Machining device and clamping table

Abstract

Machining device (1) comprising: a clamping table (14) with a holding surface (16) designed to hold a workpiece (11) and a frame body (17) surrounding the holding surface (16); a machining unit (18) designed to machine the workpiece (11) held on the clamping table (14); a motion unit designed to move the clamping table (14) and the processing unit (18) relative to each other in an X-axis direction parallel to the holding surface (16) and a Y-axis direction orthogonal to the X-axis direction; a height measuring unit (44-1) fitted to the processing unit (18), wherein the height measuring unit (44-1) measures heights (Z) as height data at several coordinates (X, Y) of the measured holding surface (16) while the motion unit is moved; a reading unit capable of reading an information medium; and a control unit (100), wherein the clamping table (14) has an information medium in which identification information distinguishing the clamping table (14) is included, the reading unit reads the information medium of the clamping table (14) installed in the processing device (1) and the control unit (100) has: an elevation data acquisition section designed to capture elevation data and identification information in a coordinated manner, and a processing control section (120) which is designed to control the height of the processing unit (18) during processing on the basis of the height data associated with the identification information read by the reading unit.

Description

TECHNICAL BACKGROUND Technical field

[0001] The present invention relates to a machining device and a clamping table. Description of the related technique

[0002] A machining device is known that cuts a workpiece, such as a semiconductor wafer, using a cutting blade mounted on a spindle, thereby forming a groove of a desired depth in the workpiece or splitting the workpiece. A technology has been developed that controls the cutting depth of the cutting blade relative to the workpiece, for example, when the groove of the desired depth is formed in the workpiece with high depth accuracy.

[0003] When the cutting depth of the cutting blade is controlled relative to the workpiece, the distance between a cutting edge of the cutting blade and a holding surface of a clamping table must be precisely controlled. Essentially, a point where the edge (bottom end) of the cutting blade and the holding surface of the clamping table are in contact is registered (set) as what is called the origin position, and the cutting depth is controlled by adjusting the distance (height) from this point.

[0004] However, the clamping surface of the worktable could exhibit variations in height on the order of a few micrometers and an inclination. Therefore, applying a single origin position to the entire worktable surface could introduce an error in the cutting depth accuracy. Additionally, there is a limit to the linearity of a Y-axis motion unit, which moves the spindle in the indexing direction (Y-axis direction), and an X-axis motion unit, which moves the worktable in a machining direction (X-axis direction). Therefore, if very high accuracy in controlling the cutting depth is desired, it is necessary to register origin positions across the entire surface of the worktable and correct the movement on each of the X, Y, and Z axes according to these origin positions.

[0005] In view of such a point, a technology has been proposed which measures the height of the clamping table's holding surface at several coordinates and stores a relationship between the respective coordinates and heights (see, for example, Japanese patent application JP 2018-27601A).

[0006] JP 2018 027 601 A relates to a clamping table for holding a plate-shaped workpiece against a holding surface. US 2003 / 0077993 A1 relates to a holding device for a flat object for holding an arrangement of a flat object and a frame. PRESENTATION OF THE INVENTION

[0007] In a mass production chip manufacturing environment, the clamping table in the machining device could be exchanged to process wafers of varying diameters or for periodic inspection. It is desirable that the machining device described above improves the accuracy of the cutting depth of the cutting blade relative to the workpiece and prevents a decrease in workpiece machining quality, even when the clamping table is replaced.

[0008] Accordingly, an objective of the present invention is to provide a machining device and a clamping table which can inhibit a decrease in the machining quality of a workpiece that accompanies a clamping table replacement.

[0009] According to one aspect of the present invention, a machining device is provided comprising: a clamping table with a holding surface configured to hold a workpiece and a frame body surrounding the holding surface, a machining unit configured to machine the workpiece held on the clamping table, a motion unit configured to move the clamping table and the machining unit relative to each other in an X-axis direction parallel to the holding surface and a Y-axis direction orthogonal to the X-axis direction, a height measuring unit fitted to the machining unit, wherein the height measuring unit measures heights (Z) at several coordinates (X, Y) of the measured holding surface as height data while the motion unit is moved, a reading unit capable of reading an information medium, and a control unit.The clamping table has an information medium that contains identification information specific to the clamping table. The reading unit reads the information medium of the clamping table installed in the machining device. The control unit has an elevation data acquisition section designed to record the elevation data and the identification information in a corresponding manner, and a machining control section designed to control the height of the machining unit during machining based on the elevation data associated with the identification information read by the reading unit.

