Method for manufacturing an organic, light-emitting component and organic, light-emitting component

Abstract

Method (100) for manufacturing an organic, light-emitting component (1), comprising the method (100): • Forming (110) an electrically active area (104); • Applying (120) an adhesive layer (106) to or over the electrically active area (104), wherein the adhesive layer (106) comprises a magnetic material (108) distributed in an adhesive (112), the magnetic material (108) being embedded as particles in the adhesive (112); and • Applying (130) an alternating magnetic field (114) to the adhesive layer (106) such that the adhesive (112) forms at least one adhesive bond (116), wherein an adhesive bond (116) is formed between the adhesive (112) and the electrically active area (104), • wherein the adhesive layer (106) is designed and / or the alternating magnetic field (114) is configured such that the adhesive layer (106) has a lateral structuring after the formation of the adhesive bond, wherein • the electrically active region is formed with an optically inactive region and an optically active region arranged next to the optically inactive region, wherein the adhesive layer (118) has at least one adhesive compound (116) in the optically inactive region and the optically active region is free of this adhesive compound (116), and • the optically inactive area is a peripheral area and the optically active area is a central area that is laterally surrounded by the optically inactive peripheral area.

Description

[0001] The invention relates to a method for producing an organic, light-emitting component and an organic, light-emitting component.

[0002] A conventional light-emitting device, such as an OLED, has an electrically active region with an anode, a cathode, and an organic functional layer system in between. The electrically active region is conventionally encapsulated to protect it from mechanical damage. The encapsulation also protects the electrically active region from water and / or oxygen. A conventional encapsulation, for example, consists of a glass cover that is laminated onto the electrically active region using an adhesive.

[0003] The curing of the adhesive for encapsulating organic components places high demands on process speed and reliability in the mass production of these components due to short cycle times. Furthermore, due to the large refractive index difference between the adhesive, the electrically active area, and the glass cover, a large portion of the light generated in the organic functional layer system is not extracted but remains within the organic functional layer system or the glass cover.

[0004] The adhesive is currently cured by a thermal curing process, for example in an oven, and / or by UV exposure. During curing, the organic functional layer system is subjected to an unnecessary thermal load for an extended period. This can lead to crystallization, degradation, crosslinking, and / or diffusion of the organic material within the organic functional layer system.

[0005] To increase the extraction of light from the light-emitting component, i.e., from the glass cover and / or the organically functional layer system, a film with scattering centers, also referred to as a scattering film, is conventionally laminated over the electrically active area.

[0006] The publications DE 10 2012 209 513 A1, DE 10 2007 017 641 A1, WO 02 / 012 409 A1, US 2005 / 0 274 ​​454 A1 describe methods for manufacturing an organic, light-emitting component and the same.

[0007] The object of the invention is to provide a method for producing and manufacturing an organic, light-emitting component, in which the thermal stress on the organic functional layer structure is reduced. A further object is to adjust the emission characteristics of the organic, light-emitting component in a simpler manner.

[0008] These tasks are solved by the independent patent claims.

[0009] In one aspect, a method for manufacturing an organic, light-emitting component is provided. The method involves forming an electrically active region and applying an adhesive layer to or over the electrically active region. The adhesive layer comprises a magnetic material dispersed within an adhesive. The method further involves applying an alternating magnetic field to the adhesive layer, causing the adhesive to form at least one adhesive bond.

[0010] The magnetic material can be, for example, a paramagnetic material, a diamagnetic material, or a ferromagnetic material, depending on the specific embodiment. The ferromagnetic material has a large hysteresis area and thus causes heat transfer to the adhesive medium in a small number of cycles of the alternating magnetic field.

[0011] In other words, an adhesive bond is formed between the magnetic material and the alternating magnetic field at the adhesive layer. For example, the adhesive is cured. The alternating magnetic field can be homogeneous or inhomogeneous.

[0012] In various advanced training courses, the magnetic material and the adhesive are thermally coupled. This causes a heat flow between the magnetic material and the adhesive.

[0013] In various advanced training courses, the adhesive is essentially transparent to visible light, and at least a portion of the light emitted by the light-emitting component is transmissible through the adhesive layer. This allows the magnetic material to influence the path of the transmitted light. As a result, the emission characteristics of the organic, light-emitting component can be easily adjusted.

[0014] In various advanced training courses, the magnetic material is embedded as particles in the adhesive. This allows for easy adjustment of the coupling area between the magnetic material and the adhesive, and thus enables easy adjustment of the parameters of the alternating magnetic field to form the adhesive bond.

[0015] In a further development, the magnetic particles are designed to scatter light. This means that, by means of the light-scattering magnetic particles in the adhesive layer, the light modes that would otherwise be guided in the electrically active region can be coupled out by volume scattering.

[0016] The variable size of the scattering particles and the variable magnetic field distribution allow for targeted positive influence on the emission characteristics of the organic, light-emitting component, for example, improving the color rendering index (CRI), saturation and / or emission width of the organic, light-emitting component.

[0017] In various advanced training courses, the magnetic particles are arranged in the adhesive with respect to a predetermined direction and / or structure before the adhesive bond forms, for example, by means of a homogeneous magnetic field. For non-radially symmetric magnetic particles, the predetermined direction can be, for example, an alignment of the particles with respect to a specific direction. A predetermined structure is, for example, a predetermined relative arrangement of the magnetic particles to one another, for instance, to represent information.

[0018] For example, by precisely adjusting the distribution of the applied magnetic field, the distribution—such as the arrangement and / or number density—of the magnetic particles in the adhesive layer can be influenced. This makes it possible to selectively influence the emission spectrum of the organic, light-emitting device. For instance, the magnetic particles can first be arranged within the organic, light-emitting device according to a predetermined pattern using magnetic migration, for example, by concentrating them in a specific area. The adhesive has a lower viscosity for this purpose than it will after the adhesive bond has formed. In a further process step, the arranged magnetic particles can be exposed to an alternating magnetic field to induce the formation of the adhesive bond.

[0019] In various advanced training courses, an adhesive bond is formed between the bonding agent and the electrically active area. This results in a more reliable encapsulation of the organic, light-emitting component.

