Arrangement comprising a power semiconductor module and a motor and method for manufacturing this arrangement

The power semiconductor module design with a rigid metallic connection element and elastic retaining device addresses mounting challenges, providing durable and sealed electrical contact on electric motors.

DE102019111145B4Active Publication Date: 2026-05-28SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG
Filing Date
2019-04-30
Publication Date
2026-05-28

AI Technical Summary

Technical Problem

Existing power semiconductor modules face challenges in easy and reliable mounting on electric motors, particularly due to issues with durability at high ambient temperatures and environmental sealing.

Method used

A power semiconductor module design featuring a rigid metallic connection element with an outer contact surface, movably connected via an insulating and elastic retaining device, and a spring element that forms a conductive pressure contact with a motor contact device, allowing easy assembly and environmental sealing.

Benefits of technology

Facilitates easy and durable mounting of power semiconductor modules on electric motors, ensuring reliable electrical contact and effective environmental sealing against dust and moisture.

✦ Generated by Eureka AI based on patent content.

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Abstract

An arrangement comprising a motor (9) with a motor contact device (94) and a power semiconductor module (1) with a power semiconductor arrangement (2), a housing (7) having a recess (704, 724) in a housing side (700, 720) with an outer surface (702, 722) having a through-direction in the normal direction (N) of this outer surface (702, 722), an internal contact device (3) having an electrically conductive contact within the housing (7) to an external connection element (4), in particular designed as a load connection element, arranged with a section in the recess (704, 724), and a spring element (6), wherein the connection element (4) is designed as a rigid metallic shaped body with an inner and an outer contact surface (40, 42), wherein the outer contact surface (42) is accessible from the outside.wherein the connecting element (4) is movably connected to the housing (7) in the through-direction (704, 724) via an electrically insulating and mechanically elastic retaining device (5), and wherein the spring element (6) is arranged and designed such that its spring action acts directly or indirectly on the connecting element (4) in the through-direction, and wherein the connecting element (4) has a first connecting element position relative to the through-direction in which the outer contact surface (42) has a first contact surface position (P1) relative to the outer surface (702, 722), and wherein the connecting element (4) is displaceable in the negative through-direction against a spring force of the spring element, and wherein the power semiconductor module (1) is fixed with its outer surface (702, 722) on a power module surface (92) by means of a fastening device (76, 96).wherein an electrically conductive pressure contact is formed between the outer contact surface (42) and the associated motor contact device (94).
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Citation Information

Patent Citations

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    DE102006006425A1

  • Power semiconductor module and power semiconductor device with a power semiconductor module

    DE102018111594A1

  • semiconductor assembly

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