[0010] According to a further aspect of the present invention, a machining device is provided comprising: a clamping table with a holding surface configured to hold a workpiece and a frame body surrounding the holding surface, a machining unit configured to machine the workpiece held on the clamping table, a motion unit configured to move the clamping table and the machining unit relative to each other in an X-axis direction parallel to the holding surface and a Y-axis direction orthogonal to the X-axis direction, a height measuring unit fitted to the machining unit, wherein the height measuring unit measures heights (Z) at several coordinates (X, Y) of the measured holding surface as height data while the motion unit is moved, a reading unit capable of reading an information medium, and a control unit.The clamping table has an information medium on which the height data of the clamping table are recorded, and the control unit has a processing control section designed to control the height of the processing unit during processing based on the height data read by the reading unit.

[0011] Preferably, the information medium is formed by a two-dimensional code or a radio frequency (RF) tag of a radio frequency identification (RFID), whereby information can be written and read via wireless communication.

[0012] According to another aspect of the present provision, a clamping table is provided, comprising: a holding surface, a frame body surrounding the holding surface and an information medium designed to record height data obtained by measuring heights at several coordinates of the holding surface in a state in which the clamping table is installed in a machining device.

[0013] Preferably, the information medium is formed by a two-dimensional code or a radio frequency (RF) tag of a radio frequency identification (RFID), whereby information can be written and read by wireless communication.

[0014] The present invention produces such an effect that it is able to inhibit a decrease in the machining quality of a workpiece that could accompany a change in the clamping table.

[0015] The above and further aims, features and advantages of the present invention and the way in which they are realized will become more apparent, and the invention itself will best be understood by studying the following description and the attached claims with reference to the attached drawings, which show some preferred embodiments of the invention. SHORT FIGURE DESCRIPTION Fig. Figure 1 is a perspective view showing an external configuration of a machining device according to a first embodiment; Fig. 2 is a perspective view showing an external configuration of a workpiece according to the first embodiment; Fig. Figure 3 is a perspective view that schematically illustrates an example of a design of a clamping table according to the first embodiment; Fig. Figure 4 is a side view showing a positional relationship between the clamping table according to the first embodiment and a height measuring unit; Fig. Figure 5 is a diagram that provides an example of defining measurement lines according to the first embodiment; Fig. Figure 6 is a diagram that illustrates an example of defining measurement points according to the first embodiment; Fig. Figure 7 is a diagram that represents an outline of elevation data according to the first embodiment; Fig. 8 is a top view that schematically represents a machining control according to the first embodiment; Fig. Figure 9 is a flowchart that illustrates an example of a machining process of the machining device according to the first embodiment; Fig. Figure 10 is a perspective view that schematically represents an example of a design of a clamping table according to a modification; Fig. Figure 11 is a perspective view showing an external configuration of a machining device according to a second embodiment; Fig. Figure 12 is a perspective view that schematically illustrates an example of an embodiment of a clamping table according to the second embodiment; and Fig. Figure 13 is a flowchart that illustrates an example of a machining process of the machining device according to the second embodiment. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS

[0016] Embodiments of the present invention are described in detail below with reference to the drawings. The present invention is not limited to the components described in the following embodiments. In addition, the components described below may include those that can be easily devised by a person skilled in the art and those that are essentially the same. Furthermore, the embodiments described below can be combined with one another as required. Various omissions, substitutions, or modifications can also be made without departing from the basic concept of the present invention.

[0017] In addition, in embodiments of the present invention, components with essentially identical functional configurations could be described by an identical reference numeral assigned to them, provided that such differentiation is not particularly necessary. Furthermore, several components with essentially identical functional configurations could be distinguished from one another by assigning different numbers, letters, or the like, which follow an identical reference numeral.

[0018] In the embodiments described below, an orthogonal XYZ coordinate system is defined, and the positional relationship of each part is described with reference to this orthogonal XYZ coordinate system. A direction in a horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to both the X-axis and Y-axis directions is defined as a Z-axis direction. An XY plane containing an X-axis and a Y-axis is parallel to the horizontal plane. The Z-axis direction orthogonal to the XY plane is a vertical direction. [First embodiment]

[0019] Fig. Figure 1 is a perspective view showing an external configuration of a machining device according to a first embodiment. Fig. Figure 2 is a perspective view depicting an external configuration of a workpiece according to the first embodiment. A view in Fig. The machining device 1 shown is a device that holds a workpiece 11 by means of a clamping table 14 and cuts the workpiece 11 by means of a cutting blade 42.

[0020] The in Fig. The workpiece 11 shown in Figure 2 is a disk-shaped wafer, such as a semiconductor wafer or an optical component wafer, which has silicon, sapphire, gallium, or the like as a base material. An upper surface 11a of the workpiece 11 is provided with a functional layer consisting of a metallic layer serving as a conductor, an insulating layer providing insulation between conductor sections, and the like.