[0020] In various advanced training programs, the process further involves forming a barrier thin layer on the electrically active area and applying the adhesive layer to the barrier thin layer. An adhesive bond is formed between the adhesive and the barrier thin layer.

[0021] In various advanced versions, the process further involves placing a cover on the adhesive layer before the adhesive forms the bond. An additional adhesive bond between the adhesive and the cover is then formed using an alternating magnetic field.

[0022] By combining the lamination process of the cover with the simultaneous alignment of the magnetic particles contained in the adhesive, two manufacturing steps can be integrated. This results in shorter lead times in series production. Furthermore, the thermal load on the organic materials used is reduced, as the induction process only generates heat locally and for a short time within the adhesive layer.

[0023] In various advanced training courses, the alternating magnetic field is applied to the adhesive layer in a specified area, so that at least one adhesive bond is formed only in the specified area.

[0024] In various advanced training courses, the magnetic material is a ferrite and the magnetic material is demagnetized after the formation of the adhesive bond, for example by means of a component-external neodymium magnet.

[0025] This means that the magnetization of the magnetic particles does not affect, or does not significantly affect, the current flow in the organic, light-emitting component.

[0026] In various aspects, an organic, light-emitting device is provided, comprising an electrically active area and an adhesive layer on or above the electrically active area. The adhesive layer contains magnetic particles embedded in an adhesive. The magnetic particles are arranged in a predefined pattern within the adhesive.

[0027] This allows for targeted adjustment of the optical, electrical and magnetic properties of the organic, light-emitting component.

[0028] In various advanced training courses, the adhesive layer has at least one adhesive bond in a specified first area and a second area arranged next to the first area, which is free of this adhesive bond.

[0029] In various advanced training programs, the magnetic particles are designed and arranged in the adhesive layer in such a way that information can be represented using the magnetic particles. This information can be read out optically and / or magnetically, for example. The information could be, for example, text or an image.

[0030] In various advanced training courses, the light-emitting component is designed at least as a top emitter, for example as a bi- or omnidirectional light-emitting component.

[0031] In various advanced training courses, the organically light-emitting component exhibits the same characteristics as the process for manufacturing the organically light-emitting component, and vice versa.

[0032] Exemplary embodiments of the invention are shown in the figures and are explained in more detail below.

[0033] They show: Fig. 1. Schematic cross-sectional views show a flowchart of a process for manufacturing an organic, light-emitting component according to various embodiments; Fig. 2 a schematic sectional view of an exemplary embodiment of an organic, light-emitting component; and Fig. 3A-C in schematic cross-sectional views excerpts of a flowchart of a process for manufacturing an organic, light-emitting component with a laterally structured adhesive layer according to various embodiments.

[0034] The following detailed description refers to the accompanying drawings, which form part of this description and in which specific embodiments of the invention are shown for illustrative purposes. Since components of embodiments can be positioned in a number of different orientations, the directional terminology serves only for illustration and is in no way restrictive. It is understood that the features of the various embodiments described herein can be combined with one another unless specifically stated otherwise. The present invention is defined by the attached claims. In the figures, identical or similar elements are provided with identical reference numerals where appropriate.

[0035] An organic light-emitting assembly can contain one, two, or more organic light-emitting components. Optionally, an organic light-emitting assembly can also contain one, two, or more electronic components. An electronic component can, for example, be an active and / or a passive component. An active electronic component can, for example, be a computing, control, and / or regulating unit and / or a transistor. A passive electronic component can, for example, be a capacitor, a resistor, a diode, or an inductor.

[0036] An organic, light-emitting component can be an electromagnetic radiation-emitting component. In various embodiments, an electromagnetic radiation-emitting component can be an electromagnetic radiation-emitting semiconductor component and / or be configured as an electromagnetic radiation-emitting diode, an organic electromagnetic radiation-emitting diode, an electromagnetic radiation-emitting transistor, or an organic electromagnetic radiation-emitting transistor. The radiation can be, for example, visible light, ultraviolet light, and / or infrared light.In this context, the electromagnetic radiation-emitting component can be designed, for example, as a light-emitting diode (LED), an organic light-emitting diode (OLED), a light-emitting transistor, or an organic light-emitting transistor. The light-emitting component can be part of an integrated circuit in various embodiments. Furthermore, multiple light-emitting components can be provided, for example, housed in a common package.

[0037] Depending on various configurations, the light-emitting component (e.g., organic light-emitting component such as OLED) can be designed as a "bottom emitter".

[0038] The term "bottom emitter" or "bottom-emitting light-emitting device," as used herein, refers to a design that is transparent towards the substrate side of the light-emitting device. For example, at least the substrate and any layers formed between the substrate and the at least one functional layer (e.g., an electrode (base electrode) formed between the substrate and the functional layer(s)) can be transparent. A light-emitting device designed as a bottom emitter can therefore emit radiation generated in the functional layers (e.g., organic functional layers in an organic light-emitting device such as an OLED) onto the substrate side of the light-emitting device.

[0039] Alternatively or additionally, the light-emitting component can be designed as a "top emitter" according to various embodiments.

[0040] The term "top emitter" or "top-emitting light-emitting device," as used herein, refers, for example, to a design that is transparent on the side facing away from the substrate (in other words, the top side) of the light-emitting device. In particular, the layers formed on or above the at least one functional layer of the light-emitting device (e.g., the electrode (top electrode) formed between the functional layer(s) and the barrier thin film, the barrier thin film, the intermediate layer, the top layer) can be transparent. A light-emitting device designed as a top emitter can therefore, for example, emit radiation generated in the functional layers (e.g., organic functional layers in an organic light-emitting device such as an OLED) onto the top side of the light-emitting device.

[0041] A light-emitting component designed as a top emitter, according to various embodiments, can advantageously exhibit high light output and very low angular dependence of the radiation density. A light-emitting component according to various embodiments can advantageously be used for lighting applications, such as room luminaires.

[0042] A combination of bottom-emitter and top-emitter is also provided in various embodiments. In such a design, the light-emitting device is generally able to emit the light generated in the functional layers (e.g., the organic functional layers in an organic light-emitting device such as an OLED) in both directions – that is, both towards the substrate side and towards the top side (transparent or translucent OLED).

