Energy-efficient vacuum lock with preheating function as part of a high-temperature process plant
The vacuum lock with a preheating function addresses energy inefficiencies by using thermal radiation and recycled heat to desorb residual water, enhancing efficiency and cleanliness in high-temperature process plants.
DE102025104851B3Active Publication Date: 2026-07-02SINGULUS TECHNOLGIES AG
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Patent Information
- Application Number
- DE102025104851
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-07-02
- Estimated Expiration
- 2045-02-10
AI Technical Summary
Technical Problem
Existing vacuum locks in high-temperature process plants require significant energy to preheat substrates and remove residual water, leading to inefficient energy use and potential contamination of the processing area.
Method used
A vacuum lock with a preheating function that utilizes thermal radiation from a coated chamber and a heat transfer medium to desorb water efficiently, recycling energy from downstream processes to maintain a clean and efficient substrate transfer.
Benefits of technology
Achieves rapid and energy-efficient water desorption from substrates, reducing energy consumption by 2-10% and minimizing contamination, while ensuring precise temperature control and substrate uniformity.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention relates to a vacuum lock (2) for a high-temperature process plant (42), and to a high-temperature process plant in which a heating chamber (3) is connected downstream of the vacuum lock (2) for processing, wherein the vacuum lock (2) comprises: a heating device with a first heat transfer medium (5) in fluid form for heating the vacuum lock (2), a heat exchanger (20), and a first heat transfer medium circuit (8) for the first heat transfer medium (5) with a circulation of the heat transfer medium (5) from the heat exchanger (20) to the heating device of the vacuum lock (2) and back to the heat exchanger (20), wherein the heat exchanger (20) is configured to heat the first heat transfer medium (5) by means of a second heat transfer medium circuit (9) coupled to the heat exchanger (20).
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