[0021] Additionally, the upper surface 11a of the workpiece 11 is subdivided into several areas by grid-like planned division lines 13. A component 15, such as an integrated circuit (IC) or a large-scale integration (LSI) circuit, is formed in each area. Furthermore, a notch 11c, which serves as a marker when determining the orientation of the workpiece 11 (crystal orientation), is provided on an outer edge section of the workpiece 11. However, an alignment flat may be provided instead of the notch 11c. Additionally, the notch 11c need not be provided if the orientation of the workpiece 11 is determined based on a pattern of components 15 or the like.

[0022] The material, shape, structure, and the like of the workpiece 11 need not be particularly restricted. A substrate made of a material such as a ceramic, a metal, or a plastic can also be used as the workpiece 11. The type, quantity, arrangement, and the like of the components 15 need not be particularly restricted.

[0023] As in Fig. As shown in Figure 2, a protective element 21 is attached to a lower surface 11b of the workpiece 11. The protective element 21 is formed by a circular layer (band) with a diameter corresponding to that of the workpiece 11. An upper surface 21a of the protective element 21 is provided with an adhesive layer. The protective element 21 is attached to the workpiece 11 by the adhesive-coated side of the upper surface 21a of the protective element 21 being brought into contact with the lower surface 11b of the workpiece 11. Alternatively, the protective element 21 could be formed solely from a base material layer of a synthetic plastic and attached to the workpiece 11 by thermocompression bonding. Additionally, the workpiece 11 could be attached to an opening of an annular frame via the protective element 21.

[0024] The machining device 1 has a base 4 that supports each structure. A cassette support device 6, which is raised and lowered, is provided within a rectangular opening 4a formed in a front corner section of the base 4. The cassette support device 6 has a mounting surface to which a cassette 8 can be attached, which is capable of accommodating several workpieces 11.

[0025] An X-axis motion table 10 moved in the X-axis direction by an X-axis motion unit (not shown) and a dustproof cover 12 are provided within an elongated rectangular opening 4b formed on one side of the cassette support device 6 in a machining feed direction (X-axis direction).

[0026] The X-axis motion unit has a pair of X-axis guide rails (not shown) parallel to the X-axis direction. The X-axis motion table 10 is slidably mounted on the X-axis guide rails. A nut section (not shown) is provided on the lower surface of the X-axis motion table 10. An X-axis ball screw (not shown), parallel to the X-axis guide rails, is screwed into this nut section. An X-axis motor (not shown) is coupled to an end section of the X-axis ball screw. The X-axis motion table 10 is moved along the X-axis guide rails by the X-axis motor rotating the X-axis ball screw. The clamping table 14 for holding the workpiece 11 is located on the X-axis motion table 10.

[0027] Fig. Figure 3 is a diagram that schematically illustrates an example of an embodiment of the clamping table according to the first embodiment. As in Fig. As shown in Figure 3, the clamping table 14 has a disc shape and a holding surface 16 for holding the workpiece 11, wherein the holding surface 16 is made of a porous ceramic or the like, and a frame body 17 surrounding the holding surface 16. Additionally, a two-dimensional barcode 201 (an example of an information medium), which contains a table ID (an example of identification information) that identifies the clamping table 14, is provided on the upper surface of the frame body 17. The table ID is information uniquely assigned to each of the multiple clamping tables to be installed in the machining device 1.

[0028] Additionally, the clamping table 14 is arranged such that it can be moved by the X-axis motion unit in the X-axis direction between a machining area below a machining unit 18 and a loading and unloading area, which is separate from the area below the machining unit 18 and in which the workpiece is loaded and unloaded. The clamping table 14 is arranged so that it can be rotated about an axis parallel to the Z-axis direction by a rotary drive source, such as a motor (not shown). The clamping table 14 is connected to a vacuum suction source (not shown). The clamping table 14 draws the workpiece 11, which is attached to the holding surface 16, into the vacuum suction source and holds it.

[0029] A gate-shaped support structure 20, which carries two arrangements of machining units 18, is arranged on the upper surface of the base 4 such that it spans the opening 4b. A front upper section of the support structure 20 is provided with two arrangements of machining unit movement mechanisms 22 (an example of a movement unit) which move the respective machining units 18 in an indexing feed direction (Y-axis direction) and a cutting feed direction (Z-axis direction).

[0030] The machining unit motion mechanisms 22 share a pair of Y-axis guide rails 24, which are arranged on the front surface of the support structure 20 and are parallel to the Y-axis direction. Respective Y-axis motion plates 26 are attached to the pair of Y-axis guide rails 24 so that they are displaceable in the Y-axis direction. A nut section (not shown) is provided on the lower surface of each Y-axis motion plate 26. Y-axis ball screws 28, parallel to the Y-axis guide rails 24, are screwed into the respective nut sections. The respective Y-axis motion plates 26 are moved along the Y-axis guide rails 24 by rotating the Y-axis ball screw spindle 28 by Y-axis motors 30 coupled to first end sections of the respective Y-axis ball screw spindles 28.