[0043] The term "translucent" or "translucent layer" can be understood to mean that the layer is permeable to light, for example, to the light generated by the organic, light-emitting component. For example, the term "translucent layer" can mean that essentially all the light coupled into the layer is also coupled out of the layer, with some of the light being scattered in the process. The term "transparent" or "transparent layer" can be understood to mean that the layer is permeable to light, whereby light coupled into the layer is also coupled out of the layer essentially without scattering or light conversion.

[0044] Fig. Figure 1 shows a flowchart of a process 100 for manufacturing an organic, light-emitting component according to various embodiments in schematic cross-sectional views.

[0045] The method 100 features the formation 110 of an electrically active area 104 on or above a substrate 102.

[0046] Furthermore, the method 100 comprises the application 120 of an adhesive layer 106 or of the electrically active area 104. The adhesive layer 106 comprises a magnetic material 108 distributed in an adhesive 112.

[0047] Furthermore, the process 100 involves applying 130 a magnetic alternating field 114 to the adhesive layer 106, such that the adhesive 112 forms at least one adhesive bond 116 - illustrated in the further process step 140 as an adhesive layer 118 with adhesive bond 116.

[0048] The magnetic material exhibits a hysteresis curve in an alternating magnetic field. The area enclosed by the hysteresis curve of the magnetic material is the energy per unit volume of the magnetic material that is released during one pass of the magnetization process from the positive saturation flux density B. S up to the negative saturation flux density -B S and the subsequent return journey from -B S to B S Energy is expended. This energy is released as heat during the magnetization process. The supplied heat, which essentially corresponds to the area of ​​the hysteresis curve, leads to an increase in the temperature of the magnetic material. The temperature change of the magnetic material is therefore approximately proportional to the amount of heat from the area of ​​the hysteresis curve.

[0049] The magnetic material and the adhesive, for example, the bonding agent of the adhesive layer, are thermally coupled to each other via a common surface. Through the alternating magnetic field and the resulting temperature increase of the magnetic material, a temperature difference is created between the magnetic material and the adhesive. This causes a heat flow from the magnetic material to the adhesive.

[0050] The heat flow leads to an increase in the temperature of the adhesive and an increase in the stored heat of the adhesive, whereby the adhesive can develop an adhesive or sticking effect depending on the specific design of the adhesive when a predetermined, adhesive-specific temperature is exceeded.

[0051] The magnetic material is, for example, a magnetically hard material, which means the area of ​​the hysteresis curve is larger than with a magnetically soft material. A magnetically hard material exhibits high remanence Br, a high saturation flux density Bs, and / or a high coercive field Hc. This results in a large hysteresis area and thus high energy per unit volume of the magnetic material, which can be converted into heat. This allows the process time and the number of cycles of the alternating magnetic field to be reduced. Furthermore, magnetically hard materials are more resistant to minor disturbances of the magnetization caused by external magnetic fields, heat, or impacts. This results in a more stable alignment of the magnetic material within the adhesive.

[0052] Applying, influencing, or exposing the magnetic alternating field to the adhesive layer can be achieved by passing the component through a constant magnetic field in process step 120. Alternatively, in process step 120, the component can be positioned in a position-invariant manner between the pole pieces of an electromagnet whose magnetic field strength and direction are changed over time.

[0053] The heat transferred to the adhesive should be limited so that the temperature of the organic functional layer structure remains below approximately 120 °C. Otherwise, the organic material of the electrically active area could be subjected to thermal stress. In other words, the heat required to form the adhesive bond, for example, to cure the adhesive, is generated only locally within the adhesive layer. This can lead to temperatures exceeding 150 °C in some areas of the adhesive layer. It is therefore crucial that the temperature within the organic functional layer structure remains below approximately 120 °C, for example, below 100 °C or below 80 °C.

[0054] Depending on the specific adhesive, an increase in temperature can cause an acceleration of the removal of any existing solvent, a chemical reaction (e.g., a cross-linking reaction), melting, and / or hardening.

[0055] In various advanced training courses, the adhesive is essentially transparent to visible light, and at least a portion of the light emittable by the light-emitting component is emittable through the adhesive layer.

[0056] The adhesive is, for example, a chemically curing adhesive, meaning an adhesive in which the bond is formed through a chemical reaction. Examples of chemically curing adhesives include polymerization adhesives, polycondensation adhesives, and polyaddition adhesives. Polymerization adhesives include cyanoacrylate adhesives, methyl methacrylate adhesives, anaerobically curing adhesives, unsaturated polyesters (UP resins), and radiation-curing adhesives. Polycondensation adhesives include phenol-formaldehyde resin adhesives, silicones, silane-curing polymer adhesives, polyimide adhesives, and polysulfide adhesives. Polyaddition adhesives include silicones, epoxy resins, and polyurethanes.

[0057] Alternatively, the adhesive is a physically setting adhesive, for example a hot melt adhesive, a solvent-based wet adhesive, a contact adhesive, a dispersion adhesive, a water-based adhesive or a plastisol.

[0058] Depending on the specific properties of the adhesive, the adhesive layer can be applied to or over the electrically active area in the form of a film, granules, block, or solution. The magnetic material can be distributed, embedded, or dissolved within the adhesive during its application to or over the electrically active area. Alternatively, the magnetic material can be distributed, embedded, or dissolved within the adhesive before and / or after its application to or over the electrically active area.

[0059] In various advanced training courses, the magnetic material is embedded as particles in the adhesive. In other words, the magnetic material is dispersed in the adhesive in particle form. The magnetic particles can be designed to scatter light.

[0060] The magnetic material can be in the form of metallic or oxide particles, such as nanoparticles. The magnetic material can, for example, contain or be composed of Au, Ag, Ti, In, TiO2, or Fe2O3.

[0061] The magnetic particles can be designed to scatter light or be non-scattering with respect to their shape and dimensions.

[0062] In various advanced training courses, magnetic particles are arranged within the adhesive layer with respect to a predetermined direction, orientation, and / or structure before the adhesive bond forms, for example, before the adhesive cures. This is achieved, for instance, by means of a homogeneous magnetic field that causes magnetic migration of the magnetic particles. Using an inductive method and a variable magnetic field density, for example, with Helmholtz coils, targeted alignment of the magnetic particles contained in the adhesive layer can be achieved before or during the application, exposure, or action of the alternating magnetic field on the adhesive layer.

