TELECENTRAL IMAGE: MULTIPLE LIGHT RAYS INTO A TARGET AREA

Abstract

The present application relates to an imaging device for telecentrically imaging multiple light beams into a target area and an associated micromirror device. The imaging device comprises a beam inclination correction element and a beam control device configured to image N ≥ 2 substantially non-overlapping light beams onto the beam inclination correction element and to control the position of one or more of the N light beams on the beam inclination correction element. The imaging device further comprises a beam imaging device configured to image the light beams corrected by the beam inclination correction element onto the target area, wherein the beam inclination correction element is configured to correct the inclination of the N light beams in each case such that the N light beams are imaged onto substantially non-overlapping positions in the target area.The beam inclination correction element can be implemented, for example, by a micromirror device.

Description

1. Technical field

[0001] The present application relates to a device for telecentrically imaging multiple light beams into a target area and an associated static micromirror device. The imaging device can be used, in particular, for the simultaneous and selective addressing of multiple atoms in a quantum register of a quantum computer or for parallelized microscopy. 2. Technical Background

[0002] Highly focused laser beams are used in various applications to manipulate matter with high spatial resolution. For example, in a quantum register of a quantum computer, whose qubits are realized by neutral atoms or atomic ions, the atoms are arranged with distances in the range of < 10 µm, < 2 µm, or < 1 µm. To manipulate such atoms selectively, individually, and reproducibly, a laser focus that can be shifted within the quantum register is typically required, the extent of which (e.g., defined by 1 / e) 2 -width or the width of the intensity distribution within which 99% of the laser beam power lies; hereinafter also referred to as FW 99The atom (M) should be so small and its positional stability so precise that manipulating one of the atoms leaves the neighboring atoms essentially unaffected. Similar requirements for optical imaging systems are found, for example, in laser material processing, high-resolution microscopy, laser measurement, or optical communication networks.

[0003] To increase the manipulation, observation, or sampling rate in such applications, parallelization is desirable. For example, multiple laser beams or beam paths can be optically superimposed in such a way that several positions in the target area can be manipulated simultaneously, or several positions in the target area can be observed or scanned simultaneously with different sensors. This would allow, for example, the implementation of multi-qubit gates or the parallel execution of multiple gates by addressing several atoms at once. In other technical fields, such as laser material processing or high-resolution microscopy (e.g., of tissue sections or cell cultures), it can also be advantageous to be able to process or observe multiple positions at the focus of a high-resolution optical system simultaneously.

[0004] The telecentricity of the focused rays (i.e., the state in which their principal rays are parallel to the optical axis) is usually advantageous or even essential for the applications described above for one or more of the following reasons: (1) to achieve higher polarization purity of the focused light rays in the target area, (2) to ensure perpendicular incidence for higher illumination intensities, and (3) to ensure magnification that is independent of the image or object distance.

[0005] However, the scalability of the number of light beams in a telecentric configuration is often insufficient with conventional methods. For example, devices are known in the art that enable the superposition of multiple laser beams by means of beam combination. Non-polarizing beam splitters are typically used for this purpose. However, these have the disadvantage that the laser power decreases with each pass through such a beam splitter, so that such devices are not scalable due to the often limited optical power. Furthermore, many conventional beam splitters (e.g., polarizing or dichroic ones) alter the physical properties such as the polarization or the frequency spectrum of each beam, which can, for example, negatively affect beam control applications.

[0006] As a possible alternative to such beam splitters, devices are known from the prior art in which several beams share an optical aperture. However, this necessitates that the partial beams be significantly smaller than the entrance pupil of the focusing optics, which, for example, leads to a decrease in resolution during focusing. This approach, too, is therefore only scalable to a very limited extent due to the limited size of the entrance pupil. Furthermore, this approach eliminates the telecentricity of the partial beams during focusing. 3. Summary

[0007] Some of the disadvantages of the prior art outlined above are addressed by a device as defined in the claims. In particular, the present application describes an imaging device with which, for example, several laser beams can be focused simultaneously onto different atoms in an optical lattice or a quantum register, or with which light emanating from different positions on an object to be observed can be analyzed simultaneously with several optical sensors.

[0008] The imaging device described here comprises a beam inclination correction element and a beam control device configured to image N ≥ 2 substantially non-overlapping light beams onto the beam inclination correction element and to control the position of one or more of the N light beams on the beam inclination correction element. The imaging device further comprises a beam imaging device configured to image the light beams corrected by the beam inclination correction element onto a target area, wherein the beam inclination correction element is configured to correct the inclination of the N light beams such that the N light beams are imaged onto substantially non-overlapping positions in the target area.

[0009] Here and in the following, the term "essentially non-overlapping" is to be understood as meaning that the overlap has no practical significance for the respective application. In particular, it is known to those skilled in the art that a typical laser beam with an ideally Gaussian beam profile has, mathematically and theoretically speaking, an infinite extent. However, from an experimental point of view, two light beams—e.g., laser beams—are essentially non-overlapping if the regions in which 99% of the optical beam power of each of the two laser beams lies do not overlap.

[0010] In particular, the beam control device can include a beam focusing device configured to image the N >= 2 substantially non-overlapping light beams onto the beam tilt correction element. The beam imaging device can further be configured to produce substantially telecentricity-preserving imaging (e.g., with a deviation from an ideal telecentricity-preserving image of <= 5%, preferably <= 1%), preferably via a 4f image.

