifications of semiconductor workpieces, and enhance the applicability and service life of the equipment.

[0025] The working principle of this utility model is as follows: the material conveying mechanism 1 automatically conveys the workpiece to the processing area, the stepping suction conveying mechanism 2 automatically completes the gripping, transfer and angle adjustment of the workpiece, and the unloading conveying mechanism 3 automatically conveys the processed workpiece to the sorting and collection mechanism 4. The sorting and collection mechanism 4 automatically completes the workpiece detection, sorting and classification collection. The entire process requires no manual intervention, which greatly reduces the time and effort invested in manual operation, significantly improves the overall production efficiency, and can meet the needs of large-scale and continuous production in the semiconductor industry. After the workpiece enters the sorting chute 45, the detection sensor 46 detects it, and the sorting drive mechanism 44 drives the sorting component to move according to the detection result, guiding the workpiece to the corresponding collection box 47 to complete the sorting and collection. The horizontal linear module 26 can precisely control the lateral displacement of the suction component; the vertical cylinder 27 can precisely control the vertical lifting distance of the pneumatic suction nozzle 210, ensuring the precise docking of the suction nozzle 210 with the semiconductor workpiece; the rotary cylinder 28 can precisely adjust the angle of the workpiece, so that the semiconductor workpiece maintains a precise posture during processing or transfer; the precise cooperation of the components realizes high-precision positioning of the semiconductor workpiece during gripping and transfer, effectively avoiding processing errors caused by positioning deviation, thereby greatly improving product yield and ensuring that the processing quality of the semiconductor workpiece meets high industry standards; The pneumatic suction nozzle 210 can be replaced according to the shape, size and material of different semiconductor workpieces, and the structural design of the suction nozzle bracket 29 also facilitates the disassembly and assembly of the suction nozzle; the workpiece platform 23 is arranged in a ring and can be adapted to semiconductor workpieces of different specifications, which can meet the bearing requirements of various semiconductor workpieces; thus, the mechanism can adapt to the processing requirements of different types and specifications of semiconductor workpieces, and enhance the applicability and service life of the equipment.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0027] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A step-and-suck mechanism in a semiconductor processing process, characterized by: include The feeding conveyor (1) is provided with a stepping suction conveyor (2) at its front end; the stepping suction conveyor (2) is provided with a discharging conveyor (3) at its front end; and the discharging conveyor (3) is provided with a sorting and collecting mechanism (4) at its front end. The loading conveyor (1) and unloading conveyor (3) are composed of the same structure; The stepping material conveying mechanism (2) includes a working platform (22), and support legs (21) are fixedly installed at the four corners of the lower surface of the working platform (22); the upper left side of the working platform (22) is provided with a workpiece platform (23) in a rectangular array, and a semiconductor workpiece is placed inside the workpiece platform (23), and the workpiece platform (23) is arranged in a ring. The work platform (22) is fixedly installed with a support frame (24) on the upper right side. The support frame (24) is fixedly installed with mounting seats (25) in a rectangular array on the lower surface. The mounting seats (25) arranged in a rectangular array are fixedly connected to the horizontal linear module (26) on the left side.

2. The stepping feeding mechanism in the semiconductor processing according to claim 1, characterized in that: The horizontal linear module (26) has vertical cylinders (27) installed on the sliders arranged in a rectangular array on the left side, and a rotary cylinder (28) is provided at the lower end of each vertical cylinder (27).

3. The step-and- suck mechanism in a semiconductor processing process according to claim 2, wherein: The lower end of the rotary cylinder (28) is provided with a suction nozzle bracket (29), and multiple pneumatic suction nozzles (210) are fixedly installed on the suction nozzle bracket (29); the front and rear ends of the working platform (22) are respectively provided with a feeding conveyor (3) and a feeding conveyor (1).

4. The step-and- suck mechanism in a semiconductor processing process according to claim 3, wherein: The material feeding and conveying mechanism (3) is provided with a sorting slide (45) at the front end. The sorting slide (45) is inclined and the rear end of the sorting slide (45) is symmetrically fixedly installed with detection sensors (46). The lower end of the sorting slide (45) is fixedly connected to the sorting mounting plate (42).

5. The step-and- suck mechanism in a semiconductor processing process according to claim 4, wherein: The sorting mounting plate (42) is fixedly installed on the upper end of the sorting mechanism base (41); a sorting mechanism mounting seat (43) is fixedly installed on the sorting mounting plate (42), and a sorting drive mechanism (44) is fixedly installed on the sorting mechanism mounting seat (43); a collection box (47) is symmetrically provided at the front end of the sorting slide (45).

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