[0063] In various further developments, the alternating magnetic field is applied to the adhesive layer in a predefined area, such that at least one adhesive bond is formed only in that predefined area. In other words, in some further developments, the adhesive bond is structured. According to the invention, an adhesive bond is formed in the optically inactive edge region of the organic, light-emitting component. A second region, for example, the optically active region, i.e., the light-emitting region, of the organic, light-emitting component, which is surrounded by the optically inactive region, is free of the adhesive bond.

[0064] In the first region, for example, a first type of magnetic material and / or particles can be arranged, and in the second region, a second type of magnetic material and / or particles. The first and second types can, for example, exhibit different magnetic properties, such as different hysteresis curve areas. Alternatively or additionally, the coupling area between the magnetic material and the adhesive layer can differ for the first and second types. For example, the particles in the first region might be smaller than those in the second region, while the volume fraction of the magnetic material in the adhesive layer in each region is the same or approximately the same. Alternatively or additionally, the first region can have a higher volume fraction and / or a higher distribution or number density of magnetic material than the second region.Alternatively or additionally, an inhomogeneous, alternating magnetic field can be used to form the adhesive bond. For example, the magnetic field strength can be greater in the first area than in the second area.

[0065] By structuring the adhesive layer, the light scattering, i.e., the emission characteristics of the organic, light-emitting component, can be adjusted, allowing for the display of information such as a symbol, lettering, pictogram, or similar. Furthermore, the structure of the adhesive bond can increase the hardness of the adhesive layer. By structuring the adhesive bond, an area can be created that exhibits lower hardness and thus better mechanical damping than the area without adhesive bonding.

[0066] In various advanced training courses, an adhesive bond is formed between the adhesive and the electrically active area. Alternatively, the process involves forming a barrier thin layer on the electrically active area and applying the adhesive layer to this barrier thin layer. An adhesive bond is then formed between the adhesive and the barrier thin layer.

[0067] In various further developments, the process also involves placing a cover or covering body on the adhesive layer before the adhesive forms the bond. An additional adhesive bond between the adhesive and the cover can be formed by means of an alternating magnetic field. In some further developments, the magnetic material is a ferrite, and the magnetic material is demagnetized after the adhesive bond has formed, for example, after the adhesive has cured, for instance, using an external neodymium magnet.

[0068] In various advanced processes, the adhesive layer is applied to or over the electrically active area along with the magnetic material, forming an adhesive bond. In other words, the adhesive layer thus formed constitutes the outer layer (capping layer) of the organic, light-emitting component. Alternatively, a cover layer is placed on the adhesive layer before its formation. In this case, the cover layer forms the outer layer of the organic, light-emitting component. Alternatively, a second adhesive layer is applied to the first adhesive layer after the adhesive bond has been formed—that is, to the first adhesive layer already treated with the alternating magnetic field. The second adhesive layer can be configured according to any of the described configurations.The second adhesive layer allows, for example, the cover body to be positioned on or over the first adhesive layer and bonded together using an adhesive. The second adhesive layer can be identical or different from the first. For instance, the second adhesive layer can have a different, perhaps lower, hardness than the first. Alternatively or additionally, the second adhesive layer can contain a different type of magnetic particles, such as particles of a different shape or size. This enables a particle gradient and thus facilitates the adjustment of optical properties.

[0069] Fig. Figure 2 shows a schematic sectional view of an organic, light-emitting component 100, which, for example, largely corresponds to the one in Fig. can correspond to the embodiment shown in 1.

[0070] The organic, light-emitting device has an electrically active area on the substrate and an adhesive layer on or over the electrically active area. The adhesive layer contains magnetic particles embedded in an adhesive. The magnetic particles are arranged in a predefined pattern within the adhesive.

[0071] The electrically active area has a first electrode layer which includes a first contact section 16, a second contact section 18 and the first electrode 20.

[0072] The electrode 20 is electrically isolated from the first contact section 16 by means of an electrical insulation barrier 21. The second contact section 18 is electrically coupled to the first electrode 20.

[0073] The electrode 20 can be configured as an anode or a cathode. The electrode 20 can be translucent or transparent. The electrode 20 comprises an electrically conductive material, for example, a metal and / or a transparent conductive oxide (TCO), or a stack of multiple layers comprising metals or TCOs. The electrode 20 can, for example, comprise a stack of layers combining a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers. Alternatively or additionally to the aforementioned materials, the electrode 20 can comprise: networks of metallic nanowires and particles, for example, made of Ag; networks of carbon nanotubes; graphene particles and layers; and / or networks of semiconducting nanowires.

[0074] The first electrode 20 has an organic functional layer structure 22, which is configured, for example, to emit light and is also part of the electrically active region. The organic functional layer structure 22 can, for example, have one, two, or more sublayers. For instance, the organic functional layer structure 22 can have a hole injection layer, a hole transport layer, an emitter layer, an electron transport layer, and / or an electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode 20 and the hole transport layer. In the hole transport layer, the hole conductivity is greater than the electron conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is greater than the hole conductivity.The electron transport layer serves to transport the electrons. The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. Furthermore, the organic functional layer structure 22 can comprise one, two, or more functional layer structure units, each of which has the aforementioned sublayers and / or further intermediate layers.

[0075] Above the organic functional layer structure 22, the second electrode 23 is formed, which can also be referred to as the second electrode 23 and is likewise part of the electrically active region. The second electrode 23 is electrically coupled to the first contact section 16. The second electrode 23 can be configured according to one of the embodiments of the first electrode 20, whereby the electrode 20 and the second electrode 23 can be identical or different. The electrode 20 serves, for example, as the anode or cathode of the active region. Correspondingly to the first electrode, the second electrode 23 serves as the cathode or anode of the active region.

[0076] A getter structure (not shown), which is part of the encapsulation structure 112, can be arranged on or above the active area. The getter layer can be translucent, transparent, or opaque. The getter layer can have a material, or be formed from a material, that absorbs and binds substances harmful to the active area.