[0011] It is known to those skilled in the art that a 4f image is characterized, for example, by the fact that it comprises two lenses or similar optical elements (e.g., a microscope objective) with focal lengths f1 and f2, arranged such that the distance between the two lenses is essentially the sum of their focal lengths f1 + f2, and the object plane (e.g., the target area) is essentially at the focal point of one lens and the image plane at the focal point of the other lens (cf. Fig. 1).

[0012] The imaging device disclosed herein allows, among other things, the simultaneous imaging of multiple laser beams to different positions in the target area without significant power loss and while preserving telecentricity. For example, it enables the simultaneous addressing of N atomic qubits in a quantum register of a quantum computer with essentially identical physical beam parameters (e.g., intensity, frequency spectrum, polarization in the target plane, etc.). This allows, for example, the simultaneous execution of multiple identical quantum gates at different positions within a quantum register without having to control the pulse area separately for each addressing beam. Furthermore, the beam control device, in combination with the beam tilt correction element, allows the position of one or more of the light beams in the target area to be controlled, which is advantageous for quantum computers and potentially for other applications.Material processing can be essential, but for certain microscopy applications it can also be omitted, for example to simplify the optical setup.

[0013] In one possible implementation, the beam inclination correction element M ≥ 2 micro-optical elements can comprise micro-optical elements configured to correct the inclination of the N light beams, where M is preferably greater than or equal to N. The micro-optical elements can, in particular, be micromirrors of a micromirror arrangement or a micromirror device. The micromirror device can, in particular, be a static micromirror device (see the one in Fig. 3 to Fig. (5 examples shown). In other implementations, the beam tilt correction element can also include a digitally or analogously controllable micromirror device, or a so-called spatial light modulator (SLM). In particular, the beam tilt correction element can be designed such that different light rays, which are imaged onto the beam tilt correction element at different angles of inclination to the surface normal of the beam tilt correction element, are corrected so that they propagate substantially parallel to the optical axis of the imaging device after passing through the beam tilt correction element.

[0014] The imaging device described above therefore makes it possible, in particular, to maintain the telecentricity of multiple focused light beams on a target grid while simultaneously controlling their position within the grid as needed. This allows, for example, the simultaneous targeting of N arbitrary atoms in a quantum register with, say, 20 x 20 grid positions, in order to perform N / 2 two-qubit gates concurrently. Maintaining telecentricity increases polarization and power projection onto perpendicular image planes, thus improving the efficiency of relevant quantum optical and / or materials processing applications. In the reverse beam direction (e.g., in the microscopy of tissue sections or fluorescence imaging), this ensures, for example, that the magnification does not change when the object is moved along the beam direction.Telecentrity ensures, in particular, that defocusing at the object or image planes does not alter the image magnification. Furthermore, such an imaging device is not designed for specific wavelengths but can operate over a broad spectral range, e.g., from the deep ultraviolet (XUV) to the infrared. The low sensitivity to polarization changes achieved through telecentrity is a further advantage, especially for quantum technologies, where precise control of the internal state of quantum objects, such as atoms, is typically crucial.

[0015] Implementing the beam tilt correction element using a static micromirror device allows the use of micromirrors with varying curvatures. For example, micromirrors with spherical, aspherical, and / or freeform surfaces can be combined in a single micromirror array. Such different geometric-optical properties can be controlled separately for each target position within the target area via the beam control device—for example, for controlled defocusing, aberration correction, and / or wavefront modification. As described in more detail below, the static micromirror device can comprise multiple micromirror arrays on a single substrate, such as a silicon wafer (see Figure 1). Fig. 7) Different micromirror arrangements can be used via the beam control device and / or an additional positioning device for the micromirror apparatus. Further implementations, details and embodiments of the imaging device described above are described below with reference to Fig. 1 and Fig. 2 described.

[0016] The present application further relates to a microscopy system comprising an imaging device as described herein, and a device for arranging an object to be examined in the target area such that the substantially non-overlapping positions are on or in a part of the object to be examined, and, optionally, a device for illuminating the object to be examined such that the substantially non-overlapping positions in the target area are at least partially illuminated.

[0017] In some implementations, such a microscopy system may further comprise a plurality of optical sensors, preferably CCD or CMOS sensors, wherein the imaging device is configured to image light emanating from the substantially non-overlapping positions in the target area and entering the imaging system onto different sensors of the plurality of optical sensors. Furthermore, the device for illuminating the object under investigation may be configured to illuminate two or more of the substantially non-overlapping positions with different light, each having a different frequency spectrum (e.g., with two different lasers emitting at different operating wavelengths).

[0018] In some implementations, two sensors from the plurality of optical sensors can differ in their sensor type. The imaging device can also have different optical filters for at least two sensors from the plurality of optical sensors, where the different optical filters can be selected from: a spectral filter, a polarization filter, and a spatial frequency filter.

[0019] Furthermore, the device for illuminating the object can be configured to illuminate at least two of the non-overlapping positions differently, such that the light entering the imaging system has a different frequency spectrum. In particular, the device for illuminating the object under investigation can be configured to image the illumination light onto the substantially non-overlapping positions in the target area via the imaging device, for example, using a dichroic mirror whose frequency-dependent reflection behavior corresponds to an absorption and emission spectrum of a fluorescent dye in the object. In this way, different areas can be examined in different colors, which can lead to decisive advantages in modern neuroimaging systems, for example, because complex neural circuits with different functions can be observed simultaneously.