[0031] A pair of Z-axis guide rails 32, parallel to the Z-axis direction, is provided on the front surface of each of the Y-axis motion plates 26. A Z-axis motion plate 34 is attached to each pair of Z-axis guide rails 32 so that it is displaceable in the Z-axis direction. A nut section (not shown) is provided on the rear surface of each Z-axis motion plate 34. A Z-axis ball screw 36, parallel to the Z-axis guide rails 32, is screwed into each such nut section. The respective Z-axis motion plates 34 are moved along the respective pairs of Z-axis guide rails 32 by Z-axis motors 38 coupled to the first end sections of the respective Z-axis ball screws 36.

[0032] The machining units 18 (an example of a machining unit) are provided on the lower sections of the respective Z-axis motion plates 34. The in Fig. The machining device 1 shown is what is called a device of the facing dual type, with two machining units 18, that is, a twin-spindle indexing device.

[0033] Each of the machining units 18 processes a workpiece 11 held on the clamping table 14. Each of the machining units 18 has an annular cutting blade 42 for cutting the workpiece 11. The cutting blade 42 is detachably attached to an end section of a spindle 40.

[0034] A composite measuring unit 44 is fitted to each of the machining units 18. The composite measuring unit 44 is designed as a composite unit that integrally comprises a height measuring unit 44-1 (an example of a height measuring unit) for measuring the height of the holding surface 16 of the clamping table 14 and an imaging unit 44-2 (reading unit) for imaging the workpiece 11 or the like.

[0035] The height measuring unit 44-1 is implemented, for example, by a laser distance measuring device that measures the height of a target using a laser beam L1. The height measuring unit 44-1 can measure the height of the holding surface 16 of the clamping table 14 in a non-contact manner. The height measuring unit 44-1 is fitted to the processing unit 18 and measures heights (Z) at several coordinates (X, Y) of the measured holding surface 16 as height data while the X-axis motion unit and each of the processing unit motion mechanisms 22 are moving.

[0036] The imaging unit 44-2 (an example of a reading unit) is equipped, for example, with a camera and an imaging element with a charge-coupled device (CCD) or an imaging element with a complementary MOS (CMOS). The imaging unit 44-2 photographs the workpiece 11 held on the holding table 14, thereby obtaining an image for performing an alignment that involves positioning between the workpiece 11 and the cutting blade 42, and then outputs the obtained image to a control unit 100.

[0037] Additionally, the imaging unit 44-2 has a function for reading information recorded in the two-dimensional barcode 201 provided on the clamping table 14. The imaging unit 44-2 sends a table ID read from the two-dimensional barcode, where the table ID identifies the clamping table, to the control unit 100.

[0038] The X-axis motion unit and the respective machining unit motion mechanisms 22 move the clamping table 14 and the machining units 18 relative to each other in the X-axis direction and in the Y-axis direction parallel to the holding surface 16. This means that the clamping table 14 and the machining units 18 are fed to the machining process relative to each other along the X-axis direction by moving the clamping table 14 in the X-axis direction as a machining feed direction by the X-axis motion unit. Additionally, the machining units 18 and the combined measuring units 44 are indexed in the Y-axis direction by moving the Y-axis motion plates 26 by the respective machining unit motion mechanisms 22 in the Y-axis direction.Meanwhile, the machining units 18 and the combined measuring units 44 are fed in the Z-axis direction by moving the Z-axis motion plates 34 in the Z-axis direction by the respective machining unit motion mechanisms 22.

[0039] A cleaning unit 46 is provided within an opening 4c of the base 4. The cleaning unit 46 cleans workpieces 11 after cutting or the like. Components of the machining unit 1, namely the X-axis motion unit (not shown), the clamping table 14, the machining units 18, the machining unit motion mechanisms 22, the combined measuring units 44, and the cleaning unit 46, are each connected to the control unit 100.

[0040] The control unit 100 (an example of a control unit) comprises an arithmetic processing device such as a central processing unit (CPU), a storage device such as a random access memory (ROM) or a working memory (RAM), and an input / output interface device. The control unit 100 is a computer capable of executing a computer program to control each of the components described above, or the like, to perform various types of processing as described below by each such component.

[0041] As in Fig. As shown in Figure 1, the control unit 100 has a data acquisition section 110 and a processing control section 120. The control unit 100 implements or performs the functions and actions of different processing modes of the processing device 1 according to the first embodiment through each such section. The sections of the control unit 100 are implemented, for example, by functions provided by a program stored in the memory device. That is, the sections of the control unit 100 are implemented by the arithmetic processing device by executing the program stored in the memory device with the RAM or the like, which is used as a work area. The functional design of the control unit 100 does not necessarily have to be limited to the one shown in Figure 1. Fig. The embodiment shown in 1 may be limited and could be a different embodiment, as long as the embodiment can perform the different types of machining in the machining device 1, which will be described later. [Outline of an edit]

[0042] The control unit 100 performs a height measurement operation, which measures the height of the holding surface 16 of the clamping table 14 by the height measuring unit 44-1 of a compound measuring unit 44. Fig. Figure 4 is a side view showing a positional relationship between the clamping table according to the first embodiment and the height measuring unit. Fig. Figure 5 is a diagram that provides an example of defining measurement lines according to the first embodiment. Fig. Figure 6 is a diagram that illustrates an example of defining measurement points according to the first embodiment.

