SEMICONDUCTOR MODULE

DE102022106911B4Undetermined Publication Date: 2026-06-25FUJI ELECTRIC CO LTD
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Patent Information

Application Number
DE102022106911P0
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-05-21
Filing Date
2022-03-23
Publication Date
2026-06-25
Estimated Expiration
2042-03-23

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Abstract

Semiconductor module (100) comprising: a semiconductor chip (40) with a semiconductor substrate (110) and a metal electrode (52) arranged over the semiconductor substrate (110); a protective film (150) arranged over the metal electrode (52); a plating layer (36) arranged over the metal electrode (52), at least a part of which has the same height as the protective film (150); a solder layer (32) arranged over the plating layer (36); and a conductor frame (60) arranged above the solder layer (32), wherein: the plating layer (36) is arranged in an area that does not touch the protective film (150), the solder layer (32) is arranged between the plating layer (36) and the protective film (150), and the solder layer (32) is configured to cover a corner section (37) of the plating layer (36) that touches the solder layer (32).
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Citation Information

Patent Citations

  • Semiconductor device and manufacturing method thereof

    JP2006245182A

  • Semiconductor device, semiconductor package, semiconductor module, and semiconductor circuit device

    JP2019186510A

  • Semiconductor device

    WO2019244492A1

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    DE102006041575A1

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    JP2011060883A