[0020] Furthermore, the device for arranging the object to be examined can be configured to move the object to be examined in such a way that at least two different non-overlapping positions are successively mapped onto at least two different sensors.

[0021] The microscopy system described above allows, for example, the selective observation and imaging / scanning of samples or structures, potentially using different cameras or optical systems. This can be the case, for instance, in a so-called lab-on-a-chip, where different substances act at different locations. In such a case, the system described here allows different areas to be observed simultaneously with different spectral filters. Furthermore, the sample can be moved so that each area of ​​the sample is viewed by each of the N imaging channels. In this way, the entire sample can be scanned more quickly and ultimately combined into a complete image.

[0022] The present application further relates to a laser addressing system comprising an imaging device as described herein, wherein the N light beams are laser beams that are imaged into the target area. The laser addressing system further comprises a laser beam source that provides the N laser beams to the imaging device. The laser beam source can, for example, include a beam splitter, preferably a diffractive beam splitter, for generating the N laser beams. This makes it possible to generate multiple laser beams with a single laser (e.g., a fiber laser or an amplified diode laser). Further implementations, details, and embodiments of the laser addressing system described above are set forth below with reference to Fig. 2 described.

[0023] The present application further relates to a quantum computer or quantum simulation device comprising a plurality of individual atoms, ions, or molecules arranged in a substantially lattice-like configuration in the target region within a lattice-like trap, and a laser addressing system as described in this application for simultaneously addressing a subset of the atoms, ions, or molecules arranged in the lattice-like trap. The operation of such a quantum computer or quantum simulation device is described, inter alia, in the earlier application EP 23181879.0 entitled “HARDWARE-EFFICIENT NEUTRAL ATOM QUANTUM COMPUTING METHOD AND DEVICE” of the Max Planck Society for the Advancement of Science, to which reference is made in full hereafter.

[0024] In some implementations, at least M ≥ 2 individual atoms, ions, or molecules can be arranged in the lattice-like trap at preferably adjacent positions. Furthermore, the atoms, ions, or molecules can be arranged in a hexagonal, rectangular, or kagome-like lattice arrangement within the target region, with the M ≥ 2 micro-optical elements of the beam tilt correction element being arranged accordingly. In particular, the N ≥ 4 micromirrors of each of the L ≥ 1 groups can have a geometric arrangement, especially a hexagonal, rectangular, or kagome-like arrangement, which corresponds to any desired arrangement of target positions within a target region.

[0025] The present application further relates to a material processing device comprising a device for arranging a material to be processed in the target area, and a laser addressing system as described in this application for simultaneously addressing the material to be processed at several positions, wherein the N laser beams are configured to process the material to be processed, e.g. thermally or photochemically.

[0026] The present application further relates to an optical telecommunications switching device comprising a laser addressing system as described in this application, wherein the N laser beams are modulated with different optical communication signals, and an output module with L > N optical output ports, preferably optical waveguides, arranged in the target area such that the position of the output ports corresponds to the substantially non-overlapping positions of the laser beams in the target area, wherein the beam control device is controllable such that each of the N laser beams can be coupled into at least two of the L output ports.

[0027] The present application further relates to a static micromirror device, SMD, as a possible implementation of the beam tilt correction element described herein. Such an SMD comprises a substrate and M ≥ 2, preferably M ≥ 4, micromirrors arranged on or in the substrate, wherein at least two of the M micromirrors have a different angle with a surface normal of the substrate (see SEM images in Fig. 6) Further implementations, details and designs of such SMDs are described below with reference to Fig. 3 to Fig. 7 described.

[0028] Further aspects of possible implementations of the devices and systems described here and / or their technical advantages are described below with reference to the attached drawings. 4. Brief description of the drawings Fig. Figure 1 shows a schematic structure of an imaging device of the present application. Fig. Figure 2 shows an exemplary imaging device of the present application, which is part of a laser addressing system with which 6 atoms at arbitrary lattice sites of a lattice-like quantum register can be addressed simultaneously with N = 6 telecentric laser beams. Fig. Figure 3 shows the height profile of a surface of an exemplary micromirror arrangement of a micromirror device according to a possible implementation of the present application. Fig. Figure 4 shows the height profile of a surface of an exemplary micromirror device according to a possible implementation of the present application. Fig. Figure 5 shows the height profile of a surface of an exemplary micromirror device according to a possible implementation of the present application. Fig. Figure 6 shows exemplary SEM images of typical micromirror devices according to possible implementations of the present application. Fig. Figure 7 shows a wafer, e.g. a Si wafer, on which different micromirror devices are arranged according to possible implementations of the present application. 5. Detailed description of exemplary embodiments

[0029] Exemplary embodiments of the present application are described below with reference to the accompanying drawings. Various combinations of features are described with reference to the illustrated embodiments, using the example of an addressing system for a quantum register of a quantum computer. As stated above, the imaging device of the present disclosure can also be used in microscopy systems, material processing systems, and / or switching devices for telecommunications systems. Further areas of application of the present application include optical tweezers, laser measurement, and LiDAR.

[0030] Naturally, not all features of the described embodiments need to be present to realize the disclosed inventions. Furthermore, the embodiments can be modified by combining certain features of one embodiment with one or more features of another embodiment—provided this is technically compatible and makes sense—without deviating from the disclosure and scope of protection of the present application, which is defined by the claims. Some features, functions, and properties that have already been described in the preceding section may only be briefly mentioned below or not described at all to avoid repetition.