[0043] As in Fig. As shown in Figure 4, the data acquisition section 110 of the control unit 100 positions the imaging unit 44-2 of the combined measuring unit 44 above the clamping table 14 installed in the machining device 1. The data acquisition section 110 then causes the imaging unit 44-2 to read the two-dimensional barcode 201 provided on the frame body 17 of the clamping table 14. The data acquisition section 110 then receives a table ID read by the imaging unit 44-2.

[0044] Subsequently, the data acquisition section 110 moves the height measuring unit 44-1 to a position above the holding surface 16 of the clamping table 14 by moving the clamping table 14 and the height measuring unit 44-1 relative to each other. The data acquisition section 110 then positions the height measuring unit 44-1 at a position where the laser beam L1, applied by the height measuring unit 44-1, measures a previously defined measurement line 16-1 on the holding surface 16. Fig. 5) can be irradiated. The data acquisition section 110 then performs the height measurement processing by applying the laser beam L1 for a measurement along several measurement lines 16-1 (see Fig. 5) in a sequence while the clamping table 14 and the height measuring unit 44-1 move relative to each other. The data acquisition section 110 can thereby measure heights (Z) at several coordinates (X, Y) of the holding surface 16 of the clamping table 14. The data acquisition section 110 can record a correlation between the several coordinates (X, Y) and the heights (Z) at the several coordinates (X, Y), with the data being obtained as height data as a result of the measurement. However, the height measuring unit 44-1 is not limited to a laser irradiation-type sensor, but another measuring unit using a backside pressure sensor, a contact-type sensor, or the like can also be configured as the height measuring unit 44-1.

[0045] As in Fig. As shown in Figure 5, the multiple measuring lines 16-1 are predefined on the holding surface 16 at a predetermined distance (interval) in the X-axis and Y-axis directions. Information regarding the heights (Z) at the multiple coordinates (X, Y) on the holding surface 16 is obtained by performing a height measurement along the measuring lines 16-1. The multiple measuring lines 16-1 can be defined on the holding surface 16 at intervals of, for example, 20 to 50 mm. However, the number, spacing, and positions of the measuring lines 16-1 on the holding surface 16 are not particularly limited and can be changed by an operator to any desired number, spacing, or position.

[0046] Additionally, data acquisition section 110 need not necessarily be limited to the example of performing an altitude measurement along measurement lines 16-1. As in Fig. As shown in Figure 6, several measuring points 16-2 could be predetermined on the holding surface 16 and a height measurement could be carried out at each measuring point 16-2.

[0047] The data acquisition section 110 records the height data obtained through the height measurement processing described above and the table ID of the clamping table 14, which is assigned to each other. Fig. Figure 7 is a diagram that outlines the elevation data according to the first embodiment. As in Fig. As shown in Figure 7, the elevation data recorded by data acquisition section 110 each have a table ID, coordinates, and elevation item, and these items are linked to one another. The table ID item is the table ID of the clamping table 14, which is read by the imaging unit 44-2. The coordinates item is the value of the coordinates (X, Y) of the holding surface 16 during the elevation measurement process. The elevation item is the value of an elevation (Z) of the holding surface 16 during the elevation measurement process.

[0048] The processing control section 120 of the control unit 100 controls the height of the processing units 18 during processing based on the height data recorded in the data acquisition section 110. This means that the processing control section 120 receives the height data associated with the table ID read by the imaging unit 44-2 of the data acquisition section 110 and controls the height of the processing units 18 during processing based on this height data. Fig. Figure 8 is a top view schematically illustrating a machining control according to the first embodiment. As in Fig. As shown in Figure 8, the machining control section 120 forms a cutting groove with a desired depth in the workpiece 11 by causing the cutting blade 42 to cut into the workpiece 11 based on the height data. [Processing process]

[0049] An example of a process for machining the machining device according to the first embodiment is given with reference to Fig. 9 will be described. Fig. Figure 9 is a flowchart illustrating an example of the machining process of the machining device according to the first embodiment. The diagram shown in Figure 9 is a flowchart illustrating the machining process of the machining device according to the first embodiment. Fig. The processing shown in section 9 is carried out by the sections available in control unit 100.

[0050] As a Fig. As shown in Figure 9, the data acquisition section 110 receives the table ID of the clamping table 14 from the imaging unit 44-2 (step S101). The data acquisition section 110 then determines whether the height data of the holding surface 16 of the clamping table 14, which are assigned to the table ID, have been acquired or not (step S102).