[0077] An encapsulation structure is formed over the second electrode 23 and partially over the first contact section 16 and partially over the second contact section 18.

[0078] In various advanced training courses, the encapsulation structure features the adhesive layer 118, an encapsulation layer 24 and / or a cover 38.

[0079] Furthermore, the encapsulation structure can include an encapsulation layer 24, which is formed on the active area and encapsulates it. The encapsulation layer 24 can be designed as a barrier layer, for example, as a barrier thin film 24. The encapsulation layer 24 can also be referred to as thin-film encapsulation. The encapsulation layer 24 forms a barrier against chemical impurities or atmospheric substances, in particular against water (moisture) and oxygen. The encapsulation layer 24 can be designed as a single layer, a stack of layers, or a layered structure.The encapsulation layer 24 can comprise or be formed from: aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide, silicon oxide, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, poly(p-phenylene terephthalamide), nylon 66, as well as mixtures and alloys thereof. Optionally, a further barrier layer can be formed on the substrate 102, i.e., between the substrate 102 and the active area, corresponding to a configuration of the encapsulation layer 24.

[0080] In the encapsulation layer 24, a first recess is formed above the first contact section 16, and a second recess is formed above the second contact section 18. A first contact area 32 is exposed in the first recess, and a second contact area 34 is exposed in the second recess. The first contact area 32 serves to electrically contact the first contact section 16, and the second contact area 34 serves to electrically contact the second contact section 18.

[0081] The adhesive layer 118, which forms part of the encapsulation structure, is formed on the encapsulation layer 24 or, alternatively, on the electrically active area. The adhesive layer 118 comprises, for example, an adhesive, such as a laminating adhesive, a lacquer, and / or a resin, as described above. The magnetic particles of the adhesive layer 118 can be configured to scatter electromagnetic radiation, for example, as magnetic, light-scattering particles.

[0082] In various embodiments, a cover body 38 is formed above the adhesive layer 118 and is also part of the encapsulation structure. The cover body 38 can also be referred to as a cover 38. The adhesive layer 118 serves to attach the cover body 38 to the encapsulation layer 24 or the electrically active area. The cover body 38 may be made of, for example, plastic, glass, and / or metal. For example, the cover body 38 may be made primarily of glass and have a thin metal layer, such as a metal foil, and / or a graphite layer, such as a graphite laminate, on the glass body. The cover body 38 serves to protect the conventional light-emitting component 1, for example, from external mechanical forces. Furthermore, the cover body 38 may serve to distribute and / or dissipate heat generated in the conventional light-emitting component 1.For example, the glass of the cover body 38 can serve as protection against external influences and the metal layer of the cover body 38 can serve to distribute and / or dissipate the heat generated during the operation of the conventional light-emitting component 1.

[0083] In various advanced training programs, the cover body 38 is essentially transparent, for example in the case of an organic, light-emitting component that is configured as at least a top emitter. The organic, light-emitting component can, for example, be configured as a bi- or omnidirectional light-emitting component.

[0084] Alternatively, the cover body can be designed to be reflective or specular, for example for an organic, light-emitting component in a bottom-emitter configuration. In this case, light-scattering, magnetic particles could change the angle of incidence on the cover body 38.

[0085] In various advanced training courses, the adhesive layer has at least one adhesive bond in a specified first area and a second area arranged next to the first area, which is free of this adhesive bond.

[0086] In various advanced training courses, the magnetic particles are designed and arranged in the adhesive layer in such a way that information can be represented using the magnetic particles.

[0087] In various training courses, the light-emitting component is at least a top emitter.

[0088] Fig. Figures 3A to 3C show schematic cross-sectional views of excerpts from a flowchart of a process for manufacturing an organic, light-emitting component with a laterally structured adhesive layer according to various embodiments. Fig. 3A, Fig. 3B and Fig. 3C illustrate further developments of the process and the organic, light-emitting component, as already described above.

[0089] In Fig. 3A, Fig. 3B and Fig. Section 3C illustrates the examples described above in more detail, in which the adhesive layer 106 is laterally structured, i.e., a lateral structuring is formed in the adhesive layer 106. The examples shown in Fig. The training courses illustrated in sections 3A-3C are shown in isolation from each other, but can also be combined.

[0090] As described above, the adhesive layer 106 can be designed and / or the alternating magnetic field 114 can be arranged such that the adhesive layer 106 has a lateral structuring after the adhesive bond has formed.

[0091] At the in Fig. 3A illustrated further training 300 of the application 130 of a magnetic alternating field 114 (see Fig. 1) a laterally inhomogeneous alternating magnetic field 114, 302 is used (in Fig. 3A illustrates this by means of the different line thicknesses of the arrows). Furthermore, the organic, light-emitting component is illustrated after the formation of at least one adhesive bond (analogous to process step 140 in ). Fig. 1) The alternating magnetic field can be inhomogeneous in time and / or space.

[0092] In a first region, a first alternating magnetic field 114 is applied (locally), which, for example, causes an adhesive bond 116 to form between the adhesive layer 106 and the electrically active region 104 and / or the substrate 102. The first region is, for example, an edge region of the organic, light-emitting component, an optically active region, or an optically inactive region.

[0093] In a second area, a second alternating magnetic field 302 or essentially no alternating magnetic field is applied (locally), so that this area is free of adhesive compound 116. The second area is arranged next to the first area.

[0094] The second area, for example, has a contact area 32, 34 of the organic, light-emitting component for external contact and / or at least a part of the light-emitting area of ​​the organic, light-emitting component.

[0095] In the event that the adhesive layer does not cure over the contact area 32, 34, the adhesive layer 106 can be more easily removed from the contact area 32, 34 and the contact area 32, 34 can thus be more easily exposed.

[0096] In the case of an uncured adhesive layer 106 above the optically active area, the uncured adhesive layer 106 acts as mechanical damping for the active area 104, for example with regard to a shock, an impact or an indentation.

[0097] Optionally, a cover 38 can be provided on or over the adhesive layer 106 (see Fig. 2) The cover 38 can be fixed to or over the substrate 102 in the first area by means of the cured adhesive layer 106, for example by means of a first adhesive bond 116 and a second adhesive bond 304.