[0031] Fig. Figure 1 schematically shows the components and operation of an imaging device 100 of the present disclosure. The imaging device 100 comprises a beam tilt correction element 120 and a beam control device 130, which is configured to image N ≥ 2 substantially non-overlapping light beams 102 onto the beam tilt correction element 120 and to control the position of one or more of the N light beams 102 on the beam tilt correction element 120. The imaging device 100 further comprises a beam control device 130, which is configured to image N ≥ 2 substantially non-overlapping light beams 102 onto the beam tilt correction element 120 and to control the position of one or more of the N light beams 102 on the beam tilt correction element 120.

[0032] The beam control device 130 can further comprise a beam focusing device 110. In some embodiments (see Fig. 2) These may be spatially and / or functionally separate optical components. In some embodiments, the beam focusing device 110 may comprise one or more lenses for each of the N light rays. As in Fig. As shown in Figure 2, the lenses of the beam focusing device 110 can also be spatially separated from one another. The imaging device 100 further comprises a beam imaging device 140, which is configured to image the light rays 102 corrected by the beam inclination correction element 120 into the target area 150. The beam inclination correction element 120 is further configured to correct the inclination of the N light rays in such a way that the N light rays are imaged onto substantially non-overlapping positions in the target area 150.

[0033] The beam imaging device 140 can further be configured to produce a substantially telecentric imaging effect, preferably via a 4f image. This enables the beam path and, in particular, the imaging of the N light rays 102 into the target area 150 to be substantially telecentric. Specifically, each light ray 102 requires a different tilt angle on the beam tilt correction element 120 in order to propagate telecentrically through the last lens (e.g., a high-resolution lens) before the target area 150.

[0034] The beam inclination correction element 120 can have M ≥ 2 micro-optical elements configured to correct the inclination of the N light rays 102, wherein M is preferably greater than or equal to N. In some embodiments, the beam inclination correction element 120 can comprise a micromirror device (SMD). This can be, for example, a Si wafer on which several SMDs with different properties are arranged (see Figure 1). Fig. 7) Furthermore, the beam control device 130 can be configured to control one or more of the light beams 102 so that it is focused onto one or more different micro-optical elements. M can correspond to a number of sub-areas or zones of the target plane or target area 150, each of which can be addressed by one of the N light beams. If M is not significantly larger than N (see Fig. 5), the areas are typically large, whereby each laser beam can then cover a certain area within its region, allowing several essentially non-overlapping positions in the target region to be addressed. If M is significantly larger than N (see Fig. 3, Fig. 4 and Fig. 6) The areas are small, meaning each laser beam must remain largely static within a given area to avoid significant attenuation. However, the laser beam can jump back and forth between different assigned areas to address different positions within the target area.

[0035] Alternatively or additionally, the beam control device 130 can also be configured to control one or more of the N light beams 102 such that they are focused onto different non-overlapping positions on one or more of the M micro-optical elements. In particular, the beam control device 130 can have one or more acousto-optic deflectors (AODs) and / or one or more piezoelectrically adjustable mirrors (see Figure 1). Fig. 2) to control one or more of the N light beams 102.

[0036] The beam control device 130 can also have an acousto-optic deflector (AOD) and a piezoelectrically adjustable mirror for each of the N light beams, wherein an output beam of the AOD is imaged onto the piezoelectrically adjustable mirror via a substantially telecentricity-preserving imaging, preferably a 4f-imaging (see Fig. 2) This allows an angle change by the AOD to only result in an angle change on the mirror, but not in a position change.

[0037] In some embodiments, the beam imaging device 140 can include a microscope objective that focuses the N light rays 102 onto the target area 150, the numerical aperture, NA, of which can be greater than or equal to 0.1, preferably greater than or equal to 0.5. In particular, the beam tilt correction element 120, or its micro-optical elements, can be configured to correct the tilt of the N light rays 102 such that they overlap in a plane 145 of an entrance focus point of the microscope objective at substantially different angles of inclination. This makes it possible to utilize substantially the entire NA of the microscope objective for all N light rays. In this way, the number of rays, and thus the simultaneously manipulable positions, can be scaled without significantly impairing the focus quality in the target area 150 or the resolving power of the individual beam paths.

[0038] As mentioned above, such an imaging device 100 can be used in a microscopy system which, in addition to the imaging device 100, also includes a device for positioning an object to be examined in the target area 150 such that the substantially non-overlapping positions lie on or in a part of the object to be examined. The microscopy system can further include a device for illuminating the object to be examined, which is configured so that the substantially non-overlapping positions in the target area 150 are at least partially illuminated. The imaging device 100 can then, for example, be used to observe these non-overlapping positions in the target area 150 simultaneously with several beam paths.

[0039] In particular, such a microscopy system can comprise a plurality of optical sensors, e.g., CCD or CMOS sensors, wherein the imaging device 100 is configured to image light emanating from the substantially non-overlapping positions and entering the imaging device 100 onto different sensors of the plurality of optical sensors. Furthermore, the device for illuminating the object under investigation can be configured to illuminate two or more of the substantially non-overlapping positions in the target area 150 with different light, each of which, for example, has a different frequency spectrum.

[0040] At least two of the plurality of optical sensors can differ in their sensor type. Furthermore, the imaging device 100 can have different optical filters for at least two of the plurality of optical sensors, wherein the different optical filters can be selected from: a spectral filter, a polarization filter, and a spatial frequency filter. Furthermore, the illumination device can be configured to illuminate at least two of the non-overlapping positions differently such that the light entering the imaging system in each case has a different frequency spectrum. With such a system, the sampling rate, e.g., in digital applications, can be significantly improved, since N areas can be sampled simultaneously.Furthermore, the device for arranging the object to be examined in the target area 150 can be configured to move the object to be examined in such a way that at least two different non-overlapping positions are successively mapped onto at least two different sensors.