[0051] When data acquisition section 110 determines that the elevation data associated with the table ID has been acquired (step S102; Yes), data acquisition section 110 receives the elevation data associated with the table ID (step S103). Process control section 120 performs a processing control based on the elevation data received from data acquisition section 110 (step S104) and then terminates the processing in Fig. 9 shown processing.

[0052] If the data acquisition section 110 determines in step S102 described above that the height data associated with the table ID has not been acquired (step 102; No), the data acquisition section 110 measures the height of the holding surface 16 of the clamping table 14 (step S105). Alternatively, if it is determined that the height data associated with the table ID has not been acquired, the machining control section 120 could perform a control operation to machine the workpiece 11 by cutting into the workpiece 11 with the cutting blade 42 to a specified height from the holding surface 16 without using the height data, as is usually the case.

[0053] Next, data acquisition section 110 takes the elevation data obtained by the measurement in step S105, assigns it to the table ID obtained in step S101 (step S106), and proceeds to the processing operation of step S104 described above. This means that processing control section 120 performs processing control based on the elevation data obtained from data acquisition section 110.

[0054] As described above, the machining device 1 according to the first embodiment comprises the clamping table 14, the machining units 18, the (not shown) X-axis motion unit, the machining unit motion mechanisms 22, the height measuring units 44-1, the imaging units 44-2, and the control unit 100. The clamping table 14 has the holding surface 16 for holding the workpiece 11 and the frame body 17 surrounding the holding surface 16 and has the two-dimensional barcode 201 (an example of an information medium) that contains identification information distinguishing the clamping table 14. The machining units 18 (an example of a machining unit) machine the workpiece 1 held on the clamping table 14.The (not shown) X-axis motion unit and the machining unit motion mechanisms 22 (an example of a motion unit) move the clamping table 14 and the machining units 18 in the X-axis direction and the Y-axis direction parallel to the holding surface 16 relative to each other.

[0055] Each of the height measurement units 44-1 (an example of a height measurement unit) is fitted to the processing unit 18 and measures as height data the multiple coordinates (X, Y) of the holding surface 16, which are measured while the (not shown) X-axis motion unit and the processing unit motion mechanism 22 are moving, and the heights (Z) at the multiple coordinates (X, Y). Each of the imaging units 44-2 (an example of a height measurement unit) can read the two-dimensional barcode 201. That is, the imaging unit 44-2 can obtain the table ID by reading the two-dimensional barcode 201. The control unit 100 (an example of a control unit) includes the data acquisition section 110 and the processing control section 120. The data acquisition section 110 (an example of a height data acquisition section) acquires the height data and the table ID, corresponding to each other.The machining control section 120 controls the height of the machining units 18 during machining based on the height data assigned to the table ID read by the imaging unit 44-2. Thus, the machining device 1 according to the first embodiment can perform machining control based on the height data corresponding to the clamping table 14, even if the clamping table 14 is replaced. The machining unit 1 according to the first embodiment can therefore prevent a reduction in the machining quality of the workpiece 11 if the clamping table 14 is replaced. [Modification]

[0056] In the preceding first embodiment, an example was described in which the two-dimensional barcode 201 is used as an information medium containing the table ID (identification information) of the clamping table 14. However, the information medium need not be specifically limited to this example. Fig. Figure 10 is a diagram that schematically illustrates an example of a design for a clamping table according to a modification. As in Fig. As shown in Figure 10, a two-dimensional code 202 (an example of an information medium), which stores the table ID (an example of identification information) that characterizes the clamping table 14, could be provided on the upper surface of the frame body 17 surrounding the holding surface 16 of the clamping table 14. In this case, the imaging unit 44-2 has a function of reading information stored in the two-dimensional code 202 provided on the clamping table 14 and sends the table ID read from the two-dimensional code 202 to the control unit 100. The two-dimensional code 202 is referred to as a two-dimensional matrix code. The two-dimensional code 202 has a Quick Response code (QR code: registered trademark). [Second embodiment]

[0057] In the preceding first embodiment, an example was described in which the two-dimensional barcode 201 and the two-dimensional code 202 are used as the information medium that stores the table ID of the clamping table 14. However, there is no need to restrict this to the present example, and an RFID-bearing RF tag can be used as the information medium storing the table ID of the clamping table 14. A machining device according to a second embodiment is described below with reference to Fig. 11 to 13 will be described. Fig. Figure 11 is a perspective view showing an external embodiment of the machining device according to the second embodiment. Fig. Figure 12 is a diagram that schematically illustrates an example of a design of a clamping table according to the second embodiment. Fig. Figure 13 is a flowchart that illustrates an example of a machining operation of the machining device according to the second embodiment.