[0098] The further, second adhesive bond 304 can be formed before, after or during the first adhesive bond 116.

[0099] The cover 38 can cover the adhesive layer 106 in the light-emitting area of ​​the organic, light-emitting component and protect it from direct contact. The adhesive layer 106 can optionally be uncured in the light-emitting area.

[0100] The cover 38 can essentially lie flat on the adhesive layer 106 (see Fig. 2) or have a cavity 324 adjacent to the adhesive layer 106 (in Fig. 3A shown).

[0101] An encapsulation with a cover 38 with cavity 324 is also referred to as cavity glass encapsulation. The cavity 324 is filled, for example, with a gas or getter material. In the light-emitting region of the organic, light-emitting device, the adhesive layer 106 in a cavity glass encapsulation can, for example, be free of any bonding effect, i.e., it does not form a material-bonded connection between the electrically active region 104 and the cover 38. Thus, the adhesive layer 106 in the region of the cavity 324 borders, for example, air.

[0102] At the in Fig. 3B illustrated further training 320 of the application 130 of a magnetic alternating field 114 (see Fig. 1) Before applying the alternating magnetic field, the magnetic material is first laterally structured such that at least one region of higher magnetizability 306 and at least one region of lower magnetizability 308 are formed. The region of higher magnetizability 306, for example, has a higher number density of particles made of magnetizable material 108 than the region of lower magnetizability 308. The region of lower magnetizability 308 is, for example, free of magnetizable material 108.

[0103] Furthermore, the organic, light-emitting component is illustrated after the formation of at least one adhesive bond (analogous to process step 140 in Figure 330). Fig. 1).

[0104] By means of the laterally inhomogeneous distribution of the magnetizable material 108 in the adhesive layer 106, a light-scattering region 314 can be formed next to a non-scattering region 312 in the light-emitting area. This allows, for example, information to be displayed or a predefined emission characteristic to be realized, as already described in more detail above.

[0105] Alternatively or additionally, an adhesive bond can be formed in an area 316 at the edge or next to the electrically active area. This area can be used, for example, to fix a cover 38 to the adhesive layer 106 (see Fig. 2 and Fig. 3A).

[0106] At the in Fig. 3C illustrated further training 320 of the application 130 of an alternating magnetic field 114 (see Fig. 1) A first type of magnetizable material 108 and a second type of magnetizable material 318 are used, wherein the second magnetizable material has a smaller hysteresis area, i.e. less inductive heating, than the first magnetizable material 108.

[0107] Alternatively or additionally, the adhesive layer contains a first type of magnetizable particle 108 and a second type of magnetizable particle 318. The particles 318 of the second type, for example, have a larger mean diameter than the particles of the first type 118. As a result, the particles of the first type 118 have a larger surface area to volume ratio than the particles of the second type 318. Consequently, the particles 118 of the first type, for example, with the same material as the particles of the second type 318, exhibit a greater heat flux than the particles of the second type 318. Thus, in a high-frequency alternating magnetic field, the region of the adhesive layer 106 containing particles 108 of the first type can reach the temperature required to form the adhesive bond 116 and form it, while the region of the adhesive layer 106 containing particles of the second type 318 remains below this temperature.Alternatively, an adhesive bond is also formed in the area of ​​the adhesive layer with the particles 318 of the second type 318 (not illustrated).

[0108] Furthermore, the organic, light-emitting component is illustrated after the formation of at least one adhesive bond 116 (analogous to process step 140 in Figure 350). Fig. 1) By means of the different types of magnetizable particles 108, 318 with different mean diameters, for example a first light-scattering region 314 and a second light-scattering region 322 can be realized, wherein these regions have different degrees of light scattering.