[0041] As described above, a 4f imaging system (e.g., a 4f lens group) or a similar imaging setup allows the imaging configuration between the beam tilt correction element 120 and the image plane or target area 150 to be essentially telecentric on both sides. However, the rays incident on the plane of the beam tilt correction element 120 can have different angles of incidence. Depending on the number of rays, several rays can be arranged in different cross-sectional configurations in 2D (e.g., rectangular, pentagonal, hexagonal, etc.). In such a configuration, a different tilt correction angle is typically required for each of the N light rays 102, which can be achieved, for example, by a separate tilt correction element of the beam tilt correction element 120 (e.g., a separate micromirror with a different angle to the plane, as shown in [reference]). Fig. 3, Fig. 4 and Fig. 5 shown and Fig. 6 shown) can be provided.

[0042] If the light rays are focused onto the plane of the beam tilt correction element 120, each individual correction element can be microscopically small (e.g., a rectangle with sides of approximately 50 µm and 100 µm, etc.) and arranged in any desired grid pattern. In such a configuration, each tilt correction element of the beam tilt correction element 120 can correspond to a pixel or position in the target area 150 (see the points in Fig. 3, Fig. 4 and Fig. 5) In this way, each beam can address or map / scan one or a multitude of controllable areas of the target area 150.

[0043] A pixel-like beam tilt correction element 120 can, for example, be composed of very small elements (in the micrometer range), depending on the focusing condition, the size of the target grid, and the magnification of the beam imaging device 140. Therefore, micro-optical components such as MEMS arrays, e.g., SLMs (Spatial Light Modulators), MMAs (Micromirror Arrays), etc., can be used for this purpose. Furthermore, any technology that can be miniaturized and pixelated to correct the tilt of focused beams can be a possible implementation of such a beam tilt correction element 120. The beam tilt correction element 120 of the present application is not, in principle, limited to tilt correction. Each pixel can provide a specific wavefront contribution, e.g., defocus, coma, or astigmatism, to introduce and / or compensate for specific wavefront aberrations for each pixelated target area.In this application, where individual tip / tilt correction is desired at each pixel, MMAs are typical implementations of the beam tilt correction element 120. The available MMA technologies support the modulation of micromirrors in two ways: digitally and analogously (see Song, RM Panas, JB Hopkins, “A review of micromirror arrays”, Prec. Eng., 51, 729 (2018)).

[0044] In a digital micromirror device (DMD), the individual micromirrors can be tilted into a few usable positions, which are typically switched on and off. Analog micromirror devices (AMDs) are capable of generating continuous tilt angles and can therefore be used to manipulate the direction of an incident beam within a defined angular range (see Fusao, "Analog micromirror devices with continuous intermediate states," CN 101611467A). Thus, if multiple beams strike different pixels, each pixel can provide a different angular correction. Another advantage of AMDs for beam control applications is that full position-to-angle connectivity can be achieved because the mirrors can be dynamically manipulated. With such an AMD, any input channel can therefore drive any output channel.For complete connectivity, it is in principle sufficient if N mirrors M can assume fixed angles in order to operate in a telecentricity-preserving manner.

[0045] During the development of the devices and systems described here, it became apparent that for application scenarios where the use of a DMD or AMD is suboptimal (e.g., too expensive and / or too imprecise), specially manufactured microstructured inclined mirror configurations can be used. Such a static micromirror device (SMD; examples: Fig. 3 to Fig. 7) can therefore also be used as a beam inclination correction element 120, which provides a different inclination correction angle for different light beams. For example, for N=6 beams, there are also 6 different inclination configurations, as e.g. in Fig. 3, Fig. 4 and Fig. Figure 5 is shown. The SMD is then imaged essentially telecentrically onto the image plane in the target area 150 by the beam imaging device 140 (e.g., with a 4f lens group) using the corrected tilt angles. Since each micromirror has a static tilt angle, each light beam can only be directed to one or more predefined positions in a sub-area of ​​the target area 150. Compared to an SMD, the use of AMDs offers all-to-all pixel-to-angle connectivity. However, the advantage of an SMD is that it can be manufactured more quickly in large quantities and more cost-effectively through the use of microlithographic or additive manufacturing processes.

[0046] Fig. Figure 2 shows a possible optical setup of an imaging device of the present disclosure, which is part of a laser addressing system. As described above, the imaging device comprises a beam tilt correction element 120, which may, for example, include a static micromirror device with one or more micromirror arrays. N incoming laser beams are generated via a (e.g., diffractive) beam splitter 210. For example, the first diffraction maxima of a hexagonal diffractive beam splitter can form the N incoming laser beams. The N laser beams can, for example, be directed via deflection mirrors 220a, 220b, 220c onto a beam separation element 230, which diffracts the laser beams hexagonally (see top view in Figure 2). Fig. 2) to each of six further deflecting mirrors 220d. Each of the N laser beams is then imaged onto the beam tilt correction element 120 via a combined beam control and focusing device, wherein each of the combined beam control and focusing devices comprises an AOD 130a, a beam focusing device 110 formed from, for example, three lenses, and a piezoelectrically controllable deflecting mirror 130b.