[0058] As in Fig. As shown in Figure 12, an RF tag 203 (an example of an information medium), which contains the table ID of the clamping table 14, is provided on the frame body 17 surrounding the holding surface 16 of the clamping table 14. However, the RF tag 203 might not be exposed on the surface of the frame body 17 and could be contained within the clamping table 14.

[0059] As in Fig. As shown in Figure 11, the processing device 2 according to the second embodiment has a reading device 90 (an example of a reading unit). The reading device 90 is, for example, an RFID device capable of writing and reading information via wireless communication. The reading device 90 reads the table ID of the clamping table 14 from the [unclear text] in [unclear text]. Fig. The clamping table 14 shown in Figure 12 is equipped with an RF tag. The reader 90 can communicate wirelessly or via a cable. The reader 90 sends the table ID read by the RF tag 203 to the control unit 100. [Processing process]

[0060] An example of a process for machining the machining device according to the second embodiment is given with reference to Fig. 13 will be described. This is in Fig. The processing described in section 13 is carried out by the sections available in control unit 100. However, the one in Fig. 13. Processing operation shown from in Fig. 9 shown processing procedure with regard to the process of step S201.

[0061] As in Fig. As shown in Figure 13, the data acquisition section 110 receives the table ID of the clamping table 14, which is read by the reading device 90 (step S201). The data acquisition section 110 then determines whether the height data of the holding surface 16 of the clamping table 14, which is assigned to the table ID obtained in step S201, has been recorded (step S202).

[0062] When data acquisition section 110 determines that the elevation data associated with the table ID has been acquired (step S202; Yes), data acquisition section 110 receives the elevation data associated with the table ID (step S203). Process control section 120 performs a processing control based on the elevation data received from data acquisition section 110 (step S204) and then terminates the processing in Fig. 13 shown processing.

[0063] If the data acquisition section 110 determines in step S202 described above that the height data associated with the table ID obtained in step S201 has not been acquired (step S202; No), the data acquisition section 110 measures the height of the holding surface 16 of the clamping table 14 (step S205). Alternatively, if it is determined that the height data associated with the table ID has not been acquired, the machining control section 120 could perform a control operation to machine the workpiece 11 by cutting into the workpiece 11 with the cutting blade 42 to a fixed height from the holding surface 16, without using the height data as is usually the case.

[0064] Next, data acquisition section 110 records the elevation data obtained by the measurement in step S205, assigns it to the table ID obtained in step S201 (step S206), and proceeds to the processing operation of step S204 described above. This means that processing control section 120 performs processing control based on the elevation data obtained from data acquisition section 110. [Third embodiment]

[0065] In the preceding embodiments, an example was described in which the processing device 1 reads the table ID from the information medium, such as the two-dimensional barcode 201, the two-dimensional code 202, or the RF tag 203, and performs processing control based on the height data associated with the read table ID. However, there is no need to restrict this to the example. For instance, instead of the table ID, the height data of the holding surface 16 of the clamping table 14 could be stored on the information medium. The processing device 1 can then directly perform processing control using the height data read from the information medium.

[0066] For example, in a case where the two-dimensional barcode 201 or the two-dimensional code 202 is used, the operator installs the clamping table 14 in the machining device 1 and performs the height measurement operation for the clamping table 14 before using it. The operator then generates the two-dimensional barcode 201 or the two-dimensional code 202, incorporating the height data obtained through the height measurement operation, and installs the generated two-dimensional barcode 201 or the generated two-dimensional code 202 on the clamping table 14 before use. The machining control section 120 of the control unit 100 causes the imaging unit 44-2 of the composite measuring unit 44 to read the two-dimensional code 202 or the two-dimensional barcode 201 provided on the frame body 17 of the clamping table 14.The processing control section 120 receives the elevation data read by the imaging unit 44-2 and performs processing control using the received elevation data.

[0067] Additionally, in a case where the RF tag 203 is used, the operator installs the clamping table 14 in the machining device 1 and performs the height measurement operation for the clamping table 14 before using it. The operator writes the height data obtained from the height measurement operation to the RF tag 203 using an RFID-enabled writer and installs the RF tag 203 with the height data written to it on the clamping table 14 beforehand. The machining control section 120 of the control unit 100 receives the height data read from the RF tag 203 by the reader 90 and performs machining control using this data.

[0068] Thus, according to the third embodiment, the processing device 1 can directly receive the height data recorded on the information medium of the clamping table 14 and perform processing control without the effort of recording the height data assigned to the table ID in the data acquisition section 110.