[0109] Alternatively or additionally, the area of ​​the adhesive layer 106 with adhesive bond 116 can have different optical properties than the adjacent area of ​​the adhesive without adhesive bond 116, for example, a different refractive index, a different optical absorption, or a different optical anisotropy. This allows, for example, information to be displayed or a predetermined emission characteristic to be achieved even with non-light-scattering, magnetizable material 108. Example 1 describes a method for manufacturing an organic, light-emitting device. The method involves forming an electrically active region and applying an adhesive layer to or over the electrically active region. The adhesive layer contains a magnetic material dispersed within the adhesive. The method further involves applying an alternating magnetic field to the adhesive layer, causing the adhesive to form at least one adhesive bond. Example 2 is a method according to Example 1, wherein the magnetic material and the adhesive are thermally coupled. Example 3 is a method according to Example 1 or 2, wherein the adhesive is substantially transparent to visible light and at least some of the light emittable by the light-emitting component is emittable through the adhesive layer. Example 4 is a method according to one of Examples 1 to 3, wherein the magnetic material is embedded as particles in the adhesive. Example 5 is a method according to Example 4, wherein the magnetic particles are designed to scatter light. Example 6 is a method according to one of Examples 4 or 5, wherein the magnetic particles are arranged in the adhesive with respect to a predetermined direction and / or structure before the formation of the adhesive bond in the adhesive. Example 7 is a method according to one of Examples 1 to 6, wherein an adhesive bond is formed between the adhesive and the electrically active area. Example 8 is a method according to any one of Examples 1 to 6, further comprising: forming a barrier thin film on the electrically active area, and applying the adhesive layer to the barrier thin film, wherein an adhesive bond is formed between the adhesive and the barrier thin film. Example 9 is a method according to any one of Examples 1 to 8, further comprising: placing a cover on the adhesive layer before the adhesive forms the adhesive bond, wherein a further adhesive bond is formed between the adhesive and the cover by means of the alternating magnetic field. Example 10 is a method according to one of Examples 1 to 9, wherein the alternating magnetic field is applied to the adhesive layer in a specified area, such that at least one adhesive bond is formed only in the specified area. Example 11 is a method according to one of Examples 1 to 10, wherein the magnetic material is a ferrite and the magnetic material is demagnetized after the formation of the adhesive bond. Example 12 is an organic, light-emitting device comprising: an electrically active region, and an adhesive layer on or above the electrically active region, wherein the adhesive layer comprises magnetic particles embedded in an adhesive, the magnetic particles being arranged in a predetermined arrangement in the adhesive. Example 13 is an organic, light-emitting component according to Example 12, wherein the adhesive layer has at least one adhesive bond in a specified first region and a second region arranged next to the first region is free of this adhesive bond. Example 14 is an organic, light-emitting device according to one of Examples 12 or 13, wherein the magnetic particles are configured and arranged in the adhesive layer such that information can be represented by means of the magnetic particles. Example 15 is an organic, light-emitting device according to one of Examples 12 to 14, wherein the light-emitting device is configured at least as a top emitter. Example 16 is a method for producing an organic, light-emitting device, comprising: forming an electrically active region; applying an adhesive layer to or over the electrically active region, wherein the adhesive layer comprises a magnetic material dispersed in an adhesive, the magnetic material being embedded as particles in the adhesive; and applying an alternating magnetic field to the adhesive layer such that the adhesive forms at least one adhesive bond, wherein an adhesive bond is formed between the adhesive and the electrically active region, wherein the adhesive layer is formed and / or the alternating magnetic field is configured such that the adhesive layer has a lateral structuring after the formation of the adhesive bond. Example 17 is a method according to Example 16, further comprising: arranging a cover on the adhesive layer before the adhesive forms the adhesive bond, wherein a further adhesive bond is formed between the adhesive and the cover by means of the alternating magnetic field. Example 18 is a method according to one of Examples 16 or 17, wherein the electrically active region is formed with an optically inactive region and an optically active region arranged next to the optically inactive region, wherein the adhesive layer has at least one adhesive compound in the optically inactive region and the optically active region is free of this adhesive compound. Example 19 is a method for manufacturing an organic, light-emitting device, comprising: forming an electrically active region, wherein the electrically active region is formed with an optically inactive region and an optically active region arranged next to the optically inactive region; applying an adhesive layer to or over the electrically active region, wherein the adhesive layer comprises a magnetic material dispersed in an adhesive, the magnetic material being embedded as particles in the adhesive;and arranging a cover on the adhesive layer, applying an alternating magnetic field to the adhesive layer such that the adhesive forms at least one adhesive bond, wherein the adhesive layer is designed and / or the alternating magnetic field is configured such that the adhesive layer has a lateral structuring after the formation of the adhesive bond, wherein at least in the optically inactive area an adhesive bond is formed between the adhesive and the cover and at least a part of the optically active area is free of adhesive bond. Example 20 is a method according to one of Examples 16 to 19, wherein the magnetic particles are arranged in the adhesive with respect to a predetermined direction and / or structure prior to the formation of the adhesive bond in the adhesive. Example 21 is a method according to one of Examples 16 to 20, wherein the magnetic particles are designed and arranged in the adhesive layer in such a way that information can be represented by means of the magnetic particles. Example 22 is a method according to Example 21, wherein the information can be represented, or is represented, by means of laterally differing emission characteristics of the organic, light-emitting component. Example 23 is a method according to Example 21 or 22, wherein the information is a symbol, a word mark, or a pictogram. Example 24 is a method according to one of Examples 16 to 23, wherein the alternating magnetic field is applied to the adhesive layer in a first region, such that at least one adhesive bond is formed only in the first region and a second region arranged next to the first region is free of this adhesive bond. Example 25 is a method according to Example 24, wherein the alternating magnetic field is inhomogeneous such that the magnetic field strength in the first region is greater than in the second region. Example 26 is a method according to Example 24 or 25, wherein the adhesive layer has a first type of magnetic particles in the first region and a second type of magnetic particles in the second region, wherein the first type of magnetic particles has a different magnetic property than the second type of magnetic particles; and / or wherein the first type of magnetic particles has a different coupling surface with the adhesive than the second type of magnetic particles. Example 27 is a method according to one of Examples 9 to 11, wherein the first area has a higher volume fraction and / or a higher number density of magnetic particles than the second area. Example 28 is a method according to one of Examples 1 to 12, wherein the optically active region is surrounded by the optically inactive region. Example 29 is a method according to any one of Examples 1 to 13, the method further comprising: forming a barrier thin layer on the electrically active area, and applying the adhesive layer to the barrier thin layer, wherein the adhesive bond is formed between the adhesive and the barrier thin layer. Example 30 is a method according to one of Examples 16 to 29, wherein the magnetic material is a ferrite and the magnetic material is demagnetized after the formation of the adhesive bond. Example 31 is an organic, light-emitting device comprising: an electrically active region, and an adhesive layer on or above the electrically active region, wherein the adhesive layer comprises magnetic particles embedded in an adhesive, wherein the magnetic particles are arranged in a predetermined arrangement in the adhesive, wherein the adhesive layer comprises at least one adhesive compound in a predetermined first region and a second region arranged adjacent to the first region is free of this adhesive compound. Example 32 is an organic, light-emitting component comprising: an electrically active region with an optically inactive region and an optically active region arranged next to the optically inactive region; an adhesive layer on or over the electrically active region, wherein the adhesive layer comprises magnetic particles embedded in an adhesive, wherein the magnetic particles are arranged in a predetermined arrangement in the adhesive; a cover on the adhesive layer, wherein at least one adhesive bond exists, wherein the adhesive layer has an adhesive bond between the adhesive and the cover at least in the optically inactive region, and at least a portion of the optically active region is free of adhesive bond. Example 33 is an organic, light-emitting component according to Example 16 or 17, wherein the magnetic particles are designed and arranged in the adhesive layer in such a way that information can be represented by means of the magnetic particles. Example 34 is an organic, light-emitting device according to one of Examples 16 to 18, wherein the light-emitting device is configured at least as a top emitter. REFERENCE MARK LIST 100, 110, 120, 130, 140, 310, 320, 330, 340, 350 Procedures / Procedure Steps 102 Substrat 104 electrically active area 106 Adhesive layer 108, 318 magnetic material / particles 112 adhesives 114, 302 magnetic alternating field 116, 304 Adhesive bond 118 Adhesive layer with adhesive bond 1 organic, light-emitting component 16 first contact section 18 second contact section 20 first electrode 21 electrical insulation barrier 22 organically functional layered structure 23 second electrode 24 Barrier thin film 32 first contact area 34 second contact area 38 Cover bodies 324 Cavity 312, 314, 316, 322 lateral structuring