[0047] The laser beams corrected by the beam tilt correction element 120 are then directed again via a common deflecting mirror 220e to a beam imaging device, which images the N laser beams essentially telecentrically onto N essentially non-overlapping positions in the target area. The beam imaging device comprises a first lens 240 (also called a tube lens) and an objective lens (not shown).

[0048] In general, a laser addressing system comprising an imaging device as described in the present application may further comprise a laser beam source that provides the N laser beams to the imaging device. As mentioned above, the laser beam source may comprise a beam splitter 210, in particular a diffractive beam splitter for generating the N laser beams, wherein the beam splitter may be configured to generate N ≥ 3 laser beams in a polygonal or star-shaped arrangement, and wherein the imaging device may comprise a beam separation device 230 that directs each of the N ≥ 3 laser beams in a different direction, preferably maintaining the polygonal or star-shaped arrangement.

[0049] The laser addressing system can further comprise a beam monitoring beam splitter 250, which is arranged in the optical path between the beam tilt correction element 120 and the target area 150 and which is configured to direct a portion of the laser beam power of the N laser beams 102 to a beam analysis device 260 (e.g., a CCD camera). Furthermore, the laser addressing system can also include an illumination device 270, which illuminates the beam tilt correction element 120 such that it can be observed via the beam monitoring beam splitter 250 with the beam analysis device 260.For example, the laser addressing system can comprise a first lens 280, which is arranged in the optical path between the beam tilt correction element 120 and the beam analysis device 260 downstream of the beam monitoring beam splitter 250, and a second lens 285, which is arranged in the optical path between the first lens 280 and the beam analysis device 260. The first lens 280 provides a 2f image between the beam tilt correction element 120 and the illumination device 270 via a superposition beam splitter 275, and both lenses together provide a 4f image between the beam tilt correction element 120 and the beam analysis device 260. This ensures that the beam tilt correction element 120 is illuminated essentially over a large area and homogeneously, while the focal points of the laser beams are still sharply imaged onto the beam analysis device 260.

[0050] The imaging device 100, or the laser addressing system described above, can also be used as part of a material processing device, which also includes a device for arranging a material to be processed in the target area. The laser addressing system is used to simultaneously address the material to be processed at multiple positions. Furthermore, the N laser beams are configured to process the material to be processed, for example, thermally (e.g., in laser sintering, selective laser melting, laser cutting, laser welding, etc.) or photochemically. In such a material processing device, the N laser beams can be provided, for example, by a high-power CO2 laser, a continuous-wave or pulsed fiber laser, a disk laser, and / or a diode laser.

[0051] Another embodiment relates to an optical telecommunications switching device comprising a laser addressing system of the present application, wherein the N laser beams are modulated with different optical communication signals. The telecommunications switching device further comprises an output module with L > N optical output ports, preferably optical waveguides, arranged in the target area 150 such that the position of the output ports corresponds to the substantially non-overlapping positions of the laser beams in the target area. The beam control device 130 can be controlled such that each of the N laser beams can be coupled into at least two of the L output ports.

[0052] Another embodiment relates to a quantum computer or quantum simulation device comprising a plurality of individual atoms, ions, or molecules arranged in a lattice-like trap in the target region, and a laser addressing system as described above, which allows N ≥ 2 of the atoms, ions, or molecules arranged in the lattice-like trap to be addressed simultaneously. Here, at least M ≥ 2 individual atoms, ions, or molecules can be arranged in the lattice-like trap at preferably adjacent positions, where M ≥ N. In particular, the atoms, ions, or molecules can be arranged in a hexagonal, rectangular, or kagome-like lattice arrangement in the target region, with the M ≥ 2 micro-optical elements of the beam tilt correction element 120 arranged accordingly.

[0053] Fig. 3 to Fig. Figure 5 shows exemplary micromirror arrangements, SMDs, each of which can be part of a static micromirror device 120. Such a micromirror device of the present application comprises a substrate (e.g. a silicon substrate), and M ≥ 2, preferably M ≥ 4 micromirrors 310, which are arranged adjacent to each other on or in the substrate, wherein at least two of the micromirrors 310 have a different angle with a surface normal of the substrate (see Figure 5). Fig. 7) These different angles are in Fig. 3, Fig. 4 and Fig. 5 can be seen from the different height profiles of the micromirrors 310.

[0054] As in Fig. As shown in Figure 3, a micromirror arrangement L >= 2 identical groups 320 of N >= 2 micromirrors 310 can have, where M = L × N >= 4. In the example of Fig. There are L = 35 groups 320, each consisting of N = 6 micromirrors 310, where each of the N micromirrors 310 in each of the L groups 320 has a different angle with a surface normal of the substrate than the other micromirrors 310 in the same group 320. If such a micromirror arrangement is used with N controllable laser beams, each laser beam can be focused onto L different micromirrors 310 in L different groups 320 and its beam inclination can be corrected. The points 315 in Fig. 3, Fig. 4 and Fig. 5 correspond to the positions of the atoms in the lattice-like arrangement of a quantum register, where the distance between the points is scaled to the target area according to the magnification (e.g. 200x) of the beam imaging.