[0069] Additionally, in the preceding embodiment, the table ID and / or the height data of the clamping table 14 could be recorded on an information medium. In a case where only the table ID is recorded on the information medium, the machining device 1 can obtain the height data associated with the table ID from the data acquisition section 110 and perform machining control as in the first and second embodiments. Additionally, in a case where only the height data is recorded on the information medium, the machining device 1 can obtain the height data recorded on the information medium and perform machining control as in the third embodiment.Additionally, in a case where the table ID and the elevation data are recorded on the information medium, the processing device 1 could obtain the elevation data associated with the table ID from the data acquisition section 110 and perform processing control as in the first and second embodiments, or it could obtain the elevation data recorded on the information medium and perform processing control as in the third embodiment.Meanwhile, if the table ID and elevation data are recorded on the information medium, the processing device 1 could determine whether the elevation data associated with the table ID is recorded in data acquisition section 110. If the elevation data associated with the table ID is recorded in data acquisition section 110, the processing device 1 could determine whether the elevation data recorded on the information medium and the elevation data recorded in data acquisition section 110 are compatible. If the processing device 1 determines that the elevation data pieces are compatible, the processing device 1 could perform a processing control operation using one of the elevation data pieces.If the machining device 1 determines that the height data pieces do not match up, the machining device 1 could repeat the height measurement and perform machining control using the obtained height data. Thus, machining control can be performed using higher-reliability height data. [Other]

[0070] Each of the preceding embodiments is applicable not only to a processing device such as a cutting device, but also to a laser processing device. For example, the height data of a clamping table in a laser processing device can be obtained using a method similar to that of the preceding embodiments, and the position of a laser beam's condensation point can be raised or lowered based on this height data. This makes it possible to apply the laser beam to the workpiece at a uniform height, regardless of any unevenness in the clamping table of the laser processing device. This can therefore improve processing quality.

[0071] The components of the machining device 1 described in each of the preceding embodiments are functionally conceptual and need not necessarily be physically configured as shown in the figures. This means that a particular form of distribution and integration of the control unit 100 provided on the machining device 1 is not limited to those shown in the figures, and that the entire control unit 100 or a part thereof can be configured to be functionally or physically distributed or integrated within any unit according to different types of loads, operating conditions, and the like. For example, the data acquisition section 110 and the machining control section 120 of the control unit 100 could be configured in a state in which they are functionally or physically integrated with each other within the control unit 100.

Claims

[1] Machining device (1) comprising: a clamping table (14) with a holding surface (16) designed to hold a workpiece (11) and a frame body (17) surrounding the holding surface (16); a machining unit (18) designed to machine the workpiece (11) held on the clamping table (14); a motion unit designed to move the clamping table (14) and the processing unit (18) relative to each other in an X-axis direction parallel to the holding surface (16) and a Y-axis direction orthogonal to the X-axis direction; a height measuring unit (44-1) fitted to the processing unit (18), wherein the height measuring unit (44-1) measures heights (Z) as height data at several coordinates (X, Y) of the measured holding surface (16) while the motion unit is moved; a reading unit capable of reading an information medium; and a control unit (100), wherein the clamping table (14) has an information medium in which identification information distinguishing the clamping table (14) is included, the reading unit reads the information medium of the clamping table (14) installed in the processing device (1) and the control unit (100) has: an elevation data acquisition section designed to capture elevation data and identification information in a coordinated manner, and a processing control section (120) which is designed to control the height of the processing unit (18) during processing on the basis of the height data associated with the identification information read by the reading unit. [2] Machining device (1) comprising: a clamping table (14) with a holding surface (16) designed to hold a workpiece (11) and a frame body (17) surrounding the holding surface (16); a machining unit (18) designed to machine the workpiece (11) held on the clamping table (14); a motion unit designed to move the clamping table (14) and the processing unit (18) relative to each other in an X-axis direction parallel to the holding surface (16) and a Y-axis direction orthogonal to the X-axis direction; a height measuring unit (44-1) fitted to the processing unit (18), wherein the height measuring unit (44-1) measures heights (Z) as height data at several coordinates (X, Y) of the measured holding surface (16) while the motion unit is moved; a reading unit capable of reading an information medium; and a control unit (100), wherein the clamping table (14) has an information medium on which the height data of the clamping table (14) are recorded, and the control unit (100) has a processing control section (120) which is designed to control the height of the processing unit (18) during processing on the basis of height data read by the reading unit. [3] Processing device (1) according to claim 1, wherein the information medium is formed by a two-dimensional code or a radio frequency tag of a radio frequency identification, wherein information is written and read by wireless communication. [4] Processing device (1) according to claim 2, wherein the information medium is formed by a two-dimensional code or a radio frequency tag of a radio frequency identification, wherein information is written and read by wireless communication. [5] Single clamping table (14), comprising: a holding surface (16); a frame body (17) surrounding the holding surface (16); and an information medium designed to record height data obtained by measuring heights at several coordinates of the holding surface (16) in a state in which the clamping table (14) is installed in a processing device (1). [6] Single clamping table (14) according to claim 5, wherein the information medium is formed by a two-dimensional code or a radio frequency tag of a radio frequency identification, wherein information is written and read by wireless communication.

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