Claims

[1] Method (100) for producing an organic, light-emitting component (1) comprising the method (100): • Forming (110) an electrically active area (104); • Applying (120) an adhesive layer (106) to or over the electrically active area (104), wherein the adhesive layer (106) comprises a magnetic material (108) distributed in an adhesive (112), the magnetic material (108) being embedded as particles in the adhesive (112); and • Applying (130) an alternating magnetic field (114) to the adhesive layer (106) such that the adhesive (112) forms at least one adhesive bond (116), wherein an adhesive bond (116) is formed between the adhesive (112) and the electrically active area (104), • wherein the adhesive layer (106) is designed and / or the alternating magnetic field (114) is configured such that the adhesive layer (106) has a lateral structuring after the formation of the adhesive bond, wherein • the electrically active region is formed with an optically inactive region and an optically active region arranged next to the optically inactive region, wherein the adhesive layer (118) has at least one adhesive compound (116) in the optically inactive region and the optically active region is free of this adhesive compound (116), and • the optically inactive area is a peripheral area and the optically active area is a central area that is laterally surrounded by the optically inactive peripheral area. [2] Method (100) according to claim 1, further comprising: • an arrangement of a cover (38) on the adhesive layer (106) before the adhesive (112) forms the adhesive bond (116), • wherein a further adhesive bond is formed between the adhesive (112) and the cover (38) by means of the alternating magnetic field (114). [3] Method (100) for producing an organic, light-emitting component (1) comprising the method (100): • Forming (110) an electrically active area (104), wherein the electrically active area is formed with an optically inactive area and an optically active area arranged next to the optically inactive area; • Applying (120) an adhesive layer (106) to or over the electrically active area (104), wherein the adhesive layer (106) comprises a magnetic material (108) distributed in an adhesive (112), the magnetic material (108) being embedded as particles in the adhesive (112); and • Arranging a cover (38) on the adhesive layer (106), • Applying (130) an alternating magnetic field (114) to the adhesive layer (106) such that the adhesive (112) forms at least one adhesive bond (116), wherein the adhesive layer (106) is designed and / or the alternating magnetic field (114) is configured such that the adhesive layer (118) has a lateral structuring after the formation of the adhesive bond, wherein at least in the optically inactive region an adhesive bond (116) is formed between the adhesive (112) and the cover (38) and at least a part of the optically active region is free of adhesive bond (116), wherein the optically inactive region is a peripheral region and the optically active region is a central region that is laterally surrounded by the optically inactive peripheral region. [4] Method (100) according to any one of claims 1 to 3, wherein the magnetic particles (108) are arranged in the adhesive agent (112) with respect to a predetermined direction and / or structure prior to the formation of the adhesive bond. [5] Method (100) according to one of claims 1 to 4, wherein the magnetic particles (108) are designed and arranged in the adhesive layer (118) such that information can be represented by means of the magnetic particles (108). [6] Method (100) according to claim 5, wherein the information can be represented by means of laterally different emission characteristics of the organic, light-emitting component. [7] Method (100) according to claim 5 or 6, wherein the information is a symbol, a lettering or a pictogram. [8] Method (100) according to any one of claims 1 to 7, wherein the alternating magnetic field (114) is applied to the adhesive layer (106) in a first region, such that at least one adhesive bond is formed only in the first region and a second region arranged next to the first region is free of this adhesive bond (116). [9] Method (100) according to claim 8, wherein the alternating magnetic field (114) is inhomogeneous such that the magnetic field strength in the first region is greater than in the second region. [10] Method (100) according to claim 8 or 9, wherein the adhesive layer has a first type of magnetic particles in the first region and a second type of magnetic particles in the second region, • wherein the first type of magnetic particle has a different magnetic property than the second type of magnetic particle; and / or • wherein the first type of magnetic particles has a different coupling surface with the adhesive than the second type of magnetic particles. [11] Method (100) according to any one of claims 8 to 10, wherein the first region has a higher volume fraction and / or a higher number density of magnetic particles than the second region. [12] Method (100) according to any one of claims 1 to 11, wherein the optically active region is surrounded by the optically inactive region. [13] Method (100) according to any one of claims 1 to 12, further comprising: • Formation of a barrier thin film (24) on the electrically active area (104), and • Applying (120) the adhesive layer (106) to the barrier thin layer (24), forming the adhesive bond between the adhesive (112) and the barrier thin layer (24). [14] Method (100) according to any one of claims 1 to 13, wherein the magnetic material is a ferrite and the magnetic material is demagnetized after the formation of the adhesive bond. [15] Organic light-emitting component (1) comprising: • an electrically active area (104), and • an adhesive layer (118) on or over the electrically active area (104), • wherein the adhesive layer (118) comprises magnetic particles (108) embedded in an adhesive (112), • wherein the magnetic particles (108) are arranged in a predetermined arrangement in the adhesive (112), • wherein the adhesive layer (118) has at least one adhesive compound (116) in a specified first region and a second region arranged next to the first region is free of this adhesive compound (116), • where the first area is an optically inactive edge area and the second area is an optically active central area, which is laterally surrounded by the optically inactive edge area. [16] Organic light-emitting component (1) comprising: • an electrically active area (104) with an optically inactive area and an optically active area arranged next to the optically inactive area, • an adhesive layer (118) on or over the electrically active area (104), • wherein the adhesive layer (118) comprises magnetic particles (108) embedded in an adhesive (112), • wherein the magnetic particles (108) are arranged in a predetermined arrangement in the adhesive (112), • a cover (38) on the adhesive layer (118) with at least one adhesive connection (116), wherein the adhesive layer (118) has at least in the optically inactive area an adhesive connection (116) between the adhesive (112) and the cover (38) and at least a part of the optically active area is free of adhesive connection, wherein the optically inactive area is an edge area and the optically inactive area surrounds the optically active area laterally. [17] Organic light-emitting component (1) according to claim 15 or 16, wherein the magnetic particles (108) are designed and arranged in the adhesive layer (118) such that information can be represented by means of the magnetic particles (108). [18] Organic light-emitting component (1) according to any one of claims 15 to 17, wherein the light-emitting component (1) is configured at least as a top emitter.

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