[0055] In particular, each of the M micromirrors 310 can have an effective mirror area that fits into a circle whose diameter is larger than 1 / e 2-width or as the FW99M width of the laser focus. In this way, it is ensured that each laser beam is only very slightly truncated by the micromirrors 310. As a result, the imaging of the corrected laser beam onto the target plane 150 is not significantly affected by the finite extent of the micromirrors 310. For example, each of the M micromirrors can have an effective mirror area that fits into a circle with a diameter of 200 µm, and a circle with a diameter of 50 µm fits into the effective mirror area. Such a geometric arrangement of the micromirrors has proven to be particularly advantageous for quantum register manipulation.In another advantageous configuration, each of the M micromirrors has an effective mirror area that fits into a circle with a diameter of 600 µm, and wherein 30 or more circles with a diameter of 50 µm fit into the effective mirror area without overlapping (see . Fig. 5) To further reduce crosstalk between the individual optical channels, the mirror surface can be made even larger.

[0056] The micromirror arrangement described above also allows the use of groups with different curvatures of the mirror surfaces. In particular, the N mirrors of one of the L groups can have a different curvature than the N mirrors of the other L groups. This allows, for example, the combination of micromirrors with a spherical surface, an aspherical surface, and / or a freeform surface in a single micromirror arrangement. Such different geometric-optical properties can be controlled separately for each target position in the target area via the beam control device – e.g., for controlled defocusing, aberration correction, and / or wavefront modification.

[0057] As in Fig. As shown in Figure 4, N different types of micromirrors can also be arranged essentially randomly on the substrate. Alternatively or additionally, each micromirror can also have random inclination angles in one or both inclination axes.

[0058] Fig. Figure 5 shows an alternative micromirror arrangement having N = 6 large-area micromirrors whose effectively usable mirror area is many times larger than the beam cross-section (e.g., than 1 / e 2 -width or the FW99M width). Such an arrangement allows the position of each of the N light beams in its sub-area within the target area to be controlled essentially continuously.

[0059] Fig. Figure 6 shows four SEM images of different micromirror arrangements. The different tilt angles of the micromirrors are clearly visible.

[0060] Fig. Figure 7 schematically shows a wafer 700 on which several micromirror arrangements 710 are arranged, as are used, for example, in Fig. 6 or Fig. 3 to Fig. Figure 5 shows that different images can be produced using only one wafer, which can be arranged, for example, on an electronically controlled transfer table. The wafer 700 can also have fiducial markings or registration marks 730, an alignment surface 740, and a single mirror 720 for single-channel operation of the imaging device. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] CN 101611467A

[0044] Cited non-patent literature

[0000] Song, RM Panas, JB Hopkins, “A review of micromirror arrays,” Prec. Eng., 51, 729 (2018

[0043]

Claims

[1] Imaging device (100) comprising: a beam tilt correction element (120); a beam control device (130) configured to image N >= 2 substantially non-overlapping light beams (102) onto the beam tilt correction element (120) and to control a position of one or more of the N light beams on the beam tilt correction element; and a beam imaging device (140) configured to image the light beams corrected by the beam inclination correction element onto a target area; wherein the beam inclination correction element (120) is configured to correct an inclination of the N light beams in each case such that the N light beams are imaged onto substantially non-overlapping positions in the target area. [2] Imaging device according to claim 1, wherein the beam inclination correction element comprises M>=2 micro-optical elements (122), wherein M is preferably greater than or equal to N, and wherein the M>=2 micro-optical elements are configured to correct the inclination of the N light beams; and / or wherein the beam control device comprises a beam focusing device (110) configured to image the N >= 2 substantially non-overlapping light beams (102) onto the beam inclination correction element (120); and / or wherein the beam imaging device (140) effects a substantially telecentricity-preserving imaging, preferably via a 4f imaging. [3] Imaging device according to claim 2, wherein the beam control device is arranged to control one or more of the light beams so that it or they are imaged onto one or more different micro-optical elements of the M>=2 micro-optical elements of the beam tilt correction element. [4] Imaging device according to one of claims 2 to 3, wherein the beam control device is further arranged to control one or more of the N light beams so that it or they are imaged onto different non-overlapping positions on one of the M micro-optical elements. [5] Imaging device according to one of claims 1 to 4, wherein the beam control device comprises one or more acousto-optical deflectors and / or one or more piezoelectrically adjustable mirrors for controlling the one or more of the N light beams. [6] Imaging device according to claim 5, wherein the beam control device comprises an acousto-optical deflector and / or a piezoelectrically adjustable mirror for each of the N light beams, wherein an output beam of the acousto-optical deflector is imaged onto the piezoelectrically adjustable mirror via a substantially telecentricity-preserving image, preferably a 4f image. [7] Imaging device according to one of claims 1 to 6, wherein the beam imaging device comprises a microscope objective which images the N light beams onto the target area and which preferably has a numerical aperture, NA, greater than or equal to 0.1, preferably greater than or equal to 0.

5. [8] Imaging device according to claim 7, wherein the M micro-optical elements are arranged to correct the inclination of the N light beams so that they overlap in a plane (145) of an entrance focal point of the microscope objective substantially at different inclination angles. [9] Microscopy system comprising: an imaging device according to any one of claims 1 to 8, a device for arranging an object to be examined in the target area such that the substantially non-overlapping positions lie on or in a part of the object to be examined; and, optionally, a device for illuminating the object to be examined such that the substantially non-overlapping positions in the target area are at least partially illuminated. [10] Microscopy system according to claim 9, further comprising a plurality of optical sensors, preferably CCD or CMOS sensors, wherein the imaging device is configured to image light emanating from the substantially non-overlapping positions and entering the imaging system onto different sensors of the plurality of optical sensors; and / or wherein the device for illuminating the object to be examined is configured to illuminate two or more of the substantially non-overlapping positions each with different light, each having a different frequency spectrum. [11] Microscopy system according to claim 9 or 10, wherein at least two sensors of the plurality of optical sensors differ in their sensor type; and / or wherein the imaging device has different optical filters for at least two sensors of the plurality of optical sensors, wherein, optionally, the different optical filters are selected from: a spectral filter, a polarization filter, and a spatial frequency filter, and / or wherein the device for illuminating is configured to illuminate at least two of the non-overlapping positions differently such that the light entering the imaging system in each case has a different frequency spectrum. [12] Microscopy system according to one of claims 9 to 11, wherein the device for arranging the object to be examined is arranged to displace the object to be examined such that at least two different non-overlapping positions are imaged successively on at least two different sensors. [13] Microscopy system according to one of claims 9 to 12, wherein the device for illuminating the object to be examined is arranged to image the illuminating light via the imaging device onto the substantially non-overlapping positions in the target area, preferably using a dichroic mirror whose frequency-dependent reflection behavior corresponds to an absorption and emission spectrum of a fluorescent dye of the object. [14] Laser addressing system comprising: an imaging device according to any one of claims 1 to 8, wherein the N light beams are laser beams imaged into the target area; and a laser beam source that provides the N laser beams to the imaging device. [15] Laser addressing system according to claim 14, wherein the laser beam source comprises a beam splitter (210), preferably a diffractive beam splitter, for generating the N laser beams from an input beam. [16] Laser addressing system according to claim 15, wherein the beam splitter is configured to generate N >= 3 laser beams in a polygonal or star-shaped arrangement; and wherein the imaging device comprises a beam separator 230 which directs each of the N >= 3 laser beams in a different direction, wherein the polygonal or star-shaped arrangement is preferably maintained. [17] Laser addressing system according to one of claims 14 to 16, wherein the imaging device further comprises a beam monitoring beam splitter (250) arranged in the optical path between the beam tilt correction element (120) and the target area (150) and arranged to direct a portion of the laser beam power of the N laser beams to a beam analysis device (260). [18] The laser addressing system of claim 17, further comprising an illuminator (270) that illuminates the beam tilt correction element (120) such that it can be observed via the beam monitoring beam splitter with the beam analysis device. [19] Laser addressing system according to claim 16 or 17, further comprising a first lens (280) arranged in the optical path between the beam monitoring beam splitter (250) and the beam analysis device (260), and a second lens (285) arranged in the optical path between the first lens (280) and the beam analysis device (280), wherein the first lens (280) provides a 2f image, via a heterodyne beam splitter (275) between the beam tilt correction element (120) and the illumination device (270), and both lenses together provide a 4f image between the beam tilt correction element (120) and the beam analysis device (260). [20] Quantum computer or quantum simulation device, comprising: a plurality of individual atoms, ions or molecules arranged in a grid-like trap in the target area; and a laser addressing system according to any one of claims 15 to 19 for simultaneously addressing N>=2 of the atoms, ions or molecules arranged in the grid-like trap. [21] Quantum computer or quantum simulation device according to claim 20, wherein at least M >= 2 individual atoms, ions or molecules are arranged in the grid-like trap at preferably adjacent positions, where M >= N. [22] Quantum computer or quantum simulation device according to one of claims 20 or 21, wherein the atoms, ions or molecules are arranged in a hexagonal, rectangular or kagome-like lattice arrangement in the target region, and wherein the M>=2 micro-optical elements are arranged accordingly. [23] Material processing device comprising: a device for arranging a material to be processed in the target area; and a laser addressing system according to one of claims 15 to 19 for simultaneously addressing the material to be processed at a plurality of positions, wherein the N laser beams are arranged to process the material to be processed. [24] Optical telecommunications switching device comprising: a laser addressing system according to any one of claims 15 to 19, wherein the N laser beams are modulated with different optical communication signals; and an output module with L > N optical output ports, preferably optical fibers, arranged in the target area such that the position of the output ports coincides with the substantially non-overlapping positions of the laser beams in the target area; wherein the beam control device is controllable such that each of the N laser beams can be coupled into at least two of the L output ports. [25] Static micromirror device (120) comprising: a substrate (600, 700); and M >= 2, preferably M >= 4 micromirrors (310) arranged on or in the substrate, and wherein at least two of the M micromirrors have a different angle with a surface normal of the substrate. [26] A static micromirror device according to claim 25, comprising L >= 1 similar groups of N >= 4 micromirrors, where M = L x N, and wherein each of the N micromirrors of each group has a different angle with a surface normal of the substrate than the other micromirrors of the same group. [27] A static micromirror device according to claim 26, wherein the N >= 4 micromirrors of each of the L >= 1 groups have a geometric arrangement, in particular a hexagonal, rectangular or kagome-like arrangement, corresponding to an arrangement of target positions in a target area. [28] A static micromirror device according to any one of claims 25 to 27, wherein each of the M micromirrors has an effective mirror surface that fits within a circle of diameter 200 µm, and wherein a circle with a diameter of 50 µm fits within the effective mirror surface. [29] A static micromirror device according to any one of claims 25 to 28, wherein the N mirrors of one of the L groups have a different curvature than another of the L groups. [30] A static micromirror device according to any one of claims 25 to 29, wherein each of the M micromirrors has an effective mirror area that fits into a circle of diameter 600 µm, and wherein 30 or more circles with a diameter of 50 µm fit into the effective mirror area without overlapping.

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